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2SC3547A 2N222 HC253 1358A1 M74ALS M4003 54193 VSH31115
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  power transistors 1 2sc18462sc1846 2sc18462sc1846 2sc1846 silicon npn epitaxial planar type for midium output power amplification complementary to 2sa0885 ( 2 sa 885 )  features ? low collector to emitter saturation voltage v ce(sat) ? output of 3 w can be obtained by a complementary pair with 2sa0885 ? to-126b package which requires no insulation plate for installa- tion to the heat sink  absolute maximum ratings t c = 25 c 1 : emitter 2 : collector 3 : base to-126b package unit: mm  electrical characteristics t c = 25 c parameter symbol rating unit collector to base voltage v cbo 45 v collector to emitter voltage v ceo 35 v emitter to base voltage v ebo 5v peak collector current i cp 1.5 a collector current i c 1a collector power dissipation p c 1.2 * 1 w 5 * 2 junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c parameter symbol conditions min typ max unit collector cutoff current i cbo v cb = 20 v, i e = 0 0.1 a i ceo v ce = 20 v, i b = 0 100 a emitter cutoff current i ebo v eb = 5v, i c = 0 10 a collector to base voltage v cbo i c = 1 ma, i e = 0 45 v collector to emitter voltage v ceo i c = 2 ma, i b = 0 35 v forward current transfer ratio h fe1 * v ce = 10 v, i c = 500 ma 85 160 340 h fe2 v ce = 5 v, i c = 1 a 50 collector to emitter saturation voltage v ce(sat) i c = 500 ma, i b = 50 ma 0.5 v transition frequency f t v cb = 10 v, i e = ? 50 ma, f = 200 mhz 200 mhz collector output capacitance c ob v cb = 10 v, i e = 0, f = 1 mhz 20 pf rank q r s h fe1 85 to 170 120 to 240 170 to 340 note) * 1: without heat sink * 2: with a 100 100 2 mm a1 heat sink 8.0 +0.5 ?0.1 1.9 0.1 3.05 0.1 3.8 0.3 11.0 0.5 16.0 1.0 3.2 0.2 0.75 0.1 0.5 0.1 2.3 0.2 4.6 0.2 0.5 0.1 1.76 0.1 123 3.16 0.1 note) * : rank classification
power transistors 2 2sc1846 v ce(sat) ? i c v be(sat) ? i c h fe ? i c p c ? t a i c ? v ce i c ? i b f t ? i e c ob ? v cb v cer ? r be 0 6 5 4 3 2 1 0 200 40 80 160 120 180 20 60 140 100 (1)with a 100 100 2mm al heat sink (2)without heat sink (1) (2) ambient temperature t a ( ?c ) collector power dissipation p c ( w ) 0 1.5 1.25 1.0 0.75 0.5 0.25 010 24 8 6 t c =25 ? c 9ma 8ma 7ma 6ma 5ma 4ma 3ma 2ma 1ma i b =10ma collector to emitter voltage v ce ( v ) collector current i c ( a ) 0 1.2 1.0 0.8 0.6 0.4 0.2 012 210 48 6 v ce = 10v ta=25 ? c base current i b ( ma ) collector current i c ( a ) 0.001 0.003 0.01 0.03 0.1 0.3 1 0.01 0.03 0.1 0.3 1 3 i c /i b =10 25 ? c 25 ? c t c =100 ? c collector current i c ( a ) collector to emitter saturation voltage v ce(sat) ( v ) 0.01 0.03 0.01 1 0.1 0.03 0.3 0.1 0.3 1 3 10 3 i c /i b =10 t c = 25 ? c 25 ? c 100 ? c collector current i c ( a ) base to emitter saturation voltage v be(sat) ( v ) 0.01 3 1 0.1 0.03 0.3 1 3 10 30 100 300 1000 v ce =10v t c =100 ? c 25 ? c 25 ? c collector current i c ( a ) forward current transfer ratio h fe 1 3 10 30 100 0 40 80 120 200 160 20 60 100 180 140 v cb =10v f=200mhz t c =25 ? c emitter current i e ( ma ) transition frequency f t ( mhz ) 1 3 10 30 100 0 50 40 30 20 10 i e =0 f=1mhz t c =25 ? c collector to base voltage v cb ( v ) collector output capacitance c ob ( pf ) 0.1 0.3 1 3 10 30 100 0 20 40 60 80 100 i c =10ma t c =25 ? c base to emitter resistance r be ( k ? ) collector to emitter voltage v cer ( v )
power transistors 3 2sc1846 i cbo ? t a area of safe operation (aso) 1 10 10 2 10 3 10 4 0 160 40 120 80 140 20 100 60 v ce =10v ambient temperature t a ( ? c ) i cbo ( t a ) i cbo ( t a =25 ? c ) 0.001 0.003 0.1 0.3 0.01 0.03 0.1 0.3 1 3 10 1 3 10 30 100 single pulse t c =25 ? c t=10ms i cp i c t=1s collector to emitter voltage v ce ( v ) collector current i c ( a )
please read the following notes before using the datasheets a. these materials are intended as a reference to assist customers with the selection of panasonic semiconductor products best suited to their applications. due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. b. panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. therefore, panasonic will not assume any liability for any damages arising from any errors etc. that may ap- pear in this material. c. these materials are solely intended for a customer's individual use. therefore, without the prior written approval of panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the internet or in any other way, is prohibited. request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese govern- ment if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative character- istics and applied circuit examples of the products. it does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) the products described in this material are intended to be used for standard applications or gen- eral electronic equipment (such as office equipment, communications equipment, measuring in- struments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. at the final stage of your design, purchas- ing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) when using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) no part of this material may be reprinted or reproduced by any means without written permission from our company. 2001 mar


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