description this series of low current blue chipleds is designed specifically for low current application. this makes them very suitable for cellular phone and portable equipment which runs off a battery. these parts are according to industry standard footprint. in order to facilitate agilent hsmb-c1xx surface mount chipleds data sheet features ? various size and mount options available ? industry standard footprint ? operating temperature range of C30?c to +85?c ? compatible with ir solder reflow ? available in 8 mm tape on 7" diameter reel applications ? lcd backlighting ? keypad backlighting ? pushbutton backlighting ? symbol indicator ? front panel indicator caution: hsmb-c1xx leds are class 1 esd sensitive per mil-std-1686. please observe appropriate precautions during handling and processing. refer to agilent technologies application note an-1142 for additional details. hsmb-c112/c172/c192/c196/c152 automated pick and place operation, these chipleds are shipped in tape and reel, with 4000 units per reel for hsmb- c172/192/196 series and 3000 units per reel for the hsmb- c112/152 series. these parts are compatible with ir soldering.
2 package dimensions 3.2 (0.126? 0.5 (0.020) 0.9 (0.035) polarity cathode
mark 1.5 (0.059) led die clear
epoxy pc board soldering
terminal 1.0 (0.039) 1.0 (0.039) 2.6 (0.102? 1.6 (0.063? cathode line hsmx-c112 notes:
1. all dimensions in millimeters (inches).
2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. 3.2 (0.126? 0.5 (0.020) 0.5 ?0.2
(0.020 ?0.008) 0.6 (0.024) polarity cathode
mark 1.1 (0.043) 0.5 ?0.2
(0.020 ?0.008) 2.0 (0.079) 0.8 (0.031) led die diffused
epoxy pc board soldering
terminal 1.6 (0.063) cathode line hsmx-c152 2.0 (0.079? 0.3 (0.012) 0.4 ?0.15
(0.016 ?0.006) 0.3 (0.012) polarity cathode
mark 0.8 (0.031) 0.4 ?0.15
(0.016 ?0.006) 1.4
(0.055) 0.62 (0.024) led die diffused
epoxy pc board soldering
terminal 1.25 (0.049) cathode line hsmx-c172
3 1.6
(0.063? 0.3 (0.012) 0.3 ?0.15
(0.012 ?0.006) 0.3 (0.012) polarity cathode
mark 0.6 (0.023) 0.3 ?0.15
(0.012 ?0.006) 1.0
(0.039) 0.4 (0.016) led die diffused epoxy pc board soldering
terminal 0.8 (0.031) cathode line 0.7 (0.028) min. package dimensions notes:
1. all dimensions in millimeters (inches).
2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. 1.6
(0.063? 0.3 (0.012) 0.3 ?0.15
(0.012 ?0.006) 0.3 (0.012) polarity cathode
mark 0.8 (0.031) 0.3 ?0.15
(0.012 ?0.006) 1.0
(0.039) 0.4 (0.016) led die diffused epoxy pc board soldering
terminal 0.8 (0.031) cathode line 0.7 (0.028) min. hsmx-c192 hsmx-c196
4 device selection guide package dimension (mm) gan blue package description 1.6 (l) x 0.8 (w) x 0.6 (h) HSMB-C196 untinted, diffused 1.6 (l) x 0.8 (w) x 0.8 (h) hsmb-c192 untinted, diffused 2.0 (l) x 1.25 (w) x 0.8 (h) hsmb-c172 untinted, diffused 3.2 (l) x 1.0 (w) x 1.5 (h) [1] hsmb-c112 untinted, nondiffused 3.2 (l) x 1.6 (w) x 1.1 (h) hsmb-c152 untinted, diffused note: 1. right angle package. electrical characteristics at t a = 25?c forward reverse voltage breakdown capacitance c thermal v f (volts) v r (volts) (pf), v f = 0, resistance @ i f = 10 ma @ i r = 100 m a f = 1 mhz r q j-pin (?c/w) part number typ. max. min. typ. typ. hsmb-c152/c172/c192/c196 4.1 4.6 5 43 550 hsmb-c112 4.1 4.6 5 43 550 absolute maximum ratings at t a = 25?c parameter hsmb-c112/172/192/196/152 units dc forward current [1] 10 ma power dissipation 48 mw reverse voltage (i r = 100 m a) 5 v led junction temperature 95 ?c operating temperature range C30 to +85 ?c storage temperature range C40 to +85 ?c soldering temperature see ir soldering profile (figure 7) note: 1. derate linearly as shown in figure 4. optical characteristics at t a = 25?c luminous color intensity peak dominant luminous i v (mcd) wavelength wavelength viewing angle efficacy @ 10 ma [1] l peak (nm) l d [2] (nm) 2 q 1/2 degrees [3] h v (lm/w) part number min. typ. typ. typ. typ. typ. hsmb-c112 1.0 3.1 428 462 130 55 hsmb-c172 1.0 3.0 428 462 170 55 hsmb-c192 1.0 3.0 428 462 170 55 HSMB-C196 1.0 3.0 428 462 170 55 hsmb-c152 1.0 3.0 428 462 170 55 notes: 1.the luminous intensity i v is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2.the dominant wavelength l d is derived from the cie chromatically diagram and represents the perceived color of the device. 3. q 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. v f tolerance: 0.1 v
5 blue color bin limits [1] dom. wavelength (nm) bin id min. max. a 460 465 b 465 470 c 470 475 d 475 480 light intensity (i v ) bin limits [1] intensity (mcd) bin id min. max. a 0.11 0.18 b 0.18 0.29 c 0.29 0.45 d 0.45 0.72 e 0.72 1.10 f 1.10 1.80 g 1.80 2.80 h 2.80 4.50 j 4.50 7.20 k 7.20 11.20 l 11.20 18.00 m 18.00 28.50 n 28.50 45.00 p 45.00 71.50 q 71.50 112.50 r 112.50 180.00 s 180.00 285.00 t 285.00 450.00 u 450.00 715.00 v 715.00 1125.00 w 1125.00 1800.00 x 1800.00 2850.00 y 2850.00 4500.00 figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. figure 3. luminous intensity vs. forward current. figure 4. maximum forward current vs. ambient temperature. figure 5. relative intensity vs. angle for hsmx-c172, c192, c196, and c152. 400 100 0 600 700 20 relative intensity ?% wavelength ?nm 500 60 40 80 450 550 650 100 10 1 0.1 3.0 3.2 3.6 3.8 4.2 v f ?forward voltage ?v i f ?forward current ?ma 3.4 4.0 relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 05 15 i f ?forward current ?ma 0 40 100 120 luminous intensity
(normalized at 20 ma) 20 60 20 80 10 tolerance: 15% note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your agilent representative for information regarding currently available bins. 0 12 0 20 60 80 100 2 i f max. ?maximum forward current ?ma t a ?ambient temperature ?? 40 8 6 10 4 10 30 50 70 90 tolerance: 1 nm
6 figure 6. relative intensity vs. angle for hsmx-c112. figure 7. recommended reflow soldering profile. figure 8. recommended soldering pattern for hsmx-c112. figure 9. recommended soldering pattern for hsmx-c172. figure 10. recommended soldering pattern for hsmx-c192 and hsmx-c196. figure 11. recommended soldering pattern for hsmx-c152. relative intensity ?% 100 0 angle 40 20 60 80 0 20 100 -100 -20 -80 -60 -40 40 60 80 relative intensity ?% 100 0 angle 40 20 60 80 0 20 100 -100 -20 -80 -60 -40 40 60 80 5.0 (0.200) 1.0 (0.039) 1.5
(0.059) 1.5
(0.059) 2.0
(0.079) 0.9 (0.035) 0.2 (0.008) 0.9 (0.035) centering
board 1.2 (0.047) 1.2
(0.047) 0.9
(0.035) 1.2
(0.047) 0.8 (0.031) 0.8
(0.031) 0.7
(0.028) 0.8
(0.031) 1.5 (0.059) 1.5
(0.059) 1.5
(0.059) 2.0
(0.079) note:
1. all dimensions in millimeters (inches). 230? max. 10 sec. max. 4?/sec.
max. over 2 min. time temperature 4?/sec. max. 140-160? ??/sec.
7 figure 12. reeling orientation. figure 13. reel dimensions. x x x x x x x x x x x x x x x x x x x x cathode side printed label user feed direction 10.50 ?1.0 (0.413 ?0.039) 59.60 ?1.00
(2.346 ?0.039) 20.20 min.
( 0.795 min.) 6 ps 178.40 ?1.00
(7.024 ?0.039) 3.0 ?0.5
(0.118 ?0.020) 4.0 ?0.5
(0.157 ?0.020) 5.0 ?0.5
(0.197 ?0.020) 13.1 ?0.5
( 0.516 ?0.020) 8.0 ?1.0 (0.315 ?0.039) note:
1. all dimensions in millimeters (inches).
www.agilent.com/semiconductors e-mail: semiconductorsupport@agilent.com data subject to change. copyright ? 2002 agilent technologies, inc. obsoletes 5988-4385en june 14, 2002 5988-7127en for product information and a complete list of agilent contacts and distributors, please go to our web site. figure 14. tape dimensions. figure 15. tape leader and trailer dimensions. 8.00 ?0.30
(0.315 ?0.012) user feed
direction dim. a
(see table 1) 3.50 ?0.05
(0.138 ?0.002) 1.75 (0.069) dim. c
(see table 1) 0.20 ?0.05
(0.008 ?0.002) carrier tape cover tape dim. b
(see table 1) 4.00 (0.157) 2.00 ?0.05
(0.079 ?0.002) 4.00 (0.157) 1.50 (0.059) table 1
dimensions in millimeters (inches) cathode dim. a
?0.10 (?0.004) dim. b
?0.10 (?0.004) part number dim. c
?0.10 (?0.004) hsmx-c172 series 2.40 (0.094) 1.60 (0.063) 1.20 (0.047) hsmx-c192 series 1.80 (0.071) 0.95 (0.037) 0.87 (0.034) hsmx-c112 series 3.40 (0.134) 1.70 (0.067) 1.20 (0.047) hsmx-c196 series 1.80 (0.071) 0.95 (0.037) 0.75 (0.030) hsmx-c152 series 3.75 (0.148) 2.10 (0.083) 1.20 (0.047) hsmx-c110
position in
carrier tape dim. b
(see table 1) dim. a
(see table 1) r 1.0 ?0.05
(0.039 ?0.002) end start there shall be a
minimum of 160 mm
(6.3 inch) of empty
component pockets
sealed with cover
tape. mounted with
components. there shall be a
minimum of 160 mm
(6.3 inch) of empty
component pockets
sealed with cover
tape. minimum of
230 mm
(9.05 inch)
may consist
of carrier
and/or
cover tape. notes:
1. all dimensions in millimeters (inches).
2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components . storage condition: 5 to 30 c @ 60% rh max. baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week baking recommended condition: 60 5 c for 20 hours.
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