? semiconductor components industries, llc, 2006 may, 2006 ? rev. 3 1 publication order number: NSDEMP11XV6T1/d NSDEMP11XV6T1, nsdemp11xv6t5 common anode quad array switching diode these common anode epitaxial planar quad diodes are designed for use in ultra high speed switching applications. the NSDEMP11XV6T1 device is housed in the sot?563 package which is designed for low power surface mount applications, where board space is at a premium. features ? fast t rr ? low c d ? these are pb?free devices maximum ratings (t a = 25 c) rating symbol value unit reverse voltage v r 80 vdc peak reverse voltage v rm 80 vdc forward current i f 100 madc peak forward current i fm 300 madc peak forward surge current i fsm (note 1) 2.0 adc thermal characteristics characteristic (one junction heated) symbol max unit total device dissipation t a = 25 c derate above 25 c p d 357 (note 2) 2.9 (note 2) mw mw/ c thermal resistance, junction-to-ambient r ja 350 (note 2) c/w characteristic (both junctions heated) symbol max unit total device dissipation t a = 25 c derate above 25 c p d 500 (note 2) 4.0 (note 2) mw mw/ c thermal resistance, junction-to-ambient r ja 250 (note 2) c/w junction and storage temperature t j , t stg ?55 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. t = 1 s 2. fr?4 @ minimum pad http://onsemi.com sot?563 case 463a plastic 1 marking diagram p9 m (1) (2) (3) (4) (5) (6) device package shipping ? ordering information NSDEMP11XV6T1 sot?563* 4000/tape & ree l nsdemp11xv6t5 8000/tape & ree l p9 = device code m = date code = pb?free package NSDEMP11XV6T1g 4000/tape & ree l nsdemp11xv6t5g 8000/tape & ree l sot?563* sot?563* sot?563* ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. *this package is inherently pb?free. (note: microdot may be in either location)
NSDEMP11XV6T1, nsdemp11xv6t5 http://onsemi.com 2 electrical characteristics (t a = 25 c) characteristic symbol condition min max unit reverse voltage leakage current i r v r = 70 v ? 0.1 adc forward voltage v f i f = 100 ma ? 1.2 vdc reverse breakdown voltage v r i r = 100 a 0 ? vdc diode capacitance c d v r = 6.0 v, f = 1.0 mhz ? 3.5 pf reverse recovery time t rr (note 3) i f = 5.0 ma, v r = 6.0 v, r l = 100 , i rr = 0.1 i r ? 4.0 ns 3. t rr test circuit for NSDEMP11XV6T1 in figure 4. typical electrical characteristics 100 0.2 0.4 v f , forward voltage (volts) 0.6 0.8 1.0 1.2 10 1.0 0.1 10 0 v r , reverse voltage (volts) 1.0 0.1 0.01 0.001 10 20 30 40 50 1.75 0 v r , reverse voltage (volts) 1.5 1.25 1.0 0.75 c d , diode capacitance (pf) 2468 i f , forward current (ma) figure 1. forward voltage figure 2. reverse current figure 3. diode capacitance t a = 150 c t a = 125 c t a = 85 c t a = 55 c t a = 25 c i r , reverse current ( a) t a = 85 c t a = ?40 c t a = 25 c a r l t r t p t 10% 90% v r t p = 2 s t r = 0.35 ns i f t rr t i rr = 0.1 i r i f = 5.0 ma v r = 6 v r l = 100 recovery time equivalent test circuit input pulse output pulse figure 4. reverse recovery time test circuit for the NSDEMP11XV6T1
NSDEMP11XV6T1, nsdemp11xv6t5 http://onsemi.com 3 package dimensions h e dim min nom max millimeters a 0.50 0.55 0.60 b 0.17 0.22 0.27 c d 1.50 1.60 1.70 e 1.10 1.20 1.30 e 0.5 bsc l 0.10 0.20 0.30 1.50 1.60 1.70 0.020 0.021 0.023 0.007 0.009 0.011 0.059 0.062 0.066 0.043 0.047 0.051 0.02 bsc 0.004 0.008 0.012 0.059 0.062 0.066 min nom max inches sot?563, 6 lead case 463a?01 issue f e m 0.08 (0.003) x b 6 5 pl a c ?x? ?y? notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. d e y 12 3 4 5 l 6 1.35 0.0531 0.5 0.0197 mm inches scale 20:1 0.5 0.0197 1.0 0.0394 0.45 0.0177 0.3 0.0118 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e 0.08 0.12 0.18 0.003 0.005 0.007 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5773?3850 NSDEMP11XV6T1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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