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d a t a sh eet product speci?cation supersedes data of september 1993 file under integrated circuits, ic06 1998 sep 30 integrated circuits 74hc/hct257 quad 2-input multiplexer; 3-state for a complete data sheet, please also download: the ic06 74hc/hct/hcu/hcmos logic family specifications the ic06 74hc/hct/hcu/hcmos logic package information the ic06 74hc/hct/hcu/hcmos logic package outlines
1998 sep 30 2 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 features non-inverting data path 3-state outputs interface directly with system bus output capability: bus driver i cc category: msi general description the 74hc/hct257 are high-speed si-gate cmos devices and are pin compatible with low power schottky ttl (lsttl). they are specified in compliance with jedec standard no. 7a. the 74hc/hct257 have four identical 2-input multiplexers with 3-state outputs, which select 4 bits of data from two sources and are controlled by a common data select input (s). the data inputs from source 0 (1i 0 to 4i 0 ) are selected when input s is low and the data inputs from source 1 (1i 1 to 4i 1 ) are selected when s is high. data appears at the outputs (1y to 4y) in true (non-inverting) form from the selected inputs. the 257 is the logic implementation of a 4-pole, 2-position switch, where the position of the switch is determined by the logic levels applied to s. the outputs are forced to a high impedance off-state when oe is high. the logic equations for the outputs are: 1y = oe.(1i 1 .s + 1i 0 . s) 2y = oe.(2i 1 .s + 2i 0 . s) 3y = oe.(3i 1 .s + 3i 0 . s) 4y = oe.(4i 1 .s + 4i 0 . s) the 257 is identical to the 258 but has non-inverting (true) outputs. quick reference data gnd = 0 v; t amb =25 c; t r =t f = 6 ns notes 1. c pd is used to determine the dynamic power dissipation (p d in m w): p d =c pd v cc 2 f i +? (c l v cc 2 f o ) where: f i = input frequency in mhz f o = output frequency in mhz ? (c l v cc 2 f o ) = sum of outputs c l = output load capacitance in pf v cc = supply voltage in v 2. for hc the condition is v i = gnd to v cc for hct the condition is v i = gnd to v cc - 1.5 v symbol parameter conditions typical unit hc hct t phl / t plh propagation delay c l = 15 pf; v cc =5 v ni 0 , ni 1 to ny 11 13 ns s to ny 14 17 ns c i input capacitance 3.5 3.5 pf c pd power dissipation capacitance per multiplexer notes 1 and 2 45 45 pf
1998 sep 30 3 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 ordering information pin description type number package name description version 74hc257n; 74HCT257n dip16 plastic dual in-line package; 16 leads (300 mil); long body sot38-1 74hc257d; 74HCT257d so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1 74hc257db; 74HCT257db ssop16 plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 74hc257pw; 74HCT257pw tssop16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 pin no. symbol name and function 1 s common data select input 2, 5, 11, 14 1i 0 to 4i 0 data inputs from source 0 3, 6, 10, 13 1i 1 to 4i 1 data inputs from source 1 4, 7, 9, 12 1y to 4y 3-state multiplexer outputs 8 gnd ground (0 v) 15 oe 3-state output enable input (active low) 16 v cc positive supply voltage fig.1 pin configuration. f page gnd v cc mlb311 s oe 1y 2y 4y 3y 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 257 1i 0 1i 1 2i 0 2i 1 4i 0 4i 1 3i 0 3i 1 fig.2 logic symbol. f page mga835 s oe 1y 2y 3y 4y 2 3 5 6 11 10 14 13 15 1 4 7 9 12 1i 0 1i 1 2i 0 2i 1 3i 0 3i 1 4i 0 4i 1 fig.3 iec logic symbol.
1998 sep 30 4 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 fig.4 functional diagram. mgr280 s 1 1i 0 2 1y 4 1i 1 3 selector 3-state multiplexer outputs 2i 0 5 2y 7 2i 1 6 3i 0 11 3y 12 3i 1 10 4i 0 14 4y 9 4i 1 13 oe 15 function table notes 1. h = high voltage level l = low voltage level x = dont care z = high impedance off-state inputs output oe s ni 0 ni 1 ny hxxx z lhxl l lhxh h lllx l llhx h fig.5 logic diagram.
1998 sep 30 5 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 dc characteristics for 74hc for the dc characteristics see 74hc/hct/hcu/hcmos logic family specifications . output capability: bus driver i cc category: msi ac characteristics for 74hc gnd = 0 v; t r =t f = 6 ns; c l = 50 pf symbol parameter t amb ( c) unit test conditions 74hc v cc (v) waveforms + 25 - 40 to + 85 - 40 to + 125 min. typ. max. min. max. min. max. t phl / t plh propagation delay ni 0 to ny; ni 1 to ny 36 110 140 165 ns 2.0 fig.6 13 22 28 33 4.5 10 19 24 28 6.0 t phl / t plh propagation delay s to ny 47 150 190 225 ns 2.0 fig.6 17 30 38 45 4.5 14 26 33 38 6.0 t pzh / t pzl 3-state output enable time oe to ny 33 150 190 225 ns 2.0 fig.7 12 30 38 45 4.5 10 26 33 38 6.0 t phz / t plz 3-state output disable time oe to ny 41 150 190 225 ns 2.0 fig.7 15 30 38 45 4.5 12 26 33 38 6.0 t thl / t tlh output transition time 14 60 75 90 ns 2.0 fig.6 5 12 15 18 4.5 4 10 13 15 6.0
1998 sep 30 6 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 dc characteristics for 74hct for the dc characteristics see 74hc/hct/hcu/hcmos logic family specifications . output capability: bus driver i cc category: msi note to hct types the value of additional quiescent supply current ( d i cc ) for a unit load of 1 is given in the family specifications. to determine d i cc per input, multiply this value by the unit load coefficient shown in the table below. ac characteristics for 74hct gnd = 0 v; t r =t f = 6 ns; c l = 50 pf input unit load coefficient ni 0 0.40 ni 1 0.40 oe 1.35 s 0.70 symbol parameter t amb ( c) unit test conditions 74hct v cc (v) waveforms + 25 - 40 to + 85 - 40 to + 125 min. typ. max. min. max. min. max. t phl / t plh propagation delay 16 30 38 45 ns 4.5 fig.6 ni 0 to ny ni 1 to ny t phl / t plh propagation delay s to ny 20 35 44 53 ns 4.5 fig.6 t pzh / t pzl 3-state output enable time oe to ny 15 30 38 45 ns 4.5 fig.7 t phz / t plz 3-state output disable time oe to ny 16 30 38 45 ns 4.5 fig.7 t thl / t tlh output transition time 5 12 15 18 ns 4.5 fig.6
1998 sep 30 7 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 ac waveforms fig.6 waveforms showing the input (ni 0 , ni 1 ) to output (ny) propagation delays and the output transition times. (1) hc: v m = 50%; v i = gnd to v cc . hct: v m = 1.3 v; v i = gnd to 3 v. fig.7 waveforms showing the 3-state enable and disable times. (1) hc: v m = 50%; v i = gnd to v cc . hct: v m = 1.3 v; v i = gnd to 3 v.
1998 sep 30 8 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 package outlines unit a max. 1 2 b 1 cee m h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot38-1 92-10-02 95-01-19 a min. a max. b max. w m e e 1 1.40 1.14 0.055 0.045 0.53 0.38 0.32 0.23 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 3.9 3.4 0.15 0.13 0.254 2.54 7.62 0.30 8.25 7.80 0.32 0.31 9.5 8.3 0.37 0.33 2.2 0.087 4.7 0.51 3.7 0.15 0.021 0.015 0.013 0.009 0.01 0.10 0.020 0.19 050g09 mo-001ae m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 16 1 9 8 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) d (1) z dip16: plastic dual in-line package; 16 leads (300 mil); long body sot38-1
1998 sep 30 9 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 sot109-1 95-01-23 97-05-22 076e07s ms-012ac 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.050 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
1998 sep 30 10 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 7.9 7.6 1.03 0.63 0.9 0.7 1.00 0.55 8 0 o o 0.13 0.2 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot338-1 94-01-14 95-02-04 (1) w m b p d h e e z e c v m a x a y 1 8 16 9 q a a 1 a 2 l p q detail x l (a ) 3 mo-150ac pin 1 index 0 2.5 5 mm scale ssop16: plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 a max. 2.0
1998 sep 30 11 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o o 0.13 0.1 0.2 1.0 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot403-1 mo-153 94-07-12 95-04-04 w m b p d z e 0.25 18 16 9 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 a max. 1.10 pin 1 index
1998 sep 30 12 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (order code 9398 652 90011). dip s oldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. r epairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. so, ssop and tssop r eflow soldering reflow soldering techniques are suitable for all so, ssop and tssop packages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. w ave soldering wave soldering can be used for all so packages. wave soldering is not recommended for ssop and tssop packages, because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. if wave soldering is used - and cannot be avoided for ssop and tssop packages - the following conditions must be observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. even with these conditions: only consider wave soldering ssop packages that have a body width of 4.4 mm, that is ssop16 (sot369-1) or ssop20 (sot266-1). do not consider wave soldering tssop packages with 48 leads or more, that is tssop48 (sot362-1) and tssop56 (sot364-1). during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
1998 sep 30 13 philips semiconductors product speci?cation quad 2-input multiplexer; 3-state 74hc/hct257 r epairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.

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