pin diodes reliability data description for applications requiring compo- nent reliability estimation, hewlett-packard provides reliability data for all families of devices. data is initially compiled from reliability tests run prior to market introduction to demon- strate that a product meets design criteria. additional tests are run periodically. the data on this sheet represents the latest review of accumulated test results. applications this information represents the capabilities of the generic device. failure rates and mttf values presented here are achievable with normal mil-s-19500 tx level screening. this reliability screen- ing is no longer available from hewlett-packard. the screening tests, references, conditions, lot sizes, and ltpd are provided as references only. 1n5719 5082-3001 5082-3039 5082-3077 400 junction temperature, t j ( c) mean time to failure, mttf (hrs) mean time to failure vs. junction temperature 350 300 250 200 150 100 50 25 10 2 10 3 10 4 10 5 10 6 10 7 10 8 10 9 e a = 1.3 ev
for technical assistance or the location of your nearest hewlett-packard sales office, distributor or representative call: americas/canada: 1-800-235-0312 or 408-654-8675 far east/australasia: call your local hp sales office. japan: (81 3) 3335-8152 europe: call your local hp sales office. data subject to change. copyright ? 1997 hewlett-packard co. obsoletes 5965-8885e printed in u.s.a. 5966-0945e (9/97) burn-in and storage ltpd/ test test conditions 1000 hours high temperature life 1,000 hrs. min. storage time @ 150 c3 steady state operating life 1,000 hrs. min. operating time @ p fm = 250 mw, 3 v rm = 150 v, f = 60 hz, t a = 25 c environmental mil-std-750 test reference test conditions ltpd solderability 2026 sn 95, pb 5, solder at 260 c10 temperature cycling 1051 100 cycles from -65 c to +150 c, 0.5 hrs. at 7 extremes, 5 min. transfer thermal shock 1056 100 cycles from 0 c to +100 c, 3 sec. transfer 7 moisture resistance 1021 10 days, 90-98% rh, -10 to +65 c, non operating 7 shock 2016 5 blows each x 1 , y 1 , y 2 , 1500 g. 0.5 msec pulse 7 vibration variable 2056 4, 4 minute cycles each x, y, z at 20 g min. 7 frequency 100 to 2000 hz constant acceleration 2006 1 minute each x 1 , y 1 , y 2 , at 20,000 g 7 terminal strength 2036 miniature glass package, -3, 90 arcs, 2 leads, 10 8 oz., lead restriction hermeticity 1014 fine and gross 2 dod-hdbk-1686 esd classification: the pin diodes covered in this reliability data sheet are class i.
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