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rf & protection devices data sheet revision 3.8, 2010-12-23 BGA735N16 high linearity tri-band lte/umts lna (2600/2300/2100, 1900 /1800, 900/800/700 mhz)
edition 2010-12-23 published by infineon technologies ag 81726 munich, germany ? 2010 infineon technologies ag all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infine on technologies hereby disclaims any and all warranties and liabilities of any kind, including witho ut limitation, warranties of non-infrin gement of intellectua l property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies compon ents may be used in life-su pport devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that de vice or system. life support devices or systems are intended to be implanted in the hu man body or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGA735N16 high linearity tri-band lte/umts lna data sheet 3 revision 3.8, 2010-12-23 trademarks of infineon technologies ag aurix?, bluemoon?, c166?, ca npak?, cipos?, cipurse?, comn eon?, econopack?, coolmos?, coolset?, corecontrol?, crossave?, dave?, easypim?, econobri dge?, econodual?, econopim?, eicedriver?, eupec?, fcos?, hitfe t?, hybridpack?, i2rf?, isoface?, isopack?, mipaq?, modstack?, my-d?, novalithic?, omnitune?, optimos?, origa?, primarion?, primepack?, primestack?, pr o-sil?, profet?, rasic?, re versave?, satric?, sieget?, sindrion?, sipmos?, smarti?, smartlew is?, solid flash?, tempfet?, thinq!?, trenchstop?, tricore?, x-go ld?, x-pmu?, xmm?, xposys?. other trademarks advance design system? (ads) of agilent te chnologies, amba?, arm?, multi-ice?, keil?, primecell?, realview?, thumb?, vision? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvc o, llc (visa holdings in c.). epcos? of epcos ag. flexgo? of microsoft corp oration. flexray? is licensed by flexray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrot echnique internationale. irda? of infrared data association corporation. iso? of international organization for standardization. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. microtec?, nucleus? of mentor graphics corporation. mifare? of nx p. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave offi ce? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. open wave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of sirius sate llite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of sy mbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. t ektronix? of tektroni x inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilog?, palladium? of cadence design systems, inc. vlynq? of texas instruments inco rporated. vxworks?, wind river? of wind river systems, inc. zetex? of diodes zetex limited. last trademarks update 2010-10-26 BGA735N16 high linearity tri-band lte/umts lna (2600/2300/2100, 1900/18 00, 900/800/700 mhz) revision history: 2010-12-23, revision 3.8 previous revision: 2010-09-06, revision 3.7 page subjects (major cha nges since last revision) 13-14 added lte bands 12, 13, 14, 17 21-22 added lte bands 38, 40 BGA735N16 high linearity tri-band lte/umts lna table of contents data sheet 4 revision 3.8, 2010-12-23 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 list of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2 thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 esd integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.5 band select / gain control truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.6 supply current characteristics; t a = 25 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.7 logic signal characteristics; t a = 25 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.8 switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.9 measured rf characteristics umts bands 12 / 17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 2.10 measured rf characteristics umts bands 13 / 14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.11 measured rf characteristics umts band 20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.12 measured rf characteristics umts bands 5 / 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.13 measured rf characteristics umts band 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.14 measured rf characteristics umts bands 3 / 9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.15 measured rf characteristics umts band 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.16 measured rf characteristics umts bands 1 / 4 / 10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.17 measured rf characteristics umts band 40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.18 measured rf characteristics umts band 38 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.19 measured rf characteristics umts band 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3 application circuit and block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.1 umts bands 1, 2, 4, 5, 6 and 10 application circuit schema tic . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.2 umts bands 3, 7, 8, 9 and 38 application circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.3 umts bands 2, 12, 13, 14, 17 and 40 application circuit sc hematic . . . . . . . . . . . . . . . . . . . . . . . . 26 3.4 umts bands 1, 2, 4, 10 and 20 application circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.5 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.6 application board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4 physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4.1 package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4.2 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 table of contents BGA735N16 high linearity tri-band lte/umts lna list of figures data sheet 5 revision 3.8, 2010-12-23 figure 1 block diagram of tri-band lna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 2 application circuit with chip outlin e (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 figure 3 application circuit with chip outlin e (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 figure 4 application circuit with chip outlin e (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 figure 5 application circuit with chip outlin e (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 figure 6 application board layout on 3-layer fr4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 figure 7 cross-section view of application board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 figure 8 detail of application board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 figure 9 recommended footprint and stencil layout for the tsnp-16-1 package . . . . . . . . . . . . . . . . . . 31 figure 10 package outline (top, side and bott om view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 list of figures BGA735N16 high linearity tri-band lte/umts lna list of tables data sheet 6 revision 3.8, 2010-12-23 table 1 absolute maximum ra tings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 2 thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 3 esd integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 4 dc characteristics, t a =-30 ... 85 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 5 band select truth table, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 6 gain control truth table, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 7 typical switching times; t a = -30 ... 85 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 8 typical characteristics 700 mhz band, t a =25c, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 9 typical characteristics 700 mhz band, t a =25c, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 10 typical characteristics 800 mhz band, t a =25c, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 11 typical characteristics 800 mhz band, t a =25c, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 12 typical characteristics 900 mhz band, t a =25c, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 13 typical characteristics 1800 mhz band, t a =25c, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . 18 table 14 typical characteristics 1900 mhz band, t a =25c, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . 19 table 15 typical characteristics 2100 mhz band, t a =25c, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . 20 table 16 typical characteristics 2300 mhz band, t a =25c, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . 21 table 17 typical characteristics 2600 mhz band, t a =25c, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . 22 table 18 typical characteristics 2600 mhz band, t a =25c, v cc = 2.8 v . . . . . . . . . . . . . . . . . . . . . . . . 23 table 19 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 20 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 21 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table 22 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 23 pin definition and function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 list of tables product name package chip marking BGA735N16 tsnp-16-1 t1530 bga735 high linearity tri-band lte / u m t s l n a (2600/2300/2100, 1900/1800, 900/800/700 mhz) BGA735N16 data sheet 7 revision 3.8, 2010-12-23 1 features main features: ? gain: 16 (17) / -7.5 db in high / low gain mode (all bands) ? noise figure: 1.1 / 1.1 / 1.1 db in high gain mode (800 mhz / 1900 mhz / 2100 mhz) ? supply current: 3.4 (4.0) / 0.65 ma in high / low gain mode (all bands) ? standby mode (< 2 a typ.) ? output internally matched to 50 ? ? inputs pre-matched to 50 ? ? 2kv hbm esd protection ? low external component count ? small leadless tsnp-16-1 package (2.3 x 2.3 x 0.39 mm) ? pb-free (rohs compliant) package description the BGA735N16 is a highly flexible, high linearity tri-band (2600/2300/2100, 1900/1800, 900/800/700 mhz) low noise amplifier mmic for worldwide use. based on infineon?s proprietary and cost-effective sige:c technology, the BGA735N16 uses an advanced biasing conc ept in order to achieve high linearity. the device features dynamic gain co ntrol, temperature stabilization, standby mode, and 2 kv esd protection on- chip as well as matching off chip. because the matchi ng is off chip, different lte/umts bands can be easily applied. for example, the 1900 mhz path can be conver ted into a 2100 mhz path and vice versa by optimizing the input and output matching network. note: lte/umts bands 1/ 2/ 5 is the standard band combin ation for this product requiring no external output matching network. BGA735N16 high linearity tri-band lte/umts lna features data sheet 8 revision 3.8, 2010-12-23 figure 1 block diagram of tri-band lna % * $ 1 b & |