extruded heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 50 extruded heat sinks for power semiconductors 621 and 623 series low-profile heat sinks for all metal-case power semiconductors footprint thermal performance at typical load standard dimensions height mounting natural forced w eight p/n in. (mm) in. (mm) hole pattern convection convection lbs. (grams) 621a 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) (1) to-3 75? @ 15w 2.0?/w @ 250 lfm 0.1000 (45.36) 621k 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) none 75? @ 15w 2.0?/w @ 250 lfm 0.1000 (45.36) 623a 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) (1) to-3 52? @ 15w 1.5?/w @ 250 lfm 0.2100 (95.26) 623k 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) none 52? @ 15w 1.5?/w @ 250 lfm 0.210o (95.26) a general purpose yet efficient heat dissipator for to-3 and virtually all other styles of metal case power semiconductor package types, the 621 and 623 series low-profile flat back heat sinks find a wide variety of applications. the central channel between fins measures 1.300 in. (33.0) (min.) in width, accommodating many types of packages. mounting hole pattern "a" is predrilled for the standard to-3 package. material: aluminum alloy, black anodized. to-3 mechanical dimensions 621 and 623 series (extrusion profile 1327) dimensions: in. (mm) natural and forced convection characteristics semiconductor mounting holes mechanical dimensions 302 and 303 series 301 series dimensions: in. (mm) natural and forced convection characteristics semiconductor mounting holes mechanical dimensions 641 series (extrusion profile 1371) dimensions: in. (mm) natural and forced convection characteristics semiconductor mounting holes 301/302/303 series compact heat sinks for dual stud-mounted semiconductor cases outline mounting thermal performance at typical load standard dimensions length ? hole (s) natural forced w eight p/n in. (mm) in. (mm) pattern and number convection convection lbs. (grams) 301k 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) none 70 c @ 15w 2.5 c/w @ 250 lfm 0.0580 (26.31) 301m 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) 10-32unf, 0.625 in. thread depth 70 c @ 15w 2.5 c/w @ 250 lfm 0.0580 (26.31) 301n 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) 1 4 -28unf, 0.625 in. thread depth 70 c @ 15w 2.5 c/w @ 250 lfm 0.0580 (26.31) 302m 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (1) 10-32unf, 0.625 in. thread depth 50 c @ 15w 1.8 c/w @ 250 lfm 0.1330 (60.33) 302mm 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (2) 10-32unf, 0.625 in. thread depth 50 c @ 15w 1.8 c/w @ 250 lfm 0.1330 (6033) 302n 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (1) 1 4 -28unf, 0.625 in. thread depth 5o c @ 15w 1.8 c/w @ 250 lfm 0.1330 (60.33) 302nn g 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (2) 1 4 -28unf, 0.625 in. thread depth 50 c @ 15w 1.8 c/w @ 250 lfm 0.1330 (60.33) 303m 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (1) 10-32unf, 0.625 in. thread depth 37 c @ 15w 1.3 c/w @ 250 lfm 0.2680 (121.56) 303mm 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (2) 10-32unf, 0.625 in. thread depth 37 c @ 15w 1.3 c/w @ 250 lfm 0.2680 (121.56) 303n g 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (1) 1 4 -28unf, 0.625 in. thread depth 37 c @ 15w 1.3 c/w @ 250 lfm 0.2680 (121.56) 303nn 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (2) 1 4 -28unf, 0.625 in. thread depth 37 c @ 15w 1.3 c/w @ 250 lfm 0.2680 (121.56) the large fin area in minimum total volume provided by the radial design of the 301/302/303 series offers maximum heat transfer efficiency in natural convection. all types are available with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the 302 and 303 series offer maximum cost savings with dual mounting locations (?m?and ?n?mounting hole patterns) for two stud-mount devices. material: aluminum alloy, black anodized. stud-mount 641 series maximum performance natural convection heat sink for all metal-case semiconductors outline mounting thermal performance at typical load standard dimensions height hole natural forced w eight p/n in. (mm) in. (mm) pattern convection convection lbs. (grams) 641a g 4.125 (104.8) x 3.000 (76.2) 1.000 (25.4) (1) to-3 36 c @ 15w 0.9 c/w @ 250 lfm 0.2900 (131.54) 641k g 4.125 (104.8) x 3.000 (76.2) 1.000 (25.4) none 36 c @ 15w 0.9 c/w @ 250 lfm 0.2900 (131.54) a vailable with a standard to-3 mounting hole pattern predrilled for cost-effective mounting in limited-height applications, the 641 series provides maximum performance in natural convec - tion with an optimized heat sink surface area. the 641k type with an open channel area of 1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require - ments for most metal case power semiconductor types. material: aluminum alloy, black anodized. to-3 a k k series 301 302 303 m a k n
extruded heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 51 413/421/423 series low-height double-surface heat sinks for to-3 case styles and diodes space-saving double surface 413, 421, and 423 series utilize finned surface area on both sides of the power semiconductor mounting surface to provide maximum heat dissipation in a compact profile. ready to install on popular power components in natural and forced convection applications. apply w akefield type 126 silicone-free thermal compound or wakefield deltapad interface materials for maximum performance. material: aluminum alloy, black anodized. to-3; do-5; stud-mount extruded heat sinks for power semiconductors 401 and 403 series double-surface heat sinks for to-3 case styles to-3; stud-mount with fins oriented vertically in cabinet sidewall applications, 401 and 403 series heat sinks are recommended for critical space applications where maximum heat dissipation is required for high-power to-3 case styles. forced convection performance is also exemplary with these double surface fin types. semiconductor mounting hole style ??offers a single centered 0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for mounting stud-type diodes and rectifiers. hole pattem ?" available upon request. material: aluminum alloy, black anodized. standard width overall dimensions height semiconductor thermal performance at typical load w eight p/n in. (mm) in. (mm) in. (mm) mounting hole pattem natural convection forced convection lbs. (grams) 401a g 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) (1) to-3 80 c @ 30w 1.5 c/w @ 250 lfm 0.1500 (68.04) 401f 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) 0.270 in. (6.9)-dia hole 80 c @ 30w 1.5 c/w @ 250 lfm 0.1500 (68.04) 401k g 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) none 80 c @ 30w 1.5 c/w @ 250 lfm 0.1500 (68.04) 403a g 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) (1) to-3 55 c @ 30w 0.9 c/w @ 250 lfm 0.3500 (158.76) 403f g 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) 0.270 in. (6.9)-dia hole 55 c @ 30w 0.9 c/w @ 250 lfm 0.3500 (158.76 403k g 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) none 55 c @ 30w 0.9 c/w @ 250 lfm 0.3500 (158.76) mechanical dimensions semiconductor mounting holes natural and forced convection characteristics 403 series a f k v 401 series 401 and 403 series (extrusion profile 1024) 413 series (extrusion profile 2276 421 series (extrusion profile 1025) series 413 421 423 series (extrusion profile 1025) a f k v nominal dimensions standard width length height ? semiconductor thermal performance at typical load w eight p/n in. (mm) in. (mm) in. (mm) mounting hole pattern natural convection forced convection lbs. (grams) 413a 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) (1) to-3 72 c @ 50w 0.85 c/w @ 250 lfm 0.6300 (285.77) 413f 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) 0.270 in. (6.9)-dia hole 72 c @ 50w 0.85 c/w @ 250 lfm 0.6300 (285.77) 413k g 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) none 72 c @ 50w 0.85 c/w @ 250 lfm 0.6300 (285.77) 421a 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) (1) to-3 58 c @ 50w 0.7 c/w @ 250 lfm 0.6300 (285.77) 421f 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) 0.270 in. (6.9)-dia hole 58 c @ 50w 0.7 c/w @ 250 lfm 0.6300 (285.77) 421k g 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) none 58 c @ 50w 0.7 c/w @ 250 lfm 0.6300 (285.77) 423a 4.750 (120.7) 5.500 (140.2) 2.625 (66.7) (1) to-3 47 c @ 50w 0.5 c/w @ 250 lfm 1.1700 (530.71) 423k g 4.750 (120.7) 5.500 (140.2) 2.625 (66.7) none 47 c @ 50w 0.5 c/w @ 250 lfm 1.1700 (530.71) dimensions: in. (mm) dimensions: in. (mm) mechanical dimensions semiconductor mounting holes natural and forced convection characteristics
extruded heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 52 extruded heat sinks for power semiconductors 431 and 433 series high-performance heat sinks for 30-100w metal power semiconductors need maximum heat dissipation from a to-3 rectifier heat sink in minimum space? the wakefield 431 and 433 series center chan - nel double-surface heat sinks offer the highest performance-to-weight ratio for minimum vol - ume occupied for to-3, diode, and stud-mount metal power semiconductors in the 30- to 100-watt operating range. additional interface resistance reduction for maximized overall per - formance can be achieved with proper application of wakefield type 126 silicone-free thermal compound. material: aluminum alloy, black anodized. to-3; stud-mount to-3 nominal dimensions standard width length ? height semiconductor thermal performance at typical load w eight p/n in. (mm) in. (mm) in. (mm) mounting hole pattern natural convection forced convection lbs. (grams) 431k 4.750 (120.7) 3.000 (76.2) 3.000 (76.2) none 55? @ 5ow 0.40?/w @ 250 lfm 0.7800 (353.81) 433k g 4.750 (120.7) 5.500 (139.7) 3.000 (76.2) none 42? @ 5ow 0.28?/w @ 250 lfm 1.4900 (675.86) dimensions: in. (mm) mechanical dimensions series 431 433 k natural and forced convection characteristics semiconductor mounting hole 431 and 433 series (extrusion profile 2726) 435 series lightweight quadruple mount heat sink for to-3 case styles nominal dimensions standard width length height semiconductor thermal performance at typical load w eight p/n in. (mm) in. (mm) in. (mm) mounting hole pattern natural convection forced convection lbs. (grams) 435aaaa 4.250(108.0) 5.500(139.7) 4.300(109.2) (4) to-3 37? @ 50w 0.38?/w @ 250 lfm 1.1500 (521.64) 54? @ 80w 0.24?/w @ 600 lfm mechanical dimensions dimensions: in. (mm) natural and forced convection characteristics semiconductor mounting holes aaaa 441 series high-performance natural convection heat sinks for rectifiers and diodes stud-mount nominal dimensions standard width length height semiconductor thermal performance at typical load w eight p/n in. (mm) in. (mm) in. (mm) mounting hole pattern natural convection forced convection lbs. (grams) 441k g 4.750 (120.7) 5.500 (139.7) 4.500 (114.3) none 34? @ sow 0.30?/w @ 250 lfm 1.9700 (893.59) 47? @ 80w 0.19?/w @ 600 lfm designed for vertical mounting within a power supply enclosure or equipment cabinet without forced airflow available. this w akefield 441 series heat sink will dissipate up to 100 watts efficiently in natural convection with a maximum 55? heat sink temperature rise above ambient. when applied in a forced convection environment, the 441k type will achieve thermal resistance of 0.18?/w (sink to ambient) at 1000 lfm. supplied with no predrilled device mounting hole pattern. material: aluminum alloy, black anodized. this lightweight high-performance heat sink is designed to mount and cool efficiently one to four to-3 style metal case power semiconductors. the type 435aaaa is the standard configuration available from stock, predrilled for mounting four to-3 style devices. increased performance can be achieved with the proper selection and installation of a wakefield type 175 deltapad kapton interface material for each power semiconductor or, for maximum reduction of case-to-sink interface loss, the application of wakefield type 126 silicone-free thermal compound. material: aluminum alloy, black anodized. 435 series (extrusion profile 4226) mechanical dimensions natural and forced convection characteristics semiconductor mounting hole 441 series (extrusion profile 1273) k dimensions: in. (mm)
extruded heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 53 extruded heat sinks for power semiconductors 465 and 476 series high-power heat sinks for medium hex-type rectifiers and diodes stud-mount w akefield engineering has designed four standard heat sink types for ease of installation and efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount power devices: 465, 476, 486, and 489 series. the 465 and 476 series shown here are designed for 1.060 in. hex (465 type) and 1.250 in. hex (476 type). the 476w type is avail - able predrilled for an 0.765 in. (19.4) dia, mounting hole, material: aluminum alloy, black anodized. nominal dimensions standard width length height hex style mounting thermal performance at typical load w eight p/n in. (mm) in. (mm) in. (mm) t ype hole pattern natural convection forced convection lbs. (grams) 465k 4.000 (101.6) 5.000 (127.0) 4.000 (101.6) 1.060 in. hex none 38? @ 5ow 0.27?/w @500 lfm 1.9300 (875.45) 476k 5.000 (127.0) 6.000 (152.4) 5.000 (127.0) 1.250 in. hex none 25? @ 5ow 0.19?/w @500 lfm 2.8200(1279.15) 476w 5.000 (127.0) 6.000 (152.4) 5.000 (127.0) 1.250 in. hex 0.765 in. 25? @ 5ow 0.19?/w @500 lfm 2.8000(1270.08) (19.4)dia. center mount natural and forced convection characteristics semiconductor mounting holes k w 476 series (extrusion profile 1245) 465 series (extrusion profile 1244) 486 and 489 series heat sinks for high-power hex-type rectifiers and diodes stud-mount nominal dimensions standard width length height hex style mounting thermal performance at typical load w eight p/n in. (mm) in. (mm) in. (mm) t ype hole pattern natural convection forced convection lbs. (grams) 486k g 6.250 (158.8) 6.000 (152.4) 6.250 (158.8) 1.750 in. hex none 24 c @ 50w 0.20 c/w @250 lfm 4.2100 (1909.66) 86 c @ 250w 0 .13 c/w @500 lfm 489k g 6.250 (158.8) 9.000 (228.6) 6.250 (158.8) 1.750 in. hex none 19 c @ 50w 0.15 c/w @250 lfm 6.1400 (2785.10) 75 c @ 250w 0.10 c/w @500 lfm these two heat sink types accept industry standard 1.750 in. (44.5) hex-type devices for mounting and efficient heat dissipation. each type is provided with a 1.750 in. (44.5) x 2.000 in. (50.8) area on the semiconductor base mounting surface which is free of anodize. material: aluminum alloy, black anodized. natural and forced convection characteristics k semiconductor mounting hole mechanical dimensions 486 and 489 series (extrusion profile 1541) dimensions: in. (mm) dimensions: in. (mm) mechanical dimensions series 486 489
extruded heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 54 extruded heat sinks for power semiconductors 490 series king size heat sinks for high-power rectifiers the 490 series can be used to mount a single high-power rectifier or a grouping of smaller power devices. the semiconductor device mounting surface is free of anodize on the entire surface on one side only; finish overall is black anodize. use type 109 mounting brackets (see accessories section) for mounting to enclosure wall and for electrical isolation. the anodize-free mounting surface is milled for maximum contact area. the 490 series can also be drilled for mounting and cooling igbts and other isolated power modules. material: aluminum alloy, black anodized. general purpose nominal dimensions standard width length ? height semiconductor thermal performance at typical load w eight p/n in. (mm) in. (mm) in. (mm) mounting hole pattern natural convection forced convection lbs. (grams) 490-35k 9.250 (235.0) 3.500 (88.9) 6.750 (171.5) none 84 c @ 20ow 0.18 c/w @ 600 lfm 3.2400(1469.66) 490-6k g 9.250 (235.0) 6.000 (152.4) 6.750 (171.5) none 60 c @ 20ow 0.13 c/w @ 600 lfm 5.4700(2481.19) 490-12k g 9.250 (235.0) 12.000 (304.8) 6.750 (171.5) none 45 c @ 20ow 0.09 c/w @ 600 lfm 10.62 (4817.23) mechanical dimensions 490 series (extrusion profile 2131) natural and forced convection characteristics semiconductor mounting hole dimensions: in. (mm) performance, low profile heat sinks for power modules & igbt s 394, 395, 396 series thermal resistance at typical load overall dimensions: in. (mm) device base natural forced standard length height width mounting area base mounting convection ( sa) (1) convection ( sa) p/n in. (mm) in. (mm) in. (mm) (mm) holes (?/w) (?/w @ 500 lfm) 394-1ab 3.000 (76.2) 1.500 (38.1) 5.000 (127.0) 101 x 76 4 1.85 0.90 394-2ab 5.500 (139.7) 1.500 (38.1) 5.000 (127.0) 101 x 139 6 1.51 0.60 395-1ab 3.000 (76.2) 2.500 (63.5) 5.000 (127.0) 50 x 76 4 1.10 0.50 395-2ab 5.500 (139.7) 2.500 (63.5) 5.000 (127.0) 50 x 139 6 0.90 0.32 396-1ab 3.000 (76.2) 1.380 (35.1) 5.000 (127.0) 50 x 76 4 1.85 1.07 396-2ab 5.500 (139.7) 1.380 (35.1) 5.000 (127.0) 50 x 139 6 1.51 0.64 note: 1.thermal resistance values shown are for black anodized finish at 50? rise above ambient. natural and forced convection characteristics natural and forced convection characteristics natural and forced convection characteristics mechanical dimensions 394 series (extrusion profile 7332) 395 series (extrusion profile 7330) 396 series (extrusion profile 7331) dimensions: in. (mm)
extruded heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 55 series 517, 527, 518 and 528 heat sinks for ?alf brick?dc/dc converters thermal performance footprint natural convection forced convection standard dimensions height fin number power dissipation (watts) thermal resistance p/n in. (mm) in. (mm) orientation of fins 60? rise heat sink to ambient at 300 ft/min 517-95ab 2.28 (57.9) x 2.40 (61.0) 0.95 (24.1) horizontal 8 11w 2.0 ?/w 527-45ab 2.28 (57.9) x 2.40 (61.0) 0.45 (11.4) horizontal 11 7w 3.2 ?/w 527-24ab 2.28 (57.9) x 2.40 (61.0) 0.24 (6.1) horizontal 11 5w 5.8 ?/w 518-95ab 2.40 (61.0) x 2.28 (57.9) 0.95 (24.1) v ertical 8 11w 2.0 ?/w 528-45ab 2.40 (61.0) x 2.28 (57.9) 0.45 (11.4) v ertical 11 7w 3.2 ?/w 528-24ab 2.40 (61.0) x 2.28 (57.9) 0.24 (6.1) v ertical 11 5w 5.8 ?/w material: aluminum, black anodized. keep your "half brick" size at&t and computer products power modules cool with these effi - cient black anodized aluminum heat sinks made for natural or forced convection applications. t o include four m3 x 8mm phillips head sem attachment screws, add an ??suffix to stan - dard part number. to specify factory applied deltalink iv thermal interface material, add an ?4?suffix to standard part number. deltalink iv is a non-insulating graphite based material used as a clean, thermally efficient alternative to thermal grease. to-220 and to-218 mechanical dimensions 517, 527, 518 and 528 series product designation 51 7 / 527 series dimensions 51 8 / 528 series dimensions extruded heat sinks for power semiconductors standard description for use with series mounting hipot rating w eight p/n hardware material (vac) lbs. (grams) s 103 spool-shaped insulator 300, 400, 600, 111, 113 #6-32 screw t eflon 1500 0.00012 (0.05) 107 spool-shaped insulator 300, 400, 600, 111, 113 #6-32 screw, nut t eflon 5000 0.0034 (1.54) 100 series t eflon mounting insulators mounting hardware for extruded heat sinks 103 series 107 series dimensions: in. (mm)
extruded heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 56 high fin density heat sinks for power modules, igbt s , relays height thermal resistance (5) ( sa) at typical load standard catalog p/n (5) milled base (1) nonmilled base (2) natural forced milled nonmilled base width length (? series? (? series) convection (3) convection (4) base (1) base (2) in. (mm) in. (mm) in. (mm) in. (mm) (?/w) (?/w @ 100 cfm) 510-3m 510-3u 7.380 (187.452) 3.000 (76.2) 3.106 (78.9) 3.136 (79.7) 0.56 0.088 510-6m 510-6u 7.380 (187.452) 6.000 (152.4) 3.106 (78.9) 3.136 (79.7) 0.38 0.070 510-9m 510-9u 7.380 (187.452) 9.000 (228.6) 3.106 (78.9) 3.136 (79.7) 0.29 0.066 510-12m g 510-12u g 7.380 (187.452) 12.000 (304.8) 3.106 (78.9) 3.136 (79.7) 0.24 0.062 510-14m g 510-14u g 7.380 (187.452) 14.000 (355.6) 3.106 (78.9) 3.136 (79.7) 0.21 0.059 511-3m 511-3u 5.210 (132.33) 3.000 (76.2) 2.350 (59.7) 2.410 (61.2) 0.90 0.120 511-6m 511-6u 5.210 (132.33) 6.000 (152.4) 2,350 (59.7) 2.410 (61.2) 0.65 0.068 511-9m 511-9u 5.210 (132.33) 9.000 (228.6) 2.350 (59.7) 2.410 (61.2) 0.56 0.060 511-12m 511-12u 5.210 (132.33) 12.000 (304.8) 2.350 (59.7) 2.410 (61.2) 0.45 0.045 512-3m 512-3u 7.200 (182.88) 3.000 (76.2) 2.350 (59.7) 2.410 (61.2) 0.90 0.120 512-6m 512-6u 7.200 (182.88) 6.000 (152.4) 2.350 (59.7) 2.410 (61.2) 0.65 0.068 512-9m 512-9u 7.200 (182.88) 9.000 (228.6) 2.350 (59.7) 2.410 (61.2) 0.56 0.060 512-12m 512-12u 7.200 (182.88) 12.000 (304.8) 2.350 (59.7) 2.410 (61.2) 0.45 0.045 mechanical dimensions natural and forced convection characteristics series a b c flatness 511-u 512-u 0.250 (6.4) 2.410 (61.2) 0.372 (9.4) 0.006 in./in. (0.15 mm/mm) 511-m 512-m 0.220 (5.6) 2.350 (59.7 0.342 (8.7) 0.002 in./in. (0.05 mm/mm) dimensions: in. (mm) series a b flatness 510-u 0.216 (5.5) 3.136 (79.7) 0.006 in./in. (0.15 mm/mm) 510-m 0.165 (4.2) 3.106 (78.9) 0.002 in./in. (0.05 mm/mm) 510 series 510 series (extrusion profile 5113) 511 series (extrusion profile 6438-1) 511 and 512 series 512 series (extrusion profile 6438-2) 392 series high performance heat sinks for power modules, igbt s and solid st a te relays thermal resistance at typical load standard p/n, finish natural forced black gold length convection ( sa) convection ( sa) w eight anodized iridite in. (mm) (?w) (?w) lbs. (grams) 3 9 2 - 1 2 0 a b 3 9 2 - 1 2 0 a g 4.725 (120.0) 0 . 5 0 0.16 @ 100 cfm 4.452 (2019.43) 392-180ab g 392-180ag g 7.087 (180.0) 0 . 4 3 0.11 @ 100 cfm 6.636 (3010.09) 392-300ab g 392-300ag g 11.811 (300.0) 0 . 3 3 0.08 @ 100 cfm 1o.420 (4726.51) 392 series (extrusion profile 5658) 510, 511 and 512 series n o t e s : 1. precision-milled base for maximum heat transfer p e r formance (flatness 0.002 in./in.) 2. nonmilled base flatness: 0.006 in./in. 3. natural convection heat dissipation for distributed heat s o u r ces at 50? rise. 4. f o r ced convection heat dissipation for distributed heat s o u r ces at 100 cubic feet per minute, shrouded condition. 5. standard models are provided without finish. natural and forced convection characteristics mechanical dimensions dimensions: in. (mm) n at u r a l c o n v e c t i o n 392-120 (1 mod) 392-180 (1 mod) 392-300 (1 mod) 392-300 (3 mod) f o r c e d c o n v e c t i o n 392-120 (1 mod) 392-120 (3 mod) 392-180 (1 mod) 392-180 (3 mod) 392-300 (3 mod)
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