balllock ? bga socket note: aries specializes in custom design and production. in addition to the standard products shown on this page, special materials, platings, sizes, and configurations can be furnished, depending on quantities. aries reserves the right to change product specifications without notice. features: ? any grid size available on either 1.27mm [.050] or 1.50mm [.059] pitch. ? lidless design - ball locks into two-fingered contact. ? ultra-low profile socket adds only .050 [1.27] to overall package height (.100 [2.54] with snapadapt? pins). ? optional corner guides aid in package insertion (not used with snapadapt? pins). ? consult data sheet nos. 23003 and 23004 for aries ballnest? socket. specifications: ? socket body is ul 94v-0 fr-4. ? optional lead-in guides are black ul 94v-0 glass-filled thermoplastic (pps). ? contacts are beryllium copper alloy per qq-c-533. ? contact plating is either 100 m [2.54 m m] min. 90/10 tin/lead per mil-t- 10727 or 10 m [.25 m m] min. gold per mil-g-45204 over 30 m [.76 m m] nickel per qq-n-290. ? solder ball terminations are 90/10 lead/tin. ? solder paste is 63/37 eutectic. ? solder mask is dryfilm. ? inductance 1 h h/cont. @ 100mhz approx. (under testing). ? capacitance 1pf/contact @ 100mhz approx. (under testing). ? contact resistance=10mohms initial, 20mohms @10 cycles (under testing). ? durability=10 cycles max.; up to 50 cycles with snapadapt tm pin. ? insertion force=50 grams/contact avg. (approximate); 40 grams/contact initial when used with snapadapt tm pin. ? withdrawal force=20 grams/contact max. (approximate). ? socket accepts bga devices with .030 [.76] dia. balls. mounting considerations: ? suggested pcb pad size=.025.003 [.64.08] dia. ordering informa tion balllock? cont act bga package w/ .030 [.76] dia. solder balls a=bga package size + .085 [2.29] b=(no. of positions per row - 1) x bga pitch c=bga package size + .015 [.25] d=bga package size + .060 [1.52] optional corner guides note: part number assigned by factory when ordering socket with corner guides. bga package with smt snapadapt? pins in lieu of solder balls. consult data sheet no. 23012 and 23013 for details. xxx-bgxxxxx-7xx no. of positions (256 shown) ball grid array plating: 0=tin 1=gold footprint designator (assigned by factory) pitch u=1.50mm v=1.27mm contact type: 7=balllock surface mount solder ball contact (for socket w/out corner guides only) use aries bga order sheet, data sheet no. 23000, for prompt quotations. corner guides not used with snapadapt? pins. a ll dimensions : inches [ millimeters ] all tolerances .005 [.13] unless otherwise specified covered by patents and/or patents applied for. north america frenchtown, nj usa tel: (908) 996-6841 fax: (908) 996-3891 uk/ireland/gb tel: +44 870 240 0249 fax: +44 1653 600493 uking@arieselec.com europe/mainland/holland tel: +31 78 615 94 65 fax: +31 78 615 43 11 europe@arieselec.com http://www.arieselec.com ? info@arieselec.com printouts of this document may be out of date and should be considered uncon trolled 23002 rev.e
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