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  mpxm2051g rev 1, 09/2005 freescale semiconductor technical data ? freescale semiconductor, in c., 2005. all rights reserved. 50 kpa on-chip temperature compensated and calibrated silicon pressure sensors the mpxm2051g device is a silicon piezor esistive pressure sensor providing a highly accurate and linear voltage output - directly proportional to the applied pressure. the sensor is a single, mono lithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. the chip is laser trimmed for precise span and offset ca libration and temperature compensation. features ? temperature compensated over 0 c to +85 c ? available in easy-to-use tape & reel ? ratiometric to supply voltage ? gauge ported typical applications ? pump/motor controllers ? robotics ? level indicators ? medical diagnostics ? pressure switching ? non-invasive blood pressure measurement figure 1 shows a block diagram of the internal circ uitry on the stand-alone pressure sensor chip. ordering information device type options case no. mpx series order no. packing options device marking ported absolute, axial port 1320a mpxm2051gs rails mpxm2051g absolute, element only 1320a MPXM2051GST1 tape & reel mpxm2051g mpxm2051g series compensated and calibrated pressure sensor 0 to 50 kpa (0 to 7.25 psi) 40 mv full scale span (typical) mpxm2051gs/gst1 case 1320a-02 pin number 1 gnd 3 v s 2 +v out 4 -v out mpak packages v s 3 x-ducer sensing element thin film temperature compensation and calibration 2 4 v out+ v out- 1 gnd figure 1. temperature compensated pressure sensor schematic
mpxm2051g sensors 2 freescale semiconductor voltage output versus applied differential pressure the differential voltage output of the sensor is directly proportional to the differential pressure applied. the output voltage of the diff erential or gauge sensor increases with increasing pressure applied to the pressure side relative to the vacuum si de. similarly, output voltage increases as increasing vacuum is applied to the vacuum side relative to the pressure side. table 1. maximum ratings (1) 1. exposure beyond the specified limits may caus e permanent damage or degradation to the device. rating symbol value unit maximum pressure p max 200 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c table 2. operating characteristics (v s = 10 vdc, t a = 25 c.) characteristic symbol min typ max unit pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 0?50kpa supply voltage (2) 2. device is ratiometric within this sp ecified excitation range. oper ating the device above the s pecified excitation range may i nduce additional error due to device self-heating. v s ?1016vdc supply current i o ?6.0?madc full scale span (3) 3. full scale span (v fss ) is defined as the algebraic difference between the output vo ltage at full rated pressure and the output voltage at the minimum rated pressure. v fss 38.5 40 41.5 mv offset (4) 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off -1.0 ? 1.0 mv sensitivity ? v/ ? p? 0.8 ?mv/kpa linearity (5) ? -0.3 ? 0.3 %v fss pressure hysteresis (5) (0 to 50 kpa) 5. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. ? emperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycl ed to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within t he specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation at full rated pressure over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressu re applied, over the temperature range of 0 to 85 c, relative to 25 c. ?? 0.1 ? %v fss temperature hysteresis (5) (-40 c to +125 c) ?? 0.5 ? %v fss temperature effect on full scale span (5) tcv fss -1.0 ? 1.0 %v fss temperature effect on offset (5) tcv off -1.0 ? 1.0 mv input impedance z in 1000 ? 2500 ? output impedance z out 1400 ? 3000 ? response time (6) (10% to 90%) 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?ms warm-up ? ? 20 ? ms offset stability (7) 7. offset stability is the product's output deviation when subjected to 1000 hours of pu lsed pressure, temperature cycling with bias test. ?? 0.5 ? %v fss
mpxm2051g sensors freescale semiconductor 3 linearity linearity refers to how well a transducer's output follows the equation: v out = v off + sensitivity x p over the operating pressure range. there are two basic methods for calculating nonlinearity: (1) end point straight line fit (see figure 2 ) or (2) a least squares best line fit. while a least squares fit gives the ?best case? linearity error (lower numerical value), the calculations required are burdensome. conversely, an end point fit will give the ?worst case? error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. the specified pressure sensor lin earities are based on the end point straight line method measured at the midrange pressure. figure 2. linearity specification comparison on-chip temperature compensation and calibration figure 3 shows the minimum, maxi mum and typical output characteristics of the mpxm2051g series at 25 c. the output is directly proportional to the differential pressure and is essentially a straight line. a silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. figure 3. output versus pressure differential relative voltage output pressure (% fullscale) 0 50 100 end point straight line fit exaggerated performance curve least squares fit straight line deviation offset least square deviation output (mvdc) kpa psi 40 35 30 25 15 10 5 0 -5 0 12.5 1.8 25 3.6 37.5 5.4 50 7.25 20 max typ min offset (typ) span range (typ) v s = 10 vdc t a = 25 c
mpxm2051g sensors 4 freescale semiconductor package dimensions case 1320a-02 issue a pin 4 pin 1 page 1 of 2
mpxm2051g sensors freescale semiconductor 5 package dimensions case 1320a-02 issue a page 2 of 2
mpxm2051g rev. 1 09/2005 how to reach us: home page: www.freescale.com e-mail: support@freescale.com usa/europe or locations not listed: freescale semiconductor technical information center, ch370 1300 n. alma school road chandler, arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) support@freescale.com japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2005. all rights reserved.


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