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microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 1 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products description the lx1993 is a high efficiency step-up boost converter that features a psuedo-hysteretic pulse frequency modulation topology for driving white or color leds in backlight or frontlight systems. designed for maximum efficiency, reduced board size, and minimal cost, the lx1993 is ideal for pda and digital camera applications. the lx1993 features an internal n-channel mosfet and control circuitry that is optimized for portable system design applications. the lx1993 promotes improved performance in battery-operated systems by operating with a quiescent supply current 70a (typical) and a shutdown current of less than 1a. the input voltage range is from 1.6v to 6.0v thus allowing for a broad selection of battery voltage applications and start-up is guaranteed at 1.6v input. the lx1993 is capable of switching currents in excess of 300ma and the output current is readily programmed using one external current sense resistor in series with the leds. this configuration provides a feedback signal to the fb pin thus maintaining constant output current regardless of varying led forward voltage (v f ). the lx1993 provides an additional feature for simple dynamic adjustment of the output current (i.e., up to 100% of the maximum programmed current). designers can make this adjustment by generating an analog reference signal or a pwm signal applied directly to the adj pin and any pwm amplitude is readily accommodated via a single external resistor. the lx1993 is available in the 8-pin msop and thus requires a very small pcb area. important: for the most current data, consult microsemi ?s website: http://www.microsemi.com key features > 80% maximum efficiency 70a typical quiescent supply current externally programmable peak inductor current limit for maximum efficiency logic controlled shutdown < 1a shutdown current dynamic output current adjustment via analog reference or direct pwm input 8-pin msop package applications pagers wireless phones pdas handheld computers led driver digital camera displays product highlight lx1993 gnd fb cs sw shdn in adj out on off li-ion package order info t a ( c) du plastic msop 8-pin 0 to 70 lx1993cdu note: available in tape & reel. append the letter ?t? to the part number. (i.e. lx1993cdut) l l x x 1 1 9 9 9 9 3 3
microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 2 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products absolute maximum ratings supply voltage (v in )........................................................................ -0.3v to 7.0v feedback input voltage (v fb ) ................................................ -0.3v to v in + 0.3v shutdown input voltage (v shdn )........................................... -0.3v to v in + 0.3v adjust input voltage (v adj ) .................................................... -0.3v to v in +0.3v output voltage (v out ) ...................................................................... -0.3v to 25v switch voltage (v sw )........................................................ -0.3v to (v out + 1.0v) switch current (i sw )............................................................................. 500marms operating junction temperature ..................................................................150 c storage temperat ure range .......................................................... -65 c to 150 c lead temperature (soldering 180 seconds) .................................................235 c note: exceeding these ratings could cause damage to the device. all voltages are with respect to ground. currents are positive into, negative out of specified terminal . thermal data du plastic msop 8-pin thermal resistance - junction to a mbient , ja 206 c/w thermal resistance - junction to c ase , jc 39 c/w junction temperature calculation: t j = t a + (p d x jc ). the ja numbers are guidelines for the therma l performance of the device/pc-board system. all of the above assume no ambient airflow. package pin out 1 2 4 3 5 6 8 7 sw fb in gnd out cs adj du p ackage (top view) shdn front marking ? pin 1 indicator functional pin description n ame d escription in unregulated ic supply voltage i nput ? input range from +1.6v to +6.0v. bypass with a 1 f or greater capacitor for low voltage operation. fb feedback input ? connect to a current sense resistor between the load and gnd to set the maximum output current. shdn active-low shutdown input ? a logic low shuts down the device and reduces the supply current to <1 a. connect shdn to v cc for normal operation. sw inductor switching connection ? internally connected to the drain of a 28v n-channel mosfet. sw is high impedance in shutdown. cs current-sense amplifier input ? connecting a resistor bet ween cs and gnd sets the peak inductor current limit. gnd common terminal for ground reference. adj output current adjustment input ? prov ides the internal reference for the output current feedback. the signal input can be either a pwm signal or analog voltage allowi ng a dynamic output current adjustment. the signal should typically range from 500mv to gnd, but is capable of an input up to v in . caution should be used not to exceed the device output current rating. out output current - adjustable up to 25m a. load voltage should not exceed 25v. p p a a c c k k a a g g e e d d a a t t a a 1993 c ? msc
microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 3 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products electrical characteristics unless otherwise specified, the following specificati ons apply over the operat ing ambient temperature 0 c t a 70 c except where otherwise noted and the following test conditions: v in = 3v, v fb = 0.3v, v adj = 0.2v and sw pin has +5v through 39.2 ? , shdn = v in and cs = gnd. lx1993 parameter symbol test conditions min typ max units ` operating voltage v in 1.6 6.0 v minimum start-up voltage v su t a = +25 c 1.6 v start-up voltage temperature coefficient k vst guaranteed; not tested -2 mv/ c not switching 70 100 a quiescent current i q v shdn < 0.4v 0.2 0.5 a fb threshold voltage v fb 275 300 325 mv fb input bias current i fb switching v adj = 0.4v -100 100 na adj input voltage range v adj 0.0 v in v adj input bias current i adj v adj < 0.3v -150 50 na shutdown input bias current i shdn v shdn = 0v -100 100 na shutdown high input voltage v shdn 1.6 v shutdown low input voltage v shdn 0.4 v current sense bias current i cs 3 5 7 a minimum peak current i min r cs = 0 ? 85 155 ma internal nfet on-resistance r ds(on) t a = +25 c; i sw = 10ma; v fb = 1v 1.1 ? switch pin leakage current i leak v sw = 25v 0.23 a maximum switch off-time t off v fb = 1v 100 300 500 ns diode forward voltage v f t a = +25 c; i f = 150ma 1.0 v diode reverse current i r t a = +25 c; v r = 25v 1.5 a simplified block diagram control logic reference logic adj fb shutdown logic shdn cs driver gnd sw in 4 a out 2.5m ? 50pf a1 a2 e e l l e e c c t t r r i i c c a a l l s s
microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 4 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products application circuits typical led driver applications c 1 1 f l 1 47 h 1206 case size lx1993 gnd fb cs sw shdn in adj out r set 15? v bat = 1.6v to 6.0v on off v f = 3.6v typ. i led = 20ma to 0ma r cs 1 k ? figure 1 ? led driver with full-range dimming via pwm input c 1 1 f l 1 47 h 1206 case size lx1993 gnd fb cs sw shdn in adj out r set 15? v bat = 1.6v to 6.0v on off v f = 3.6v typ. i led = 20ma to 0ma r cs 1 k ? v adj = 0.3v to 0.0v + - figure 2 ? led driver with full-range dimming via analog voltage input note: the component values shown are only examples for a wo rking system. actual values will vary greatly depending on desired parameters, efficiency, and layout constraints. a a p p p p l l i i c c a a t t i i o o n n s s
microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 5 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products application information o perating t heory the lx1993 is a pfm boost converter that is optimized for driving a string of series connected leds. it operates in a pseudo-hysteretic mode with a fixed switch ?off time? of 300ns. conver ter switching is enabled as led current decreases causing the voltage across r set to decrease to a value less than th e voltage at the vadj pin. when the voltage across r set (i.e., v fb ) is less than vadj, comparator a1 activates the control logic. the control logic activates the drv output circuit that connects to the gate of the internal fet. the output (i.e., sw) is switched ?on? (and remains ?on?) until the inductor current ramps up to the peak current level. this current level is set via the external r cs resistor and monitored through the cs input by comparator a2. the led load is powered from energy stored in the output capacitor during the inductor charging cycle. once the peak inductor current valu e is achieved, the output is turned off (off-time is typically 300ns) allowing a portion of the energy stored in the inductor to be delivered to the load (e.g., see figure 6, channel 2). this causes the output voltage to continue to rise across r set at the input to the feedback circuit. the lx1993 continues to switch until the voltage at the fb pin exceeds the control voltage at the adj pin. the value of r set is established by dividing the maximum adjust voltage by the maximum series led current. a minimum value of 15 ? is recommended for r set . the voltage at the fb pin is the product of i out (i.e., the current through the led chain) and r set . ? ? ? ? ? ? = ledmax adjmax set i v r the application of an exte rnal voltage source at the adj pin provides for output current adjustment over the entire dimming range and the designer can select one of two possible methods. the first option is to connect a pwm logic signal to the adj pi n (e.g., see figure 1). the lx1993 includes an internal 50pf capacitor to ground that works with an external resistor to create a low-pass filter (i.e., filter out the ac co mponent of a pulse width modulated input of f pwm 100khz). the second option is to adjust the reference voltage directly at the adj pin by applying a dc voltage from 0.0 to 0.3v (e.g., see figure 2). the adjustment voltage level is selectable (with limited accuracy) by implementing the voltage divider created between the external series resistor and the internal 2.5m ? resistor. disabling the lx1993 is achieved by driving the shdn pin with a low-level logic signal thus reducing the device power consumption to approximately 0.5 a (typ). i nductor s election and o utput c urrent l imit p rogramming setting the level of peak inductor current to approximately 2x the expected maximum dc input current will minimize the inductor size, the input ripple current, and the output ripple voltage. the designer is encouraged to use inductors that will not saturate at the peak inductor current level. an inductor value of 47 h is recommended. choosing a lower value emphasizes peak current overshoot while choosing a higher value emphasizes output ripple voltage. the peak switch current is defined using a resistor placed between the cs terminal and ground and the i peak equation is: cs ics cs d in min peak r r i t l v i i ? ? ? ? ? ? ? ? ? ? ? ? + + = the maximum i peak value is limited by the i sw value (max. = 500ma rms). the minimum i peak value is defined when r cs is zero. the value range for parameters i min and i cs are provided in the e lectrical c haracteristics section of this data sheet. the parameter t d is related to internal operation of the de vice. a typical value at 25 o c is 800ns. r ics is the internal current se nse resistor connected to the src pin. a typical value at 25 o c is 200m ? . all of these parameters have an effect on the final i peak value. d esign e xample : determine i peak where v in equals 3.0v and r cs equals 4.02k ? using nominal values for all other parameters. ( ) ( ) ? ? + + = k 02 . 4 200m a 0 . 5 800ns h 47 3.0v ma 120 i peak the result of this example yields a nominal i peak of approximately 272ma. o utput r ipple and c apacitor s election output voltage ripple is a function of the inductor value (l), the output capacitor value (c out ), the peak switch current setting (i peak ), the load current (i out ), the input voltage (v in ) and the output voltage (v out ) for a this boost converter regulation scheme. when the switch is first turned on, the peak-to-peak voltage ripple is a function of the output droop (as the inductor current charges to i peak ), the feedback transition error (i.e., typically 10mv), and the output overshoot (when the stored energy in the inductor is delivered to the load at the end of the charging cycle). therefore the total ripple voltage is v ripple = ? v droop + ? v overshoot + 10mv the initial droop can be estimated as follows where the 0.5v value in the denominator is an estimate of the voltage drop a a p p p p l l i i c c a a t t i i o o n n s s
microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 6 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products application information across the inductor and the fet rds_on : () () 0.5 v i i c l ? v in out pk out droop ? = ? ? ? ? ? ? ? ? the output overshoot can be esti mated as follows where the 0.5 value in the denominator is an estimate of the voltage drop across the diode: () () in out 2 out pk out 2 1 overshoot v 0.5 v i i c l ? v ? + ? ? ? ? ? ? ? ? ? = d esign e xample : determine the v ripple where i pk equals 200ma, i out equals 13.0ma, l equals 47 h, c out equals 4.7 f, v in equals 3.0v, and v out equals 13.0v: () () mv 0 . 2 0.5 13.0 ma 8 . 2 1 200ma f 4.7 h 47 ? v droop ? ? ? ? ? ? ? ? ? ? = () () mv 4 . 18 0 . 3 0.5 0 . 13 ma 8 . 12 ma 200 f 4.7 h 47 ? v 2 2 1 overshoot ? ? + ? ? ? ? ? ? ? ? ? = therefore , v ripple = ? 2.0mv + 18.4mv + 10mv = 30.4mv d iode s election a schottky diode is recommended for most applications (e.g., microsemi ups5817). the low forward voltage drop and fast recovery time associat ed with this device supports the switching demands associated with this circuit topology. the designer is en couraged to consider the diode?s average and peak curren t ratings with respect to the application?s output and peak inductor current requirements. further, the diode?s reverse breakdown voltage characteristic must be capable of withstanding a negative voltage transition that is greater than v out . pcb l ayout the lx1993 produces high slew-rate voltage and current waveforms hence; the designer should take this into consideration when laying out the circuit. minimizing trace lengths from the ic to the inductor, diode, input and output capacitors, and feedback connection (i.e., pin 3) are typical considerations. moreover, the designer should maximize the dc input and output trace widths to accommodate peak current levels associated with this topology. e valuation b oard the lxe1993 evaluation board is available from microsemi for assessing overall circuit performance. the evaluation board, shown in figure 3, is 3 by 3 inches (i.e., 7.6 by 7.6cm) square and programmed to drive 2 to 4 leds (provided). designers can easily modify circuit parameters to suit their particular application by replacing r cs (as described in this section) r set (i.e., r4) and led load. moreover, the inductor, fet, and switching diode are easily swapped out to promote design verification of a circuit that maximizes efficiency and minimizes cost for a specific application. the evaluation board input and output connections are described in table 1. the dc input voltage is applied to vbat (not vcc) however the lx1993 ic may be driven from a separate dc source via the vcc input. the output current (i.e., led brightness) is controlled by adjusting the on-board potentiometer. the designer may elect to drive the brightness adjustment circuit from vbat or via a separate voltage source by selecting the appropriate jumper position (see table 2). optional external adjustment of the output led current is achieved by disengaging the potentiometer and applying either a dc volt age or a pwm-type signal to the vadj input. the pwm signal frequency should be higher than 150khz and contain a dc component less than 350mv. the lx1993 exhibits a low quiescent current (i q < 0.5 a: typ) during shutdown mode. the shdn pin is used to exercise the shutdown function on the evaluation board. this pin is pulled-up to vcc via a 10k ? resistor. grounding the shdn pin shuts down the ic (not the circuit output). the output voltage (i.e., voltage across the led string) is readily measured at the vout terminal and led current is derived from measuring the voltage at the vfdbk pin and dividing this value by 15 ? (i.e., r4). the factory installed component list for this must-have design tool is provided in table 3 and the schematic is shown in figure 4. efficiency measurement hint : when doing an efficiency evaluation using the lx1993 evaluation board, vpot should be driven by a separate voltage supply to account for losses associated w ith the onboard reference (i.e., the 1.25v shunt regulator and 1k ? resistor). this circuit will have vbat - 1.25v across it and at the higher input voltages the 1k ? resistor could have as much as 4ma through it. this shunt regulator circuitry will adversely effect the overall efficiency measuremen t. it is not normally used in an application; hence, it should not be co nsidered when measuring efficiency. a a p p p p l l i i c c a a t t i i o o n n s s
microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 7 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products application information (continued) figure 3: lxe1993 engineering evaluation board table 1: input and ouput pin assignments pin name allowable range description vbat 0 to 6v main power supply for output. (set external current limit to 0.5a) vcc 1.6v to 6v lx1993 power. may be strapped to vbat or use a separate supply if vcc jumper is in the sep position. do not power output from vcc pin on board.. vpot 1.6v to 6v potentiometer power. may be strapped to vbat or use a separate supply if vpot jumper is in the sep position. do not power output from vpot pin on board. vadj in 0 to 350mv apply a dc voltage or a pwm voltage to this pin to adjust the led current. pwm inputs should be greater than 120hz and dc portion less than 350mv. /shdn 0 to vcc pulled up to vcc on board (10k ? ), ground to inhibit the lx1992. vout 0 to 18v power supply output voltage that is applied to led string. vfdbk 0 to 400mv sense resistor voltage. divi de this voltage by 15 to determine led current. table 2: jumper pin position assignments jumper position functional description vcc/ bat use this position when powering vbat and vcc from the same supply. do not connect power to the vcc input when using this jumper position. vcc/ sep use this position when using a sepa rate vcc supply (different from vbat). vpot/ vbat use this position when powering the potentiometer refer ence circuit from the vbat supply. do not connect power to the vcc input when using this jumper position. vpot/ sep use this position when using a separate power supply (different from vbat) to power the potentiometer reference circuit. this will lower the vbat current a nd provide a more accurate efficiency reading for the lx1993 circuit. adj/ pot use this position when using the potentiometer to adjust led current. adj/ ext use this position when adjusting the le d current with an external pwm that has a repetition rate >120hz. or when using a dc adjustment voltage. led# off use this position to s hort out led # 3 and / or led # 4. note: always put jumpers in one of the two possible positions a a p p p p l l i i c c a a t t i i o o n n s s
microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 8 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products application information (continued) table 3: factory installed component list for the lx1993 evaluation board quantity part reference description manufacturer part number 1 cr1 rectifier, schottky, 1a, 20v, powermite type smt microsemi ups5817 1 l1 inductor, 47uh, 540ma, smt toko a920cy-470 2 c1, c2 capacitor, ceramic x5r, 4.7uf, 25v, 1210 type smt taiyo yuden cetmk325bj475mn 2 c3, c4 capacitor, ceramic x7r, 0.1uf, 50v, 0805 type smt murata grm40x7r104m050 1 r4 resistor, 15 ohm, 1/10w, 0805 type smt panasonic erj6enf15r0 1 r3 resistor, 590k, 1/16w, 0603 type smt panasonic erj3ekf5903 1 r2 resistor, 100, 1/16w, 0603 type smt panasonic erj3ekf1000 2 r6, r8 resistor, 100k, 1/16w, 0603 type smt panasonic erj3ekf1003 1 r1, r5 resistor, 10k, 1/16w, 0603 type smt panasonic erj3ekf1002 1 r7 trimpot, 50k, 1/2w, through hole type bourns 3352e-1-503 1 vr1 ic, voltage reference, 1.25 volts, sot23 type smt microsemi lx432csc 1 vr2 diode, zener, 20v, 1w powermite type smt microsemi 1pmt4114 4 led1 - 4 white led chicago miniature cmd333uwc 5 jb1 - jb3 header, 3 pos vertical type 3m 929647-09-36 5 jumper 3m 929955-06 note : the minimum set of parts needed to build a working power suppl y are: cr1, l1, c1, c2, r2, r4, u1. evaluation board p/l subje ct to change without notice. vbat vadj vcc vpot gnd vcc shdn vadj vpot c1 4.7f 25v l1 47h cr1 ups5817 c2 4.7f 25v vr2 20v 1w 1pmt4114 cmd333uwc cmd333uwc cmd333uwc cmd333uwc vout vfdbk r1 10k c3 0.1f 50v r3 590k c4 4.7f 25v r5 10k r6 100k r7 50k vr1 lx432 r4 15 ? out gnd adj cs fb sw in shdn r2 100 ? r8 100k led4 led3 on off figure 4 ? lxe1993 boost evaluation board schematic a a p p p p l l i i c c a a t t i i o o n n s s
microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 9 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products characteristic curves 19 0 215 240 265 290 315 340 365 0 1000 2000 3000 4000 r cs (ohms) i peak (ma) figure 5: example of peak current versus r cs value conditions: v in = 2.5v ( bottom ), 3.3v ( middle ) & 4.5v ( top ) @ t a = 25 o c figure 6: v out and inductor current waveforms. channel 1: v out (ac coupled; 100mv/div) channel 2: inductor current (100ma/div.) 4 led configuration: v in = 3.0v 50 % 55% 60% 65% 70 % 75% 80% 85% 1 6 11 16 led current (ma) efficiency figure 7: efficiency vs. led output current. 2 led configuration: v in = 3.5v, l = 47 h, r cs = 100 ? note: data taken from lxe1993 evaluation board 50 % 55% 60% 65% 70 % 75% 80% 85% 90% 1 6 11 16 2 1 led current (ma) efficiency figure 8: efficiency vs. led output current. 2 led configuration: v in = 5.0v, l = 47 h, r cs = 100 ? note: data taken from lxe1993 evaluation board 50 % 60% 70 % 80% 90% 10 0 % 05101520 led current (ma) efficiency figure 9: efficiency vs. led output current. 4 led configuration: v in = 3.5v, l = 47 h, r cs = 100 ? note: data taken from lxe1993 evaluation board 50 % 60% 70 % 80% 90% 10 0 % 05101520 led current (ma) efficiency figure 10: efficiency vs. led output current. 4 led configuration: v in = 5.0v, l = 47 h, r cs = 100 ? note: data taken from lxe1993 evaluation board c c h h a a r r t t s s
microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 10 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products characteristic curves 1. 0 0 1. 10 1. 2 0 1. 3 0 1. 4 0 0255075 temperature o c rds_on (ohms) figure 11: r ds(on) vs. temperature condition: v in = 3.0v; i sw = 10ma; t a = 25 o c 0.80 0.90 1. 0 0 1. 10 0255075 temperature o c rds_on (ohms) figure 12: r ds(on) vs. temperature condition: v in = 5.0v; i sw = 10ma; t a = 25 o c 12 5 . 0 0 13 0 . 0 0 13 5 . 0 0 14 0 . 0 0 14 5 . 0 0 0255075 temperature o c i min (ma) figure 13: i min versus temperature. condition: v in = 3.0v 3.00 4.00 5.0 0 6.00 7.0 0 0255075 temperature o c i cs ( a) figure 14: i cs versus temperature. condition: v in = 3.0v c c h h a a r r t t s s
microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 11 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products package dimensions du 8-pin miniature shrink outline package (msop) n l p k m b d g h c a m illimeters i nches dim min max min max a 2.85 3.05 .112 .120 b 2.90 3.10 .114 .122 c ? 1.10 ? 0.043 d 0.25 0.40 0.009 0.160 g 0.65 bsc 0.025 bsc h 0.38 0.64 0.015 0.025 j 0.13 0.18 0.005 0.007 k 0.95 bsc 0.037 bsc l 0.40 0.70 0.016 0.027 m 3 3 n 0.05 0.15 0.002 0.006 p 4.75 5.05 0.187 0.198 note: dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm( 0.006?) on any side. lead dimension shall not include solder coverage. m m e e c c h h a a n n i i c c a a l l s s
microsemi integrated products division 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 page 12 copyright ? 2000 rev. 1.0x , 2002-03-28 www. microsemi . com lx1993 hi g h efficienc y led driver p reliminary d a ta s heet integrated products notes preliminary data ? information contained in this document is proprietary to microsemi and is current as of publication date. this document may not be modified in any way without the express written consent of microsemi. product processing does not necessarily include testing of all parameters. microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. n n o o t t e e s s

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