a - 2005 19 - may LVG3330 ligitek electronics co.,ltd. property of ligitek only LVG3330 super bright round type led lamps data sheet doc. no : qw0905- rev. : date :
100% 75% 50% -60 x -30 x 25% 0 25% 75% 50% 100% 0 x 60 x 30 x 7.6 2.54typ 25.0min 1.0min ?? 0.5 typ 1.5max 5.9 5.0 8.6 1/4 page LVG3330 part no. ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation
green diffused color lens gap material LVG3330 part no green emitted 90 luminous intensity @20ma(mcd) typ. 30 spectral halfwidth ??f nm 565 peak wave length f pnm 2.6 max. forward voltage @ ma(v) 1.7 min. 20 50 min. viewing angle 2 c 1/2 (deg) 36 2/4 page ligitek electronics co.,ltd. property of ligitek only unit ma ma g a j j mw 30 120 vg ratings 10 ir -40 ~ +85 max 260 j for 5 sec max (2mm from body) -40 ~ +100 100 part no. LVG3330 forward current peak forward current duty 1/10@10khz parameter operating temperature soldering temperature storage temperature reverse current @5v power dissipation typical electrical & optical characteristics (ta=25 j ) symbol tsol t opr tstg i f pd i fp absolute maximum ratings at ta=25 j note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 vg chip 3.5 page 3/4 part no. LVG3330
part no. LVG3330 page 4/4 ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. this test intended to see soldering well performed or not.
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