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revisions ltr description date (yr-mo-da) approved a remove vendor cage 13919. add device type 02. add vendors cage 31757 and 60024. change to reflect mil-h-38534 processing. editorial changes throughout. 91-09-13 tim h. noh b table i, device type 01, correct output voltage peak and output current peak tests. 00-01-11 ray monnin the original first page of this drawing has been replaced. rev sheet rev sheet rev status rev bbbbbbbbbbbb of sheets sheet 123456789101112 pmic n/a prepared by gary zahn defense supply center columbus standard microcircuit drawing checked by steve duncan post office box 3990 columbus, ohio 43216-5000 this drawing is available for use by all departments approved by tim h. noh microcircuit, hybrid, linear, high power operational amplifier and agencies of the department of defense drawing approval date 87-09-16 amsc n/a revision level b size a cage code 67268 5962-87620 sheet 1 of 12 dscc form 2233 apr 97 5962-e099-00 distribution statement a. approved for public release; distribution is unlimited.
standard microcircuit drawing size a 5962-87620 defense supply center columbus columbus, ohio 43216-5000 revision level b sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope. this drawing documents one product assurance class, class h (high reliability) and a choice of case outlines and lead finishes are available and are reflected in the part or identifying number (pin). 1.2 pin. the pin shall be as shown in the following example: 5962-87620 01 x x ~~ ~~ ~ ~ drawing number device type case outline lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 device type(s). the device type(s) identify the circuit function as follows: device type generic number circuit function 01 42106, pa51m/883 high power operational amplifier 02 42106-1, pa51m/883 high power operational amplifier 1.2.2 case outline(s). the case outline(s) are as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style x see figure 1 8 flange mount y see figure 1 8 flange mount 1.2.3 lead finish. the lead finish shall be as specified in mil-prf-38534. 1.3 absolute maximum ratings. supply voltage range .................................................................. 40 v dc maximum differential input voltage ............................................................. v cc - 3 v common mode input .................................................................. v cc maximum power dissipation (p d ): device type 01 ........................................................................ 80 w 1/ device type 02 ........................................................................ 97 w 2/ thermal resistance, junction-to-case ( t jc ): device type 01 ........................................................................ 2.2 q c/w device type 02 ........................................................................ 1.8 q c/w junction temperature (t j )........................................................... +200 q c lead temperature (soldering, 10 seconds) ................................. +300 q c storage temperature range......................................................... -65 q c to +150 q c 1.4 recommended operating conditions. supply voltage ( v cc ) ............................................................... 34 v dc operating temperature range: device type 01 (t a )................................................................. -55 q c to +125 q c device type 02 (t c ) ................................................................ -55 q c to +125 q c 1/ at ambient temperature of +25 q c, derate at 2.2 q c/w above ambient temperature of +25 q c. 2/ at case temperature of +25 q c, derate at 1.8 q c/w above case temperature of +25 q c.
standard microcircuit drawing size a 5962-87620 defense supply center columbus columbus, ohio 43216-5000 revision level b sheet 3 dscc form 2234 apr 97 2. applicable documents 2.1 government specification, standards, and handbooks. the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of these documents are those liste d in the issue of the department of defense index of specifications and standards (dodiss) and supplement thereto, cited in the solicitation. specification department of defense mil-prf-38534 - hybrid microcircuits, general specification for. standards department of defense mil-std-883 - test method standard microcircuits. mil-std-973 - configuration management. mil-std-1835 - interface standard for microcircuit case outlines. handbooks department of defense mil-hdbk-103 - list of standard microcircuit drawings (smd's). mil-hdbk-780 - standard microcircuit drawings. (unless otherwise indicated, copies of the specification, standards, and handbooks are available from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence. in the event of a conflict between the text of this drawing and the references cited herein, the tex t of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirements. the individual item performance requirements for device class h shall be in accordance with mil-prf-38534. compliance with mil-prf-38534 may include the performance of all tests herein or as designated in the device manufacturer's quality management (qm) plan or as designated for applicable device class. therefore, the tests and inspections herein may not be performed for applicable device class (see mil-prf-38534). furthermore, the manufacturers may take exceptions or use alternate methods to the tests and inspections herein and not perform them. however, the performance requirements as defined in mil-prf-38534 shall be met for the applicable device class. the modification in the qm plan shall not affect the form, fit, or function as described herein. 3.2 design, construction, and physical dimensions. the design, construction, and physical dimensions shall be as specified in mil-prf-38534 and herein. 3.2.1 case outline(s). the case outline(s) shall be in accordance with 1.2.2 herein and on figure 1. 3.2.2 terminal connections. the terminal connections shall be as specified on figure 2. 3.3 electrical performance characteristics. unless otherwise specified herein, the electrical performance characteristics are as specified in table i and shall apply over the full specified operating temperature range.
standard microcircuit drawing size a 5962-87620 defense supply center columbus columbus, ohio 43216-5000 revision level b sheet 4 dscc form 2234 apr 97 3.4 electrical test requirements. the electrical test requirements shall be the subgroups specified in table ii. the electri cal tests for each subgroup are defined in table i. 3.5 marking of device(s). marking of device(s) shall be in accordance with mil-prf-38534. the device shall be marked with the pin listed in 1.2 herein. in addition, the manufacturer's vendor similar pin may also be marked as listed in mil-hdbk - 103 and qml-38534. 3.6 data. in addition to the general performance requirements of mil-prf-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group a lot sample, for each device type listed herein. also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. this data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (dscc-va) upon request. 3.7 certificate of compliance. a certificate of compliance shall be required from a manufacturer in order to supply to this drawing. the certificate of compliance (original copy) submitted to dscc-va shall affirm that the manufacturer's product meets the performance requirements of mil-prf-38534 and herein. 3.8 certificate of conformance. a certificate of conformance as required in mil-prf-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. quality assurance provisions 4.1 sampling and inspection. sampling and inspection procedures shall be in accordance with mil-prf-38534 or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. 4.2 screening. screening shall be in accordance with mil-prf-38534. the following additional criteria shall apply: a. burn-in test, method 1015 of mil-std-883. (1) test condition b or d. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either dscc-va or the acquiring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of mil-std-883. (2) t a = +125 ( c minimum for device type 01 and t c = +125 ( c, minimum for device type 02. b. interim and final electrical test parameters shall be as specified in table ii herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer.
standard microcircuit drawing size a 5962-87620 defense supply center columbus columbus, ohio 43216-5000 revision level b sheet 5 dscc form 2234 apr 97 table i. electrical performance characteristics. limits test symbol conditions -55 q c < t a < +125 q c v cc = 34 v dc unless otherwise specified group a subgroups device type min max unit input offset voltage v io t a = +25 q c 1 01 -5 +5 mv input offset voltage drift dv io t a = -55 q c and +125 q c 2, 3 01 -40 +40 p v/ q c 1 -20 +20 input bias current i ib 2, 3 01 -35 +35 na 1 -3 +3 input offset current i io 2, 3 01 -7 +7 na 1 -100 +100 +psrr -v cc = -34 v dc, +v cc = +10 v to +40 v dc 2, 3 -200 +200 1 -100 +100 power supply rejection ratio -psrr +v cc = +34 v dc, -v cc = -10 v to -40 v dc 2, 3 01 -200 +200 p v/v 1 80 common mode rejection ratio cmrr v cm = 22 v, f = dc 2, 3 01 76 db supply current i cc v cm = 0 v, no load condition 1, 2, 3 01 -10 +10 ma i o = 10 a peak 4 -26 i o = 10 a peak 4 26 r l = 10 k : : 5, 6 -30 output voltage peak v op r l = 10 k : : 5, 6 01 30 v output current peak i op r l = 2.6 : : , t a = +25 q c 401 10 a voltage gain a vs r l = 10 k : : 4, 5, 6 01 94 db slew rate sr r l = 6.5 : : , t a = +25 q c 4 01 1.35 v/ p s
standard microcircuit drawing size a 5962-87620 defense supply center columbus columbus, ohio 43216-5000 revision level b sheet 6 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. limits test symbol conditions 1/ -55 q c < t c < +125 q c v cc = 34 v dc unless otherwise specified group a subgroups device type min max unit 1, 3 10 supply current i s v in = 0 v dc, g = 100, 2/ r cl = 0.1 : : , v cm = 0 v dc 2 02 13 ma 1 -16.0 +16.0 2 -22.5 +22.5 v in = 0 v dc, g = 100, 2/ r cl = 0.1 : : , v cc = 10 v dc 3 -21.2 +21.2 1 -10.0 +10.0 2 -16.5 +16.5 v in = 0 v dc, g = 100, 2/ r cl = 0.1 : : , v cc = 34 v dc 3 -15.2 +15.2 1 -11.2 +11.2 2 -17.7 +17.7 input offset voltage v os v in = 0 v dc, g = 100, 2/ r cl = 0.1 : : , v cc = 40 v dc 3 02 -16.7 +16.7 mv 1 40.0 input bias current (+in) +i s v in = 0 v dc, r bias < 100 m : : 2, 3 02 80.0 na 1 40.0 input bias current (-in) -i s v in = 0 v dc, r bias < 100 m : : 2, 3 02 80.0 na 1 10.0 input offset current i os v in = 0 v dc, r bias < 100 m : : 2, 3 02 30.0 na v cc = 40 v dc, i o = 68 ma, r l = 500 : : 4, 5, 6 34 v cc = 34 v dc, i o = 4 a, r l = 6 : : 4, 5, 6 24 v cc = 18 v dc, i o = 10 a, r l = 1 : , t c = +25 q c and -55 q c 4, 6 10 output voltage v o v cc = 16 v dc, i o = 8 a, r l = 1 : : , t c = +125 q c 5 02 8 v current limits i cl v cc = 16 v dc, r cl = 0.1 : : , r l = 1 : : , t c = +25 q c 2 / 4 02 5.0 7.9 a see footnotes at end of table.
standard microcircuit drawing size a 5962-87620 defense supply center columbus columbus, ohio 43216-5000 revision level b sheet 7 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. limits test symbol conditions 1/ -55 q c < t c < +125 q c v cc = 34 v dc unless otherwise specified group a subgroups device type min max unit current limits i cl v cc = 16 v dc, 2/ r cl = 0.1 : : , r l = 1 : : , t c = +25 q c 4 02 5.0 7.9 a stability/noise e n v cc = 34 v dc, c l = 1.5 nf, g = 1 4, 5, 6 02 1.0 mv slew rate s r v cc = 34 v dc, v in > 4 vp-p, r l = 500 : : 4, 5, 6 02 1.0 10 v/ p s open loop gain a ol v cc = 34 v dc, v in > 4 vp-p, r l = 500 : : , f = 15 hz 4, 5, 6 02 91 db common mode rejection cmr v cc = 15 v dc, v cm = 9 v dc, +f = dc 4, 5, 6 02 70 db 1/ during all group a testing, terminal connection f. o. (pin 7) is left open. 2/ a current limiting resistor (r cl ) is connected between c l + to the output and c l - to the output during these tests.
standard microcircuit drawing size a 5962-87620 defense supply center columbus columbus, ohio 43216-5000 revision level b sheet 8 dscc form 2234 apr 97 case outline x. inches millimeters symbol min max min max a 1.510 1.550 38.35 39.37 b 0.745 0.770 18.92 19.56 c 0.260 0.300 6.60 7.62 d 0.038 0.042 0.97 1.07 e 0.080 0.105 2.03 2.67 f 40 q bsc 40 q bsc g 0.500 bsc 12.7 bsc h 1.186 bsc 30.12 bsc j 0.593 bsc 15.06 bsc k 0.400 0.500 10.16 12.70 q 0.151 0.161 3.84 4.09 r 0.980 1.020 24.89 25.91 notes: 1. leads in true position within 0.010 inch (0.25 mm) r at mmc at seating plane. 2. the u. s. preferred system of measurement is the metric si. this case outline was originally designed using inch- pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound shall take precedence. 3. pin numbers are for reference and may not be marked on package. figure 1. case outline(s).
standard microcircuit drawing size a 5962-87620 defense supply center columbus columbus, ohio 43216-5000 revision level b sheet 9 dscc form 2234 apr 97 case outline y. inches millimeters symbol min max min max a 1.510 1.550 38.35 39.37 b 0.745 0.770 18.92 19.56 c 0.225 0.250 5.71 6.35 d 0.038 0.042 0.97 1.07 e 0.080 0.105 2.03 2.67 f 40 q bsc 40 q bsc g 0.500 bsc 12.7 bsc h 1.186 bsc 30.12 bsc j 0.593 bsc 15.06 bsc k 0.400 0.500 10.16 12.70 q 0.151 0.161 3.84 4.09 r 0.980 1.020 24.89 25.91 notes: 1. leads in true position within 0.010 inch (0.25 mm) r at mmc at seating plane. 2. the u. s. preferred system of measurement is the metric si. this case outline was originally designed using inch- pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound shall take precedence. 3. pin numbers are for reference and may not be marked on package. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-87620 defense supply center columbus columbus, ohio 43216-5000 revision level b sheet 10 dscc form 2234 apr 97 device type 01and 02 case outline x and y terminal number terminal symbol 1 2 3 4 5 6 7 8 output +current limit (c l +) +v cc +in -in -v cc no connection -current limit (c l -) figure 2. terminal connections.
standard microcircuit drawing size a 5962-87620 defense supply center columbus columbus, ohio 43216-5000 revision level b sheet 11 dscc form 2234 apr 97 table ii. electrical test requirements. mil-prf-38534 test requirements subgroups (in accordance with mil-prf-38534, group a test table) interim electrical parameters 1 final electrical parameters 1*, 2, 3, 4, 5, 6 group a test requirements 1, 2, 3, 4, 5, 6 group c end-point electrical parameters 1 * pda applies to subgroup 1. 4.3 conformance and periodic inspections. conformance inspection (ci) and periodic inspection (pi) shall be in accordance with mil-prf-38534 and as specified herein. 4.3.1 group a inspection (ci). group a inspection shall be in accordance with mil-prf-38534 and as follows: a. tests shall be as specified in table ii herein. b. subgroups 7, 8, 9, 10, and 11 shall be omitted. 4.3.2 group b inspection (pi). group b inspection shall be in accordance with mil-prf-38534. 4.3.3 group c inspection (pi). group c inspection shall be in accordance with mil-prf-38534 and as follows: a. end-point electrical parameters shall be as specified in table ii herein. b. steady-state life test, method 1005 of mil-std-883. (1) test condition b or d. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either dscc-va or the acquiring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of mil-std-883. (2) t a = +125 ( c minimum for device type 01 and t c = +125 ( c, minimum for device type 02. (3) test duration: 1,000 hours, except as permitted by method 1005 of mil-std-883. 4.3.4 group d inspection (pi). group d inspection shall be in accordance with mil-prf-38534. 5. packaging 5.1 packaging requirements. the requirements for packaging shall be in accordance with mil-prf-38534.
standard microcircuit drawing size a 5962-87620 defense supply center columbus columbus, ohio 43216-5000 revision level b sheet 12 dscc form 2234 apr 97 6. notes 6.1 intended use. microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 replaceability. microcircuits covered by this drawing will replace the same generic device covered by a contractor- prepared specification or drawing. 6.3 configuration control of smd's. all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this coordination will be accomplished in accordance with mil-std-973 using dd form 1692, engineering change proposal. 6.4 record of users. military and industrial users shall inform defense supply center columbus when a system application requires configuration control and the applicable smd. dscc will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectronic devices (fsc 5962) should contact dscc-va, telephone (614) 692-0544. 6.5 comments. comments on this drawing should be directed to dscc-va, p. o. box 3990, columbus, ohio 43216-5000, or telephone (614) 692-0512. 6.6 sources of supply. sources of supply are listed in mil-hdbk-103 and qml-38534. the vendors listed in mil-hdbk- 103 and qml-38534 have submitted a certificate of compliance (see 3.7 herein) to dscc-va and have agreed to this drawing.
standard microcircuit drawing bulletin date: 00-01-11 approved sources of supply for smd 5962-87620 are listed below for immediate acquisition only and shall be added to mil-hdbk-103 and qml-38534 during the next revision. mil-hdbk-103 and qml-38534 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by dscc-va. this bulletin is superseded by the next dated revision of mil-hdbk-103 and qml-38534. standard microcircuit drawing pin 1/ vendor cage number vendor similar pin 2/ 5962-8762001xa 5962-8762001xc 5962-8762001ya 31757 31757 60024 42106 42106 pa51m/883 5962-8762002XA 5962-8762002xc 5962-8762002ya 31757 31757 60024 42106-1 42106-1 pa51m/883 1/ the lead finish shown for each pin, representing a hermetic package, is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine availability. 2/ caution . do not use this number for item acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. vendor cage vendor name number and address 31757 micropac industries, incorporated 905 e. walnut street garland, tx 75040 point of contact: 912 e. walnut street garland, tx 75040 60024 apex microtechnology corporation 5980 n. shannon road tucson, az 85741 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin.

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