14.2 mm (0.56 inch) dual digits general purpose seven segment displays reliability data description the following cumulative test results have been obtained from testing performed at agilent technologies optoelectronics division in accordance with the latest revision of mil- std-883. agilent tests parts at or beyond the absolute maximum rated conditions recommended for the device. the actual performance you obtain from agilent parts depends on the electrical and environmental characteristics of hdsp-521e, -523e HDSP-521G, -523g table 2. environmental tests units units test name reference test conditions tested failed solder heat resistance hp internal test solder wave at 250 c for total of 2500 0 ppm 5 seconds and 5 temperature cycles per mil-std-883 method 1010. temperature cycle mil-std-883 method 1010 -35 c to +85 c, 15 min. dwell, 5 min. transfer, 20 cycles 400 0 50 cycles 400 1 humidity storage jis c 7021 method b-11 85 c, 85% rh, 1000 hours 84 0 solderability mil-std-883 method 2003 16 hours steam aging followed by 40 0 solder dip at 260 c for 5 seconds. your application but will probably be better than the performance outlined in table 1. total stress test device units total colors stress test conditions hours tested failed high efficiency low temperature operating life t a = -35 c 84,000 84 0 red and green i f = 25 ma high efficiency high temperature operating life t a = 55 c 84,000 84 0 red and green i f = 15 ma high efficiency wet high temperature operating life t a = 85 c 84,000 84 0 red and green r.h. = 85% i f = 5 ma table 1. life tests demonstrated performance
www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies 5968-7189e (11/99)
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