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revisions ltr description date (yr-mo-da) approved a add device 02. editorial changes throughout. change drawing cage tp 67268. 90-03-07 w. heckman b changes iaw nor 5962-r023-99. -ljs 99-01-27 raymond monnin c update to reflect latest changes in format and requirements. editorial changes throughout. -les 01-11-28 raymond monnin the original first sheet of this drawing has been replaced. current cage code 67628 rev sheet rev c c c sheet 15 16 17 rev status rev c c c c c c c c c c c c c c of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by christopher a. rauch defense supply center columbus standard microcircuit drawing checked by tim h. noh columbus, ohio 43216 http://www.d scc.dla.mil this drawing is available for use by all departments approved by william k. heckman microcircuit, digital, bipolar, octal, 3-state, bidirectional, bus transceiver, and agencies of the department of defense drawing approval date 87-02-09 monolithic silicon amsc n/a revision level c size a cage code 14933 5962-86723 sheet 1 of 17 dscc form 2233 apr 97 5962-e007-02 distribution statement a . approved for public releas e; distribution is unlimited.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing describes device requirements for mil- std-883 compliant, non-jan class level b microcircuits in accordance with mil-prf-38535, appendix a. 1.2 part or identifying number (pin) . the complete pin is as shown in the following example: 5962-86838 01 r x drawing number device type (see 1.2.1) case outline (see 1.2.2) lead finish (see 1.2.3) 1.2.1 device type(s) . the device type(s) identify the circuit function as follows: device type generic number circuit function 01 2947 octal, 3-state, bi-directional, bus transceivers noninverting 02 2946 octal, 3-state, bi-directional, bus transceivers inverting 1.2.2 case outlines . the case outlines are as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style r gdip1-t20 or gdip2-t20 20 dual-in-line 2 cqcc1-n20 20 square chip carrier 1.3 absolute maximum ratings . supply voltage ................................................................. -0.5 v dc to +7.0 v dc input voltage r ange ...................................................... -1.5 v dc to +5.5 v dc storage temper ature range .............................................. -65 c to +150 c maximum power dissipation (p d ) per device 1 /............... 775 mw lead temperature (solder ing, 10 sec onds) ..................... +300 c thermal resistance, junction-to-case ( jc ) ..................... see mil-std-1835 junction temperature (t j ) ................................................ +175 c 1.4 recommended operating conditions . supply voltage range (v cc ).............................................. +4.5 v dc to 5.5 v dc minimum high level input voltage (v ih )............................. 2. 0 v dc maximum low level input voltage (v il ) ............................ 0. 7 v dc ambient operati ng temperature range (t c ) .................... -55 c to +125 c ___ 1 / must withstand the added p d due to short circuit test (e.g. i os ).
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 3 dscc form 2234 apr 97 2. applicable documents 2.1 government specif ication, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specif ied herein. unless otherwise specified, t he issues of these doc uments are those liste d in the issue of the department of defense index of specif ications and standards (dodiss) and s upplement thereto, cited in the solicitation. specification department of defense mil-prf-38535 -- integrated circuits, manufacturing, general specification for. standards department of defense mil-std-883 - test me thod standard microcircuits. mil-std-1835 - interface standard electronic component case outlines. handbooks department of defense mil-hdbk-103 -- list of st andard microcircuit drawings. mil-hdbk-780 - standard microcircuit drawings. (unless otherwise indicated, copies of the specification, standards, and handbooks are availabl e from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence . in the event of a conflict betw een the text of this drawing and the references cited herein, the text of this drawing takes precedence. nothing in this docum ent, however, supersedes applicable laws and regulations unless a specific exempti on has been obtained. 3. requirements 3.1 item requirements . the individual item requirements shall be in accordance with mil-prf-38535, appendix a for non- jan class level b devices and as specified herein. product built to this drawing t hat is produced by a q ualified manufacturer listing (qml) certified and qualif ied manufacturer or a manufacturer who has been granted transitional ce rtification to mil- prf-38535 may be processed as qml product in accordance wi th the manufacturers approv ed program plan and qualifying activity approval in accordance with mil-prf-38535. this qml flow as documented in the quality management (qm) plan may make modifications to the requirements herein. these modifi cations shall not affect form, fit, or function of the device. these modifications shall not affect the pi n as described herein. a "q" or "qml" ce rtification mark in accordance with mil- prf-38535 is required to identify w hen the qml flow option is used. 3.2 design, construction, and physical dimensions . the design, construction, and physica l dimensions shall be as specified in mil-prf-38535, appendix a and herein. 3.2.1 case outlines . the case outlines shall be in accordance with 1.2.2 herein. 3.2.2 terminal connections . the terminal connections shall be as specified on figure 1. 3.2.3 truth table . the truth table shall be as specified on figure 2. 3.2.4 logic diagram . the logic diagram shall be as specified on figure 3. 3.2.5 test circuit and switching waveforms . the test circuit and switching waveforms shall be as specified on figures 4 through 6.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 4 dscc form 2234 apr 97 3.3 electrical performance characteristics . unless otherwise specified herein, the electrical performance characteristics are as specified in table i and shall apply over the full ambient operati ng temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in table ii. the electrical tests for each subgroup are described in table i. 3.5 marking . marking shall be in accordance with mil-prf-38535, appendix a. the part shall be marked with the pin listed in 1.2 herein. in addition, the manufac turer's pin may also be marked as list ed in mil-hdbk-103 (see 6.6 herein). for packages where marking of the entire smd pin number is not f easible due to space limitati ons, the manufacturer has the option of not marking t he "5962-" on the device. 3.5.1 certification/co mpliance mark. a compliance indicator ?c? shall be marked on all non-jan devices built in compliance to mil-prf-38535, appendix a. the compliance indicator ?c? sha ll be replaced with a "q" or "q ml" certification mark in accordance with mil-prf-38535 to identif y when the qml flow option is used . 3.6 certificate of compliance . a certificate of compliance shall be required from a manufactu rer in order to be listed as an approved source of supply in mil-hdbk-103 (s ee 6.6 herein). the certificate of co mpliance submitted to dscc-va prior to listing as an approved source of supply sha ll affirm that the manufacturer's product meets the requirement s of mil-prf-38535, appendix a and the requirements herein. 3.7 certificate of conformance . a certificate of conformance as requi red in mil-prf-38535, appendix a shall be provided with each lot of microcircuits delivered to this drawing. 3.8 notification of change . notification of change to dscc-va shall be required in accordance with mil-prf-38535, appendix a. 3.9 verification and review . dscc, dscc's agent, and the acquiring activity re tain the option to review the manufacturer's facility and applicable required doc umentation. offshore documentat ion shall be made available ons hore at the option of the reviewer.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 5 dscc form 2234 apr 97 test symbol conditions -55 c t a +125 c unless otherwise specified group a subgroups device type limits unit min max high level output voltage, v oh1 i oh = -0.4 ma 1, 2, 3 all 3.35 v a 0 - a 7 v cc = 4.5 v, t/ r = 0.8 v, cd = 0.7 v i oh = -3.0 ma 1, 2, 3 all 2.7 v high level output voltage, v oh2 i oh = -0.4 ma 1, 2, 3 all 3.35 v b 0 - b 7 v cc = 4.5 v, t/ r = 2.0 v, cd = 0.7 v i oh = -5.0 ma 1, 2, 3 all 2.7 v i oh = -10 ma 1, 2, 3 all 2.4 v low level output voltage, a 0 - a 7 v ol1 v cc = 4.5 v, t/ r = 0.8 v, cd = 0.7 v, i ol = 12 ma 1, 2, 3 all 0.4 v low level output voltage, v ol 2 i ol = 20 ma 1, 2, 3 all 0.4 v b 0 - b 7 v cc = 4.5 v, t/ r = 2.0 v, cd = 0.7 v i ol = 48 ma 1, 2, 3 all 0.55 v input clamp voltage, a 0 - a 7 and b 0 - b 7 v i c1 v cc = 4.5 v, cd = 2.0 v, i in = -12 ma 1, 2, 3 all -1.5 v input clamp voltage, cd, t/ r v i c2 v cc = 4.5 v, i in = -12 ma 1, 2, 3 all -1.5 v high level input current, a 0 - a 7 i ih1 v cc = 5.5 v, t/ r = 2.0 v, cd = 0.7 v, v in = 2.7 v 1, 2, 3 all 80 a high level input current, b 0 - b 7 i ih2 v cc = 5.5 v, t/ r = cd = 0.7 v, v in = 2.7 v 1, 2, 3 all 80 a high level input current, cd, t/ r i ih3 v cc = 5.5 v, v in = 2.7 v 1, 2, 3 all 20 a high level input current, a 0 - a 7 , b 0 - b 7 i ih4 v cc = 5.5 v, cd = 2.0 v, v in = 5.5 v 1, 2, 3 all 1 ma high level input current, t/ r , cd i ih5 v cc = 5.5 v, v in = 5.5 v 1, 2, 3 all 1 ma low level input current, a 0 - a 7 i il1 v cc = 5.5 v, t/ r = 2.0 v, cd = 0.7 v, v in = 0.4 v 1, 2, 3 all -200 a low level input current, b 0 - b 7 i il2 v cc = 5.5 v, t/ r = 0.7 v, cd = 0.7 v, v in = 0.4 v 1, 2, 3 all -200 a low level input current, cd, t/ r i il3 v cc = 5.5 v, v in = 0.4 v 1, 2, 3 all -250 a see footnotes at end of table.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 6 dscc form 2234 apr 97 table i. electrical performance characteristics . test symbol conditions -55 c t a +125 c unless otherwise specified group a subgroups device type limits unit min max short circuit output current, a 0 - a 7 i os1 v cc = 5.5 v, t/ r = 0.8 v, cd = 0.7 v, v out = 0.0 v 1 / 1, 2, 3 all -10 -75 ma short circuit output current, b 0 - b 7 i os2 v cc = 5.5 v, t/ r = 2.0 v, cd = 0.7 v, v out = 0.0 v 1 / 1, 2, 3 all -25 -150 ma functional tests see 4.3.1c 7, 8 all a 0 - a 7 1, 2, 3 all 80 a off state output current high i ozh v cc = 5.5 v, cd = 2.0 v, v out = 4.0 v b 0 - b 7 1, 2, 3 all 200 a off state output current low, a 0 - a 7 , b 0 - b 7 i ozl v cc = 5.5 v, cd = 2.0 v, v out = 0.4 v 1, 2, 3 all -200 a v in = 0.4 v 1, 2, 3 01 100 ma supply current i cc v cc = 5.5 v, cd = 2.0 v, t/ r = 0.4 v v in = 2.0 v 1, 2, 3 02 100 ma v in = 0.4 v 1, 2, 3 01 140 ma v cc = 5.5 v, cd = 0.4 v, t/ r = 2.0 v v in = 2.0 v 1, 2, 3 02 150 ma 01 18 ns 9 2 / 02 12 ns 01 24 ns t phl1 9, 10, 11 3 / 02 19 ns 01 18 ns 9 2 / 02 16 ns 01 24 ns propagation delay time, input b port to output a port t plh1 cd = t/ r = 0.4 v, r 1 = 1 k ? , r 2 = 5 k ? , c 1 = 30 pf (see figure 4) 9, 10, 11 3 / 02 23 ns 9 2 / all 15 ns t plz1 b 0 - b 7 = 0.4 v s 3 = 1 9, 10, 11 3 / all 21 ns 9 2 / all 15 ns disable time, cd to a port t phz1 t/ r = 0.4 v, r 5 = 1 k ? , c 4 = 15 pf (see figure 6) b 0 - b 7 = 2.4 v s 3 = 0 9, 10, 11 3 / all 21 ns see footnotes at end of table.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 7 dscc form 2234 apr 97 table i. electrical performance characteristics . test symbol conditions -55 c t a +125 c unless otherwise specified group a subgroups device type limits unit min max 9 2 / all 25 ns t pzl1 b 0 - b 7 = 0.4 v s 3 = 1 r 5 = 1 k ? 9, 10, 11 3 / all 33 ns 9 2 / all 25 ns enable time, cd to a port t pzh1 c 4 = 30 pf, t/ r = 0.4 v, (see figure 6) 4 / b 0 - b 7 = 2.4 v s 3 = 0 r 5 = 5 k ? 9, 10, 11 3 / all 33 ns 01 23 ns 9 2 / 02 18 ns 01 34 ns r 1 = 100 ? r 2 = 1 k ? c 1 = 300 pf 9, 10, 11 3 / 02 29 ns 01 18 ns 9 2 / 02 12 ns 01 25 ns t phl2 r 1 = 667 ? r 2 = 5 k ? c 1 = 45 pf 9, 10, 11 3 / 02 19 ns 01 23 ns 9 2 / 02 20 ns 01 34 ns r 1 = 100 ? r 2 = 1 k ? c 1 = 300 pf 9, 10, 11 3 / 02 30 ns 01 18 ns 9 2 / 02 14 ns 01 25 ns propagation delay time, input a port to output b port t plh2 cd = 0.4 v, t/ r = 2.4 v, (see figure 4) 4 / r 1 = 667 ? r 2 = 5 k ? c 1 = 45 pf 9, 10, 11 3 / 02 22 ns see footnotes at end of table.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 8 dscc form 2234 apr 97 table i. electrical performance characteristics . test symbol conditions -55 c t a +125 c unless otherwise specified group a subgroups device type limits unit min max 9 2 / all 18 ns t plz2 a 0 - a 7 = 0.4 v s 3 = 1 9, 10, 11 3 / all 26 ns 9 2 / all 15 ns disable time, cd to b port t phz2 t/ r = 2.4 v, r 5 = 1 k ? c 4 = 15 pf, (see figure 6) 4 / a 0 - a 7 = 2.4 v s 3 = 0 9, 10, 11 3 / all 21 ns 9 2 / all 35 ns r 5 = 100 ? c 4 = 300 pf 9, 10, 11 3 / all 43 ns 9 2 / all 22 ns t pzl2 a 0 - a 7 = 0.4 v, t/ r = 2.4 v, s 3 = 1, (see figure 6) 4 / r 5 = 667 ? c 4 = 45 pf 9, 10, 11 3 / all 30 ns 9 2 / all 35 ns r 5 = 1 k ? c 4 = 300 pf 9, 10, 11 3 / all 43 ns 9 2 / all 22 ns enable time, cd to b port t pzh2 a 0 - a 7 = 2.4 v, t/ r = 2.4 v, s 3 = 0, (see figure 6) 4 / r 5 = 5 k ? c 4 = 45 pf 9, 10, 11 3 / all 30 ns see footnotes at end of table.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 9 dscc form 2234 apr 97 table i. electrical performance characteristics . test symbol conditions -55 c t a +125 c unless otherwise specified group a subgroups device type limits unit min max 01 38 ns 9 2 / 02 33 ns 01 48 ns a port; s 2 = 1; c 2 = 30 pf; cd = 0.4 v, r 3 = 1 k ? (see figure 5) 4 / 9, 10, 11 3 / 02 43 ns 01 38 ns 9 2 / 02 33 ns 01 48 ns t trl b port; s 1 = 0; r 4 = 100 ? ; c 3 = 5 pf (see figure 5) 4 / 9, 10, 11 3 / 02 43 ns 01 38 ns 9 2 / 02 33 ns 01 48 ns a port; s 2 = 0; c 2 = 30 pf; cd = 0.4 v, r 3 = 5 k ? (see figure 5) 4 / 9, 10, 11 3 / 02 43 ns 01 38 ns 9 2 / 02 33 ns 01 48 ns propagation delay time, from transmit mode to receive, t/ r to a port t trh b port; s 1 = 1; r 4 = 100 ? ; c 3 = 5 pf (see figure 5) 4 / 9, 10, 11 3 / 02 43 ns see footnotes at end of table.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 10 dscc form 2234 apr 97 table i. electrical performance characteristics . test symbol conditions -55 c t a +125 c unless otherwise specified group a subgroups device type limits unit min max 01 40 ns 9 2 / 02 35 ns 01 51 ns a port; s 2 = 0; c 2 = 5 pf; cd = 0.4 v, r 3 = 300 ? (see figure 5) 4 / 9, 10, 11 3 / 02 47 ns 01 40 ns 9 2 / 02 35 ns 01 51 ns t rtl b port; s 1 = 1; r 4 = 100 ? ; c 3 = 300 pf (see figure 5) 4 / 9, 10, 11 3 / 02 47 ns 01 40 ns 9 2 / 02 35 ns 01 51 ns a port; s 2 = 1; c 2 = 5 pf; cd = 0.4 v, r 3 = 300 ? (see figure 5) 4 / 9, 10, 11 3 / 02 47 ns 01 40 ns 9 2 / 02 35 ns 01 51 ns propagation delay time, from transmit mode to receive, t/ r to b port t rth b port; s 1 = 0; r 4 = 1 k ? ; c 3 = 300 pf (see figure 5) 4 / 9, 10, 11 3 / 02 47 ns 1 / not more than one output should be short ed at a time and the duration of the s hort circuit condition should not exceed one second. 2 / v cc = 5.0 v. 3 / v cc = 4.5 v to 5.5 v. 4 / all ac loads are correlated from load of 50 pf during test.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 11 dscc form 2234 apr 97 device types 01 02 case outlines r, 2 r, 2 terminal number terminal symbols 1 a 0 a 0 2 a 1 a 1 3 a 2 a 2 4 a 3 a 3 5 a 4 a 4 6 a 5 a 5 7 a 6 a 6 8 a 7 a 7 9 cd cd 10 gnd gnd 11 t/ r t/ r 12 b 7 b 7 13 b 6 b 6 14 b 5 b 5 15 b 4 b 4 16 b 3 b 3 17 b 2 b 2 18 b 1 b 1 19 b 0 b 0 20 v cc v cc figure 1. terminal connections . inputs conditions chip disable l l h h = high level transmit/ receive l h x l = low level a port out in z z = high impedance state b port in out z x = irrelevant figure 2. truth table .
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 12 dscc form 2234 apr 97 figure 3. logic diagram .
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 13 dscc form 2234 apr 97 note: c1 includes test fixture capacitance. from a/b port to b/a port . figure 4. test circuit and switching waveforms .
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 14 dscc form 2234 apr 97 note: c2 and c3 incl ude test fixture capacitance. figure 5. test circuit and switching waveforms - from t/ r to a or b port.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 15 dscc form 2234 apr 97 note: c4 includes test fixture capacitanc e, port input is in a fixed logical condition. figure 6. test circuit and switching waveforms - from cd to a or b port.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 16 dscc form 2234 apr 97 4. quality assurance provisions 4.1 sampling and inspection . sampling and inspection procedures sha ll be in accordance with mil-prf-38535, appendix a. 4.2 screening . screening shall be in accordance with method 5004 of mil-std-883, and shall be conducted on all devices prior to quality conformance inspection. the following additional criteria shall apply: a. burn-in test, method 1015 of mil-std-883. (1) test condition a, b, c, or d. the test circuit sha ll be maintained by the manufacturer under document revision level control and shall be made available to t he preparing or acquiring activity upon reques t. the test circuit shall specify the inputs, outputs, bias es, and power dissipation, as applicable, in acco rdance with the intent specified in test method 1015 of mil-std-883. (2) t a = +125 c, minimum. b. interim and final electrical test param eters shall be as specified in table ii herei n, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. table ii. electrical test requirements . mil-std-883 test requirements subgroups (in accordance with mil-std-883, method 5005, table i) interim electrical parameters (method 5004) - - - final electrical test parameters (method 5004) 1*, 2, 3, 7, 8, 9 group a test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10**, 11** groups c and d end-point electrical parameters (method 5005) 1, 2, 3 * pda applies to subgroup 1. ** subgroups 10 and 11, if not te sted, shall be guaranteed to the limits specified in table i. 4.3 quality conf ormance inspection . quality conformance inspection shall be in accordance with method 5005 of mil-std- 883 including groups a, b, c, and d inspections. the following additional criteria shall apply. 4.3.1 group a inspection . a. tests shall be as spec ified in table ii herein. b. subgroups 4, 5, and 6 in table i, me thod 5005 of mil-std-883 shall be omitted. c. subgroups 7 and 8 shall include ve rification of the truth table.
standard microcircuit drawing size a 5962-86723 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 17 dscc form 2234 apr 97 4.3.2 groups c and d inspections . a. end-point electrical parameters s hall be as specified in table ii herein. b. steady-state life test condi tions, method 1005 of mil-std-883. (1) test condition a, b, c, or d. the test circuit shall be maintained by the manuf acturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. the test circuit shall specify the inputs, output s, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of mil-std-883. (2) t a = +125 c, minimum. (3) test duration: 1,000 hour s, except as permitted by method 1005 of mil-std-883. 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil-prf-38535, appendix a. 6. notes 6.1 intended use . microcircuits conforming to this drawing are int ended for use for government microcircuit applications (original equipment), design applic ations, and logistics purposes. 6.2 replaceability . microcircuits covered by this drawing will repl ace the same generic device covered by a contractor- prepared specificati on or drawing. 6.3 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this c oordination will be accomplished using dd form 1692, engineering change proposal. 6.4 record of users . military and industrial users shall inform defense supply center columbus when a system application requires configuration control and the applicable smd. dscc will maintain a re cord of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectronics devices (fsc 5962) should contact dscc-va, telephone (614) 692-0544. 6.5 comments . comments on this drawing should be directed to dscc-va, columbus, ohio 43216-5000, or telephone (614) 692-0547. 6.6 approved sources of supply . approved sources of supply are listed in mil-hdbk-103. the vendors listed in mil- hdbk-103 have agreed to this drawing and a ce rtificate of compliance (s ee 3.6 herein) has been subm itted to and accepted by dscc-va.
standard microcircuit drawing bulletin date: 01-11-07 approved sources of supply for smd 5962-86723 are listed below for immediate acquisition information only and shall be added to mil-hdbk-103 and qml-38535 during the next revisi on. mil-hdbk-103 and qml-38535 will be revised to include the addition or deletion of source s. the vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by dscc-va. this bulletin is superseded by the next dated revision of mil-hdbk-103 and qml-38535. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-8672301ra 3v146 0dks7 3/ 2947/bra gem07501bra am2947/bra 5962-8672301rc 0dks7 gem07501brc 5962-86723012a 3v146 0dks7 3/ 2947/b2a gem07501b2a am2947/b2a 5962-86723012c 0dks7 gem07501b2c 5962-8672302ra 3v146 0dks7 3/ 2946/bra gem13302bra am2947/bra 5962-8672302RC 0dks7 gem13302brc 5962-86723022a 3v146 0dks7 3/ 2946/b2a gem13302b2a am2947/b2a 5962-86723022c 0dks7 gem13302b2c 1 / the lead finish shown for each pin representing a hermetic pa ckage is the most readily ava ilable from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine its availability. 2 / caution . do not use this number for item acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. 3 / no current source. vendor cage vendor name number and address 3v146 rochester electronics 10 malcom hoyt drive newburyport, ma 01950 0dks7 sarnoff, david research center 201 washington road princeton, nj 08540-5300 the information contained herein is di sseminated for convenience only and the government assumes no liability whats oever for any inaccuracies in the information bulletin.

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