pb lead-free parts ligitek electronics co.,ltd. property of ligitek only tape and box type led lamps ly3331-pf/tbs-x data sheet a doc. no : qw0905- rev. : date : - 2008 20 - feb. ly3331-pf/tbs-x-08
1/6 page ligitek electronics co.,ltd. property of ligitek only part no. ly3331-pf/tbs-x package dimensions ly3331-pf 7.6 8.6 + - 1.0min 25.0min 1.5max 0.5 typ 2.54typ 5.0 5.9 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. d f p p1 - + t h2 l h1 p2 h w3 w0 w1 w2
10 gaasp/gap yellow ly3331-pf/tbs-x 20 150 65 2.1 1.7 35 585 i fp pd i f tstg t opr symbol power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 50 -40 ~ +100 -40 ~ +85 ir10 ratings yellow 50 15 mw a ma ma unit color material part no emitted typ. luminous intensity @10ma(mcd) spectral halfwidth nm peak wave length pnm lens typ. forward voltage @ ma(v) min.min. viewing angle 2 1/2 (deg) typical electrical & optical characteristics (ta=25 ) page2/6 ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the radiant intensity data did not including 15% testing tolerance. yellow transparent part no. ly3331-pf/tbs-x
ligitek electronics co.,ltd. property of ligitek only page 3/6 maximum specifications symbolminimum mm inch 3.0 0.09 4.2 0.15 f ------- d ------- mm 3.8 2.3 option code 0.17 inch 0.12 18.5 0.69 26.5 1.0 22.5 0.85 tbs-1 tbs-3 tbs-221.5 17.5 25.5 20.9 25.0 0.78 0.94 1.0 25.5 20.0 0.96 0.75 tbs-6 tbs-7 tbs-8 tbs-9 h1 24.0 19.9 19.0 24.5 23.5 0.89 22.5 tbs-5 0.98 1.04 0.82 0.93 0.73 0.89 0.79 2.00.08 ------- ------- h ------- 19.4 22.0 0.72 0.83 21.5 19.0 0.81 0.71 tbs-10 tbs-11 tbs-12 tbs-13 21.0 18.4 18.0 20.5 1.42 36 11 ------- w0 13 5.8 0.49 0.17 h2 l ------- ------- p p1 ------- ------- ------- 4.4 12.4 0.75 0.43 0.76 0.85 0.87 0.23 0.51 0.3 7.7 1.42 0.2 ------- 9.75 15.5 0.33 0.57 p2 t ------- ------- w0 w1 ------- ------- ------- 5.1 14.5 8.5 4.0 19 0 0.69 0 w2 w3 ------- ------- 17.5 0.38 0.75 0.16 0.61 0.06 specification inch mm inch maxmum 275 10.410.8 2.4 60 1.97 34013.4 13.0 package dimensions ? symbol items dimension symbol information ? component lead pitch tape feed hole diameter feed hole to bottom of component front-to-rear deflection feed hole to overall component height lead length after component height lead location feed hole pitch feed hole location adhesive tape width overall taped package thickness center of component location tape width adhesive tape position mm symbol description 265 w 50 h quantity/box overall thickness overall width 330 l overall length dimensions symbol information ? minimum 2000pcs remark:tbs=tape and box straight leads part no. ly3331-pf/tbs-x
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 500550600650 0.0 0.5 1.0 700 y chip page4/6 fig.6 directivity radiation 60 30 75% 50% 025% 100% -30 25% 75%50% 100% -60 0 part no. ly3331-pf/tbs-x
page 5/6 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only time(sec) 100 150 temp( c) 5 /sec max 260 2 /sec max 120 0 25 preheat 60 seconds max 0 50 260 c3sec max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. ly3331-pf/tbs-x
ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition reliability test: test item 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. page6/6 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles high temperature high humidity test solder resistance test thermal shock test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. part no. ly3331-pf/tbs-x
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