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extended temperature four character 5.0 mm (0.20 inch) 5 x 7 alphanumeric display for sunlight viewable applications technical data hdsp-2351 hdsp-2352 HDSP-2353 features ? sunlight viewable up to 10,000 footcandles ? wide operating temperature range -55 c to +85 c ? compact ceramic package ? wide viewing angle ? end and row stackable ? 5 x 7 led matrix displays full ascii set ? integrated shift registers with constant current led drivers ? ttl compatible ? categorized for luminous intensity ? hdsp-2351/2353 categorized for color applications ? military avionics cockpit displays, aircraft system monitors, fuel management and airborne navigational radio systems ? military test and ground support field equipment ? military vehicles and equipment ? other applications requiring readability in direct sunlight description the hdsp-2351/2352/2353 displays are designed for use in military applications requiring readability in bright sunlight. with a proper contrast enhance- ment filter and heat sinking, these displays are readable in sunlight ambients up to 10,000 footcandles. the character font is a 5.0 mm (0.20 inch) 5 x 7 led array for displaying alphanumeric information. these devices are available in yellow, high efficiency red, and high performance green. each four character cluster is packaged in a 12-pin dual-in-line package. an on-board serial-in- parallel-out 7-bit shift register associated with each digit controls constant current led row drivers. full character display is achieved by external column strobing. devices yellow high efficiency red high performance green hdsp-2351 hdsp-2352 HDSP-2353
2 package dimensions hdsp-235x x2 xxyy 20.01 (0.790) max. 2.84 (0.112) ref. see note 3 see note 3 8.43 (0.332) 4.87 (0.192) ref. 5.00 ?0.13 (0.197 ?0.005) 123456 12 11 10 9 8 7 pin 1 marked by dot on back of package 5.08 (0.200) 2.54 (0.100) 1.27 ?0.13 (0.050 ?0.005) 6.85 (0.270) 2.54 ?0.13 (0.100 ?0.005) non accum. typ. 1.27 (0.050) typ. 0.54 ?0.08 (0.020 ?0.003) c l 6.35 ?0.25 (0.250 ?0.010) 0.25 ?0.05 (0.010 ?0.002) typ. color bin 1.78 (0.070) 2.41 (0.095) 3.56 (0.140) 2.79 ?0.13 (0.110 ?0.005) 1.27 (0.050) pin 1 date code part number 712 61 pin function pin function 1 2 3 4 5 6 column 1 column 2 column 3 column 4 column 5 int. connect* 7 8 9 10 11 12 data out v b v cc clock ground data in *do not connect or use notes: 1. dimensions in millimeters (inches). 2. unless otherwise specified, the tolerance on all dimensions is ?0.38 mm (?0.15"). 3. characters are centered with respect to leads within ?0.13 mm (?0.005"). 4. lead material is gold plated copper alloy. 12 34 luminous intensity category
3 electrical characteristics over operating temperature range (-55 c to +85 c) description symbol test conditions min. typ.* max. units fig. supply current i cc v cc = 5.25 v v b = 0.4 v 50 60 ma v clock = v data = 2.4 v all sr stages = v b = 2.4 v 90 100 ma logical 1 column input current i col v cc = 5.25 v v b = 0.4 v 500 m a (any column pin) v col = 3.5 v 4 column input current i col all sr stages = v b = 2.4 v 550 653 ma (any column pin) logical 1 v b , clock or data input v ih 2.0 v threshold high v cc = v col = 4.75 v v b , data input v il 0.8 v threshold low clock input v il v cc = 4.75 v 0.6 v threshold low input current v b , clock i ih v cc = 5.25 v, v ih = 2.4 v 20 80 m a logical 1 data in i ih 10 40 m a input current v b , clock i il v cc = 5.25 v, v il = 0.4 v -500 -800 m a logical 0 data in i il -250 -400 m a data out voltage v oh v cc = 4.75 v, i oh = -0.5 ma, i col = 0 ma 2.4 3.4 v v ol v cc = 4.75 v, i ol = 1.6 ma, i col = 0 ma 0.2 0.4 v p d v cc = 5.0 v, v col = 3.5 v, 17.5% df 1.05 w 2 15 leds on per character, v b = 2.4 v thermal resistance ic r q j-pin 10 c/w/ 2 junction-to-pin device leak rate 5x10 -8 cc/sec recommended operating conditions over operating temperature range (-55?c to +85?c) parameter symbol min. nom. max. units fig. supply voltage v cc 4.75 5.0 5.25 v data out current, low state i ol 1.6 ma data out current, high state i oh -0.5 ma column input voltage, column on hdsp-2381/2382/2383 v col 2.75 3.5 v 4 setup time t setup 70 45 ns 1 hold time t hold 30 0 ns 1 width of clock t w(clock) 75 ns 1 clock frequency f clock 0 3 mhz 1 clock transition time t thl 200 ns 1 free air operating temperature range [1,2] t a -20 85 c3 *all typical values specified at v cc = 5.0 v and t a = 25 c unless otherwise noted. **power dissipation per package with four characters illuminated. power dissipation per package**
4 yellow hdsp-2351 description symbol test conditions min. typ.* max. units fig. peak luminous intensity per led [4,8] l v peak v cc = 5.0 v, v col = 3.5 v 2400 3400 m cd 3 (character average) t i = 25 c [6] , v b = 2.4 v dominant wavelength [5,7] l d 585 nm peak wavelength l peak 583 nm optical characteristics high efficiency red hdsp-2352 description symbol test conditions min. typ.* max. units fig. peak luminous intensity per led [4,8] l v peak v cc = 5.0 v, v col = 3.5 v 1920 2850 m cd 3 (character average) t i = 25 c [6] , v b = 2.4 v dominant wavelength [7] l d 626 nm peak wavelength l peak 635 nm high performance green HDSP-2353 description symbol test conditions min. typ.* max. units fig. peak luminous intensity per led [4,8] l vpeak v cc = 5.0 v, v col = 3.5 v 2400 3000 m cd 3 (character average) t i = 25 c [6] , v b = 2.4 v dominant wavelength [5,7] l d 574 nm peak wavelength l peak 568 nm *all typical values specified at v cc = 5.0 v and t a = 25 c unless otherwise noted. **power dissipation per package with four characters illuminated. notes: 0 1.the hdsp-2351/2352/2353 should be derated linearly above 50 c at 24.3 mw/ c, based on a device mounted such that the thermal resistance from ic junction to ambient is 45 c/w (10 c/w r q j-pin and 35 c/w pin-a ). see figure 2 for power deratings based on lower thermal resistance mounting. 2.operation above 50 c ambient is possible provided the following conditions are met. the junction temperature should not exceed 125 c (t j ) and the temperature at the pins should not exceed 100 c (t c ). 3.maximum allowable dissipation is derived from v cc = 5.25 v, v b = 2.4 v, v col = 3.5 v, 20 leds on per character, 20% df. 0 4.these led displays are categorized for luminous intensity with the intensity category designated by a letter code on the bottom of the package. 5.the hdsp-2351/2353 are categorized for color with the color category designated by a number code on the bottom of the package. 6.t i refers to the initial case temperature of the device immediately prior to the light measurement. 7.dominant wavelength l d , is derived from the cie chromaticity diagram, and represents the single wavelength which defines the color of the device. 8.the luminous sterance of the led may be calculated using the following relationships: l v (cd/m 2 ) = i v (candela)/a (metre) 2 l v (footlamberts) = p l v (candela)/a (foot) 2 a = 5.3 x 10 -8 m 2 = 5.8 x 10 -7 (foot) 2
5 figure 1. switching characteristics (t a = -20 c to +85 c). absolute maximum ratings supply voltage v cc to ground ......................................... -0.5 v to + 6.0 v inputs, data out and v b ......................................................... -0.5 v to v cc column input voltage, v col ............................................. -0.5 v to + 6.0 v free air operating temperature range, t a [1,2] ..................................................................... -55 c to +85 c storage temperature range, t s ....................................... -55 c to +100 c maximum allowable package dissipation at t a = 25 c [1,2,3] ..................................................................... 1.74 watts maximum solder temperature 1.59 mm (0.063 in.) below seating plane t<5 sec ............................................................ 260 c t hold 1/f max. t w t thl t setup t setup t hold t phl t plh parameter condition min. typ. max. units f clock clock rate 3 mhz t plh , t phl propagation delay clock to data out c l = 15 pf r l = 2.4 k w 125 ns 0.4 v clock data in 0.4 v data out 0.4 v 2.4 v 2.4 v 2.4 v 1.5 v 1.5 v 90 % 10 % 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v
6 figure 2. maximum allowable power dissipation vs. ambient temperature as a function of thermal resistance ic junction to ambient air. r q ja . figure 3. relative luminous intensity vs. device substrate (pin) temperature. figure 4. peak column current vs. column voltage. p d max. ?maximum allowable power dissipation ?watts 0 0 t a ?ambient temperature ?? 90 20 70 80 100 2.0 1.8 1.6 1.4 1.0 0.8 0.4 0.2 60 50 40 30 10 r q ja = 45?/w r q ja = 34?/w r q ja = 23?/w 1.2 0.6 1.74 reverse luminous intensity -60 0 t pm ?device pin temperature ?? 120 5.0 60 -40 0 20 80 140 4.0 3.0 2.0 1.0 -20 40 100 hdsp-2352 HDSP-2353 hdsp-2351 i col ?peak column current ?ma 0 0 v col ?column voltage ?volts 5.0 600 3.0 6.0 500 400 300 200 1.0 2.0 4.0 100
7 figure 5. block diagram of an hdsp-235x series led alphanumeric display. electrical description the electrical configuration of the hdsp-235x series alphanumeric displays allows for an effective interface to a microprocessor data source. each display device contains four 5x7 led dot matrix characters and two integrated circuits, as diagrammed in figure 5. the two integrated circuits, with ttl compatible inputs, form a 28 bit serial-in-parallel-out column data shift register. the data input is connected to shift register bit position 1 and the data output is connected to bit position 28. the shift register parallel outputs are connected to constant current sinking led row drivers that sink a nominal 19.6 ma. a logic 1 stored in the shift register enables the corresponding led row driver and a logic 0 stored in the shift register disables the corresponding led row driver. column data is loaded into an on- board shift register with high to low transitions of the clock input. to load character information into the display, column data for the character 4 is loaded first and the column data for character 1 is loaded last in the following manner: the 7 data bits for column 1, character 4 are loaded into the on-board shift register. next, the 7 data bits for column 1, character 3 are loaded into the on-board shift register, shifting the character 4 data over one character position. this process is repeated until all 28 bits of column data are loaded into the on-board shift register. then, the column 1 input is energized to illuminate column 1s in all four characters. the procedure is repeated for columns 2, 3, 4, and 5. the light output of the display may be dimmed by pulse width modulating (pwm) the blanking input v b , with the brightness being in direct proportion to the led on-time. when the blanking input is at logic high the display is illuminated and when the blanking input is at logic low the display is blanked. these displays may be dimmed by pwm on the order of a 2000:1 change in brightness while maintaining light output and color uniformity between characters. the led on-time duty factor, df, may be determined when the time to load the on-board shift register, t, the column on-time without blanking, t, and the time display is blanked, tb, are known: t df = 5(t + t + tb) led matrix 2 rows 1-7 rows 8-14 led matrix 3 rows 1-7 rows 15-21 led matrix 4 rows 1-7 rows 22-28 1 2 345 column column drive inputs 1234567 constant current sinking led drivers blanking control, v b 28-bit sipo shift register serial data input rows 1234567 clock serial data output
8 where: 5(t + t + tb) is 1/column refresh rate the column driver inputs should be strobed at a refresh rate of 100 hz or faster to achieve a flicker free display. the value of df approaches 20% when tb = 0 and t is very small compared to t. the esd susceptibility of these ic devices is class a of mil-std-883 or class 2 of dod-std-1686 and dod-hdbk-263. for information on interfacing these displays to microprocessor data sources and techniques for intensity control, see application note 1016. power dissipation and low thermal resistance design considerations the light output of the hdsp-235x devices is a function of temperature, decreasing 1.5% for each 1 c increase in junction temperature. therefore, it is desirable to maintain as low device junction temperature as possible to insure sufficient light output for sunlight readability. this is preferably achieved by designing for a low junction to ambient thermal resistance, or alternatively by controlling total display power dissipation by derating, see data sheet figure 2. power dissipation calculation: power dissipation may be calculated using the equations of figure 6a. for typical applications, the average pixel count per character is 15. the maximum power dissipation is calculated with a pixel count of 20 per character. as demonstrated in figure 6c, the maximum power dissipation is 1.741 w with df = 20%, v cc = 5.25 v and v col = 3.5 v. the average power dissipation is 1.161 w per device with df = 20%, v cc = 5.0 v and v col = 3.5 v. as shown in figure 4 on the data sheet, the column current, i col , is constant when the column input voltage, v col , is at 2.75 v or greater. setting v col substantially greater than 2.75 v does not increase light output, but does add to device total power dissipation. for optimum performance, it is recommended that v col be set between 2.75 v and 3.5 v. junction temperature and device thermal resistance: it is necessary to control the ic junction temperature, t j (ic), to insure proper operation of the display: t j (ic)max = 125 c the equations to calculate t j (ic) are given in figure 6b. t j (ic) will be higher than the device substrate temperature where as the individual led pixel junction temperatures, t j (led), will be nearly the same as the substrate temperature. a sample calculation is presented in figure 6c. an easy design rule is to obtain an ic junction to ambient thermal resistance, r q j-a , that establishes the device pin temperature less than 100 c. the value of r q j-a = 23 c/w will permit device operation in an ambient tempera- ture of 85 c, without derating. figure 7 gives the maximum values for r q j-a for reliable device operation in ambient temperatures from 25 c to 85 c. to achieve a low value of r q pin-a , the following designs may be incorporated into the display system: 1. mount the displays on a double sided maximum metalized pc board, as illustrated in figure 8. for single line display assemblies, a double sided maximum metalized pc board is a cost effective way to achieve a low thermal resistance to ambient. lands are sued instead of traces as the current carrying elements. each land is made as wide as possible, consistent with circuit layout restrictions, to achieve metalized surface area to radiate thermal energy. isolation strips, 0.64 mm (0.025 inch) wide, are etched from the board to electrically isolate the lands. pc board thermal resistance values in the range of 35 c/w per device are achievable for single line display assemblies. air flow across the display pc board assembly dissipates the heat. 2. install a metal plate, or bar, between the display packages and the pc board, with the bar mechanically fastened to the chassis, as illustrated in figure 9a. for multiple display lines, a metal plate may be placed between the display packages and the pc board to conduct the heat to the chassis housing assembly. the metal plate may be electrically insulated from the pc board by a thermally conductive insulator. heat sink bars are formed in the metal plate by milling out lead clearance slots. the ceramic package of a display rests on one of the heat sink bars with the device leads passing through the slots to make electrical contact with the pc board. the heat is transferred from the display ceramic package into the metal plate. the chassis housing acts as the thermal radiator to dissipate the heat into the surrounding
9 environment. the metal plate must be mechanically fastened to the housing assembly, otherwise it will act only as a thermal capacitor and will not dissipate the heat. 3. install a heat pipe between the display packages and the pc board, with the heat pipe mechanically fastened to the chassis housing, as shown in figure 9b. the heat pipe is a low mass alternative to the metal plate described above. a heat pipe is a small tube, filled with a chemical, that transfers heat from the source to a heat sink with minimal thermal impedance. it is not a heat sink. the heat pipe transfers the heat directly from the display ceramic package to the chassis housing which dissipates the heat into the surrounding air. 4. utilize a heat pipe to transfer the heat from a maximum metalized pc board to a finned heat sink mounted on the back of the assembly housing, as shown in figure 10. the heat pipe is placed against the back side of a maximum metalized pc board, electrically isolated by a thermally conductive insulator. when the heat pipe is connected to a finned heat sink on the back of the chassis housing, pc board to external ambient thermal resistance values in the range of 10 to 15 c/w per device can be achieved. the heat generated by the displays is directly dissipated into the external ambient surrounding the chassis housing by the finned heat sink. contact the following manu- facturers for information on: heat pipe technology: noren products 3545 haven avenue menlo park, ca 94025 (650) 365-0632 thermally conductive insulators; sil-pad: bergquist company 5300 edina industrial blvd. minneapolis, mn 55435 (612) 835-2322 pd=p(i cc) + p(i ref ) + p(i col ); total power dissipation per device. where: p(i cc ) = i cc (v b = 0.4 v) B v cc ; power dissipated by the two ics when the display is blanked. p(i ref ) = 5 B [i cc (v b = 2.4 v) C i cc (v b = 0.4 v)] B v cc B (n/35) B df; additional power dissipated by the two ics with characters illuminated. p(i col ) = 5 B i col B v col (n/35) B df; power dissipated by the led pixels when the characters are illuminated. n = 15 pixels per character for average power. n = 20 pixels per character for maximum power. figure 6a. equations for calculating device power dissipation. delta t j (ic) = r q j-pin B pd; ic junction temperature rise above device pin temperature. where: r q j-pin = 10 c/w; the thermal resistance ic junction to device pin 1. delta t pin = r q pin-a B pd; device pin temperature rise above the ambient temperature, t a . where: r q pin-a = the thermal resistance, device pin to ambient through the pc board, on a per device basis. t j (ic) = t a + [delta t j (ic) + delta t pin ]; ic junction temperature, the sum of the ambient temperature and the temperature rise above ambient. figure 6b. equations for calculating ic junction.
10 figure 8. maximum metalized pc board, double sided, for mounting hdsp-235x series displays. figure 7. maximum thermal resistance ic junction to ambient, r q j-a, vs. ambient temperature. based on: p d max. = 1.741 w, t j (ic) max. = 125 c. device maximum power dissipation: ic maximum power dissipation: p(i cc ) = (0.060a) (5.25 v) = 0.315 w p(i ref ) = 5(0.100 a C 0.060 a) (5.25 v) (20/35) (1/5) = 0.120 w i col power dissipation: p(i col ) = 5(0.653 a) (3.5 v) (20/35) (1/5) = 1.306 w device maximum power dissipation: pd(max) = 0.315 w + 0.120 w + 1.306 w = 1.741 w ic junction temperature, t a = 85 c: ic junction temperature rise above substrate pin: delta t j (ic) = (10 c/w) (1.741 w) = 17.4 c rise device pin temperature rise above ambient: delta t (pin) = (13 c/w) (1.741 w) = 22.6 c rise ic junction temperature: t j (ic) = 85 c + (17.4 c + 22.6 c) = 125.0 c figure 6c. sample calculation of device maximum power dissipation and ic junction temperature for an hdsp-235x series device operating in an ambient of t a = 85 c. note: i cc and i col values taken from the data sheet electrical characteristics. r q j-pin = 10 c/w and r q j-pin-a = 13 c/w. 0.63 mm (0.025 in.) electrical isolation strips between lands "land," current carrying element 0.5 ounce copper metalization mounting and tooling holes hdsp-235x series alphanumeric displays r q ja max. c/w 25 0 t a ?? 35 65 75 85 60 55 40 35 25 20 10 5 55 45 30 15 45 50 57 23
11 figure 10. using a heat pipe to transfer display generated heat to an externally mounted finned heat sink. figure 9a. metal plate mounted between display devices and pc board, mechanically fastened to chassis housing. figure 9b. heat pipes mounted between display devices and pc board, mechanically fastened to chassis housing. chassis housing thickness of plate 2.54 mm (0.100 in.) max. hdsp-235x series displays thermally conductive insulator metal plate chassis mounting bracket display pc board width of bar under display 2.54 mm (0.100 in.) max. chassis housing hdsp-235x series displays thermally conductive insulator heat pipes with chassis mounting bracket display pc board hdsp-235x series led display heat pipe mounting flange, heat pipe to display pc board "sil-pad" thermal conductive electrical insulating display pc board with maximum back surface metallization finned heat sink mounted on back of chassis housing
contrast enhancement for more information on contrast enhancement, please consult application notes 1015 and 1029. www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies, inc. obsoletes 5954-8411 (10/88) 5966-1858e (11/99)

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