original creation date: 04/30/96 last update date: 09/17/99 last major revision date: 04/30/96 mnlm2990-12-x rev 0b0 microcircuit data sheet negative low dropout regulator general description the lm2990 is low dropout, 1 ampere negative voltage regulator available with fixed output voltages of -5, -12, and -15v. the lm2990 uses new circuit design techniques to provide low dropout and low quiescent current. the dropout voltage at 1a load current is typically 0.6v and a guaranteed worst-case maximum of 1v over the entire operating temperature range. the quiescent current is typically 1ma with 1a load current and an input-output voltage differential greater than 3v. a unique circuit design of the internal bias supply limits the quiescent current to only 9ma (typical) when the regulator is in the dropout mode (vout - vin < 3v). output voltage accuracy is guaranteed to +5% over load, and temperature extremes. the lm2990 is short-circuit proof, and thermal shutdown includes hysteresis to enhance the reliability of the device when overloaded for an extended period of time. ns part numbers lm2990j-12-qml LM2990WG-12-QML industry part number lm2990 prime die lm2990 controlling document see features section processing mil-std-883, method 5004 quality conformance inspection mil-std-883, method 5005 subgrp description temp ( c) o 1 static tests at +25 2 static tests at +125 3 static tests at -55 4 dynamic tests at +25 5 dynamic tests at +125 6 dynamic tests at -55 7 functional tests at +25 8a functional tests at +125 8b functional tests at -55 9 switching tests at +25 10 switching tests at +125 11 switching tests at -55 1
microcircuit data sheet mnlm2990-12-x rev 0b0 features - 5% output accuracy over entire operating range - output current in excess of 1a - dropout voltage typically 0.6v at 1a load - low quiescent current - internal short circuit current limit - internal thermal shutdown with hysteresis - functional complement to the lm2940 series - controlling document: lm2990j-12-qml 5962-9571001qea LM2990WG-12-QML 5962-9571001qxa applications - post switcher regulator - local, on-card, regulation - battery operated equipment 2
microcircuit data sheet mnlm2990-12-x rev 0b0 (absolute maximum ratings) (note 1) input voltage -26v to +0.3v power dissipation (note 2, 3) internally limited operating temperature range (tj) -55 c to +125 c maximum junction temperature (tjmax) 150 c storage temperature range -65 c to +150 c thermal resistance thetaja 75 c/w cerdip (still air @ 0.5 c/w) 35 c/w (500lf/min air flow @ 0.5 c/w) 119 c/w ceramic soic (still air @ 0.5 c/w) tbd (500lf/min air flow @ 0.5 c/w) thetajc (note 3) 5 c/w cerdip 3 c/w ceramic soic lead temperature 260 c (soldering, 10 seconds) package weight (typical) tbd cerdip tbd ceramic soic esd susceptibility (note 4) 2kv note 1: absolute maximum ratings indicate limits beyond which damage to the device may occur. operating ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. for guaranteed specifications and test conditions, see the electrical characteristics. the guaranteed specifications apply only for the test conditions listed. some performance characteristics may degrade when the device is not operated under the listed test conditions. note 2: the maximum power dissipation must be derated at elevated temperatures and is dictated by tjmax (maximum junction temperature), thetaja (package junction to ambient thermal resistance), and ta (ambient temperature). the maximum allowable power dissipation at any temperature is pdmax = (tjmax -ta)/thetaja or the number given in the absolute maximum ratings, whichever is lower. if this dissipation is exceeded, the die temperature will rise above 125 c, and the lm2990 will eventually go into thermal shutdown at a tj of approximately 160 c. note 3: the package material for these devices allows much improved heat transfer over our standard ceramic packages. in order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction-to-case, thermal resistance. it must not be assumed that the device leads will provide substantial heat transfer out of the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. the stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. the user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. note 4: human body model, 100pf discharged through a 1.5k ohms resistor. 3
microcircuit data sheet mnlm2990-12-x rev 0b0 recommended operating conditions (note 1) maximum input voltage (operational) -26v note 1: absolute maximum ratings indicate limits beyond which damage to the device may occur. operating ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. for guaranteed specifications and test conditions, see the electrical characteristics. the guaranteed specifications apply only for the test conditions listed. some performance characteristics may degrade when the device is not operated under the listed test conditions. 4
mnlm2990-12-x rev 0b0 microcircuit data sheet electrical characteristics dc parameters (the following conditions apply to all the following parameters, unless otherwise specified.) dc: vin = -5v + vo(nom), io = 1a, co = 47uf. symbol parameter conditions notes pin- name min max unit sub- groups vo output voltage 5ma < io < 1a 1 -12.24 -11.76 v 1 1 -12.60 -11.40 v 2, 3 vrln line regulation io = 5ma, vo(nom) -1v > vin > -26v 1 60 mv 1, 2, 3 vrld load regulation 50ma < io < 1a 170mv1 1 100 mv 2, 3 vdo dropout voltage io = 0.1a, delta vo < 100mv 1 0.3 v 1, 2, 3 io = 1a, delta vo < 100mv 1 1 v 1, 2, 3 iq quiescent current io < 1a 1 5 ma 1 1 10 ma 2, 3 io = 1a, vin = vo(nom) 1 50 ma 1, 2, 3 ios short circuit current rl = 1 ohm 1, 2 0.9 a 1 1, 2 0.75 a 2, 3 imax maximum output current 1, 2 1.4 a 1 rr ripple rejection vripple = 1vrms, fripple = 1khz, io = 5ma 142 db1 von output noise voltage 10hz-100khz, io = 5ma 1 1500 uv 1, 2, 3 note 1: vo(nom) is the nominal (typical) regulator output voltage, -5v, -12v or -15v. note 2: the short circuit current is less than the maximum output current with the -12v and -15v versions due to internal foldback current limiting. the -5v version, tested with a lower input voltage, does not reach the foldback current limit and therefore conducts a higher short circuit current level. if the lm2990 output is pulled above ground, the maximum allowed current sunk back into the lm2990 is 1.5a. 5
microcircuit data sheet mnlm2990-12-x rev 0b0 graphics and diagrams graphics# description 06324hrb3 cerdip (j), 16 lead (b/i ckt) 06350hra1 ceramic soic (wg), 16 lead (b/i ckt) j16arl cerdip (j), 16 lead (p/p dwg) p000100b cerdip (j), 16 lead (pin out) p000383a ceramic soic (wg), 16 lead (pinout) wg16arc ceramic soic (wg), 16 lead (p/p dwg) see attached graphics following this page. 6
n mil/aerospace operations 2900 semiconductor drive santa clara, ca 95050 1 16 2 3 4 5 6 7 8 15 14 13 12 11 10 9 n/c n/c n/c n/c n/c n/c n/c n/c n/c n/c input n/c ground output n/c n/c lm2990j-xx 16 - lead dip connection diagram ( top view ) p000100b
n mil/aerospace operations 2900 semiconductor drive santa clara, ca 95050 1 16 2 15 3 14 4 13 5 12 6 11 7 10 n/c ground n/c output n/c n/c input 16 - lead ceramic soic lm2990wg top view connection diagram p000383a 8 9 n/c n/c n/c n/c n/c n/c n/c n/c n/c
microcircuit data sheet mnlm2990-12-x rev 0b0 revision history rev ecn # rel date originator changes 0a0 m0000593 09/17/99 barbara lopez initial release of: mnlm2990-12-x rev. 0a0. added note for power dissipation and reference to thermal resistance for aluminum nitride package. 0b0 m0003561 09/17/99 rose malone update mds: mnlm2990-12-x, rev. 0a0 to mnlm2990-12-x, rev. 0b0. moved reference to controlling document to features section. added graphic's reference to wg pkg to main table and absolute section and package weight heading. 7
|
