ligitek electronics co.,ltd. property of ligitek only rectangle type led lamps LH45030-PF doc. no : qw0905-LH45030-PF rev. : b date : data sheet - 2006 06 - may. pb lead-free parts
+ - note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation ligitek electronics co.,ltd. property of ligitek only package dimensions 25.0min 2.54typ 1.0min part no. LH45030-PF 9.6 1.5 max 0.5 typ 4.9 2.4 page 1/5
red diffused color lens gap material LH45030-PF part no red emitted 1.2 luminous intensity @10ma(mcd) typ. 90 spectral halfwidth nm 697 peak wave length pnm 2.6 max. forward voltage @ ma(v) 1.7 min. 20 0.8 min. viewing angle 2 1/2 (deg) 65 2/5 page ligitek electronics co.,ltd. property of ligitek only unit ma ma a mw 15 60 h ratings 10 ir -40 ~ +85 -40 ~ +100 40 forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature reverse current @5v power dissipation typical electrical & optical characteristics (ta=25 ) symbol t opr tstg i f pd i fp absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. LH45030-PF part no.
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 0.0 0.5 wavelength (nm) 700800900 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 10 1000 h chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 0.5 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 1000 3/5 page LH45030-PF part no.
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2 /sec max 0 0 preheat 25 120 150 50 100 time(sec) 260 temp( c) 5 /sec max 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 4/5 60 seconds max LH45030-PF part no.
ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. 5/5 page LH45030-PF part no.
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