marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc mcl reserves the right to update or change this specification without notice 462/sm/01577/200 issue 1/2 a marconi company P35-4310-000-200 p35 single bit absorptive step attenuator, dc - 20ghz features broadband dc - 20ghz low insertion loss; 2.2db typ at 10ghz fast switching speed high isolation; typ 45db at 10ghz through gaas vias for improved performance description the P35-4310-000-200 is a high performance gallium arsenide monolithic single bit absorptive step attenuator. it is suitable for use in broadband communications, instrumentation and electronic warfare applications. the attenuator is controlled by the application of complimentary 0v/-5v or 0/-8v signals to the control lines in accordance with the truth tables below. the die is fabricated using mcl's 0 .5 m m gate length mesfet process (s20). it is fully protected using silicon nitride passivation for excellent performance and reliability. electrical performance ambient temperature = 22 3 c , z o = 50 w , control voltages = 0v/-5v unless otherwise stated parameter condition min typ max units insertion loss (reference state) dc - 10ghz 10ghz - 18ghz 18ghz - 20ghz - - - 2.2 3.0 3.4 2.5 3.4 3.8 db db db maximum attenuation dc - 10ghz 10ghz - 18ghz 18ghz - 20ghz 42 38 35 45 40 38 - - - db db db input return loss 1 50mhz - 20ghz 13 16 - db output return loss 1 50mhz - 20ghz 13 16 - db switching speed 50% control to 10%90%rf - 5 10 ns 1db power compression point 2 2-18 ghz 18 22 - dbm notes 1. return loss measured in low loss switch state. input power at which insertion loss compresses by 1db.
marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc mcl reserves the right to update or change this specification without notice 462/sm/01577/200 issue 1/2 a marconi company P35-4310-000-200 p35 typical performance at 22 c insertion loss 0 1 2 3 4 5 0 5 10 15 20 frequency (ghz) loss (db) isolation 0 20 40 60 80 0 5 10 15 20 frequency (ghz) loss (db) input return loss 0 10 20 30 40 0 5 10 15 20 frequency (ghz) return loss (db) output return loss 0 10 20 30 40 0 5 10 15 20 frequency (ghz) return loss (db) absolute maximum ratings max control voltage -8v max i/p power +25 dbm operating temperature -60 c to +125 c storage temperature -65 c to +150 c
marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc mcl reserves the right to update or change this specification without notice 462/sm/01577/200 issue 1/2 a marconi company P35-4310-000-200 p35 chip outline die size 2.91 x 1.11mm bond pad size 120 m m x 120 m m minimum die thickness: 200 m m attenuation truth table state 1 2 3 control line -5v -5v 0v low loss 0v 0v -5v attenuation electrical schematic pad details control line state j1 rf input j2 rf output 1 attenuate j1-j2 2 attenuate j1-j2 3 enable j1-j2 4 n/c handling, mounting and bonding instructions the back of the die is gold metallized and can be die-attached manually onto gold, eutectically with au- sn (80:20) or with low temperature conductive epoxy. the maximum allowable die temperature is 310 c for 2 minutes. bonds should be made onto the exposed gold pads with 17 or 25 microns pure gold or half-hard gold wire. bonding should be achieved with the die face at 225 c to 275 c with a heated thermosonic wedge (approx. 125 c) and a maximum force of 60 grams. ball bonds may be used but care must be taken to ensure the ball size is compatible with the bonding pads shown. the length of the bond wires should be minimised to reduce parasitic inductance, particularly those to the rf and ground pads. ordering information
marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc mcl reserves the right to update or change this specification without notice 462/sm/01577/200 issue 1/2 a marconi company P35-4310-000-200 p35 p35-4310-000-20
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