marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc the data and product specifications are subject to change without notice. these devices should not be used for device qualification and production without prior notice to mcl. 463/sm/02577/000 issue 1 a marconi company P35-5134-000-200 hemt mmic 1w power amplifier, 24ghz features gain; 16db typical @ 24ghz p-1db; 30.5dbm typical @ 24ghz 0.20 ?m phemt technology description the P35-5134-000-200 is a high performance 24ghz gallium arsenide power amplifier, capable of output powers in excess of 1 watt. it is intended for use in point-to-point digital radio and point-to- multipoint communications. the die is fabricated using caswell technology's 0.20um gate length, power hemt process (h40p) and is fully protected using silicon nitride passivation for excellent performance and reliability. electrical performance ambient temperature 22 3 c, z o = 50 w , vdd = 5v,vg1 to vg3 set for typical drain current. u.o.s parameter conditions min typ max units small signal gain 23 ? 25ghz - 1 6 - db gain flatness 23 ? 25ghz - 0.5 1.0 db input return loss 23 ? 25ghz - 15 - db output return loss 23 ? 25ghz - 15 - db p-1db output power 23 ? 25ghz vdd=5v - 30.5 - dbm drain voltage vdd - - 5 7 volts gate voltage vgg - - -0.3 - volts first stage current set vg1 - 180 - ma second stage current set vg2 - 360 - ma third stage current set vg3 - 720 - ma thermal resistance - - 11 - c/w notes 1. all parameters measured on wafer
marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc the data and product specifications are subject to change without notice. these devices should not be used for device qualification and production without prior notice to mcl. 463/sm/02577/000 issue 1 a marconi company P35-5134-000-200 typical rfow performance (----- with bondwires) gain 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 frequency (ghz) gain (db) reverse isolation 0 20 40 60 80 24 26 28 30 frequency (ghz) reverse isolation (db) input return loss 0 5 10 15 20 25 30 20 22 24 26 28 30 frequency (ghz) return loss (db) output return loss 0 5 10 15 20 25 30 20 22 24 26 28 30 frequency (ghz) return loss (db) output power @ 1db compression (5v) 25 27 29 31 33 35 23.0 23.5 24.0 24.5 25.0 frequncy (ghz) pout (dbm) pout vs pin (5v) 20 22 24 26 28 30 32 0 2 4 6 8 10 12 14 16 pin (dbm) pout (dbm) 23ghz 24ghz 25ghz
marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc the data and product specifications are subject to change without notice. these devices should not be used for device qualification and production without prior notice to mcl. 463/sm/02577/000 issue 1 a marconi company P35-5134-000-200 typical rfow performance gain vs pin (5v) 15 16 17 18 19 20 21 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 pin (dbm) gain (db) 23ghz 24ghz 25ghz current vs pin (5v) 1100 1200 1300 1400 1500 1600 1700 0 2 4 6 8 10 12 14 16 pin (dbm) current ids (ma) 23ghz 24ghz 25ghz pae vs pin(5v) 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 pin (dbm) pae (%) 23ghz 24ghz 25ghz output power @ 1db compression (6v) 25 27 29 31 33 35 23.0 23.5 24.0 24.5 25.0 frequncy (ghz) pout (dbm) pout vs pin (6v) 20 22 24 26 28 30 32 0 2 4 6 8 10 12 14 16 18 pin (dbm) pout (dbm) 23ghz 24ghz 25ghz gain vs pin (6v) 12 13 14 15 16 17 18 -6 -2 2 6 10 14 pin (dbm) gain (db) 23ghz 24ghz 25ghz
marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc the data and product specifications are subject to change without notice. these devices should not be used for device qualification and production without prior notice to mcl. 463/sm/02577/000 issue 1 a marconi company P35-5134-000-200 typical rfow performance current vs pin (6v) 700 800 900 1000 1100 1200 1300 1400 1500 0 2 4 6 8 10 12 14 16 18 pin (dbm) current ids (ma) 23ghz 24ghz 25ghz pae vs pin (6v) 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 pin (dbm) pae (%) 23ghz 24ghz 25ghz
marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc the data and product specifications are subject to change without notice. these devices should not be used for device qualification and production without prior notice to mcl. 463/sm/02577/000 issue 1 a marconi company P35-5134-000-200 typical s-parameters (rfow) frequency s11 s21 s12 s22 ( ghz) mag angle mag angle mag angle mag angle 20.00 0.17 -60.4 2.95 -51.9 0.002 -27.8 0.10 -57.0 20.25 0.17 -65.6 3.17 -63.4 0.002 -23.6 0.10 -63.0 20.50 0.17 -70.1 3.40 -75.2 0.002 -30.7 0.11 -67.5 20.75 0.17 -74.7 3.65 -87.4 0.002 -52.3 0.12 -71.9 21.00 0.17 -78.9 3.91 -100.0 0.002 -46.9 0.13 -76.0 21.25 0.17 -83.4 4.18 -112.9 0.002 -48.5 0.13 -80.1 21.50 0.16 -87.9 4.46 -126.2 0.001 -54.6 0.14 -83.9 21.75 0.16 -91.7 4.76 -139.9 0.002 -52.6 0.14 -87.3 22.00 0.15 -95.4 5.04 -154.1 0.001 -65.3 0.15 -90.8 22.25 0.15 -98.5 5.33 -168.7 0.001 -68.4 0.15 -94.0 22.50 0.14 -101.7 5.59 176.3 0.002 -89.2 0.16 -97.6 22.75 0.13 -104.9 5.83 161.2 0.001 -96.9 0.16 -101.4 23.00 0.13 -108.1 6.03 145.8 0.001 -98.3 0.17 -104.6 23.25 0.12 -109.7 6.19 130.2 0.001 -90.8 0.17 -107.8 23.50 0.11 -110.4 6.31 114.4 0.002 -106.4 0.17 -111.0 23.75 0.10 -110.3 6.38 98.6 0.002 -125.4 0.17 -114.2 24.00 0.10 -109.8 6.38 82.7 0.001 -144.1 0.17 -117.5 24.25 0.09 -107.3 6.34 66.9 0.001 -173.7 0.17 -120.4 24.50 0.08 -103.2 6.26 51.1 0.001 -173.6 0.16 -122.8 24.75 0.08 -98.4 6.13 35.6 0.000 164.2 0.16 -125.0 25.00 0.09 -93.9 5.97 20.3 0.000 142.7 0.16 -126.2 25.25 0.09 -91.1 5.81 5.3 0.000 156.8 0.15 -126.7 25.50 0.10 -89.7 5.63 -9.4 0.000 125.4 0.15 -126.7 25.75 0.10 -89.5 5.44 -23.9 0.000 -54.4 0.15 -126.4 26.00 0.11 -89.5 5.25 -38.1 0.000 15.7 0.14 -126.0 26.25 0.12 -90.2 5.06 -52.2 0.000 25.8 0.14 -125.2 26.50 0.12 -92.2 4.89 -66.0 0.000 -135.5 0.14 -124.3 26.75 0.12 -93.9 4.72 -79.8 0.000 -60.3 0.15 -124.2 27.00 0.13 -95.6 4.57 -93.5 0.000 -33.7 0.15 -124.5 27.25 0.13 -97.6 4.43 -107.1 0.000 -19.7 0.15 -124.4 27.50 0.13 -100.0 4.31 -120.6 0.001 -54.6 0.15 -124.4 27.75 0.14 -102.1 4.21 -134.1 0.001 -63.1 0.15 -124.6 28.00 0.14 -104.1 4.13 -147.8 0.001 -112.9 0.16 -124.8 28.25 0.14 -106.8 4.06 -161.9 0.001 -156.2 0.16 -125.1 28.50 0.14 -108.7 3.96 -176.1 0.000 178.4 0.16 -125.4 28.75 0.14 -109.0 3.93 170.2 0.001 -122.6 0.16 -125.7 29.00 0.14 -110.5 3.90 155.3 0.001 -144.3 0.17 -125.9 29.25 0.14 -112.0 3.88 140.1 0.001 -179.2 0.17 -125.9 29.50 0.14 -113.3 3.85 124.4 0.001 176.4 0.17 -125.8 29.75 0.14 -114.9 3.82 108.1 0.001 160.1 0.18 -125.4 30.00 0.14 -115.9 3.79 91.3 0.002 146.7 0.18 -125.8
marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc the data and product specifications are subject to change without notice. these devices should not be used for device qualification and production without prior notice to mcl. 463/sm/02577/000 issue 1 a marconi company P35-5134-000-200 chip outline die size: 4.17 x 3.86mm rf bond pads (1 & 10): 120 x 120 m m all other bond pads: 120 m m x 120 m m die thickness: 100 m m pad details pad function 1 rf input 2 vg1 3 vd1 4 gnd 5 vg2 6 vd2 7 vg3 8 gnd 9 vd3 10 rf output 11 vd3 12 gnd 13 vg3 14 vd2 15 vg1 16 gnd 17 vd1 18 vg1
marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc the data and product specifications are subject to change without notice. these devices should not be used for device qualification and production without prior notice to mcl. 463/sm/02577/000 issue 1 a marconi company P35-5134-000-200 handling and assembly information gallium arsenide (gaas) devices are susceptible to electrostatic and mechanical damage. dice are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded anti-static workstation. devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers. gaas products from caswell technology?s h40p foundry process are 100 m m thick and have through gaas vias to enable grounding to the circuit. windows in the surface passivation above the bond pads are provided to allow wire bonding to the die. the surface to which the die are to be attached should be cleaned with a proprietary de-greasing cleaner. eutectic mounting should be used and entails the use of a gold-tin ( ausn) preform, approximately 0.001 2 thick, placed between the die and the attachment surface. the preferred method of mounting is the use of a machine such as a mullins 8-140 die bonder. this utilises a heated collet and workstation with a facility for applying a scrubbing action to ensure total wetting and avoid the formation of voids. dry nitrogen gas is directed across the work piece. the gold-tin eutectic (80% au 20% sn) has a melting point of approximately 280 c (note: gold germanium with a higher melting temperature should be avoided, in particular for mmics). the work station temperature should be 310 c 10 c. the collet should be heated, and the die pre-heated to avoid excessive thermal shock. the strength of the bonding formed by this method will result in fracture of the die, rather than the bond under die strength testing. the P35-5134-000-200 amplifier die has gold bond pads. the recommended wire bonding procedure uses 25 m m (0.001?) 99.99% pure gold wire with 0.5-2% elongation. thermo-compression wedge bonding is preferred though thermosonic wire bonding may be used providing the ultrasonic content of the bond is minimised. a work station temperature of 260 c 10 c with a wedge tip temperature of 120 c 10 c is recommended. the wedge force should be 45 5 grams. bonds should be made from the bond pads on the die to the package or substrate. the rf bond pads at the input and output are 120 m m x 120 m m; all other bond pads are 120 m m x 120 m m. the P35-5134-000-200 has been designed to include the inductance of two 0.2mm length, 25 m m bondwires at both the input and output, facilitating the integration of the die into a 50 w environment. operating and biasing of the P35-5134-000-200 the P35-5134-000-200 is a three-stage amplifier. the drain bias for all three stages (vd1, vd2 & vd3) should be set to 5.0 volts. the gate voltages (vg1, vg2 & vg3) are typically set to -0.3v. the separate drain and gate voltage supplies for all three stages can be combined into single supplies (vdd & vgg). dc bias supplies should be decoupled to ground using 100pf chip capacitors placed close to the chip with short bondwires to the amplifier bond pad, larger 0.01uf capacitors should be used to decouple the supplies further, as indicated on the bonding diagram.
marconi caswell limited, caswell, towcester, northamptonshire, nn12 8eq telephone: + 44 (0) 1327 350581 fax: + 44 (0) 1327 356775 website: www.caswelltechnology .com caswell technology is the trading name of marconi caswell limited which is a wholly owned subsidiary of marconi plc the data and product specifications are subject to change without notice. these devices should not be used for device qualification and production without prior notice to mcl. 463/sm/02577/000 issue 1 a marconi company P35-5134-000-200 typical bonding detail absolute maximum ratings max vdd +7v max vgg -2v max channel temperature 150 c storage temperature -65 c to +150 c ordering information P35-5134-000-200 this is a pre production specification , sample parts available 1999 quarter 3. prototype samples are devices which have determined to be a potential product but which have not completed all pre-production and production release requirements. samples can be supplied for customer evaluation purposes only but are not stocked. further devices may not be the same.
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