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point of note about solde r a b ility of lead free p r od uct s (att a c h ?g ? to p a cka ge na me) tes t paramete r test condition note use of sn-63pb solder bath solder bath temp erature = 230 c, dipping time = 5 seconds the numbe r of ti mes = one, use of r-t y pe flux solder ability use of sn-3.0ag - 0 .5cu solder bat h solder bath temp erature = 245 c, dipping time = 5 seconds the numbe r of ti mes = one, use of r-t y pe flux (us e of lead free ) pass: solder ability r a te until for m ing 95% |
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