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  composite transistors 1 publication date: february 2004 sjj00188bed XP04654 (xp4654) silicon npn epitaxial planar type (tr1) silicon pnp epitaxial planar type (tr2) for high-speed switching features ? two elements incorporated into one package ? reduction of the mounting area and assembly cost by one half basic part number ? 2sc3757 + 2sa1738 absolute maximum ratings t a = 25 c marking symbol: ed internal connection 4 tr1 tr2 5 6 1 3 2 note) the part number in the parenthesis shows conventional part number. parameter symbol rating unit tr1 collector-base voltage v cbo 40 v (emitter open) collector-emitter voltage v ces 40 v (e-b short) emitter-base voltage v ebo 5v (collector open) collector current i c 100 ma peak collector current i cp 300 ma tr2 collector-base voltage v cbo ? 15 v (emitter open) collector-emitter voltage v ces ? 15 v (e-b short) emitter-base voltage v ebo ? 4v (collector open) collector current i c ? 50 ma peak collector current i cp ? 100 ma overall total power dissipation p t 150 mw junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c unit: mm 5? 10? 2.1 0.1 1.25 0.10 1 3 2 0.2 0.05 0.12 +0.05 ?.02 0.2 0.1 (0.425) 1.3 0.1 2.0 0.1 0 to 0.1 0.9 0.1 0.9 +0.2 ?.1 6 5 4 (0.65) (0.65) 1: emitter (tr1) 4: emitter (tr2) 2: base (tr1) 5: base (tr2) 3: collector (tr2) 6: collector (tr1) eiaj: sc-88 smini6-g1 package
XP04654 2 sjj00188bed ? tr2 note) measuring methods are based on japanese industrial standard jis c 7030 measuring methods for transistors. electrical characteristics t a = 25 c 3 c ? tr1 note) measuring methods are based on japanese industrial standard jis c 7030 measuring methods for transistors. common characteristics chart p t ? t a 0 160 40 120 80 0 250 100 200 50 150 total power dissipation p t ( mw ) ambient temperature t a ( c ) parameter symbol conditions min typ max unit collector-base cutoff current (emitter open) i cbo v cb = 40 v, i e = 0 0.1 a emitter-base cutoff current (collector open) i ebo v eb = 4 v, i c = 0 0.1 a forward current transfer ratio h fe v ce = 1 v, i c = 10 ma 60 320 ? collector-emitter saturation voltage v ce(sat) i c = 10 ma, i b = 1 ma 0.17 0.25 v base-emitter saturation voltage v be(sat) i c = 10 ma, i b = 1 ma 1.0 v transition frequency f t v cb = 10 v, i e = ? 10 ma, f = 200 mhz 450 mhz collector output capacitance c ob v cb = 10 v, i e = 0, f = 1 mhz 2 6 pf (common base, input open circuited) turn-on time t on refer to the switching time measurement 17 ns turn-off time t off circuit 17 ns storage time t stg 10 ns parameter symbol conditions min typ max unit collector-base cutoff current (emitter open) i cbo v cb = ? 8 v, i e = 0 ? 0.1 a emitter-base cutoff current (collector open) i ebo v eb = ? 3 v, i c = 0 ? 0.1 a forward current transfer ratio h fe1 v ce = ? 1 v, i c = ? 10 ma 50 150 ? h fe2 v ce = ? 1 v, i c = ? 1 ma 30 collector-emitter saturation voltage v ce(sat) i c = ? 10 ma, i b = ? 1 ma ? 0.1 ? 0.2 v transition frequency f t v cb = ? 10 v, i e = 10 ma, f = 200 mhz 800 1 500 mhz collector output capacitance c ob v cb = ? 5 v, i e = 0, f = 1 mhz 1 pf (common base, input open circuited) turn-on time t on refer to the switching time measurement circuit 12 ns turn-off time t off 20 ns storage time t stg 19 ns
XP04654 3 sjj00188bed characteristics charts of tr1 h fe ? i c f t ? i e c ob ? v cb i c ? v ce v ce(sat) ? i c v be(sat) ? i c 220 ? 0.1 f 50 ? v cc = 3 v v out 3.3 k ? 50 ? v in = 10 v 3.3 k ? v bb = ? 3 v v in v out t on 90% 10% 90% 10% t off (waveform at a) v in v out 10% 10% t stg 910 ? 0.1 f 0.1 f a 90 ? v cc = 10 v v out 500 ? 50 ? v in = 10 v 500 ? 1 k ? v bb = 2 v t on , t off test circuit t stg test circuit switching time measurement circuit 0 1.2 1.0 0.8 0.2 0.6 0.4 0 120 100 80 60 40 20 t a = 25 c 2.5 ma 2.0 ma 1.5 ma 1.0 ma 0.5 ma i b = 3.0 ma collector current i c ( ma ) collector-emitter voltage v ce ( v ) 0.1 1 10 100 0.01 0.1 1 10 100 i c / i b = 10 t a = 75 c 25 c ? 25 c collector-emitter saturation voltage v ce(sat) ( v ) collector current i c ( ma ) 1 10 100 1 000 0.01 0.1 1 10 100 t a = ? 25 c 25 c 75 c base-emitter saturation voltage v be(sat) ( v ) collector current i c ( ma ) 0.1 1 10 100 0 600 500 400 300 200 100 v ce = 1 v t a = 75 c 25 c ? 25 c forward current transfer ratio h fe collector current i c ( ma ) ? 1 ? 10 ? 100 ? 1 000 0 600 500 400 300 200 100 v cb = 10 v t a = 25 c transition frequency f t ( mhz ) emitter current i e ( ma ) 110100 0 6 5 4 3 2 1 i e = 0 f = 1 mhz t a = 25 c collector-base voltage v cb ( v ) collector output capacitance (common base, input open circuited) c ob (pf)
XP04654 4 sjj00188bed characteristics charts of tr2 i c ? v ce v ce(sat) ? i c v be(sat) ? i c h fe ? i c f t ? i e c ob ? v cb switching time measurement circuit t on , t off test circuit t stg test circuit 508 ? 30 ? 51 ? v bb = ? 10 v v in v cc = ? 3 v v in = 9.0 v v in = ? 5.8 v v bb = ground v in = 9.8 v v bb = ? 8.0 v v out 0.1 f 34 ? v in 0 0 v out v in v out 90% 90% 90% 10% 10% t stg t on t off 90% 2 k ? 62 ? 51 ? v bb v in v cc = ? 1.5 v v out 0.1 f 52 ? 0 ? 12 ? 10 ? 8 ? 2 ? 6 ? 4 0 ? 60 ? 50 ? 40 ? 30 ? 20 ? 10 t a = 25 c ? 300 a ? 500 a ? 400 a ? 100 a ? 200 a i b = ? 600 a collector current i c ( ma ) collector-emitter voltage v ce ( v ) ? 1 ? 10 ? 100 ? 1 000 ? 0.01 ? 0.1 ? 1 ? 10 ? 100 i c / i b = 10 25 c ? 25 c t a = 75 c collector-emitter saturation voltage v ce(sat) ( v ) collector current i c ( ma ) ? 1 ? 10 ? 100 ? 1 000 ? 0.01 ? 0.1 ? 1 ? 10 ? 100 i c / i b = 10 25 c 75 c t a = ? 25 c base-emitter saturation voltage v be(sat) ( v ) collector current i c ( ma ) ? 0.1 ? 1 ? 10 ? 100 0 240 200 160 120 80 40 v ce = ? 10 v t a = 75 c 25 c ? 25 c forward current transfer ratio h fe collector current i c ( ma ) 1 10 100 0 2 400 2 000 1 600 1 200 800 400 v cb = ? 10 v f = 200 mhz t a = 25 c transition frequency f t ( mhz ) emitter current i e ( ma ) ? 1 ? 10 ? 100 0 2.4 2.0 1.6 1.2 0.8 0.4 i e = 0 f = 1 mhz t a = 25 c collector-base voltage v cb ( v ) collector output capacitance (common base, input open circuited) c ob (pf)
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technical information described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. it neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) the products described in this material are intended to be used for standard applications or general elec- tronic equipment (such as office equipment, communications equipment, measuring instruments and house- hold appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus- tion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifica- tions satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maximum rat- ing, the range of operating power supply voltage, and heat radiation characteristics. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2003 sep


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