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  pc352 pc352 package specifications outline dimensions (unit : mm) opaque * , mini-flat package, high resistance to noise type photocoupler 1. programmable controllers features applications 1. opaque type, mini-flat package pc352 (1-channel) 2. high resistance to noise due to high common mode rejection voltage (v cm : typ. 1.5kv) 3. subminiature type (the volume is smaller than that of our conventional dip type by as far as 30%.) 4. isolatin voltage between input and output pc352 ?iso(rms) : 3.75kv 5. recognized by ul, file no. e64380 * employs double transfer mold technology model no. package specification PC352N PC352Nt taping reel diameter 178mm (750 pcs) taping reel diameter 370mm (3 000 pcs) absolute maximum ratings 0.2mm or more soldering area notice in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occ ur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. internet internet address for electronic components group http://www.sharp.co.jp/ecg/ parameter symbol rating unit input forward current 50 1 ma a 6 v output 70 150 mw mw 170 mw 35 6 v v 50 ma ? 30 to + 100 ? c storage temperature ? 40 to + 125 ? c 260 ? c operating temperature reverse voltage peak forward current power dissipation collector-emitter voltage emitter-collector voltage collector current collector dissipation i f v r i fm p v ceo v eco i c p c t stg t opr p tot (ta=25 ? c) soldering temperature t sol 3.75 kv isolation voltage v iso (rms) *1 *1 *1 *1 *1 *3 *4 *2 *1 the derating factors of absolute maximum ratings due to ambient temperature are shown in fig.2 to 5 *2 pulse width 100 s, duty ratio:0.01, refer to fig.6 *3 ac for 1min., 40 to 60% rh, f=60hz *4 for 10s total power dissipation 3 5 2 4 3 1 2 1 2 4 3 4.4 0.2 5.3 0.3 2.6 0.2 0.1 0.1 3.6 0.3 2.54 0.25 0.4 0.1 0.5 + 0.4 ? 0.2 7.0 + 0.2 ? 0.7 anode mark epoxy resin 45 6 internal connection diagram 0.2 0.05 1 2 3 4 anode anode cathode emitter collector
pc352 electro-optical characteristics parameter conditions input forward voltage i f = 20ma v r = 4v terminal capacitance output collector-emitter i c = 0.1ma, i f = 0 emitter-collector i e = 10 a, i f = 0 i f = 0, r l = 470 ? vnp = 100mv v cm =1.5kv(peak) transfer charac- teristics collector current i f = 5ma, v ce = 5v collector-emitter saturation voltage i f = 20ma, i c = 1ma isolation resistance dc500v 40 to 60%rh floating capacitance cut-off frequency common mode rejection voltage v = 0, f = 1mhz response time rise time fall time min. ? ?? ? ? 35 6 4.5 ? 5 10 10 ? ? ? typ. 1.2 30 ? ? ? ? 0.1 1 10 11 0.6 4 5 max. 1.4 10 200 100 ? ? 24 0.2 ? 1.0 15 80 ? 18 20 collector dark current breakdown voltage breakdown voltage symbol v f i r c t i ceo bv ceo bv eco i c v ce(sat) c f f c t r t f r iso cmr v = 0, f = 1khz unit v na a v v ma 10 ? ? kv/ s v ? pf pf s s v ce = 2v, i c = 2ma r l = 100 ? v ce = 5v, i c = 2ma r l = 100 ? , ? 3db (ta = 25 ? c) v ce = 20v, i f = 0 reverse current *5 refer to fig.1 *5 fig.1 test circuit for common mode rejection voltage v cm v cp v np v o (dv/d t ) 1) r l v np v cc v cm 1) v cp : voltage which is generated by displacement current in floating capacitance between primary and secondary side. (v cp nearly = dv/d t c f r l ) v cm : high wave pulse r l = 470 ? v cc = 9v ? ? ? ? ?
pc352 forward voltage v f (v) 50 ? c 25 ? c 0 ? c 0 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 5 10 20 50 100 200 500 1 ? 25 ? c ta = 75 ? c forward current i f (ma) peak forward current i fm (ma) 10 20 50 100 200 2000 500 1000 52 10 ? 3 52 10 ? 2 52 10 ? 2 5 1 duty ratio pulse width 100 s t a = 25 c total power dissipation p tot (mw) 0 50 100 150 200 250 170 ? 30 0 25 50 75 100 125 ambient temperature t a ( c) fig.5 total power dissipation vs. ambient temperature collector power dissipation p c (mw) 0 50 100 150 200 250 ? 30 0 25 50 75 100 125 ambient temperature t a ( c) fig.4 collector power dissipation vs. ambient temperature fig.7 forward current vs. forward voltage fig.6 peak forward current vs. duty ratio forward current i f (ma) 0 10 20 30 40 50 ? 30 0 25 75 100 125 55 50 ambient temperature t a ( c) 0 20 40 60 70 80 100 ? 30 0 25 75 100 125 55 50 ambient temperature t a ( c) diode power dissipation p (mw) fig.2 forward current vs. ambient temperature fig.3 diode power dissipation vs. ambient temperature
pc352 relative current transfer ratio (%) ambient temperature t a ( c) 100 0 50 150 0255075 ? 30 100 125 i f =5ma v ce =5v response time ( s) load resistance r l (k ? ) 0.2 0.1 0.5 1 2 5 10 20 0.01 0.1 1 10 50 50 100 200 500 v ce =2v i c =2ma t a =25 ? c t f t r t d t s collector-emitter saturation voltage v ce (sat) (v) ambient temperaturet t a ( c) 0 ? 30 0.02 0 20406080100 0.04 0.06 0.08 0.10 0.12 0.14 0.16 i f =20ma i c =1ma collector dark current i ceo (a) ambient temperature t a ( c) 20 0 40 60 80 100 ? 30 v ce =20v 120 140 10 ? 7 10 ? 6 10 ? 8 10 10 10 10 ? 9 ? 10 ? 11 ? 12 fig.10 relative current transfer ratio vs. ambient temperature fig.11 collector-emitter saturation voltage vs. ambient temperature fig.13 response time vs. load resistance fig.12 collector dark current vs. ambient temperature current transfer ratio ctr (%) forward current i f (ma) 0 1 500 2 5 10 20 50 400 300 200 100 v ce =5v t a =25 ? c collector current i c (ma) collector-emitter voltage v ce (v) 0 0 5 1 10 15 20 25 30 35 40 2345678910 20ma 10ma 5ma i f =30ma t a =25 ? c p c ( max. ) fig.8 current transfer ratio vs. forward current fig.9 collector current vs. collector-emitter voltage
pc352 fig.14 test circuit for response time forward current i f (ma) collector-emitter saturation voltage v ce (sat) (v) 0 0 2 4 6 8 246810 1ma 3ma 7 5 3 1 9 7 5 3 1 5ma 7ma t a =25 ? c i c =0.5ma fig.16 collector-emitter saturation voltage vs. forward current fig.17 reflow soldering voltage gain a v (db) frequency response f (khz) 0 0.5 1 2 5 200 100 50 20 10 500 100 ? 1k ? ? 5 ? 10 ? 15 ? 20 r l =10k ? v ce =5v i c =2ma t a =25 ? c fig.15 voltage gain vs frequency 10% input output input output 90% t s t d v cc r d r l t f t r 25 c 2min 230 c 200 c 180 c 1min 1min 1.5min 30s only one time soldering is recommended within the temperature profile shown below.
115 application circuits notice l the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. l contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. l observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii)measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii)sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). l contact a sharp representative in advance when intending to use sharp devices for any "specific" applications other than those recommended by sharp or when it is unclear which category mentioned above controls the intended use. l if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade control law of japan, it is necessary to obtain approval to export such sharp devices. l this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. l contact and consult with a sharp representative if there are any questions about the contents of this publication.


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