high-flux surface mount led technical data features high-flux device improved reliability through elimination of internal wire bond -55 c to 110 c operating temperature range compatible with ir and through-the-wave solder processes available in 8 mm tape on 178 mm (7) reels applications telltale backlighting in instrument clusters lcd backlighting general status indicators description the hsmb-hx00 device is designed for applications requiring high-flux in surface mount designs. the product is ideal for telltale backlighting in automotive instrument clusters, lcd backlighting, or general status indication. the high light output lowers the cost of lighting by reducing the number of leds required for any application. the hsmb-hx00 combines high reliability surface mount flip-chip led construction with the worlds brightest red and amber led materials, hps ts alingap material. hsmb-hr00-r1t20 HSMB-HA00-R1T2H device selection guide part number color luminous intensity luminous intensity viewing typical dominant i v (mcd) i v (mcd) angle wavelength @ i f = 20 ma @ i f = 20 ma (2 q , degrees) (nm) min. typ. hsmb-hr00-r1t20 red 630 100 160 120 HSMB-HA00-R1T2H amber 590 100 200 120 notes: 1. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the perceived color of the device. 4. q is the off-axis angle where the luminous intensity is 1/2 the peak intensity. the package is compatible with ir and convective reflow soldering processes. these parts are also compatible with through-the-wave soldering processes. 1 / 2 1 / 2
2 absolute maximum ratings at t a = 25 c for hsmb-hr00/ha00 parameter max. rating units dc forward current [1] 30 ma power dissipation (t a 70 c) 100 mw average forward current 30 ma junction temperature 120 c reverse voltage (i r = 100 m a) 5 v operating temperature range -55 to 110 c storage temperature range -55 to 110 c note: 1. derate linearly as shown in figure 6 for temperatures above 70 c. package dimensions 3.6
3.4 2.4 cathode mark 3.1
3.0 3.28
3.18 2.15
1.75 0.98
0.68 2.8
2.6 metal for
soldering cathode mark all dimensions in millimeters
3 optical characteristics at t a = 25 c color, luminous luminous dominant peak intensity intensity wavelength wavelength i v (mcd) i v (mcd) part l d [2] (nm) l peak (nm) @ i f = 20 ma @ i f = 20 ma number color typ. typ. min. typ. hsmb-hr00-r1t20 red 630 640 100 160 HSMB-HA00-R1T2H amber 590 594 100 200 note: 2. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the color of the led. electrical characteristics at t a = 25 c forward forward forward reverse voltage voltage voltage breakdown v r v f (volts) v f (volts) v f (volts) (volts) part @ i f = 20 ma @ i f = 20 ma @ i f = 20 ma @ i r = 100 m a number color min. typ. max. min. hsmb-hr00-r1t20 red 1.70 2.30 3.00 5.0 HSMB-HA00-R1T2H amber 1.90 2.45 3.20 5.0 optical characteristics at t a = 25 c, continued luminous flux [3] luminous flux [3] viewing angle part @ 20 ma (mlum) @ 20 ma (mlum) (2 q , degrees) [3] number color min. typ. typ. hsmb-hr00-r1t20 red 250 400 120 HSMB-HA00-R1T2H amber 250 500 120 note: 3. luminous flux values are not measured in production. electrical characteristics at t a = 25 c, continued thermal resistance capacitance c thermal resistance on pc board (pf) part of device ( 3 4 mm 2 pad size, fr4) v f = 0, f = 1 mhz number color r q j-pin ( c/w) r q j-air ( c/w) typ. hsmb-hr00-r1t20 red 280 480 25 HSMB-HA00-R1T2H amber 280 480 25 1 / 2
4 bin id intensity (mcd) r1 100.0 C 165.0 r2 130.0 C 200.0 s1 160.0 C 260.0 s2 205.0 C 320.0 t1 250.0 C 410.0 t2 320.0 C 500.0 intensity bin definitions, hsmb-hr00, hsmb-ha00 (check with hp sales engineer for availability of bin selections) bin id dominant wavelength (nm) b 584.0 C 587.5 c 586.5 C 590.0 d 589.0 C 592.5 f bins b and c g bins c and d h bins b, c and d color bin definitions, hsmb-ha00 only color and intensity option codes (check with hp sales engineer for availability) hsmb-hx00 xxxxx last digit identifies the color bin option (use 0 for red as there are no red color bins) first four digits identify the min and max of the intensity bins examples: hsmb-ha00-r1t20 designates hsmb-ha00 with a 178 mm reel, no intensity or color bin selection hsmb-ha00-r1s2f designates hsmb-ha00 with 178 mm reel, intensity bins r1 through s2, and color bin f
5 figure 4. relative i v vs. dc forward current (normalized at 20 ma). figure 3. forward current vs. forward voltage (0 C 200 ma). figure 2. forward current vs. forward voltage (0 C 30 ma). figure 1. relative intensity vs. wavelength. wavelength ?nm relative intensity 525 605 665 725 1.1 0.1 0 hsmb-hr00 red hsmb-ha00 amber 545 565 585 625 645 685 705 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 5 10 15 20 35 forward current ?ma 0 0.4 0.6 0.8 1.00 1.20 1.60 1.80 relative intensity (normalized at 20 ma) 30 0.2 1.40 25 figure 5. maximum dc current vs. ambient temperature. figure 6. relative intensity vs. angle. 0 40 120 ambient temperature ?? 0 10 15 20 30 35 dc current ?ma 5 25 60 20 80 100 650 ?/w 550 ?/w normalized intensity 1 0 degrees 0.8 0.6 0.5 0.7 0.2 -90 0.1 0.3 0.4 -80 -70 -60 -50 -40 -20 -10 0 -30 10 20 30 40 50 60 70 80 90 0.9 -100 100 35 20 10 0 1.5 1.7 2.1 2.5 2.9 forward voltage ?v forward current ?ma 25 15 5 30 1.9 2.3 2.7 hsmb-hr00
red hsmb-ha00
amber 1.7 2.3 2.9 3.5 4.1 5.3 forward voltage ?v 0 20 60 80 100 120 160 200 220 forward current ?ma 4.7 40 140 180 hsmb-hr00
red hsmb-ha00
amber
6 figure 8. recommended wave-soldering profile. figure 9. recommended solder pad dimensions. figure 7. recommended infra-red reflow soldering profile. 0 t-time (seconds) t ?temperature ?(?) 200 170 125 100 50 45 105 75 150 180 150 183 230 p1
heat
up p2
solder paste dry p3
solder
reflow p4
cool
down 25 r1 r2 r3 r4 r5 90 sec.
max.
above
183? 15 30 60 90 120 135 165 195 210 time (s) temperature (?) first wave second wave 50 0 100 150 200 250 0 50 100 150 200 250 300 ca. 5 k/s ca. 2 k/s full line = typical
dashed line = process
limits ca. 200 k/s 100? ?130? 10 s forced
cooling 235? ?260? 2 k/s note: all temperatures measured on bottom of pc board. 4.45
(0.175) 2.41
(0.095) 1.65
(0.065) dimensions in millimeters (inches)
7 figure 10. tape and reel dimensions. 2 ?0.5 60 ?61 13 ?0.2 21 ?0.8 177 ?180 cathode side 11.4 ?1.0 9 ?0.3 all dimensions in millimeters. 8.00 ?0.30 3.50 ?0.05 1.75 dim b 4.00 2.00 ?0.05 4.00 1.50 + 0.1
0 dim a 1.1 cathode cover
tape carrier
tape end start empty pockets
sealed with
cover tape. mounted with
components. may consist of carrier
and/or cover tape. 160 min. 160 min. l empty pockets
sealed with
cover tape. 150 ?360 user feed
direction
www.hp.com/go/led for technical assistance or the location of your nearest hewlett-packard sales office, distributor or representative call: americas/canada: 1-800-235-0312 or 408-654-8675 far east/australasia: call your local hp sales office. japan: (81 3) 3335-8152 europe: call your local hp sales office. data subject to change. copyright ? 1999 hewlett-packard co. obsoletes 5968-5087e 5968-6664e (8/99)
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