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1 1 1 1 1 white electronic designs corporation ? (602) 437-1520 www.whiteedc.com WEDPN4M64V-XBX november 2003 rev. 7 the 32mbyte (256mb) sdram is a high-speed cmos, dy- namic random-access ,memory using 4 chips containing 67,108,864 bits. each chip is internally configured as a quad- bank dram with a synchronous interface. each of the chip?s 16,777,216-bit banks is organized as 4,096 rows by 256 columns by 16 bits. read and write accesses to the sdram are burst oriented; accesses start at a selected location and continue for a pro- grammed number of locations in a programmed sequence. accesses begin with the registration of an active com- mand, which is then followed by a read or write com- mand. the address bits registered coincident with the ac- tive command are used to select the bank and row to be accessed (ba0, ba1 select the bank; a0-11 select the row). the address bits registered coincident with the read or write command are used to select the starting column lo- cation for the burst access. the sdram provides for programmable read or write burst lengths of 1, 2, 4 or 8 locations, or the full page, with a burst terminate option. an auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. the 256mb sdram uses an internal pipelined architecture to achieve high-speed operation. this architecture is com- patible with the 2 n rule of prefetch architectures, but it also allows the column address to be changed on every clock cycle to achieve a high-speed, fully random access. precharging one bank while accessing one of the other three banks will hide the precharge cycles and provide seam- less, high-speed, random-access operation. the 256mb sdram is designed to operate in 3.3v, low- power memory systems. an auto refresh mode is provided, along with a power-saving, power-down mode. 4mx64 synchronous dram 21 21 discrete approach s a v i n g s area 4 x 265mm 2 = 1061mm 2 441mm 2 58% actual size 22.3 11.9 54 tsop 54 tsop 54 tsop 54 tsop WEDPN4M64V-XBX features ! high frequency = 100, 125mhz ! package: 219 plastic ball grid array (pbga), 21 x 21mm ! single 3.3v 0.3v power supply ! fully synchronous; all signals registered on positive edge of system clock cycle ! internal pipelined operation; column address can be changed every clock cycle ! internal banks for hiding row access/precharge ! programmable burst length 1,2,4,8 or full page ! 4096 refresh cycles ! commercial, industrial and military temperature ranges ! organized as 4m x 64 user configurable as 2 x 4m x 32 or 4 x 4m x 16 ! weight: WEDPN4M64V-XBX - 2 grams typical ! 58% space savings ! reduced part count ! low profile: 2.20 mm (0.087) max ! reduced trace lengths for lower parasitic capacitance ! laminate interposer for optimum tce match ! suitable for hi-reliability applications ! upgradeable to 8m x 64 (contact factory for availability) benefits *this product is subject to change without notice. general description
2 2 2 2 2 white electronic designs corporation phoenix az (602) 437-1520 WEDPN4M64V-XBX f ig . 1 p in c onfiguration note: dnu = do not use t op v iew 1 2345678910111213141516 a b c d e f g h j k l m n p r t dq 1 dq 3 dq 6 dq 7 cas 0 cs 0 v ss v ss vss vss dq 56 dq 57 dq 60 dq 62 vss v ss dq 30 dq 28 dq 25 dq 24 clk 1 cke 1 v cc v cc cs 2 cas 2 dq 39 dq 38 dq 35 dq 33 v cc dq 0 dq 2 dq 4 dq 5 dqml 0 we 0 ras 0 v ss v ss cke 3 clk 3 dqmh 3 dq 58 dq 59 dq 61 dq 63 dq 31 dq 29 dq 27 dq 26 vss dqmh 1 vcc v cc v cc ras 2 we 2 dqml 2 dq 37 dq 36 dq 34 dq 32 dq 14 dq 12 dq 10 dq 8 v cc v cc v cc v cc v cc v cc v cc v cc dq 55 dq 53 dq 51 dq 49 dq 17 dq 19 dq 21 dq 23 v ss v ss v ss vss v ss v ss v ss v ss dq 40 dq 42 dq 44 dq 46 dq 15 dq 13 dq 11 dq 9 dqmh 0 clk 0 cke 0 v cc v cc cs 3 cas 3 we 3 dq 54 dq 52 dq 50 dq 48 dq 16 dq 18 dq 20 dq 22 dqml 1 we 1 cs 1 v ss v ss cke 2 clk 2 dqmh 2 dq 41 dq 43 dq 45 dq 47 v ss v ss v cc v cc vss vss vss v ss v ss vss ras 3 dqml 3 vcc v ss v cc v cc v cc v cc v ss v ss vss ras 1 cas 1 v cc v cc vcc vcc vss vss v cc v ss v ss a 9 a 0 a 2 dnu nc vcc vcc vcc vss vss a 8 a 1 a 3 dnu nc vss vss vss vcc vcc a 10 a 7 a 5 dnu ba 0 vcc vcc vcc vss vss a 11 a 6 a 4 dnu ba 1 vss vss vss vcc vcc v ss v ss v cc v cc vss vcc vcc v ss v cc v cc v cc v cc v ss v ss vss vss vss v cc v ss v ss
3 3 3 3 3 white electronic designs corporation (602) 437-1520 www.whiteedc.com WEDPN4M64V-XBX f ig . 2 f unctional b lock d iagram a 0-11 a 0-11 ba 0-1 ba 0-1 clk 0 clk cas dq 0 dq 15 cke 0 cke cs 0 cs dqml 0 dqml dqmh 0 dqmh ras 1 we 1 cas 1 ? dq 0 dq 15 we u1 ras a 0-11 ba 0-1 clk 1 clk cas dq 16 dq 31 ras 0 we 0 cas 0 dq 0 dq 15 we u0 ras cke 1 cke cs 1 cs dqml 1 dqml dqmh 1 dqmh ras 2 we 2 cas 2 dq 0 dq 15 we u2 ras a 0-11 ba 0-1 clk 2 clk cas dq 32 dq 47 cke 2 cke cs 2 cs dqml 2 dqml dqmh 2 dqmh ras 3 we 3 cas 3 dq 0 dq 15 we u3 ras a 0-11 ba 0-1 clk 3 clk cas dq 48 dq 63 cke 3 cke cs 3 cs dqml 3 dqml dqmh 3 dqmh 4m x 16 4m x 16 4m x 16 4m x 16
4 4 4 4 4 white electronic designs corporation phoenix az (602) 437-1520 WEDPN4M64V-XBX read and write accesses to the sdram are burst oriented; accesses start at a selected location and continue for a pro- grammed number of locations in a programmed sequence. accesses begin with the registration of an active com- mand which is then followed by a read or write com- mand. the address bits registered coincident with the ac- tive command are used to select the bank and row to be accessed (ba0 and ba1 select the bank, a0-11 select the row). the address bits (a0-7) registered coincident with the read or write command are used to select the start- ing column location for the burst access. prior to normal operation, the sdram must be initialized. the following sections provide detailed information cover- ing device initialization, register definition, command de- scriptions and device operation. sdrams must be powered up and initialized in a predefined manner. operational procedures other than those speci- fied may result in undefined operation. once power is ap- plied to vdd and vddq (simultaneously) and the clock is stable (stable clock is defined as a signal cycling within tim- ing constraints specified for the clock pin), the sdram re- quires a 100s delay prior to issuing any command other than a command inhibit or a nop. starting at some point during this 100s period and continuing at least through the end of this period, command inhibit or nop com- mands should be applied. once the 100s delay has been satisfied with at least one command inhibit or nop command having been applied, a precharge command should be applied. all banks must be precharged, thereby placing the device in the all banks idle state. once in the idle state, two auto refresh cycles must be performed. after the auto refresh cycles are complete, the sdram is ready for mode register programming. because the mode register will power up in an unknown state, it should be loaded prior to applying any operational command. the mode register is used to define the specific mode of operation of the sdram. this definition includes the selec- tion of a burst length, a burst type, a cas latency, an oper- ating mode and a write burst mode, as shown in figure 3. the mode register is programmed via the load mode reg- ister command and will retain the stored information until it is programmed again or the device loses power. mode register bits m0-m2 specify the burst length, m3 specifies the type of burst (sequential or interleaved), m4- m6 specify the cas latency, m7 and m8 specify the oper- ating mode, m9 specifies the write burst mode, and m10 and m11 are reserved for future use. the mode register must be loaded when all banks are idle, and the controller must wait the specified time before initi- ating the subsequent operation. violating either of these requirements will result in unspecified operation. read and write accesses to the sdram are burst oriented, with the burst length being programmable, as shown in fig- ure 3. the burst length determines the maximum number of column locations that can be accessed for a given read or write command. burst lengths of 1, 2, 4 or 8 locations are available for both the sequential and the interleaved burst types, and a full-page burst is available for the sequential type. the full-page burst is used in conjunction with the burst terminate command to generate arbitrary burst lengths. reserved states should not be used, as unknown opera- tion or incompatibility with future versions may result. when a read or write command is issued, a block of col- umns equal to the burst length is effectively selected. all accesses for that burst take place within this block, mean- ing that the burst will wrap within the block if a boundary is reached. the block is uniquely selected by a1-7 when the burst length is set to two; by a2-7 when the burst length is set to four; and by a3-7 when the burst length is set to eight. the remaining (least significant) address bit(s) is (are) used to select the starting location within the block. full- page bursts wrap within the page if the boundary is reached. functional description initialization register definition mode register burst length all inputs and outputs are lvttl compatible. sdrams offer substantial advances in dram operating performance, in- cluding the ability to synchronously burst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks in order to hide precharge time and the capability to randomly change col- umn addresses on each clock cycle during a burst access.
5 5 5 5 5 white electronic designs corporation (602) 437-1520 www.whiteedc.com WEDPN4M64V-XBX t able 1 - b urst d efinition burst starting column order of accesses within a burst length address a0 2 0 0-1 0-1 1 1-0 1-0 a1 a0 0 0 0-1-2-3 0-1-2-3 4 0 1 1-2-3-0 1-0-3-2 1 0 2-3-0-1 2-3-0-1 1 1 3-0-1-2 3-2-1-0 a2 a1 a0 0 0 0 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7 0 0 1 1-2-3-4-5-6-7-0 1-0-3-2-5-4-7-6 0 1 0 2-3-4-5-6-7-0-1 2-3-0-1-6-7-4-5 8 0 1 1 3-4-5-6-7-0-1-2 3-2-1-0-7-6-5-4 1 0 0 4-5-6-7-0-1-2-3 4-5-6-7-0-1-2-3 1 0 1 5-6-7-0-1-2-3-4 5-4-7-6-1-0-3-2 1 1 0 6-7-0-1-2-3-4-5 6-7-4-5-2-3-0-1 1 1 1 7-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0 full n = a0-9/8/7 cn, cn + 1, cn + 2 page cn + 3, cn + 4... not supported (y) (location 0-y) ?cn - 1, cn? type = sequential type = interleaved f ig . 3 m ode r egister d efinition m3 = 0 1 2 4 8 reserved reserved reserved full page m3 = 1 1 2 4 8 reserved reserved reserved reserved operating mode standard operation all other states reserved 0 - 0 - defined - 0 1 burst type sequential interleaved cas latency reserved reserved 2 3 reserved reserved reserved reserved burst length m0 0 1 0 1 0 1 0 1 burst length cas latency bt a 9 a 7 a 6 a 5 a 4 a 3 a 8 a 2 a 1 a 0 mode register (mx) address bus m1 0 0 1 1 0 0 1 1 m2 0 0 0 0 1 1 1 1 m3 m4 0 1 0 1 0 1 0 1 m5 0 0 1 1 0 0 1 1 m6 0 0 0 0 1 1 1 1 m6-m0 m8 m7 op mode a 10 a 11 reserved* wb 0 1 write burst mode programmed burst length single location access m9 *should program m11, m10 = 0, 0 to ensure compatibility with future devices. notes: 1. for full-page accesses: y = 256. 2. for a burst length of two, a1-7 select the block-of-two burst; a0 selects the starting column within the block. 3. for a burst length of four, a2-7 select the block-of-four burst; a0-1 select the starting column within the block. 4. for a burst length of eight, a3-7 select the block-of-eight burst; a0-2 select the starting column within the block. 5. for a full-page burst, the full row is selected and a0-7 select the starting column. 6. whenever a boundary of the block is reached within a given sequence above, the following access wraps within the block. 7. for a burst length of one, a0-7 select the unique column to be accessed, and mode register bit m3 is ignored.
6 6 6 6 6 white electronic designs corporation phoenix az (602) 437-1520 WEDPN4M64V-XBX f ig . 4 c as l atency clk i/o t2 t1 t3 t0 cas latency = 3 lz d out t oh t command nop read t ac nop t4 nop don?t care undefined clk i/o t2 t1 t3 t0 cas latency = 2 lz d out t oh t command nop read t ac nop the normal operating mode is selected by setting m7and m8 to zero; the other combinations of values for m7 and m8 are reserved for future use and/or test modes. the pro- grammed burst length applies to both read and write bursts. test modes and reserved states should not be used be- cause unknown operation or incompatibility with future versions may result. when m9 = 0, the burst length programmed via m0-m2 applies to both read and write bursts; when m9 = 1, the programmed burst length applies to read bursts, but write accesses are single-location (nonburst) accesses. accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit m3. the ordering of accesses within a burst is determined by the burst length, the burst type and the starting column address, as shown in table 1. burst type the cas latency is the delay, in clock cycles, between the registration of a read command and the availability of the first piece of output data. the latency can be set to two or three clocks. if a read command is registered at clock edge n , and the latency is m clocks, the data will be available by clock edge n +m. the i/os will start driving as a result of the clock edge one cycle earlier ( n + m - 1), and provided that the relevant access times are met, the data will be valid by clock edge n + m . for example, assuming that the clock cycle time is such that all relevant access times are met, if a read command is registered at t0 and the latency is programmed to two clocks, the i/os will start driving after t1 and the data will be valid by t2. table 2 below indicates the operating frequencies at which each cas latency setting can be used. reserved states should not be used as unknown opera- tion or incompatibility with future versions may result. cas latency operating mode write burst mode commands the truth table provides a quick reference of available com- mands. this is followed by a written description of each command. three additional truth tables appear following the operation section; these tables provide current state/ next state information. t able 2 - c as l atency allowable operating allowable operating allowable operating allowable operating allowable operating frequency (mhz) frequency (mhz) frequency (mhz) frequency (mhz) frequency (mhz) cas cas cas cas cas cas cas cas cas cas speed speed speed speed speed latency = 2 latency = 2 latency = 2 latency = 2 latency = 2 latency = 3 latency = 3 latency = 3 latency = 3 latency = 3 -100 75 100 -125 100 125
7 7 7 7 7 white electronic designs corporation (602) 437-1520 www.whiteedc.com WEDPN4M64V-XBX t ruth t able - c ommands a nd dqm o pera tion (n ote 1) name (function) name (function) name (function) name (function) name (function) cs cs cs cs cs ras ras ras ras ras cas cas cas cas cas we we we we we dqm dqm dqm dqm dqm addr addr addr addr addr i/os i/os i/os i/os i/os command inhibit (nop) h x x x x x x no operation (nop) l h h h x x x active (select bank and activate row) ( 3) l l h h x bank/row x read (select bank and column, and start read burst) (4) l h l h l/h 8 bank/col x write (select bank and column, and start write burst) (4) l h l l l/h 8 bank/col v alid burst terminate l h h l x x active precharge (deactivate row in bank or banks) ( 5) l l h l x code x auto refresh or self refresh (enter self refresh mode) (6, 7) l l l h x x x load mode register (2) l l l l x op-code x write enable/output enable (8) ? ? ? ? l ? active write inhibit/output high-z (8) ? ? ? ? h ? high-z active (or open) for accesses until a precharge command is issued to that bank. a precharge command must be issued before opening a different row in the same bank. the read command is used to initiate a burst read access to an active row. the value on the ba0, ba1 inputs selects the bank, and the address provided on inputs a0-7 se- lects the starting column location. the value on input a10 determines whether or not auto precharge is used. if auto precharge is selected, the row being accessed will be precharged at the end of the read burst; if auto precharge is not selected, the row will remain open for subsequent accesses. read data appears on the i/os sub- ject to the logic level on the dqm inputs two clocks earlier. if a given dqm signal was registered high, the correspond- ing i/os will be high-z two clocks later; if the dqm signal was registered low, the i/os will provide valid data. the write command is used to initiate a burst write access to an active row. the value on the ba0, ba1 inputs selects the bank, and the address provided on inputs a0-7 se- lects the starting column location. the value on input a10 determines whether or not auto precharge is used. if the command inhibit function prevents new commands from being executed by the sdram, regardless of whether the clk signal is enabled. the sdram is effectively dese- lected. operations already in progress are not affected. the no operation (nop) command is used to perform a nop to an sdram which is selected (cs is low). this pre- vents unwanted commands from being registered during idle or wait states. operations already in progress are not affected. the mode register is loaded via inputs a0-11. see mode register heading in the register definition section. the load mode register command can only be issued when all banks are idle, and a subsequent executable command cannot be issued until tmrd is met. the active command is used to open (or activate) a row in a particular bank for a subsequent access. the value on the ba0, ba1 inputs selects the bank, and the address pro- vided on inputs a0-11 selects the row. this row remains command inhibit notes: 1. cke is high for all commands shown except self refresh. 2. a0-11 define the op-code written to the mode register. 3. a0-11 provide row address, and ba0, ba1 determine which bank is made active. 4. a0-7 provide column address; a10 high enables the auto precharge feature (nonpersistent), while a10 low disables the auto pr echarge feature; ba0, ba1 determine which bank is being read from or written to. 5. a10 low: ba0, ba1 determine the bank being precharged. a10 high: all banks precharged and ba0, ba1 are ?don?t care.? 6. this command is auto refresh if cke is high; self refresh if cke is low. 7. internal refresh counter controls row addressing; all inputs and i/os are ?don?t care? except for cke. 8. activates or deactivates the i/os during writes (zero-clock delay) and reads (two-clock delay). no operation (nop) load mode register active read write
8 8 8 8 8 white electronic designs corporation phoenix az (602) 437-1520 WEDPN4M64V-XBX auto precharge is selected, the row being accessed will be precharged at the end of the write burst; if auto precharge is not selected, the row will remain open for subsequent accesses. input data appearing on the i/os is written to the memory array subject to the dqm input logic level appearing coincident with the data. if a given dqm signal is registered low, the corresponding data will be written to memory; if the dqm signal is registered high, the corresponding data inputs will be ignored, and a write will not be executed to that byte/column location. the precharge command is used to deactivate the open row in a particular bank or the open row in all banks. the bank(s) will be available for a subsequent row access a specified time (trp) after the precharge command is is- sued. input a10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs ba0, ba1 select the bank. other- wise ba0, ba1 are treated as ?don?t care.? once a bank has been precharged, it is in the idle state and must be activated prior to any read or write commands being is- sued to that bank. auto precharge is a feature which performs the same individual-bank precharge function described above, without requiring an explicit command. this is accomplished by using a10 to enable auto precharge in conjunction with a specific read or write command. a precharge of the bank/row that is addressed with the read or write command is automatically performed upon completion of the read or write burst, except in the full-page burst mode, where auto precharge does not apply. auto precharge is nonpersistent in that it is either enabled or disabled for each individual read or write command. auto precharge ensures that the precharge is initiated at the earliest valid stage within a burst. the user must not issue another command to the same bank until the precharge time (trp) is completed. this is determined as if an explicit precharge command was issued at the earliest possible time. the burst terminate command is used to truncate either fixed-length or full-page bursts. the most recently registered read or write command prior to the burst terminate command will be truncated. auto refresh is used during normal operation of the sdram and is analagous to cas-before-ras (cbr) refresh in conventional drams. this command is nonpersistent, so it must be issued each time a refresh is required. the addressing is generated by the internal refresh control- ler. this makes the address bits ?don?t care? during an auto refresh command. the 64mb sdram requires 4,096 auto refresh cycles every refresh period (tref), regardless of width option. providing a distributed auto refresh com- mand will meet the refresh requirement and ensure that each row is refreshed. alternatively, 4,096 auto refresh com- mands can be issued in a burst at the minimum cycle rate (trc), once every refresh period (tref). the self refresh command can be used to retain data in the sdram, even if the rest of the system is powered down. when in the self refresh mode, the sdram retains data with- out external clocking. the self refresh command is initi- ated like an auto refresh command except cke is dis- abled (low). once the self refresh command is regis- tered, all the inputs to the sdram become ?don?t care,? with the exception of cke, which must remain low. once self refresh mode is engaged, the sdram provides its own internal clocking, causing it to perform its own auto refresh cycles. the sdram must remain in self refresh mode for a minimum period equal to tras and may remain in self refresh mode for an indefinite period beyond that. the procedure for exiting self refresh requires a sequence of commands. first, clk must be stable (stable clock is defined as a signal cycling within timing constraints speci- fied for the clock pin) prior to cke going back high. once cke is high, the sdram must have nop commands is- sued (a minimum of two clocks) for txsr, because time is required for the completion of any internal refresh in progress. upon exiting the self refresh mode, auto refresh com- mands must be issued as both self refresh and auto refresh utilize the row refresh counter. precharge auto precharge burst terminate auto refresh self refresh* * * * * * self refresh available in commercial and industial temperatures only.
9 9 9 9 9 white electronic designs corporation (602) 437-1520 www.whiteedc.com WEDPN4M64V-XBX dc e lectrical c haracteristics a nd o pera ting c onditions (n otes 1, 6) (vcc = +3.3v 0.3v; ta = -55c to +125c) parameter/condition parameter/condition parameter/condition parameter/condition parameter/condition symbol symbol symbol symbol symbol units units units units units min min min min min max max max max max supply voltage v cc 3 3.6 v input high voltage: logic 1; all inputs (21) v ih 2v cc + 0.3 v input low voltage: logic 0; all inputs (21) v il -0.3 0.8 v input leakage current: any input 0v - v in - v cc (all other pins not under test = 0v) i i -5 5 a input leakage address current: any input 0v - v in - v cc (all other pins not under test = 0v) i i -25 25 a output leakage current: i/os are disabled; 0v - v out - v cc i oz -5 5 a output levels: output high voltage (i out = -4ma) v oh 2.4 ? v output low voltage (i out = 4ma) v ol ? 0.4 v a bsolute m aximum r atings p p p p p arameter arameter arameter arameter arameter unit unit unit unit unit voltage on v cc supply relative to vss -1 to 4.6 v voltage on nc or i/o pins relative to vss -1 to 4.6 v operating temperature t a (mil) -55 to +125 c operating temperature t a (ind) -40 to +85 c storage temperature, plastic -55 to +150 c note: stress greater than those listed under "absolute maximum ratings" may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect reliability. c apacitance (n ote 2) p p p p p arameter arameter arameter arameter arameter symbol symbol symbol symbol symbol max max max max max unit unit unit unit unit input capacitance: clk c i1 7.0 pf addresses, ba 0-1 input capacitance ca 20 pf input capacitance: all other input-only pins c i2 7.0 pf input/output capacitance: i/os c io 10.0 pf idd s pecifica tions a nd c onditions (n otes 1,6,11,13) (vcc = +3.3v 0.3v; ta = -55c to +125c) parameter/condition parameter/condition parameter/condition parameter/condition parameter/condition symbol symbol symbol symbol symbol max max max max max units units units units units operating current: active mode; i cc1 460 ma burst = 2; read or write; t rc = t rc (min); cas latency = 3 (3, 18, 19) standby current: active mode; cke = high; cs = high; i cc3 180 ma all banks active after t rcd met; no accesses in progress (3, 12, 19) operating current: burst mode; continuous burst; i cc4 560 ma read or write; all banks active; cas latency = 3 (3, 18, 19) self refresh current: cke - 0.2v (27) i cc7 4ma bga t hermal r esistance description description description description description symbol symbol symbol symbol symbol max max max max max units units units units units notes notes notes notes notes junction to ambient theta ja 16.8 0 c/w 1 (no airflow) junction to ball theta jb 11.3 0 c/w 1 junction to case (top) theta jc 7.1 0 c/w 1 note 1: refer to bga thermal resistance correlation application note at www.whiteedc.com in the application notes section for modeling conditions.
10 10 10 10 10 white electronic designs corporation phoenix az (602) 437-1520 WEDPN4M64V-XBX parameter parameter parameter parameter parameter symbol symbol symbol symbol symbol -100 -100 -100 -100 -100 -125 -125 -125 -125 -125 unit unit unit unit unit min min min min min max max max max max min min min min min max max max max max access time from clk (pos. edge) cl = 3 t ac 76ns cl = 2 t ac 76ns address hold time t ah 11 ns address setup time t as 22 ns clk high-level width t ch 33 ns clk low-level width t cl 33 ns clock cycle time (22) cl = 3 t ck 10 8 ns cl = 2 t ck 13 10 cke hold time t ckh 11 ns cke setup time t cks 22 ns cs, ras, cas, we, dqm hold time t cmh 11 ns cs, ras, cas, we, dqm setup time t cms 22 ns data-in hold time t dh 11 ns data-in setup time t ds 22 ns data-out high-impedance time cl = 3 (10) t hz 76ns cl = 2 (10) t hz 76ns data-out low-impedance time t lz 11 ns data-out hold time (load) t oh 33 ns data-out hold time (no load) (26) t oh n 1.8 1.8 ns active to precharge command t ras 50 120,000 45 120,000 ns active to active command period t rc 70 70 ns active to read or write delay t rcd 20 21 ns refresh period (4,096 rows) ? commercial, industrial t ref 64 64 ms refresh period (4,096 rows) ? military t ref 16 16 ms auto refresh period t rfc 70 70 ns precharge command period t rp 20 20 ns active bank a to active bank b command t rrd 20 15 ns transition time (7) t t 0.3 1.2 0.3 1.2 ns write recovery time (23) t wr 1 clk + 7ns 1 clk + 7ns ? (24) 15 14 ns exit self refresh to active command t xsr 80 78 ns e lectrical c haracteristics a nd r ecommended ac o pera ting c haracteristics (n otes 5, 6, 8, 9, 11)
11 11 11 11 11 white electronic designs corporation (602) 437-1520 www.whiteedc.com WEDPN4M64V-XBX ac f unctional c haracteristics (n otes 5,6,7,8,9,11) parameter/condition parameter/condition parameter/condition parameter/condition parameter/condition symbol symbol symbol symbol symbol -100 -100 -100 -100 -100 -125 -125 -125 -125 -125 units units units units units read/write command to read/write command (17) t ccd 11t ck cke to clock disable or power-down entry mode (14) t cked 11t ck cke to clock enable or power-down exit setup mode (14) t ped 11 t ck dqm to input data delay (17) t dqd 00t ck dqm to data mask during writes (17) t dqm 00t ck dqm to data high-impedance during reads (17) t dqz 22t ck write command to input data delay (17) t dwd 00t ck data-in to active command (15) t dal 45t ck data-in to precharge command (16) t dpl 22t ck last data-in to burst stop command (17) t bdl 1 1t ck last data-in to new read/write command (17) t cdl 11t ck last data-in to precharge command (16) t rdl 22t ck load mode register command to active or refresh command (25) t mrd 2 2t ck data-out to high-impedance from precharge command (17) cl = 3 t roh 33t ck cl = 2 t roh 2?t ck notes 1. all voltages referenced to vss. 2. this parameter is not tested but garanteed by design. f = 1 mhz, ta = 25c. 3. idd is dependent on output loading and cycle rates. specified values are obtained with minimum cycle time and the outputs open. 4. enables on-chip refresh and address counters. 5. the minimum specifications are used only to indicate cycle time at which proper operation over the full temperature range is ensured. 6. an initial pause of 100s is required after power-up, followed by two auto refresh commands, before proper device operation is ensured. (vcc must be powered up simultaneously.) the two auto refresh command wake-ups should be repeated any time the tref refresh requirement is exceeded. 7. ac characteristics assume tt = 1ns. 8. in addition to meeting the transition rate specification, the clock and cke must transit between vih and vil (or between vil and vih) in a monotonic manner. 9. outputs measured at 1.5v with equivalent load: 10. thz defines the time at which the output achieves the open circuit condition; it is not a reference to voh or vol. the last valid data element will meet toh before going high-z. 11. ac timing and idd tests have vil = 0v and vih = 3v, with timing referenced to 1.5v crossover point. 12. other input signals are allowed to transition no more than once every two clocks and are otherwise at valid vih or vil levels. q 50pf 13. icc specifications are tested after the device is properly initialized. 14. timing actually specified by tcks; clock(s) specified as a reference only at minimum cycle rate. 15. timing actually specified by twr plus trp; clock(s) specified as a reference only at minimum cycle rate. 16. timing actually specified by twr. 17. required clocks are specified by jedec functionality and are not dependent on any timing parameter. 18. the icc current will decrease as the cas latency is reduced. this is due to the fact that the maximum cycle rate is slower as the cas latency is reduced. 19. address transitions average one transition every two clocks. 20. clk must be toggled a minimum of two times during this period. 21. vih overshoot: vih (max) = vcc + 2v for a pulse width - 3ns, and the pulse width cannot be greater than one third of the cycle rate. vil undershoot: vil (min) = -2v for a pulse width - 3ns. 22. the clock frequency must remain constant (stable clock is defined as a signal cycling within timing constraints specified for the clock pin) during access or precharge states (read, write, including twr, and precharge commands). cke may be used to reduce the data rate. 23. auto precharge mode only. the precharge timing budget (trp) begins 7.5ns/ 7ns after the first clock delay, after the last write is executed. 24. precharge mode only. 25. jedec and pc100 specify three clocks. 26. parameter guaranteed by design. 27. self refresh available in commercial and industrial temperatures only.
12 12 12 12 12 white electronic designs corporation phoenix az (602) 437-1520 WEDPN4M64V-XBX wed wed wed wed wed p n p n p n p n p n 4m 64 4m 64 4m 64 4m 64 4m 64 v - xxx v - xxx v - xxx v - xxx v - xxx b b b b b x x x x x p ackage 739: 219 p lastic b all g rid a rray (pbga) all linear dimensions are millimeters and parenthetically in inches o rdering i nformation device grade: device grade: device grade: device grade: device grade: m = military -55c to +125c i = industrial -40c to +85c c = commercial 0c to +70c package: package: package: package: package: b = 219 plastic ball grid array (pbga) frequency (mhz) frequency (mhz) frequency (mhz) frequency (mhz) frequency (mhz) 100 = 100mhz 125 = 125mhz 3.3v power supply 3.3v power supply 3.3v power supply 3.3v power supply 3.3v power supply configuration, 4m x 64 configuration, 4m x 64 configuration, 4m x 64 configuration, 4m x 64 configuration, 4m x 64 sdram sdram sdram sdram sdram plastic plastic plastic plastic plastic white electronic designs corp. white electronic designs corp. white electronic designs corp. white electronic designs corp. white electronic designs corp. b ottom v iew 1 2 3 4 5 6 7 8 9 10111213141516 t r p n m l k j h g f e d c b a 219 x ? 0.762 (0.030) nom 1.27 (0.050) nom 21.1 (0.831) sq. max 19.05 (0.750) nom 19.05 (0.750) nom 2.03 (0.080) max 0.61 (0.024) nom

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