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1. general description the LPC1850/30/20/10 are arm cortex-m3 based microcontrollers for embedded applications. the arm cortex-m3 is a next generation core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration. the LPC1850/30/20/10 operate at cpu fre quencies of up to 180 mhz. the arm cortex-m3 cpu incorporates a 3-stage pipe line and uses a harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. the arm cortex-m3 cpu also includes an internal prefetch unit that supports speculative branching. the LPC1850/30/20/10 include up to 200 kb of on-chip sram, a quad spi flash interface (spifi), a state configurable ti mer (sct) subsystem, two high-speed usb controllers, ethernet, lcd, an external memory controller, and multiple digital and analog peripherals. remark: this data sheet describes the rev ?- ? and the rev ?a? versions of parts LPC1850/30/20/10. 2. features and benefits ? processor core ? arm cortex-m3 processor, running at frequencies of up to 180 mhz. ? arm cortex-m3 built-in memory protection unit (mpu) supporting eight regions. ? arm cortex-m3 built-in nested vectored interrupt controller (nvic). ? non-maskable inte rrupt (nmi) input. ? jtag and serial wire debug, serial trace, eight breakpoints, and four watch points. ? enhanced trace module (etm) and enhanced trace buffer (etb) support. ? system tick timer. ? on-chip memory ? 200 kb sram for code and data use. ? multiple sram blocks with separate bus access. ? 64 kb rom containing boot code and on-chip software drivers. ? 128 bit one-time programmable (otp) memory for general-purpose use. ? clock generation unit ? crystal oscillator with an operating range of 1 mhz to 25 mhz. ? 12 mhz internal rc oscillator trimmed to 1 % accuracy over temperature and voltage. LPC1850/30/20/10 32-bit arm cortex-m3 mcu; up to 200 kb sram; ethernet, two high-speed usb, lcd, an d external memory controller rev. 3 ? 6 december 2011 preliminary data sheet
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 2 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller ? ultra-low power rtc crystal oscillator. ? three plls allow cpu operation up to the maximum cpu rate without the need for a high-frequency crystal. the second pll is dedicated to the high-speed usb, the third pll can be used as audio pll. ? clock output. ? configurable digital peripherals: ? state configurable timer (sct) subsystem on ahb. ? global input multiplexer arra y (gima) allows to cross-connect multiple inputs and outputs to event driven peripher als like timers, sct, and adc0/1. ? serial interfaces: ? quad spi flash interface (spifi) with 1-, 2-, or 4-bit data at rates of up to 40 mb per second. ? 10/100t ethernet mac with rmii and mi i interfaces and dma support for high throughput at low cpu load . support for ieee 1588 time stamping/advanced time stamping (ieee 1588-2008 v2). ? one high-speed usb 2.0 ho st/device/otg interface with dma support and on-chip phy. ? one high-speed usb 2.0 host/device in terface with dma support, on-chip full-speed phy and ulpi interface to ex ternal high-speed phy. usb interface electrical test software included in rom usb stack. ? four 550 uarts with dma support: one uart with full modem interface; one uart with irda interface; three usarts support synchronous mode and a smart card interface conforming to iso7816 specification. ? two c_can 2.0b controllers with one channel each. ? two ssp controllers with fifo and multi-protocol supp ort. both ssps with dma support. ? one fast-mode plus i 2 c-bus interface with monitor mode and with open-drain i/o pins conforming to the full i 2 c-bus specification. supports data rates of up to 1mbit/s. ? one standard i 2 c-bus interface with monitor mode and standard i/o pins. ? two i 2 s interfaces with dma support, each with one input and one output. ? digital peripherals: ? external memory controller (emc) supporting external sram, rom, nor flash, and sdram devices. ? lcd controller with dma support and a programmable display resolution of up to 1024 h ? 768 v. supports monochrome and color stn panels and tft color panels; supports 1/2/4/8 bpp color look-up table (clut) and 16/24-bit direct pixel mapping. ? sd/mmc card interface. ? eight-channel general-purpose dma (gpdma) controller can access all memories on the ahb and all dma-capable ahb slaves. ? up to 164 general-purpose input/out put (gpio) pins with configurable pull-up/pull-down resistors and open-drain modes. ? gpio registers are located on the ahb fo r fast access. gpio ports have dma support. ? up to 8 gpio pins can be selected from all gpio pins as edge and level sensitive interrupt sources.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 3 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller ? two gpio group interrupt modules enable an interrupt based on a programmable pattern of input states of a group of gpio pins. ? four general-pu rpose timer/counters with ca pture and match capabilities. ? one motor control pwm for three-phase motor control. ? one quadrature encoder interface (qei). ? repetitive interrup t timer (ri timer). ? windowed watchdog timer. ? ultra-low power real-time clock (rtc) on separate power domain with 256 bytes of battery powered backup registers. ? alarm timer; can be battery powered. ? analog peripherals: ? one 10-bit dac with dma support and a data conversion rate of 400 ksamples/s. ? two 10-bit adcs with dma support and a data conversion rate of 400 ksamples/s. ? security: ? hardware-based aes security engine programmable through an on-chip api. ? two 128-bit secure otp memories for aes key storage and customer use. ? unique id for each device. ? power: ? single 3.3 v (2.2 v to 3.6 v) power supply with on-chip internal voltage regulator for the core supply and the rtc power domain. ? rtc power domain can be powered separately by a 3 v battery supply. ? four reduced power modes: sleep, deep-sleep, power-down, and deep power-down. ? processor wake-up from sleep mode via wake-up interrupts from various peripherals. ? wake-up from deep-sleep, power-down, and deep power-down modes via external interrupts and interrupts generated by battery powered blocks in the rtc power domain. ? brownout detect with four separate thre sholds for interrup t and forced reset. ? power-on reset (por). ? available as 208-pin, 144-pin, and 100-pin lqfp packages and as 256-pin, 180-pin, and 100-pin bga packages. 3. applications ? industrial ? rfid readers ? consumer ? e-metering ? white goods
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 4 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 4. ordering information 4.1 ordering options table 1. ordering information type number package name description version LPC1850fet256 lbga256 plastic low profile ball grid array package; 256 balls; body 17 ? 17 ? 1 mm sot740-2 LPC1850fet180 tfbga180 thin fine-pitch ball grid array package; 180 balls sot570-3 LPC1850fbd208 lqfp208 plastic low profile quad flat package; 208 leads; body 28 ? 28 ? 1.4 mm sot459-1 lpc1830fet256 lbga256 plastic low profile ball grid array package; 256 balls; body 17 ? 17 ? 1 mm sot740-2 lpc1830fet180 tfbga180 thin fine-pitch ball grid array package; 180 balls sot570-3 lpc1830fet100 tfbga100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 ? 9 ? 0.7 mm sot926-1 lpc1830fbd144 lqfp144 plastic low profile quad flat package; 144 leads; body 20 ? 20 ? 1.4 mm sot486-1 lpc1820fet100 tfbga100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 ? 9 ? 0.7 mm sot926-1 lpc1820fbd144 lqfp144 plastic low profile quad flat package; 144 leads; body 20 ? 20 ? 1.4 mm sot486-1 lpc1820fbd100 lqfp100 plastic low profile quad flat package; 100 leads; body 14 ? 14 ? 1.4 mm sot407-1 lpc1810fet100 tfbga100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 ? 9 ? 0.7 mm sot926-1 lpc1810fbd144 lqfp144 plastic low profile quad flat package; 144 leads; body 20 ? 20 ? 1.4 mm sot486-1 table 2. ordering options type number total sram lcd ethernet usb0 (host, device, otg) usb1 (host, device)/ ulpi interface adc channels pwm qei gpio package LPC1850fet256 200 kb yes yes yes yes/yes 8 yes yes 164 lbga256 LPC1850fet180 200 kb yes yes yes yes/yes 8 yes yes 118 tfbga180 LPC1850fbd208 200 kb yes yes yes yes/yes 8 yes yes 142 lqfp208 lpc1830fet256 200 kb no yes yes yes/yes 8 yes yes 164 lbga256 lpc1830fet180 200 kb no yes yes yes/yes 8 yes yes 118 tfbga180 lpc1830fet100 200 kb no yes yes yes/no 4 no no 49 tfbga100 lpc1830fbd144 200 kb no yes yes yes/no 8 yes no 83 lqfp144 lpc1820fet100 168 kb no no yes no 4 no no 49 tfbga100 lpc1820fbd144 168 kb no no yes no 8 yes no 83 lqfp144 lpc1820fbd100 168 kb no no yes no 5 no no 49 lqfp100 lpc1810fet100 136 kb no no no no 4 no no 49 tfbga100 lpc1810fbd144 136 kb no no no no 8 yes no 83 lqfp144
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 5 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 5. block diagram (1) not available on all parts (see ta b l e 2 ). fig 1. LPC1850/30/20/10 block diagram arm cortex-m3 test/debug interface i-code bus d-code bus system bus swd/trace port/jtag gpdma ethernet (1) 10/100 mac ieee 1588 usb1 (1) host/ device high- speed usb0 (1) host/ device/ otg lcd (1) sd/ mmc emc high-speed phy 16/32 kb ahb sram 16 kb + 16 kb ahb sram (1) spifi aes hs gpio sct 64 kb rom ahb multilayer matrix LPC1850/30/20/10 64/96 kb local sram 40 kb local sram 002aaf218 slaves masters wwdt usart0 uart1 ssp0 i 2 c0 c_can1 i 2 s0 i 2 s1 motor control pwm (1) timer3 timer2 usart2 usart3 ssp1 ri timer qei (1) gima bridge 0 bridge 1 bridge 2 bridge 3 bridge 10-bit adc0 10-bit adc1 c_can0 i 2 c1 10-bit dac bridge rgu ccu2 cgu ccu1 alarm timer configuration registers otp memory event router power mode control 12 mhz irc rtc power domain backup registers rtc osc rtc slaves = connected to gpdma timer0 timer1 scu gpio interrupts gpio group0 interrupt gpio group1 interrupt
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 6 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 6. pinning information 6.1 pinning fig 2. pin configuration lbga256 package fig 3. pin configuration tfbga180 package 002aaf230 LPC1850/30fet256 transparent top view t r p n m l j g k h f e d c b a 24681012 13 14 15 16 1357911 ball a1 index area 002aag365 LPC1850/30fet180 transparent top view n l p m k j h g f d b e c a 2 4 6 8 10 12 13 14 1357911 ball a1 index area fig 4. pin configuration tfbga100 package 002aag366 lpc1830/20/10fet100 transparent top view j g k h f e d c b a 246810 13579 ball a1 index area
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 7 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 6.2 pin description on the LPC1850/30/20/10, digital pins are grouped into 16 ports, named p0 to p9 and pa to pf, with up to 20 pins used per port. each digital pin can support up to eight different digital functions, including general purpos e i/o (gpio), selectable through the scu registers. the pin name is not indicative of the gpio port assigned to it. not all functions listed in ta b l e 3 are available on all packages. see table 2 for availability of usb0, usb1, ethernet, and lcd functions. fig 5. pin configuration lqfp208 package f ig 6. pin configuration lqfp144 package LPC1850fbd208 156 53 104 208 157 105 1 52 002aag367 lpc1830/20/10fbd144 108 37 72 144 109 73 1 36 002aag368 fig 7. pin configuration lqfp100 package lpc1820fbd100 75 26 50 100 76 51 1 25 002aag369
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 8 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller table 3. pin description lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description multiplexed digital pins p0_0 l3 x g2 47 32 22 [3] i; pu i/o gpio0[0] ? general purpose digital input/output pin. i/o ssp1_miso ? master in slave out for ssp1. i enet_rxd1 ? ethernet receive data 1 (rmii/mii interface). - r ? function reserved. - r ? function reserved. - r ? function reserved. i/o i2s0_tx_ws ? transmit word select. it is driven by the master and received by the slave. corresponds to the signal ws in the i 2 s-bus specification . i/o i2s1_tx_ws ? transmit word select. it is driven by the master and received by the slave. corresponds to the signal ws in the i 2 s-bus specification . p0_1 m2 x g1 50 34 23 [3] i; pu i/o gpio0[1] ? general purpose digital input/output pin. i/o ssp1_mosi ? master out slave in for ssp1. i enet_col ? ethernet collision detect (mii interface). - r ? function reserved. - r ? function reserved. - r ? function reserved. enet_tx_en ? ethernet transmit enable (rmii/mii interface). i/o i2s1_tx_sda ? i 2 s1 transmit data. it is driven by the transmitter and read by the receiver. corresponds to the signal sd in the i 2 s-bus specification . p1_0 p2 x h1 54 38 25 [3] i; pu i/o gpio0[4] ? general purpose digital input/output pin. i ctin_3 ? sct input 3. capture input 1 of timer 1. i/o emc_a5 ? external memory address line 5. - r ? function reserved. - r ? function reserved. i/o ssp0_ssel ? slave select for ssp0. - r ? function reserved. - r ? function reserved.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 9 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p1_1 r2 x k2584228 [3] i; pu i/o gpio0[8] ? general purpose digital input/output pin. boot pin (see table 5 ). o ctout_7 ? sct output 7. match output 3 of timer 1. i/o emc_a6 ? external memory address line 6. - r ? function reserved. - r ? function reserved. i/o ssp0_miso ? master in slave out for ssp0. - r ? function reserved. - r ? function reserved. p1_2 r3 x k1604329 [3] i; pu i/o gpio0[9] ? general purpose digital input/output pin. boot pin (see table 5 ). o ctout_6 ? sct output 6. match output 2 of timer 1. i/o emc_a7 ? external memory address line 7. - r ? function reserved. - r ? function reserved. i/o ssp0_mosi ? master out slave in for ssp0. - r ? function reserved. - r ? function reserved. p1_3 p5 x j1 61 44 30 [3] i; pu i/o gpio0[10] ? general purpose digital input/output pin. o ctout_8 ? sct output 8. match output 0 of timer 2. - r ? function reserved. o emc_oe ? low active output enable signal. o usb0_ind1 ? usb0 port indicator led control output 1. i/o ssp1_miso ? master in slave out for ssp1. - r ? function reserved. o sd_rst ? sd/mmc reset signal for mmc4.4 card. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 10 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p1_4 t3 x j2 64 47 32 [3] i; pu i/o gpio0[11] ? general purpose digital input/output pin. o ctout_9 ? sct output 9. match output 1 of timer 2. - r ? function reserved. o emc_bls0 ? low active byte lane select signal 0. o usb0_ind0 ? usb0 port indicator led control output 0. i/o ssp1_mosi ? master out slave in for ssp1. - r ? function reserved. o sd_volt1 ? sd/mmc bus voltage select output 1. p1_5 r5 x j4 65 48 33 [3] i; pu i/o gpio1[8] ? general purpose digital input/output pin. o ctout_10 ? sct output 10. match output 2 of timer 2. - r ? function reserved. o emc_cs0 ? low active chip select 0 signal. o usb0_pwr_fault ? port power fault signal indicating overcurrent condition; this signal monitors over-current on the usb bus (external circuitry required to detect over-current condition). i/o ssp1_ssel ? slave select for ssp1. - r ? function reserved. o sd_pow ? sd/mmc card power monitor output. p1_6 t4 x k4674934 [3] i; pu i/o gpio1[9] ? general purpose digital input/output pin. i ctin_5 ? sct input 5. capture input 2 of timer 2. - r ? function reserved. o emc_we ? low active write enable signal. - r ? function reserved. - r ? function reserved. - r ? function reserved. i/o sd_cmd ? sd/mmc command signal. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 11 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p1_7 t5 x g4 69 50 35 [3] i; pu i/o gpio1[0] ? general purpose digital input/output pin. i u1_dsr ? data set ready input for uart1. o ctout_13 ? sct output 13. match output 1 of timer 3. i/o emc_d0 ? external memory data line 0. o usb0_ppwr ? vbus drive signal (towards external charge pump or power management unit); indicates that vbus must be driven (active high). add a pull-down resistor to disable the power switch at reset. this signal has opposite polarity compared to the usb_ppwr used on other nxp lpc parts. - r ? function reserved. - r ? function reserved. - r ? function reserved. p1_8 r7 x h5 71 51 36 [3] i; pu i/o gpio1[1] ? general purpose digital input/output pin. o u1_dtr ? data terminal ready output for uart1. o ctout_12 ? sct output 12. match output 0 of timer 3. i/o emc_d1 ? external memory data line 1. - r ? function reserved. - r ? function reserved. - r ? function reserved. o sd_volt0 ? sd/mmc bus voltage select output 0. p1_9 t7 x j5 73 52 37 [3] i; pu i/o gpio1[2] ? general purpose digital input/output pin. o u1_rts ? request to send output for uart1. o ctout_11 ? sct output 11. match output 3 of timer 2. i/o emc_d2 ? external memory data line 2. - r ? function reserved. - r ? function reserved. - r ? function reserved. i/o sd_dat0 ? sd/mmc data bus line 0. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 12 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p1_10 r8 x h6 75 53 38 [3] i; pu i/o gpio1[3] ? general purpose digital input/output pin. i u1_ri ? ring indicator input for uart1. o ctout_14 ? sct output 14. match output 2 of timer 3. i/o emc_d3 ? external memory data line 3. - r ? function reserved. - r ? function reserved. - r ? function reserved. i/o sd_dat1 ? sd/mmc data bus line 1. p1_11 t9 x j7 77 55 39 [3] i; pu i/o gpio1[4] ? general purpose digital input/output pin. i u1_cts ? clear to send input for uart1. o ctout_15 ? sct output 15. match output 3 of timer 3. i/o emc_d4 ? external memory data line 4. - r ? function reserved. - r ? function reserved. - r ? function reserved. i/o sd_dat2 ? sd/mmc data bus line 2. p1_12 r9 x k7785640 [3] i; pu i/o gpio1[5] ? general purpose digital input/output pin. i u1_dcd ? data carrier detect input for uart1. - r ? function reserved. i/o emc_d5 ? external memory data line 5. i t0_cap1 ? capture input 1 of timer 0. - r ? function reserved. - r ? function reserved. i/o sd_dat3 ? sd/mmc data bus line 3. p1_13 r10 x h8 83 60 41 [3] i; pu i/o gpio1[6] ? general purpose digital input/output pin. o u1_txd ? transmitter output for uart1. - r ? function reserved. i/o emc_d6 ? external memory data line 6. i t0_cap0 ? capture input 0 of timer 0. - r ? function reserved. - r ? function reserved. i sd_cd ? sd/mmc card detect input. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 13 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p1_14 r11 x j8 85 61 42 [3] i; pu i/o gpio1[7] ? general purpose digital input/output pin. i u1_rxd ? receiver input for uart1. - r ? function reserved. i/o emc_d7 ? external memory data line 7. o t0_mat2 ? match output 2 of timer 0. - r ? function reserved. - r ? function reserved. - r ? function reserved. p1_15 t12 x k8 87 62 43 [3] i; pu i/o gpio0[2] ? general purpose digital input/output pin. o u2_txd ? transmitter output for usart2. - r ? function reserved. i enet_rxd0 ? ethernet receive data 0 (rmii/mii interface). o t0_mat1 ? match output 1 of timer 0. - r ? function reserved. - r ? function reserved. - r ? function reserved. p1_16 m7 x h9 90 64 44 [3] i; pu i/o gpio0[3] ? general purpose digital input/output pin. i u2_rxd ? receiver input for usart2. - r ? function reserved. i enet_crs ? ethernet carrier sense (mii interface). o t0_mat0 ? match output 0 of timer 0. - r ? function reserved. - r ? function reserved. i enet_rx_dv ? ethernet receive data valid (rmii/mii interface). p1_17 m8 x h10 93 66 45 [4] i; pu i/o gpio0[12] ? general purpose digital input/output pin. i/o u2_uclk ? serial clock input/output for usart2 in synchronous mode. - r ? function reserved. i/o enet_mdio ? ethernet miim data input and output. i t0_cap3 ? capture input 3 of timer 0. o can1_td ? can1 transmitter output. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 14 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p1_18 n12 x j10 95 67 46 [3] i; pu i/o gpio0[13] ? general purpose digital input/output pin. i/o u2_dir ? rs-485/eia-485 output enable/direction control for usart2. - r ? function reserved. o enet_txd0 ? ethernet transmit data 0 (rmii/mii interface). o t0_mat3 ? match output 3 of timer 0. i can1_rd ? can1 receiver input. - r ? function reserved. - r ? function reserved. p1_19 m11 x k9 96 68 47 [3] i; pu i enet_tx_clk (enet_ref_clk) ? ethernet transmit clock (mii interface) or ethernet reference clock (rmii interface). i/o ssp1_sck ? serial clock for ssp1. - r ? function reserved. - r ? function reserved. o clkout ? clock output pin. - r ? function reserved. o i2s0_rx_mclk ? i 2 s receive master clock. i/o i2s1_tx_sck ? transmit clock. it is driven by the master and received by the slave. corresponds to the signal sck in the i 2 s-bus specification . p1_20 m10 x k10 100 70 48 [3] i; pu i/o gpio0[15] ? general purpose digital input/output pin. i/o ssp1_ssel ? slave select for ssp1. - r ? function reserved. o enet_txd1 ? ethernet transmit data 1 (rmii/mii interface). i t0_cap2 ? capture input 2 of timer 0. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 15 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p2_0 t16 x g10 108 75 50 [3] i; pu - r ? function reserved. o u0_txd ? transmitter output for usart0. i/o emc_a13 ? external memory address line 13. o usb0_ppwr ? vbus drive signal (towards external charge pump or power management unit); indicates that vbus must be driven (active high). add a pull-down resistor to disable the power switch at reset. this signal has opposite polarity compared to the usb_ppwr used on other nxp lpc parts. i/o gpio5[0] ? general purpose digital input/output pin. - r ? function reserved. i t3_cap0 ? capture input 0 of timer 3. o enet_mdc ? ethernet miim clock. p2_1 n15 x g7 116 81 54 [3] i; pu - r ? function reserved. i u0_rxd ? receiver input for usart0. i/o emc_a12 ? external memory address line 12. o usb0_pwr_fault ? port power fault signal indicating overcurrent condition; this signal monitors over-current on the usb bus (external circuitry required to detect over-current condition). i/o gpio5[1] ? general purpose digital input/output pin. - r ? function reserved. i t3_cap1 ? capture input 1 of timer 3. - r ? function reserved. p2_2 m15 x f5 121 84 56 [3] i; pu - r ? function reserved. i/o u0_uclk ? serial clock input/output for usart0 in synchronous mode. i/o emc_a11 ? external memory address line 11. o usb0_ind1 ? usb0 port indicator led control output 1. i/o gpio5[2] ? general purpose digital input/output pin. i ctin_6 ? sct input 6. capture input 1 of timer 3. i t3_cap2 ? capture input 2 of timer 3. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 16 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p2_3 j12 x d8 127 87 57 [4] i; pu - r ? function reserved. i/o i2c1_sda ? i 2 c1 data input/output (this pin does not use a specialized i 2 c pad). o u3_txd ? transmitter output for usart3. i ctin_1 ? sct input 1. capture input 1 of timer 0. capture input 1 of timer 2. i/o gpio5[3] ? general purpose digital input/output pin. - r ? function reserved. o t3_mat0 ? match output 0 of timer 3. o usb0_ppwr ? vbus drive signal (towards external charge pump or power management unit); indicates that vbus must be driven (active high). add a pull-down resistor to disable the power switch at reset. this signal has opposite polarity compared to the usb_ppwr used on other nxp lpc parts. p2_4 k11 x d9 128 88 58 [4] i; pu - r ? function reserved. i/o i2c1_scl ? i 2 c1 clock input/output (this pin does not use a specialized i 2 c pad). i u3_rxd ? receiver input for usart3. i ctin_0 ? sct input 0. capture input 0 of timer 0, 1, 2, 3. i/o gpio5[4] ? general purpose digital input/output pin. - r ? function reserved. o t3_mat1 ? match output 1 of timer 3. o usb0_pwr_fault ? port power fault signal indicating overcurrent condition; this signal monitors over-current on the usb bus (external circuitry required to detect over-current condition). p2_5 k14 x d10 131 91 61 [4] i; pu - r ? function reserved. i ctin_2 ? sct input 2. capture input 2 of timer 0. i usb1_vbus ? monitors the presence of usb1 bus power. note: this signal must be high for usb reset to occur. i adctrig1 ? adc trigger input 1. i/o gpio5[5] ? general purpose digital input/output pin. - r ? function reserved. o t3_mat2 ? match output 2 of timer 3. o usb0_ind0 ? usb0 port indicator led control output 0. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 17 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p2_6 k16 x g9 137 95 64 [3] i; pu - r ? function reserved. i/o u0_dir ? rs-485/eia-485 output enable/direction control for usart0. i/o emc_a10 ? external memory address line 10. o usb0_ind0 ? usb0 port indicator led control output 0. i/o gpio5[6] ? general purpose digital input/output pin. i ctin_7 ? sct input 7. i t3_cap3 ? capture input 3 of timer 3. - r ? function reserved. p2_7 h14 x c10 138 96 65 [3] i; pu i/o gpio0[7] ? general purpose digital input/output pin. isp entry pin. if this pin is pulled low at reset, the part enters isp mode using usart0. o ctout_1 ? sct output 1. match output 1 of timer 0. i/o u3_uclk ? serial clock input/output for usart3 in synchronous mode. i/o emc_a9 ? external memory address line 9. - r ? function reserved. - r ? function reserved. o t3_mat3 ? match output 3 of timer 3. - r ? function reserved. p2_8 j16 x c6 140 98 67 [3] i; pu - r ? function reserved. boot pin (see table 5 ) o ctout_0 ? sct output 0. match output 0 of timer 0. i/o u3_dir ? rs-485/eia-485 output enable/direction control for usart3. i/o emc_a8 ? external memory address line 8. i/o gpio5[7] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 18 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p2_9 h16 x b10 144 102 70 [3] i; pu i/o gpio1[10] ? general purpose digital input/output pin. boot pin (see table 5 ). o ctout_3 ? sct output 3. match output 3 of timer 0. i/o u3_baud ? baud pin for usart3. i/o emc_a0 ? external memory address line 0. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. p2_10 g16 x e8 146 104 71 [3] i; pu i/o gpio0[14] ? general purpose digital input/output pin. o ctout_2 ? sct output 2. match output 2 of timer 0. o u2_txd ? transmitter output for usart2. i/o emc_a1 ? external memory address line 1. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. p2_11 f16 x a9 148 105 72 [3] i; pu i/o gpio1[11] ? general purpose digital input/output pin. o ctout_5 ? sct output 5. match output 1 of timer 1. i u2_rxd ? receiver input for usart2. i/o emc_a2 ? external memory address line 2. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 19 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p2_12 e15 x b9 153 106 73 [3] i; pu i/o gpio1[12] ? general purpose digital input/output pin. o ctout_4 ? sct output 4. match output 0 of timer 1. - r ? function reserved. i/o emc_a3 ? external memory address line 3. - r ? function reserved. - r ? function reserved. - r ? function reserved. i/o u2_uclk ? serial clock input/output for usart2 in synchronous mode. p2_13 c16 x a10 156 108 75 [3] i; pu i/o gpio1[13] ? general purpose digital input/output pin. i ctin_4 ? sct input 4. capture input 2 of timer 1. - r ? function reserved. i/o emc_a4 ? external memory address line 4. - r ? function reserved. - r ? function reserved. - r ? function reserved. i/o u2_dir ? rs-485/eia-485 output enable/direction control for usart2. p3_0 f13 x a8 161 112 78 [3] i; pu i/o i2s0_rx_sck ? i 2 s receive clock. it is driven by the master and received by the slave. corresponds to the signal sck in the i 2 s-bus specification . o i2s0_rx_mclk ? i 2 s receive master clock. i/o i2s0_tx_sck ? transmit clock. it is driven by the master and received by the slave. corresponds to the signal sck in the i 2 s-bus specification . o i2s0_tx_mclk ? i 2 s transmit master clock. i/o ssp0_sck ? serial clock for ssp0. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 20 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p3_1 g11 x f7 163 114 79 [3] i; pu i/o i2s0_tx_ws ? transmit word select. it is driven by the master and received by the slave. corresponds to the signal ws in the i 2 s-bus specification . i/o i2s0_rx_ws ? receive word select. it is driven by the master and received by the slave. corresponds to the signal ws in the i 2 s-bus specification . i can0_rd ? can receiver input. o usb1_ind1 ? usb1 port indicator led control output 1. i/o gpio5[8] ? general purpose digital input/output pin. - r ? function reserved. o lcd_vd15 ? lcd data. - r ? function reserved. p3_2 f11 x g6 166 116 80 [3] i; pu i/o i2s0_tx_sda ? i 2 s transmit data. it is driven by the transmitter and read by the receiver. corresponds to the signal sd in the i 2 s-bus specification . i/o i2s0_rx_sda ? i 2 s receive data. it is driven by the transmitter and read by the receiver. corresponds to the signal sd in the i 2 s-bus specification . o can0_td ? can transmitter output. o usb1_ind0 ? usb1 port indicator led control output 0. i/o gpio5[9] ? general purpose digital input/output pin. - r ? function reserved. o lcd_vd14 ? lcd data. - r ? function reserved. p3_3 b14 x a7 169 118 81 [5] i; pu - r ? function reserved. - r ? function reserved. i/o ssp0_sck ? serial clock for ssp0. o spifi_sck ? serial clock for spifi. o cgu_out1 ? cgu spare clock output 1. - r ? function reserved. o i2s0_tx_mclk ? i 2 s transmit master clock. i/o i2s1_tx_sck ? transmit clock. it is driven by the master and received by the slave. corresponds to the signal sck in the i 2 s-bus specification . table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 21 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p3_4 a15 x b8 171 119 82 [3] i; pu i/o gpio1[14] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. i/o spifi_sio3 ? i/o lane 3 for spifi. o u1_txd ? transmitter output for uart1. i/o i2s0_tx_ws ? transmit word select. it is driven by the master and received by the slave. corresponds to the signal ws in the i 2 s-bus specification . i/o i2s1_rx_sda ? i 2 s1 receive data. it is driven by the transmitter and read by the receiver. corresponds to the signal sd in the i 2 s-bus specification . o lcd_vd13 ? lcd data. p3_5 c12 x b7 173 121 84 [3] i; pu i/o gpio1[15] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. i/o spifi_sio2 ? i/o lane 2 for spifi. i u1_rxd ? receiver input for uart1. i/o i2s0_tx_sda ? i 2 s transmit data. it is driven by the transmitter and read by the receiver. corresponds to the signal sd in the i 2 s-bus specification . i/o i2s1_rx_ws ? receive word select. it is driven by the master and received by the slave. corresponds to the signal ws in the i 2 s-bus specification . o lcd_vd12 ? lcd data. p3_6 b13 x c7 174 122 85 [3] i; pu i/o gpio0[6] ? general purpose digital input/output pin. - r ? function reserved. i/o ssp0_ssel ? slave select for ssp0. i/o spifi_miso ? input 1 in spifi quad mode; spifi output io1. - r ? function reserved. i/o ssp0_miso ? master in slave out for ssp0. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 22 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p3_7 c11 x d7 176 123 86 [3] i; pu - r ? function reserved. - r ? function reserved. i/o ssp0_miso ? master in slave out for ssp0. i/o spifi_mosi ? input 0 in spifi quad mode; spifi output io0. i/o gpio5[10] ? general purpose digital input/output pin. i/o ssp0_mosi ? master out slave in for ssp0. - r ? function reserved. - r ? function reserved. p3_8 c10 x e7 179 124 87 [3] i; pu - r ? function reserved. - r ? function reserved. i/o ssp0_mosi ? master out slave in for ssp0. i/o spifi_cs ? spifi serial flash chip select. i/o gpio5[11] ? general purpose digital input/output pin. i/o ssp0_ssel ? slave select for ssp0. - r ? function reserved. - r ? function reserved. p4_0 d5 x - 1 1 - [3] i; pu i/o gpio2[0] ? general purpose digital input/output pin. o mcoa0 ? motor control pwm channel 0, output a. i nmi ? external interrupt input to nmi. - r ? function reserved. - r ? function reserved. o lcd_vd13 ? lcd data. i/o u3_uclk ? serial clock input/output for usart3 in synchronous mode. - r ? function reserved. p4_1 a1 x - 3 3 - [6] i; pu i/o gpio2[1] ? general purpose digital input/output pin. o ctout_1 ? sct output 1. match output 1 of timer 0. o lcd_vd0 ? lcd data. - r ? function reserved. - r ? function reserved. o lcd_vd19 ? lcd data. o u3_txd ? transmitter output for usart3. i enet_col ? ethernet collision detect (mii interface). i adc0_1 ? adc0, input channel 1. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 23 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p4_2 d3 x - 12 8 - [3] i; pu i/o gpio2[2] ? general purpose digital input/output pin. o ctout_0 ? sct output 0. match output 0 of timer 0. o lcd_vd3 ? lcd data. - r ? function reserved. - r ? function reserved. o lcd_vd12 ? lcd data. i u3_rxd ? receiver input for usart3. - r ? function reserved. p4_3 c2 x - 10 7 - [6] i; pu i/o gpio2[3] ? general purpose digital input/output pin. o ctout_3 ? sct output 3. match output 3 of timer 0. o lcd_vd2 ? lcd data. - r ? function reserved. - r ? function reserved. o lcd_vd21 ? lcd data. i/o u3_baud ? baud pin usart3. - r ? function reserved. i adc0_0 ? adc0, input channel 0. p4_4 b1 x - 14 9 - [6] i; pu i/o gpio2[4] ? general purpose digital input/output pin. o ctout_2 ? sct output 2. match output 2 of timer 0. o lcd_vd1 ? lcd data. - r ? function reserved. - r ? function reserved. o lcd_vd20 ? lcd data. i/o u3_dir ? rs-485/eia-485 output enable/direction control for usart3. - r ? function reserved. o dac ? dac output. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 24 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p4_5 d2 x - 15 10 - [3] i; pu i/o gpio2[5] ? general purpose digital input/output pin. o ctout_5 ? sct output 5. match output 1 of timer 1. o lcd_fp ? frame pulse (stn). vertical synchronization pulse (tft). - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. p4_6 c1 x - 17 11 - [3] i; pu i/o gpio2[6] ? general purpose digital input/output pin. o ctout_4 ? sct output 4. match output 0 of timer 1. o lcd_enab/lcdm ? stn ac bias drive or tft data enable input. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. p4_7 h4 x - 21 14 - [3] o; pu o lcd_dclk ? lcd panel clock. i gp_clkin ? general purpose clock input to the cgu. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. i/o i2s1_tx_sck ? transmit clock. it is driven by the master and received by the slave. corresponds to the signal sck in the i 2 s-bus specification . i/o i2s0_tx_sck ? transmit clock. it is driven by the master and received by the slave. corresponds to the signal sck in the i 2 s-bus specification . table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 25 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p4_8 e2 x - 23 15 - [3] i; pu - r ? function reserved. i ctin_5 ? sct input 5. capture input 2 of timer 2. o lcd_vd9 ? lcd data. - r ? function reserved. i/o gpio5[12] ? general purpose digital input/output pin. o lcd_vd22 ? lcd data. o can1_td ? can1 transmitter output. - r ? function reserved. p4_9 l2 x - 48 33 - [3] i; pu - r ? function reserved. i ctin_6 ? sct input 6. capture input 1 of timer 3. o lcd_vd11 ? lcd data. - r ? function reserved. i/o gpio5[13] ? general purpose digital input/output pin. o lcd_vd15 ? lcd data. i can1_rd ? can1 receiver input. - r ? function reserved. p4_10 m3 x - 51 35 - [3] i; pu - r ? function reserved. i ctin_2 ? sct input 2. capture input 2 of timer 0. o lcd_vd10 ? lcd data. - r ? function reserved. i/o gpio5[14] ? general purpose digital input/output pin. o lcd_vd14 ? lcd data. - r ? function reserved. - r ? function reserved. p5_0 n3 x - 53 37 - [3] i; pu i/o gpio2[9] ? general purpose digital input/output pin. o mcob2 ? motor control pwm channel 2, output b. i/o emc_d12 ? external memory data line 12. - r ? function reserved. i u1_dsr ? data set ready input for uart1. i t1_cap0 ? capture input 0 of timer 1. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 26 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p5_1 p3 x - 55 39 - [3] i; pu i/o gpio2[10] ? general purpose digital input/output pin. i mci2 ? motor control pwm channel 2, input. i/o emc_d13 ? external memory data line 13. - r ? function reserved. o u1_dtr ? data terminal ready output for uart1. can also be configured to be an rs-485/eia-485 output enable signal for uart1. i t1_cap1 ? capture input 1 of timer 1. - r ? function reserved. - r ? function reserved. p5_2 r4 x - 63 46 - [3] i; pu i/o gpio2[11] ? general purpose digital input/output pin. i mci1 ? motor control pwm channel 1, input. i/o emc_d14 ? external memory data line 14. - r ? function reserved. o u1_rts ? request to send output for uart1. can also be configured to be an rs-485/eia-485 output enable signal for uart1. i t1_cap2 ? capture input 2 of timer 1. - r ? function reserved. - r ? function reserved. p5_3 t8 x - 76 54 - [3] i; pu i/o gpio2[12] ? general purpose digital input/output pin. i mci0 ? motor control pwm channel 0, input. i/o emc_d15 ? external memory data line 15. - r ? function reserved. i u1_ri ? ring indicator input for uart1. i t1_cap3 ? capture input 3 of timer 1. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 27 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p5_4 p9 x - 80 57 - [3] i; pu i/o gpio2[13] ? general purpose digital input/output pin. o mcob0 ? motor control pwm channel 0, output b. i/o emc_d8 ? external memory data line 8. - r ? function reserved. i u1_cts ? clear to send input for uart1. o t1_mat0 ? match output 0 of timer 1. - r ? function reserved. - r ? function reserved. p5_5 p10 x - 81 58 - [3] i; pu i/o gpio2[14] ? general purpose digital input/output pin. o mcoa1 ? motor control pwm channel 1, output a. i/o emc_d9 ? external memory data line 9. - r ? function reserved. i u1_dcd ? data carrier detect input for uart1. o t1_mat1 ? match output 1 of timer 1. - r ? function reserved. - r ? function reserved. p5_6 t13 x - 89 63 - [3] i; pu i/o gpio2[15] ? general purpose digital input/output pin. o mcob1 ? motor control pwm channel 1, output b. i/o emc_d10 ? external memory data line 10. - r ? function reserved. o u1_txd ? transmitter output for uart1. o t1_mat2 ? match output 2 of timer 1. - r ? function reserved. - r ? function reserved. p5_7 r12 x - 91 65 - [3] i; pu i/o gpio2[7] ? general purpose digital input/output pin. o mcoa2 ? motor control pwm channel 2, output a. i/o emc_d11 ? external memory data line 11. - r ? function reserved. i u1_rxd ? receiver input for uart1. o t1_mat3 ? match output 3 of timer 1. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 28 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p6_0 m12 x h7 105 73 - [3] i; pu - r ? function reserved. o i2s0_rx_mclk ? i 2 s receive master clock. - r ? function reserved. - r ? function reserved. i/o i2s0_rx_sck ? receive clock. it is driven by the master and received by the slave. corresponds to the signal sck in the i 2 s-bus specification . - r ? function reserved. - r ? function reserved. - r ? function reserved. p6_1 r15 x g5 107 74 - [3] i; pu i/o gpio3[0] ? general purpose digital input/output pin. o emc_dycs1 ? sdram chip select 1. i/o u0_uclk ? serial clock input/output for usart0 in synchronous mode. i/o i2s0_rx_ws ? receive word select. it is driven by the master and received by the slave. corresponds to the signal ws in the i 2 s-bus specification . - r ? function reserved. i t2_cap0 ? capture input 2 of timer 2. - r ? function reserved. - r ? function reserved. p6_2 l13 x j9 111 78 - [3] i; pu i/o gpio3[1] ? general purpose digital input/output pin. o emc_ckeout1 ? sdram clock enable 1. i/o u0_dir ? rs-485/eia-485 output enable/direction control for usart0. i/o i2s0_rx_sda ? i 2 s receive data. it is driven by the transmitter and read by the receiver. corresponds to the signal sd in the i 2 s-bus specification . - r ? function reserved. i t2_cap1 ? capture input 1 of timer 2. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 29 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p6_3 p15 x - 113 79 - [3] i; pu i/o gpio3[2] ? general purpose digital input/output pin. o usb0_ppwr ? vbus drive signal (towards external charge pump or power management unit); indicates that the vbus signal must be driven (active high). add a pull-down resistor to disable the power switch at reset. this signal has opposite polarity compared to the usb_ppwr used on other nxp lpc parts. - r ? function reserved. o emc_cs1 ? low active chip select 1 signal. - r ? function reserved. i t2_cap2 ? capture input 2 of timer 2. - r ? function reserved. - r ? function reserved. p6_4 r16 x f6 114 80 53 [3] i; pu i/o gpio3[3] ? general purpose digital input/output pin. i ctin_6 ? sct input 6. capture input 1 of timer 3. o u0_txd ? transmitter output for usart0. o emc_cas ? low active sdram column address strobe. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. p6_5 p16 x f9 117 82 55 [3] i; pu i/o gpio3[4] ? general purpose digital input/output pin. o ctout_6 ? sct output 6. match output 2 of timer 1. i u0_rxd ? receiver input for usart0. o emc_ras ? low active sdram row address strobe. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 30 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p6_6 l14 x - 119 83 - [3] i; pu i/o gpio0[5] ? general purpose digital input/output pin. o emc_bls1 ? low active byte lane select signal 1. - r ? function reserved. o usb0_pwr_fault ? port power fault signal indicating overcurrent condition; this signal monitors over-current on the usb bus (external circuitry required to detect over-current condition). - r ? function reserved. i t2_cap3 ? capture input 3 of timer 2. - r ? function reserved. - r ? function reserved. p6_7 j13 x - 123 85 - [3] i; pu - r ? function reserved. i/o emc_a15 ? external memory address line 15. - r ? function reserved. o usb0_ind1 ? usb0 port indicator led control output 1. i/o gpio5[15] ? general purpose digital input/output pin. o t2_mat0 ? match output 0 of timer 2. - r ? function reserved. - r ? function reserved. p6_8 h13 x - 125 86 - [3] i; pu - r ? function reserved. i/o emc_a14 ? external memory address line 14. - r ? function reserved. o usb0_ind0 ? usb0 port indicator led control output 0. i/o gpio5[16] ? general purpose digital input/output pin. o t2_mat1 ? match output 1 of timer 2. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 31 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p6_9 j15 x f8 139 97 66 [3] i; pu i/o gpio3[5] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. o emc_dycs0 ? sdram chip select 0. - r ? function reserved. o t2_mat2 ? match output 2 of timer 2. - r ? function reserved. - r ? function reserved. p6_10 h15 x - 142 100 - [3] i; pu i/o gpio3[6] ? general purpose digital input/output pin. o mcabort ? motor control pwm, low-active fast abort. - r ? function reserved. o emc_dqmout1 ? data mask 1 used with sdram and static devices. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. p6_11 h12 x c9 143 101 69 [3] i; pu i/o gpio3[7] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. o emc_ckeout0 ? sdram clock enable 0. - r ? function reserved. o t2_mat3 ? match output 3 of timer 2. - r ? function reserved. - r ? function reserved. p6_12 g15 x - 145 103 - [3] i; pu i/o gpio2[8] ? general purpose digital input/output pin. o ctout_7 ? sct output 7. match output 3 of timer 1. - r ? function reserved. o emc_dqmout0 ? data mask 0 used with sdram and static devices. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 32 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p7_0 b16 x - 158 110 - [3] i; pu i/o gpio3[8] ? general purpose digital input/output pin. o ctout_14 ? sct output 14. match output 2 of timer 3. - r ? function reserved. o lcd_le ? line end signal. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. p7_1 c14 x - 162 113 - [3] i; pu i/o gpio3[9] ? general purpose digital input/output pin. o ctout_15 ? sct output 15. match output 3 of timer 3. i/o i2s0_tx_ws ? transmit word select. it is driven by the master and received by the slave. corresponds to the signal ws in the i 2 s-bus specification . o lcd_vd19 ? lcd data. o lcd_vd7 ? lcd data. - r ? function reserved. o u2_txd ? transmitter output for usart2. - r ? function reserved. p7_2 a16 x - 165 115 - [3] i; pu i/o gpio3[10] ? general purpose digital input/output pin. i ctin_4 ? sct input 4. capture input 2 of timer 1. i/o i2s0_tx_sda ? i 2 s transmit data. it is driven by the transmitter and read by the receiver. corresponds to the signal sd in the i 2 s-bus specification . o lcd_vd18 ? lcd data. o lcd_vd6 ? lcd data. - r ? function reserved. i u2_rxd ? receiver input for usart2. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 33 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p7_3 c13 x - 167 117 - [3] i; pu i/o gpio3[11] ? general purpose digital input/output pin. i ctin_3 ? sct input 3. capture input 1 of timer 1. - r ? function reserved. o lcd_vd17 ? lcd data. o lcd_vd5 ? lcd data. - r ? function reserved. - r ? function reserved. - r ? function reserved. p7_4 c8 x - 189 132 - [6] i; pu i/o gpio3[12] ? general purpose digital input/output pin. o ctout_13 ? sct output 13. match output 1 of timer 3. - r ? function reserved. o lcd_vd16 ? lcd data. o lcd_vd4 ? lcd data. o tracedata[0] ? trace data, bit 0. - r ? function reserved. - r ? function reserved. i adc0_4 ? adc0, input channel 4. p7_5 a7 x - 191 133 - [6] i; pu i/o gpio3[13] ? general purpose digital input/output pin. o ctout_12 ? sct output 12. match output 0 of timer 3. - r ? function reserved. o lcd_vd8 ? lcd data. o lcd_vd23 ? lcd data. o tracedata[1] ? trace data, bit 1. - r ? function reserved. - r ? function reserved. i adc0_3 ? adc0, input channel 3. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 34 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p7_6 c7 x - 194 134 - [3] i; pu i/o gpio3[14] ? general purpose digital input/output pin. o ctout_11 ? sct output 1. match output 3 of timer 2. - r ? function reserved. o lcd_lp ? line synchronization pulse (stn). horizontal synchronization pulse (tft). - r ? function reserved. o tracedata[2] ? trace data, bit 2. - r ? function reserved. - r ? function reserved. p7_7 b6 x - 201 140 - [6] i; pu i/o gpio3[15] ? general purpose digital input/output pin. o ctout_8 ? sct output 8. match output 0 of timer 2. - r ? function reserved. o lcd_pwr ? lcd panel power enable. - r ? function reserved. o tracedata[3] ? trace data, bit 3. o enet_mdc ? ethernet miim clock. - r ? function reserved. i adc1_6 ? adc1, input channel 6. p8_0 e5 x - 2 - - [4] i; pu i/o gpio4[0] ? general purpose digital input/output pin. o usb0_pwr_fault ? port power fault signal indicating overcurrent condition; this signal monitors over-current on the usb bus (external circuitry required to detect over-current condition). - r ? function reserved. i mci2 ? motor control pwm channel 2, input. - r ? function reserved. - r ? function reserved. - r ? function reserved. o t0_mat0 ? match output 0 of timer 0. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 35 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p8_1 h5 x - 34 - - [4] i; pu i/o gpio4[1] ? general purpose digital input/output pin. o usb0_ind1 ? usb0 port indicator led control output 1. - r ? function reserved. i mci1 ? motor control pwm channel 1, input. - r ? function reserved. - r ? function reserved. - r ? function reserved. o t0_mat1 ? match output 1 of timer 0. p8_2 k4 x - 36 - - [4] i; pu i/o gpio4[2] ? general purpose digital input/output pin. o usb0_ind0 ? usb0 port indicator led control output 0. - r ? function reserved. i mci0 ? motor control pwm channel 0, input. - r ? function reserved. - r ? function reserved. - r ? function reserved. o t0_mat2 ? match output 2 of timer 0. p8_3 j3 x - 37 - - [3] i; pu i/o gpio4[3] ? general purpose digital input/output pin. i/o usb1_ulpi_d2 ? ulpi link bidirectional data line 2. - r ? function reserved. o lcd_vd12 ? lcd data. o lcd_vd19 ? lcd data. - r ? function reserved. - r ? function reserved. o t0_mat3 ? match output 3 of timer 0. p8_4 j2 x - 39 - - [3] i; pu i/o gpio4[4] ? general purpose digital input/output pin. i/o usb1_ulpi_d1 ? ulpi link bidirectional data line 1. - r ? function reserved. o lcd_vd7 ? lcd data. o lcd_vd16 ? lcd data. - r ? function reserved. - r ? function reserved. i t0_cap0 ? capture input 0 of timer 0. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 36 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p8_5 j1 x - 40 - - [3] i; pu i/o gpio4[5] ? general purpose digital input/output pin. i/o usb1_ulpi_d0 ? ulpi link bidirectional data line 0. - r ? function reserved. o lcd_vd6 ? lcd data. o lcd_vd8 ? lcd data. - r ? function reserved. - r ? function reserved. i t0_cap1 ? capture input 1 of timer 0. p8_6 k3 x - 43 - - [3] i; pu i/o gpio4[6] ? general purpose digital input/output pin. i usb1_ulpi_nxt ? ulpi link nxt signal. data flow control signal from the phy. - r ? function reserved. o lcd_vd5 ? lcd data. o lcd_lp ? line synchronization pulse (stn). horizontal synchronization pulse (tft). - r ? function reserved. - r ? function reserved. i t0_cap2 ? capture input 2 of timer 0. p8_7 k1 x - 45 - - [3] i; pu i/o gpio4[7] ? general purpose digital input/output pin. o usb1_ulpi_stp ? ulpi link stp si gnal. asserted to end or interrupt transfers to the phy. - r ? function reserved. o lcd_vd4 ? lcd data. o lcd_pwr ? lcd panel power enable. - r ? function reserved. - r ? function reserved. i t0_cap3 ? capture input 3 of timer 0. p8_8 l1 x - 49 - - [3] i; pu - r ? function reserved. i usb1_ulpi_clk ? ulpi link clk signal. 60 mhz clock generated by the phy. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. o cgu_out0 ? cgu spare clock output 0. o i2s1_tx_mclk ? i 2 s1 transmit master clock. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 37 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p9_0 t1 x - 59 - - [3] i; pu i/o gpio4[12] ? general purpose digital input/output pin. o mcabort ? motor control pwm, low-active fast abort. - r ? function reserved. - r ? function reserved. - r ? function reserved. i enet_crs ? ethernet carrier sense (mii interface). - r ? function reserved. i/o ssp0_ssel ? slave select for ssp0. p9_1 n6 x - 66 - - [3] i; pu i/o gpio4[13] ? general purpose digital input/output pin. o mcoa2 ? motor control pwm channel 2, output a. - r ? function reserved. - r ? function reserved. i/o i2s0_tx_ws ? transmit word select. it is driven by the master and received by the slave. corresponds to the signal ws in the i 2 s-bus specification . i enet_rx_er ? ethernet receive error (mii interface). - r ? function reserved. i/o ssp0_miso ? master in slave out for ssp0. p9_2 n8 x - 70 - - [3] i; pu i/o gpio4[14] ? general purpose digital input/output pin. o mcob2 ? motor control pwm channel 2, output b. - r ? function reserved. - r ? function reserved. i/o i2s0_tx_sda ? i 2 s transmit data. it is driven by the transmitter and read by the receiver. corresponds to the signal sd in the i 2 s-bus specification . i enet_rxd3 ? ethernet receive data 3 (mii interface). - r ? function reserved. i/o ssp0_mosi ? master out slave in for ssp0. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 38 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p9_3 m6 x - 79 - - [3] i; pu i/o gpio4[15] ? general purpose digital input/output pin. o mcoa0 ? motor control pwm channel 0, output a. o usb1_ind1 ? usb1 port indicator led control output 1. - r ? function reserved. - r ? function reserved. i enet_rxd2 ? ethernet receive data 2 (mii interface). - r ? function reserved. o u3_txd ? transmitter output for usart3. p9_4 n10 x - 92 - - [3] i; pu - r ? function reserved. o mcob0 ? motor control pwm channel 0, output b. o usb1_ind0 ? usb1 port indicator led control output 0. - r ? function reserved. i/o gpio5[17] ? general purpose digital input/output pin. o enet_txd2 ? ethernet transmit data 2 (mii interface). - r ? function reserved. i u3_rxd ? receiver input for usart3. p9_5 m9 x - 98 69 - [3] i; pu - r ? function reserved. o mcoa1 ? motor control pwm channel 1, output a. o usb1_ppwr ? vbus drive signal (towards external charge pump or power management unit); indicates that vbus must be driven (active high). add a pull-down resistor to disable the power switch at reset. this signal has opposite polarity compared to the usb_ppwr used on other nxp lpc parts. - r ? function reserved. i/o gpio5[18] ? general purpose digital input/output pin. o enet_txd3 ? ethernet transmit data 3 (mii interface). - r ? function reserved. o u0_txd ? transmitter output for usart0. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 39 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller p9_6 l11 x - 103 72 - [3] i; pu i/o gpio4[11] ? general purpose digital input/output pin. o mcob1 ? motor control pwm channel 1, output b. o usb1_pwr_fault ? usb1 port power fault signal indicating over-current condition; this signal monitors over-current on the usb1 bus (external circuitry required to detect over-current condition). - r ? function reserved. - r ? function reserved. i enet_col ? ethernet collision detect (mii interface). - r ? function reserved. i u0_rxd ? receiver input for usart0. pa_0 l12 x - 126 - - [3] i; pu - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. o i2s1_rx_mclk ? i 2 s1 receive master clock. o cgu_out1 ? cgu spare clock output 1. - r ? function reserved. pa_1 j14 x - 134 - - [4] i; pu i/o gpio4[8] ? general purpose digital input/output pin. i qei_idx ? quadrature encode r interface index input. - r ? function reserved. o u2_txd ? transmitter output for usart2. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. pa_2 k15 x - 136 - - [4] i; pu i/o gpio4[9] ? general purpose digital input/output pin. i qei_phb ? quadrature encoder interface phb input. - r ? function reserved. i u2_rxd ? receiver input for usart2. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 40 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pa_3 h11 x - 147 - - [4] i; pu i/o gpio4[10] ? general purpose digital input/output pin. i qei_pha ? quadrature encoder interface pha input. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. pa_4 g13 x - 151 - - [3] i; pu - r ? function reserved. o ctout_9 ? sct output 9. match output 1 of timer 2. - r ? function reserved. i/o emc_a23 ? external memory address line 23. i/o gpio5[19] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pb_0 b15 x - 164 - - [3] i; pu - r ? function reserved. o ctout_10 ? sct output 10. match output 2 of timer 2. o lcd_vd23 ? lcd data. - r ? function reserved. i/o gpio5[20] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 41 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pb_1 a14 x - 175 - - [3] i; pu - r ? function reserved. i usb1_ulpi_dir ? ulpi link dir signal. controls the ulp data line direction. o lcd_vd22 ? lcd data. - r ? function reserved. i/o gpio5[21] ? general purpose digital input/output pin. o ctout_6 ? sct output 6. match output 2 of timer 1. - r ? function reserved. - r ? function reserved. pb_2 b12 x - 177 - - [3] i; pu - r ? function reserved. i/o usb1_ulpi_d7 ? ulpi link bidirectional data line 7. o lcd_vd21 ? lcd data. - r ? function reserved. i/o gpio5[22] ? general purpose digital input/output pin. o ctout_7 ? sct output 7. match output 3 of timer 1. - r ? function reserved. - r ? function reserved. pb_3 a13 x - 178 - - [3] i; pu - r ? function reserved. i/o usb1_ulpi_d6 ? ulpi link bidirectional data line 6. o lcd_vd20 ? lcd data. - r ? function reserved. i/o gpio5[23] ? general purpose digital input/output pin. o ctout_8 ? sct output 8. match output 0 of timer 2. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 42 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pb_4 b11 x - 180 - - [3] i; pu - r ? function reserved. i/o usb1_ulpi_d5 ? ulpi link bidirectional data line 5. o lcd_vd15 ? lcd data. - r ? function reserved. i/o gpio5[24] ? general purpose digital input/output pin. i ctin_5 ? sct input 5. capture input 2 of timer 2. - r ? function reserved. - r ? function reserved. pb_5 a12 x - 181 - - [3] i; pu - r ? function reserved. i/o usb1_ulpi_d4 ? ulpi link bidirectional data line 4. o lcd_vd14 ? lcd data. - r ? function reserved. i/o gpio5[25] ? general purpose digital input/output pin. i ctin_7 ? sct input 7. o lcd_pwr ? lcd panel power enable. - r ? function reserved. pb_6 a6 x - - - - [6] i; pu - r ? function reserved. i/o usb1_ulpi_d3 ? ulpi link bidirectional data line 3. o lcd_vd13 ? lcd data. - r ? function reserved. i/o gpio5[26] ? general purpose digital input/output pin. i ctin_6 ? sct input 6. capture input 1 of timer 3. o lcd_vd19 ? lcd data. - r ? function reserved. i adc0_6 ? adc0, input channel 6. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 43 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pc_0 d4 x - 7 - - [6] i; pu - r ? function reserved. i usb1_ulpi_clk ? ulpi link clk signal. 60 mhz clock generated by the phy. - r ? function reserved. i/o enet_rx_clk ? ethernet receive clock (mii interface). o lcd_dclk ? lcd panel clock. - r ? function reserved. - r ? function reserved. i/o sd_clk ? sd/mmc card clock. i adc1_1 ? adc1, input channel 1. pc_1 e4 - - 9 - - [3] i; pu i/o usb1_ulpi_d7 ? ulpi link bidirectional data line 7. - r ? function reserved. i u1_ri ? ring indicator input for uart1. o enet_mdc ? ethernet miim clock. i/o gpio6[0] ? general purpose digital input/output pin. - r ? function reserved. i t3_cap0 ? capture input 0 of timer 3. o sd_volt0 ? sd/mmc bus voltage select output 0. pc_2 f6 - - 13 - - [3] i; pu i/o usb1_ulpi_d6 ? ulpi link bidirectional data line 6. - r ? function reserved. i u1_cts ? clear to send input for uart1. o enet_txd2 ? ethernet transmit data 2 (mii interface). i/o gpio6[1] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. o sd_rst ? sd/mmc reset signal for mmc4.4 card. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 44 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pc_3 f5 - - 11 - - [6] i; pu i/o usb1_ulpi_d5 ? ulpi link bidirectional data line 5. - r ? function reserved. o u1_rts ? request to send output for uart1. can also be configured to be an rs-485/eia-485 output enable signal for uart1. o enet_txd3 ? ethernet transmit data 3 (mii interface). i/o gpio6[2] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. o sd_volt1 ? sd/mmc bus voltage select output 1. i adc1_0 ? adc1, input channel 0. pc_4 f4 - - 16 - - [3] i; pu - r ? function reserved. i/o usb1_ulpi_d4 ? ulpi link bidirectional data line 4. - r ? function reserved. enet_tx_en ? ethernet transmit enable (rmii/mii interface). i/o gpio6[3] ? general purpose digital input/output pin. - r ? function reserved. i t3_cap1 ? capture input 1 of timer 3. i/o sd_dat0 ? sd/mmc data bus line 0. pc_5 g4 - - 20 - - [3] i; pu - r ? function reserved. i/o usb1_ulpi_d3 ? ulpi link bidirectional data line 3. - r ? function reserved. o enet_tx_er ? ethernet transmit error (mii interface). i/o gpio6[4] ? general purpose digital input/output pin. - r ? function reserved. i t3_cap2 ? capture input 2 of timer 3. i/o sd_dat1 ? sd/mmc data bus line 1. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 45 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pc_6 h6 - - 22 - - [3] i; pu - r ? function reserved. i/o usb1_ulpi_d2 ? ulpi link bidirectional data line 2. - r ? function reserved. i enet_rxd2 ? ethernet receive data 2 (mii interface). i/o gpio6[5] ? general purpose digital input/output pin. - r ? function reserved. i t3_cap3 ? capture input 3 of timer 3. i/o sd_dat2 ? sd/mmc data bus line 2. pc_7 g5 - - - - - [3] i; pu - r ? function reserved. i/o usb1_ulpi_d1 ? ulpi link bidirectional data line 1. - r ? function reserved. i enet_rxd3 ? ethernet receive data 3 (mii interface). i/o gpio6[6] ? general purpose digital input/output pin. - r ? function reserved. o t3_mat0 ? match output 0 of timer 3. i/o sd_dat3 ? sd/mmc data bus line 3. pc_8 n4 - - - - - [3] i; pu - r ? function reserved. i/o usb1_ulpi_d0 ? ulpi link bidirectional data line 0. - r ? function reserved. i enet_rx_dv ? ethernet receive data valid (rmii/mii interface). i/o gpio6[7] ? general purpose digital input/output pin. - r ? function reserved. o t3_mat1 ? match output 1 of timer 3. i sd_cd ? sd/mmc card detect input. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 46 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pc_9 k2 - - - - - [3] i; pu - r ? function reserved. i usb1_ulpi_nxt ? ulpi link nxt signal. data flow control signal from the phy. - r ? function reserved. i enet_rx_er ? ethernet receive error (mii interface). i/o gpio6[8] ? general purpose digital input/output pin. - r ? function reserved. o t3_mat2 ? match output 2 of timer 3. o sd_pow ? sd/mmc power monitor output. pc_10 m5 - - - - - [3] i; pu - r ? function reserved. o usb1_ulpi_stp ? ulpi link stp si gnal. asserted to end or interrupt transfers to the phy. i u1_dsr ? data set ready input for uart1. - r ? function reserved. i/o gpio6[9] ? general purpose digital input/output pin. - r ? function reserved. o t3_mat3 ? match output 3 of timer 3. i/o sd_cmd ? sd/mmc command signal. pc_11 l5 - - - - - [3] i; pu - r ? function reserved. i usb1_ulpi_dir ? ulpi link dir signal. controls the ulp data line direction. i u1_dcd ? data carrier detect input for uart1. - r ? function reserved. i/o gpio6[10] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. i/o sd_dat4 ? sd/mmc data bus line 4. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 47 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pc_12 l6 - - - - - [3] i; pu - r ? function reserved. - r ? function reserved. o u1_dtr ? data terminal ready output for uart1. can also be configured to be an rs-485/eia-485 output enable signal for uart1. - r ? function reserved. i/o gpio6[11] ? general purpose digital input/output pin. - r ? function reserved. i/o i2s0_tx_sda ? i 2 s transmit data. it is driven by the transmitter and read by the receiver. corresponds to the signal sd in the i 2 s-bus specification . i/o sd_dat5 ? sd/mmc data bus line 5. pc_13 m1 - - - - - [3] i; pu - r ? function reserved. - r ? function reserved. o u1_txd ? transmitter output for uart1. - r ? function reserved. i/o gpio6[12] ? general purpose digital input/output pin. - r ? function reserved. i/o i2s0_tx_ws ? transmit word select. it is driven by the master and received by the slave. corresponds to the signal ws in the i 2 s-bus specification . i/o sd_dat6 ? sd/mmc data bus line 6. pc_14 n1 - - - - - [3] i; pu - r ? function reserved. - r ? function reserved. i u1_rxd ? receiver input for uart1. - r ? function reserved. i/o gpio6[13] ? general purpose digital input/output pin. - r ? function reserved. o enet_tx_er ? ethernet transmit error (mii interface). i/o sd_dat7 ? sd/mmc data bus line 7. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 48 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pd_0 n2 - - - - - [3] i; pu - r ? function reserved. o ctout_15 ? sct output 15. match output 3 of timer 3. o emc_dqmout2 ? data mask 2 used with sdram and static devices. - r ? function reserved. i/o gpio6[14] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pd_1 p1 - - - - - [3] i; pu - r ? function reserved. - r ? function reserved. o emc_ckeout2 ? sdram clock enable 2. - r ? function reserved. i/o gpio6[15] ? general purpose digital input/output pin. o sd_pow ? sd/mmc power monitor output. - r ? function reserved. - r ? function reserved. pd_2 r1 - - - - - [3] i; pu - r ? function reserved. o ctout_7 ? sct output 7. match output 3 of timer 1. i/o emc_d16 ? external memory data line 16. - r ? function reserved. i/o gpio6[16] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 49 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pd_3 p4 - - - - - [3] i; pu - r ? function reserved. o ctout_6 ? sct output 7. match output 2 of timer 1. i/o emc_d17 ? external memory data line 17. - r ? function reserved. i/o gpio6[17] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pd_4 t2 - - - - - [3] i; pu - r ? function reserved. o ctout_8 ? sct output 8. match output 0 of timer 2. i/o emc_d18 ? external memory data line 18. - r ? function reserved. i/o gpio6[18] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pd_5 p6 - - - - - [3] i; pu - r ? function reserved. o ctout_9 ? sct output 9. match output 1 of timer 2. i/o emc_d19 ? external memory data line 19. - r ? function reserved. i/o gpio6[19] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 50 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pd_6 r6 - - 68 - - [3] i; pu - r ? function reserved. o ctout_10 ? sct output 10. match output 2 of timer 2. i/o emc_d20 ? external memory data line 20. - r ? function reserved. i/o gpio6[20] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pd_7 t6 - - 72 - - [3] i; pu - r ? function reserved. i ctin_5 ? sct input 5. capture input 2 of timer 2. i/o emc_d21 ? external memory data line 21. - r ? function reserved. i/o gpio6[21] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pd_8 p8 - - 74 - - [3] i; pu - r ? function reserved. i ctin_6 ? sct input 6. capture input 1 of timer 3. i/o emc_d22 ? external memory data line 22. - r ? function reserved. i/o gpio6[22] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pd_9 t11 - - 84 - - [3] i; pu - r ? function reserved. o ctout_13 ? sct output 13. match output 1 of timer 3. i/o emc_d23 ? external memory data line 23. - r ? function reserved. i/o gpio6[23] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 51 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pd_10 p11 - - 86 - - [3] i; pu - r ? function reserved. i ctin_1 ? sct input 1. capture input 1 of timer 0. capture input 1 of timer 2. o emc_bls3 ? low active byte lane select signal 3. - r ? function reserved. i/o gpio6[24] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pd_11 n9 x - 88 - - [3] i; pu - r ? function reserved. - r ? function reserved. o emc_cs3 ? low active chip select 3 signal. - r ? function reserved. i/o gpio6[25] ? general purpose digital input/output pin. i/o usb1_ulpi_d0 ? ulpi link bidirectional data line 0. o ctout_14 ? sct output 14. match output 2 of timer 3. - r ? function reserved. pd_12 n11 x - 94 - - [3] i; pu - r ? function reserved. - r ? function reserved. o emc_cs2 ? low active chip select 2 signal. - r ? function reserved. i/o gpio6[26] ? general purpose digital input/output pin. - r ? function reserved. o ctout_10 ? sct output 10. match output 2 of timer 2. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 52 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pd_13 t14 x - 97 - - [3] i; pu - r ? function reserved. i ctin_0 ? sct input 0. capture input 0 of timer 0, 1, 2, 3. o emc_bls2 ? low active byte lane select signal 2. - r ? function reserved. i/o gpio6[27] ? general purpose digital input/output pin. - r ? function reserved. o ctout_13 ? sct output 13. match output 1 of timer 3. - r ? function reserved. pd_14 r13 x - 99 - - [3] i; pu - r ? function reserved. - r ? function reserved. o emc_dycs2 ? sdram chip select 2. - r ? function reserved. i/o gpio6[28] ? general purpose digital input/output pin. - r ? function reserved. o ctout_11 ? sct output 11. match output 3 of timer 2. - r ? function reserved. pd_15 t15 x - 101 - - [3] i; pu - r ? function reserved. - r ? function reserved. i/o emc_a17 ? external memory address line 17. - r ? function reserved. i/o gpio6[29] ? general purpose digital input/output pin. i sd_wp ? sd/mmc card write protect input. o ctout_8 ? sct output 8. match output 0 of timer 2. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 53 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pd_16 r14 x - 104 - - [3] i; pu - r ? function reserved. - r ? function reserved. i/o emc_a16 ? external memory address line 16. - r ? function reserved. i/o gpio6[30] ? general purpose digital input/output pin. o sd_volt2 ? sd/mmc bus voltage select output 2. o ctout_12 ? sct output 12. match output 0 of timer 3. - r ? function reserved. pe_0 p14 x - 106 - - [3] i; pu - r ? function reserved. - r ? function reserved. - r ? function reserved. i/o emc_a18 ? external memory address line 18. i/o gpio7[0] ? general purpose digital input/output pin. o can1_td ? can1 transmitter output. - r ? function reserved. - r ? function reserved. pe_1 n14 x - 112 - - [3] i; pu - r ? function reserved. - r ? function reserved. - r ? function reserved. i/o emc_a19 ? external memory address line 19. i/o gpio7[1] ? general purpose digital input/output pin. i can1_rd ? can1 receiver input. - r ? function reserved. - r ? function reserved. pe_2 m14 x - 115 - - [3] i; pu i adctrig0 ? adc trigger input 0. i can0_rd ? can receiver input. - r ? function reserved. i/o emc_a20 ? external memory address line 20. i/o gpio7[2] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 54 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pe_3 k12 x - 118 - - [3] i; pu - r ? function reserved. o can0_td ? can transmitter output. i adctrig1 ? adc trigger input 1. i/o emc_a21 ? external memory address line 21. i/o gpio7[3] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pe_4 k13 x - 120 - - [3] i; pu - r ? function reserved. i nmi ? external interrupt input to nmi. - r ? function reserved. i/o emc_a22 ? external memory address line 22. i/o gpio7[4] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pe_5 n16 - - 122 - - [3] i; pu - r ? function reserved. o ctout_3 ? sct output 3. match output 3 of timer 0. o u1_rts ? request to send output for uart1. can also be configured to be an rs-485/eia-485 output enable signal for uart1. i/o emc_d24 ? external memory data line 24. i/o gpio7[5] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pe_6 m16 - - 124 - - [3] i; pu - r ? function reserved. o ctout_2 ? sct output 2. match output 2 of timer 0. i u1_ri ? ring indicator input for uart1. i/o emc_d25 ? external memory data line 25. i/o gpio7[6] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 55 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pe_7 f15 - - 149 - - [3] i; pu - r ? function reserved. o ctout_5 ? sct output 5. match output 1 of timer 1. i u1_cts ? clear to send input for uart1. i/o emc_d26 ? external memory data line 26. i/o gpio7[7] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pe_8 f14 - - 150 - - [3] i; pu - r ? function reserved. o ctout_4 ? sct output 4. match output 0 of timer 0. i u1_dsr ? data set ready input for uart1. i/o emc_d27 ? external memory data line 27. i/o gpio7[8] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pe_9 e16 - - 152 - - [3] i; pu - r ? function reserved. i ctin_4 ? sct input 4. capture input 2 of timer 1. i u1_dcd ? data carrier detect input for uart1. i/o emc_d28 ? external memory data line 28. i/o gpio7[9] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pe_10 e14 - - 154 - - [3] i; pu - r ? function reserved. i ctin_3 ? sct input 3. capture input 1 of timer 1. o u1_dtr ? data terminal ready output for uart1. can also be configured to be an rs-485/eia-485 output enable signal for uart1. i/o emc_d29 ? external memory data line 29. i/o gpio7[10] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 56 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pe_11 d16 - - - - - [3] i; pu - r ? function reserved. o ctout_12 ? sct output 12. match output 0 of timer 3. o u1_txd ? transmitter output for uart1. i/o emc_d30 ? external memory data line 30. i/o gpio7[11] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pe_12 d15 - - - - - [3] i; pu - r ? function reserved. o ctout_11 ? sct output 11. match output 3 of timer 2. i u1_rxd ? receiver input for uart1. i/o emc_d31 ? external memory data line 31. i/o gpio7[12] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pe_13 g14 - - - - - [3] i; pu - r ? function reserved. o ctout_14 ? sct output 14. match output 2 of timer 3. i/o i2c1_sda ? i 2 c1 data input/output (this pin does not use a specialized i 2 c pad). o emc_dqmout3 ? data mask 3 used with sdram and static devices. i/o gpio7[13] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 57 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pe_14 c15 - - - - - [3] i; pu - r ? function reserved. - r ? function reserved. - r ? function reserved. o emc_dycs3 ? sdram chip select 3. i/o gpio7[14] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pe_15 e13 - - - - - [3] i; pu - r ? function reserved. o ctout_0 ? sct output 0. match output 0 of timer 0. i/o i2c1_scl ? i 2 c1 clock input/output (this pin does not use a specialized i 2 c pad). o emc_ckeout3 ? sdram clock enable 3. i/o gpio7[15] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pf_0 d12 - - 159 - - [3] o; pu i/o ssp0_sck ? serial clock for ssp0. i gp_clkin ? general purpose clock input to the cgu. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. - r ? function reserved. o i2s1_tx_mclk ? i 2 s1 transmit master clock. pf_1 e11 - - - - - [3] i; pu - r ? function reserved. - r ? function reserved. i/o ssp0_ssel ? slave select for ssp0. - r ? function reserved. i/o gpio7[16] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 58 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pf_2 d11 - - 168 - - [3] i; pu - r ? function reserved. o u3_txd ? transmitter output for usart3. i/o ssp0_miso ? master in slave out for ssp0. - r ? function reserved. i/o gpio7[17] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pf_3 e10 - - 170 - - [3] i; pu - r ? function reserved. i u3_rxd ? receiver input for usart3. i/o ssp0_mosi ? master out slave in for ssp0. - r ? function reserved. i/o gpio7[18] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. pf_4 d10 x h4 172 120 83 [3] o; pu i/o ssp1_sck ? serial clock for ssp1. i gp_clkin ? general purpose clock input to the cgu. o traceclk ? trace clock. - r ? function reserved. - r ? function reserved. - r ? function reserved. o i2s0_tx_mclk ? i 2 s transmit master clock. i/o i2s0_rx_sck ? i 2 s receive clock. it is driven by the master and received by the slave. corresponds to the signal sck in the i 2 s-bus specification . table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 59 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pf_5 e9 - - 190 - - [6] i; pu - r ? function reserved. i/o u3_uclk ? serial clock input/output for usart3 in synchronous mode. i/o ssp1_ssel ? slave select for ssp1. o tracedata[0] ? trace data, bit 0. i/o gpio7[19] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. i adc1_4 ? adc1, input channel 4. pf_6 e7 - - 192 - - [6] i; pu - r ? function reserved. i/o u3_dir ? rs-485/eia-485 output enable/direction control for usart3. i/o ssp1_miso ? master in slave out for ssp1. o tracedata[1] ? trace data, bit 1. i/o gpio7[20] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. i/o i2s1_tx_sda ? i 2 s1 transmit data. it is driven by the transmitter and read by the receiver. corresponds to the signal sd in the i 2 s-bus specification . i adc1_3 ? adc1, input channel 3. pf_7 b7 - - 193 - - [6] i; pu - r ? function reserved. i/o u3_baud ? baud pin usart3. i/o ssp1_mosi ? master out slave in for ssp1. o tracedata[2] ? trace data, bit 2. i/o gpio7[21] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. i/o i2s1_tx_ws ? transmit word select. it is driven by the master and received by the slave. corresponds to the signal ws in the i 2 s-bus specification . i/o adc1_7 ? adc1, input channel 7 or band gap output. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 60 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pf_8 e6 - - - - - [6] i; pu - r ? function reserved. i/o u0_uclk ? serial clock input/output for usart0 in synchronous mode. i ctin_2 ? sct input 2. capture input 2 of timer 0. o tracedata[3] ? trace data, bit 3. i/o gpio7[22] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. i adc0_2 ? adc0, input channel 2. pf_9 d6 - - 203 - - [6] i; pu - r ? function reserved. i/o u0_dir ? rs-485/eia-485 output enable/direction control for usart0. o ctout_1 ? sct output 1. match output 1 of timer 0. - r ? function reserved. i/o gpio7[23] ? general purpose digital input/output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. i adc1_2 ? adc1, input channel 2. pf_10 a3 - - 205 - 98 [6] i; pu - r ? function reserved. o u0_txd ? transmitter output for usart0. - r ? function reserved. - r ? function reserved. i/o gpio7[24] ? general purpose digital input/output pin. - r ? function reserved. i sd_wp ? sd/mmc card write protect input. - r ? function reserved. i adc0_5 ? adc0, input channel 5. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 61 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller pf_11 a2 - - 207 - 100 [6] i; pu - r ? function reserved. i u0_rxd ? receiver input for usart0. - r ? function reserved. - r ? function reserved. i/o gpio7[25] ? general purpose digital input/output pin. - r ? function reserved. o sd_volt2 ? sd/mmc bus voltage select output 2. - r ? function reserved. i adc1_5 ? adc1, input channel 5. clock pins clk0 n5 x k3624531 [5] o; pu o emc_clk0 ? sdram clock 0. o clkout ? clock output pin. - r ? function reserved. - r ? function reserved. i/o sd_clk ? sd/mmc card clock. o emc_clk01 ? sdram clock 0 and clock 1 combined. i/o ssp1_sck ? serial clock for ssp1. i enet_tx_clk (enet_ref_clk) ? ethernet transmit clock (mii interface) or ethernet reference clock (rmii interface). clk1 t10 x - - - - [5] o; pu o emc_clk1 ? sdram clock 1. o clkout ? clock output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. o cgu_out0 ? cgu spare clock output 0. - r ? function reserved. o i2s1_tx_mclk ? i 2 s1 transmit master clock. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 62 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller clk2 d14 x k6 141 99 68 [5] o; pu o emc_clk3 ? sdram clock 3. o clkout ? clock output pin. - r ? function reserved. - r ? function reserved. i/o sd_clk ? sd/mmc card clock. o emc_clk23 ? sdram clock 2 and clock 3 combined. o i2s0_tx_mclk ? i 2 s transmit master clock. i/o i2s1_rx_sck ? receive clock. it is driven by the master and received by the slave. corresponds to the signal sck in the i 2 s-bus specification . clk3 p12 x - - - - [5] o; pu o emc_clk2 ? sdram clock 2. o clkout ? clock output pin. - r ? function reserved. - r ? function reserved. - r ? function reserved. o cgu_out1 ? cgu spare clock output 1. - r ? function reserved. i/o i2s1_rx_sck ? receive clock. it is driven by the master and received by the slave. corresponds to the signal sck in the i 2 s-bus specification . debug pins dbgen l4 x a6 41 28 18 [3] i i jtag interface control signal. also used for boundary scan. tck/swdclk j5 x h2 38 27 17 [3] i; f i test clock for jtag interface (default) or serial wire (sw) clock. trst m4 x b4422919 [3] i; pu i test reset for jtag interface. tms/swdio k6 x c4 44 30 20 [3] i; pu i test mode select for jtag interface (default) or sw debug data input/output. tdo/swo k5 x h3 46 31 21 [3] o o test data out for jtag interface (default) or sw trace output. tdi j4 x g3 35 26 16 [3] i; pu i test data in for jtag interface. usb0 pins usb0_dp f2 x e1 26 18 9 [7] - i/o usb0 bidirectional d+ line. usb0_dm g2 x e2 28 20 11 [7] - i/o usb0 bidirectional d ? line. usb0_vbus f1 x e3 29 21 12 [7] [8] - i/o vbus pin (power on usb cable). this pin includes an internal pull-down resistor of 64 k ? (typical) ? 16 k ? . table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 63 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller usb0_id h2 x f1 30 22 13 [9] - i indicates to the transceiver whether connected as an a-device (usb0_id low) or b-device (usb0_id high). for otg, this pin has an internal pull-up resistor. usb0_rref h1 x f3 32 24 15 [9] - 12.0 k ? (accuracy 1 %) on-board resistor to ground for current reference. usb1 pins usb1_dp f12 x e9 129 89 59 [10] - i/o usb1 bidirectional d+ line. usb1_dm g12 x e10 130 90 60 [10] - i/o usb1 bidirectional d ? line. i 2 c-bus pins i2c0_scl l15 x d6 132 92 62 [11] i; f i/o i 2 c clock input/output. op en-drain output (for i 2 c-bus compliance). i2c0_sda l16 x e6 133 93 63 [11] i; f i/o i 2 c data input/output. open -drain output (for i 2 c-bus compliance). reset and wake-up pins reset d9 x b6 185 128 91 [12] i; ia i external reset input: a low on this pin resets the device, causing i/o ports and peripherals to take on their default states, and processor execution to begin at address 0. wakeup0 a9 x a4 187 130 93 [12] i; ia i external wake-up input; can raise an interrupt and can cause wake-up from any of the low power modes. wakeup1 a10 x - - - - [12] i; ia i external wake-up input; can raise an interrupt and can cause wake-up from any of the low power modes. wakeup2 c9 x - - - - [12] i; ia i external wake-up input; can raise an interrupt and can cause wake-up from any of the low power modes. wakeup3 d8 x - - - - [12] i; ia i external wake-up input; can raise an interrupt and can cause wake-up from any of the low power modes. adc pins adc0_0/ adc1_0/dac e3 x a2 8 6 4 [9] i; ia i adc input channel 0. shared between 10-bit adc0/1 and dac. adc0_1/ adc1_1 c3 x a1 4 2 1 [9] i; ia i adc input channel 1. shared between 10-bit adc0/1. adc0_2/ adc1_2 a4 x b3 206 143 99 [9] i; ia i adc input channel 2. shared between 10-bit adc0/1. adc0_3/ adc1_3 b5 x a3 200 139 96 [9] i; ia i adc input channel 3. shared between 10-bit adc0/1. adc0_4/ adc1_4 c6 x - 199 138 - [9] i; ia i adc input channel 4. shared between 10-bit adc0/1. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 64 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller adc0_5/ adc1_5 b3 x - 208 144 - [9] i; ia i adc input channel 5. shared between 10-bit adc0/1. adc0_6/ adc1_6 a5 x - 204 142 - [9] i; ia i adc input channel 6. shared between 10-bit adc0/1. adc0_7/ adc1_7 c5 x - 197 136 - [9] i; ia i adc input channel 7. shared between 10-bit adc0/1. rtc rtc_alarm a11 x c3 186 129 92 [12] - o rtc controlled output. rtcx1 a8 x a5 182 125 88 [9] - i input to the rtc 32 khz ultra-low power oscillator circuit. rtcx2 b8 x b5 183 126 89 [9] - o output from the rtc 32 khz ultra-low power oscillator circuit. crystal oscillator pins xtal1 d1 x b1 18 12 5 [9] - i input to the oscillator circuit and internal clock generator circuits. xtal2 e1 x c1 19 13 6 [9] - o output from the o scillator amplifier. power and ground pins usb0_vdda 3v3_driver f3 x d1 24 16 7 - - separate analog 3.3 v power supply for driver. usb0 _vdda3v3 g3 x d2 25 17 8 - - usb 3.3 v separate power supply voltage. usb0_vssa _term h3 x d3 27 19 10 - - dedicated analog ground for clean reference for termination resistors. usb0_vssa _ref g1 x f2 31 23 14 - - dedicated clean analog ground for generation of reference currents and voltages. vdda b4 x b2 198 137 95 - - analog power supply and adc reference voltage. vbat b10 x c5 184 127 90 - - rtc power supply: 3.3 v on this pin supplies power to the rtc. vddreg f10, f9, l8, l7 xe4, e5, f4 135, 188, 195, 82, 33 94, 131, 59, 25 - - main regulator power supply. tie the vddreg and vddio pins to a common power supply to ensure the same ramp-up time for both supply voltages. vpp e8 x - x x - [13] - - otp programming voltage. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 65 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [1] x = available; - = not pinned out. [2] i = input, o = output, ia = inactive; pu = pull- up enabled (weak pull-up resistor pulls up pin to v dd(io) ); f = floating. reset state reflects the pin state at reset without boot code operation. vddio d7, e12, f7, f8, g10, h10, j6, j7, k7, l9, l10, n7, n13 x f10, k5 6, 52, 57, 102, 110, 155, 160, 202 5, 36, 41, 71, 77, 107, 111, 141 - [13] - - i/o power supply. tie the vddreg and vddio pins to a common power supply to ensure the same ramp-up time for both supply voltages. vdd - - - - - 3, 24, 27, 49, 52, 74, 77, 97 power supply for main regulator, i/o, and otp. vss g9, h7, j10, j11, k8 xc8, d4, d5, g8, j3, j6 --2, 26, 51, 76 [14] [15] - - ground. vssio c4, d13, g6, g7, g8, h8, h9, j8, j9, k9, k10, m13, p7, p13 x- 5, 56, 109, 157 4, 40, 76, 109 - [14] [15] - - ground. vssa b2 x c2 196 135 94 - - analog ground. not connected -b9-------n.c. table 3. pin description ?continued lcd, ethernet, usb0, and usb1 functions are not available on all parts. see table 2 . symbol lbga256 tfbga180 [1] tfbga100 lqfp208 [1] lqfp144 lqfp100 [1] reset state [2] type description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 66 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [3] 5 v tolerant pad with 15 ns glitch filter (5 v tolerant if v dd(io) present; if v dd(io) not present, do not exceed 3.3 v); provides digital i/o functions with ttl levels and hyst eresis; normal drive strength (see figure 39 ). [4] 5 v tolerant pad with 15 ns glitch filter (5 v tolerant if v dd(io) present; if v dd(io) not present, do not exceed 3.3 v); provides digital i/o functions with ttl levels, and hy steresis; high drive strength (see figure 39 ). [5] 5 v tolerant pad with 15 ns glitch filter (5 v tolerant if v dd(io) present; if v dd(io) not present, do not exceed 3.3 v); provides high-speed digital i/o functions with ttl levels and hysteresis (see figure 39 ). [6] 5 v tolerant pad providing digital i/o functions (with ttl levels and hysteresis) and analog input or output (5 v tolerant i f v dd(io) present; if v dd(io) not present, do not exceed 3.3 v). when configured as a adc input or dac output, the pin is not 5 v tolerant and the digital section of the pad must be disabled by setting the pin to an input function and disabling the pull-up resistor through the pin? s sfsp register. [7] 5 v tolerant transparent analog pad. [8] for maximum load c l = 6.5 ? f and maximum pull-down resistance r pd = 80 k ? , the vbus signal takes about 2 s to fall from vbus = 5 v to vbus = 0.2 v when it is no longer driven. [9] transparent analog pad. not 5 v tolerant. [10] pad provides usb functions. 5 v tolerant if v dd(io) present; if v dd(io) not present do not exceed 3.3 v. it is designed in accordance with the usb specification, revision 2. 0 (full-speed and low-speed mode only). [11] open-drain 5 v tolerant digital i/o pad, compatible with i 2 c-bus fast mode plus specification. this pad requires an external pull-up to provide output functionality. when power is switched off, this pin connected to the i 2 c-bus is floating and does not disturb the i 2 c lines. [12] 5 v tolerant pad with 20 ns glitch filter; provides digita l i/o functions with open-drain output with weak pull-up resistor and hysteresis (see figure 40 ). [13] on the tfbga100 and lqfp208 packages, vpp is internally connected to vddio. [14] on the lqfp144/208 packages, vssio and vss are connected to a common ground plane. [15] on the tfbga100 and lqfp100/208 packages , vss is internally connected to vssio.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 67 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 7. functional description 7.1 architectural overview the arm cortex-m3 includes three ahb-lite buses: the system bus, the i-code bus, and the d-code bus. the i-code and d-code core buses allow for concurrent code and data accesses from different slave ports. the LPC1850/30/20/10 use a multi-layer ah b matrix to connect the arm cortex-m3 buses and other bus masters to peripherals in a flexible manner that optimizes performance by allowing peripherals that are on different slave ports of the matrix to be accessed simultaneously by different bus masters. 7.2 arm cortex-m3 processor the arm cortex-m3 is a general purpose, 32-bit microprocessor, which offers high performance and very low power consumptio n. the arm cortex-m3 offers many new features, including a thumb-2 instruction set, low interrupt latency, hardware multiply and divide, interruptable/continuable multiple load and store instructions, automatic state save and restore for interrupts, tightly integrated interrupt controller with wake-up interrupt controller, and multiple core buses capable of simultaneous accesses. pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. the arm cortex-m3 processor is described in detail in the cortex-m3 technical reference manual.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 68 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 7.3 ahb multilayer matrix 7.4 nested vectored inte rrupt controller (nvic) the nvic is an integral part of the cortex-m 3. the tight coupling to the cpu allows for low interrupt latency and efficient processing of late arriving interrupts. 7.4.1 features ? controls system exceptions and peripheral interrupts. ? in the LPC1850/30/20/10, the nvic supports 32 vectored interrupts. ? 8 programmable interrupt priority levels , with hardware priority level masking. ? relocatable vector table. ? non-maskable interrupt (nmi). ? software interr upt generation. (1) not available on all parts (see ta b l e 2 ). fig 8. ahb multilayer matrix master and slave connections arm cortex-m3 test/debug interface gpdma ethernet (1) usb1 (1) usb0 (1) lcd (1) sd/ mmc external memory controller ahb register interfaces, apb, rtc domain peripherals 32 kb ahb sram 16 kb ahb sram (1) 16 kb ahb sram slaves 64 kb rom 64/96 kb local sram 40 kb local sram system bus i-code bus d-code bus masters 01 spifi ahb multilayer matrix = master-slave connection 002aag550
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 69 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 7.4.2 interrupt sources each peripheral device has one interrupt line connected to the nvic but may have several interrupt flags. individual interrupt flags may also represent more than one interrupt source. 7.5 event router the event router combines various internal signals, interrupts, and the external interrupt pins (wakeup[3:0]) to create an interrupt in the nvic if enabled and to create a wake-up signal to the arm core and the ccu for wa king up from sleep, deep-sleep, power-down, and deep power-down modes. individual events can be configured as edge or level sensitive and can be enabled or disabled in the event router. the event router can be battery powered. the following events if enabled in the event router can create a wake-up signal and/or an interrupt: ? external pins wakeu p0/1/2/3 and reset ? alarm timer, rtc, wwdt, bod interrupts ? c_can and qei interrupts ? ethernet, usb0, usb1 signals ? selected outputs of combined timers (sct and timer0/1/3) 7.6 global input mult iplexer array (gima) the gima allows to route signals to event-d riven peripheral targets like the sct, timers, event router, or the adcs. 7.6.1 features ? single selectio n of a source. ? signal inversion. ? can capture a pulse if the input event source is faster than the target clock. ? synchronization of input event and target clock. ? single-cycle pulse generation for target. 7.7 system tick timer (systick) the arm cortex-m3 includes a system tick timer (systic k) that is inte nded to generate a dedicated systick exception at a 10 ms interval. 7.8 on-chip static ram the LPC1850/30/20/10 support up to 200 kb sram with separate bus master access for higher throughput and individual power control for low power operation.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 70 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 7.8.1 isp (in-system programming) mode in-system programming (isp) is programming or reprogramming the on-chip sram memory, using the boot loader software and the usart0 serial port. isp can be used when the part resides in the end-user board. isp allows to load data into on-chip sram and execute code from on-chip sram. 7.9 boot rom the internal rom memory is used to store th e boot code of the LPC1850/30/20/10. after a reset, the arm processor will start its code execution from this memory. the boot rom memory includes the following features: ? rom memory size is 64 kb. ? supports booting from usart interfaces and external static memory such as nor flash, and spi flash. ? includes api for otp programming. ? includes a flexible usb device stack that supports human interface device (hid), mass storage class (msc), and device firmware upgrade (dfu) drivers. aes capable parts also support: ? cmac authentication on the boot image. ? secure booting from an encrypted image. in development mode booting from a plain text image is possible. de velopment mode is terminated by programming the aes key. ? api for aes programming. several boot modes are available depending on the values of the otp bits boot_src. if the otp memory is not programmed or the boot_src bits are all zero, the boot mode is determined by the states of the bo ot pins p2_9, p2_8, p1_2, and p1_1. table 4. boot mode when otp boot_src bits are programmed boot mode boot_src bit 3 boot_src bit 2 boot_src bit 1 boot_src bit 0 description pin state 0 0 0 0 boot source is defined by the reset state of p1_1, p1_2, p2_8, and p2_9 pins. see ta b l e 5 . usart0 0 0 0 1 boot from device connected to usart0 using pins p2_0 and p2_1. emc 8-bit 0 0 1 1 boot from external static memory (such as nor flash) using cs0 and an 8-bit data bus. emc 16-bit 0 1 0 0 boot from external static memory (such as nor flash) using cs0 and a 16-bit data bus. emc 32-bit 0 1 0 1 boot from external static memory (such as nor flash) using cs0 and a 32-bit data bus. usb0 0 1 1 0 boot from usb0.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 71 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [1] the boot loader programs the appropriate pin functi on at reset to boot using either ssp0 or spifi. [1] the boot loader programs the appropriate pin function at reset to boot using the ssp0. usb1 0 1 1 1 boot from usb1. spi (ssp) 1 0 0 0 boot from spi flash connected to the ssp0 interface on p3_3 (function ssp0_sck), p3_6 (function ssp0_miso), p3_7 (function ssp0_mosi), and p3_8 (function ssp0_ssel) [1] . usart3 1 0 0 1 boot from device connected to usart3 using pins p2_3 and p2_4. table 4. boot mode when otp boot_src bits are programmed boot mode boot_src bit 3 boot_src bit 2 boot_src bit 1 boot_src bit 0 description table 5. boot mode when opt boot_src bits are zero boot mode pins description p2_9 p2_8 p1_2 p1_1 usart0 low low low low boot from device connected to usart0 using pins p2_0 and p2_1. emc 8-bit low low high low boot from external static memory (such as nor flash) using cs0 and an 8-bit data bus. emc 16-bit low low high high boot from external static memory (such as nor flash) using cs0 and a 16-bit data bus. emc 32-bit low high low low boot from external static memory (such as nor flash) using cs0 and a 32-bit data bus. usb0 low high low high boot from usb0 usb1 low high high low boot from usb1. spi (ssp) low high high high boot from spi flash conn ected to the ssp0 interface on p3_3 (function ssp0_sck), p3_6 (function ssp0_miso), p3_7 (function ssp0_mosi), and p3_8 (function ssp0_ssel) [1] . usart3 high low low low boot from device connected to usart3 using pins p2_3 and p2_4.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 72 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 7.10 memory mapping fig 9. LPC1850/30/20/10 memory mapping (overview) reserved peripheral bit band alias region reserved high-speed gpio reserved reserved 0x0000 0000 0 gb 1 gb 4 gb 0x2001 0000 0x2200 0000 0x2400 0000 0x2800 0000 0x1000 0000 0x3000 0000 0x4000 0000 0x4001 2000 0x4004 0000 0x4005 0000 0x4010 0000 0x4400 0000 0x6000 0000 ahb peripherals apb peripherals #0 apb peripherals #1 reserved reserved reserved rtc domain peripherals 0x4006 0000 0x4008 0000 0x4009 0000 0x400a 0000 0x400b 0000 0x400c 0000 0x400d 0000 0x400e 0000 0x400f 0000 0x400f 1000 0x400f 2000 0x400f 4000 0x400f 8000 clocking/reset peripherals apb peripherals #2 apb peripherals #3 0x2000 8000 16 kb ahb sram (LPC1850/30) 16 kb ahb sram (LPC1850/30/20/10) 0x2000 c000 16 kb ahb sram (LPC1850/30) 16 kb ahb sram (LPC1850/30/20/10) reserved reserved 0x4010 1000 0x4010 2000 0x4200 0000 reserved local sram/ external static memory banks 0x2000 0000 0x2000 4000 128 mb dynamic external memory dycs0 256 mb dynamic external memory dycs1 256 mb dynamic external memory dycs2 256 mb dynamic external memory dycs3 0x7000 0000 0x8000 0000 0x8800 0000 0xe000 0000 256 mb shadow area LPC1850/30/20/10 0x1000 0000 0x1001 8000 0x1008 0000 0x1008 a000 0x1040 0000 0x1041 0000 0x1c00 0000 0x1d00 0000 reserved reserved 32 mb ahb sram bit banding reserved reserved reserved 0xe010 0000 0xffff ffff reserved spifi data arm private bus reserved 0x1001 0000 32 kb local sram (LPC1850/30/20) 64 kb local sram (LPC1850/30/20/10) 32 kb + 8 kb local sram (LPC1850/30/20/10) reserved reserved reserved reserved 64 kb rom 0x1e00 0000 0x1f00 0000 0x2000 0000 16 mb static external memory cs3 16 mb static external memory cs2 16 mb static external memory cs1 16 mb static external memory cs0 0x1400 0000 0x1800 0000 64 mb spifi data 002aaf228
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 73 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 10. LPC1850/30/20/10 memory mapping (peripherals) reserved peripheral bit band alias region high-speed gpio reserved reserved reserved reserved 0x4000 0000 0x0000 0000 0x4001 2000 0x4004 0000 0x4005 0000 0x4010 0000 0x4400 0000 0x6000 0000 0xffff ffff ahb peripherals sram memories external memory banks apb0 peripherals apb1 peripherals reserved reserved reserved rtc domain peripherals 0x4006 0000 0x4008 0000 0x4009 0000 0x400a 0000 0x400b 0000 0x400c 0000 0x400d 0000 0x400e 0000 0x400f 0000 0x400f 1000 0x400f 2000 0x400f 4000 0x400f 8000 clocking/reset peripherals apb2 peripherals apb3 peripherals reserved reserved 0x4010 1000 0x4010 2000 0x4200 0000 reserved external memories and arm private bus apb2 peripherals 0x400c 1000 0x400c 2000 0x400c 3000 0x400c 4000 0x400c 6000 0x400c 8000 0x400c 7000 0x400c 5000 0x400c 0000 ri timer usart2 usart3 timer2 timer3 ssp1 qei apb1 peripherals 0x400a 1000 0x400a 2000 0x400a 3000 0x400a 4000 0x400a 5000 0x400b 0000 0x400a 0000 motor control pwm i2c0 i2s0 i2s1 c_can1 reserved ahb peripherals 0x4000 1000 0x4000 0000 sct 0x4000 2000 0x4000 3000 0x4000 4000 0x4000 6000 0x4000 8000 0x4001 0000 0x4001 2000 0x4000 9000 0x4000 7000 0x4000 5000 dma sd/mmc emc usb1 lcd usb0 reserved spifi ethernet reserved 0x4008 1000 0x4008 0000 wwdt 0x4008 2000 0x4008 3000 0x4008 4000 0x4008 6000 0x4008 a000 0x4008 7000 0x4008 8000 0x4008 9000 0x4008 5000 uart1 w/ modem ssp0 timer0 timer1 scu gpio interrupts gpio group0 interrupt gpio group1 interrupt usart0 rtc domain peripherals 0x4004 1000 0x4004 0000 alarm timer 0x4004 2000 0x4004 3000 0x4004 4000 0x4004 6000 0x4004 7000 0x4004 5000 power mode control creg event router otp controller reserved reserved rtc backup registers clocking reset control peripherals 0x4005 1000 0x4005 0000 cgu 0x4005 2000 0x4005 3000 0x4005 4000 0x4006 0000 ccu2 rgu ccu1 LPC1850/30/20/10 002aaf229 reserved reserved apb3 peripherals 0x400e 1000 0x400e 2000 0x400e 3000 0x400e 4000 0x400f 0000 0x400e 5000 0x400e 0000 i2c1 dac c_can0 adc0 adc1 reserved gima apb0 peripherals
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 74 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 7.11 security features 7.11.1 aes security engine the hardware aes security engine can decode da ta using the aes algorithm in conjunction with a 128-bit key. 7.11.1.1 features ? decoding of external flash data connecte d to the quad spi flash interface (spifi). ? secure stor age of keys. ? support for cmac hash calculation to authenticate encrypted data. ? data is processed in little endian mode. this means that the first byte read from flash is integrated into the aes code word as least significant byte . the 16th byte read from flash is the most significant byte of the first aes codeword. ? aes engine performance of 1 byte/clock cycle. ? dma transfers supported through the gpdma. 7.11.2 one-time programmable (otp) memory the otp provides 128 bit of memory for general purpose use and two 128-bit non-volatile memory blocks to store aes ke ys or other customer data. 7.12 general purpose i/o (gpio) the LPC1850/30/20/10 provides 8 gpio ports with up to 31 gpio pins each. device pins that are not connec ted to a specific peripheral function are controlled by the gpio registers. pins may be dynamically conf igured as inputs or outputs. separate registers allow setting or clearing any number of outputs simultaneously. the value of the output register may be read back as well as the current state of the port pins. all gpio pins default to inputs with pull-up resistors enabled on reset. 7.12.1 features ? accelerated gpio functions: ? gpio registers are located on the ahb so that the fastest possible i/o timing can be achieved. ? mask registers allow treating sets of port bits as a group, leaving other bits unchanged. ? all gpio registers are byte and half-word addressable. ? entire port value can be written in one instruction. ? bit-level set and clear registers allow a single instruction set or clear of any number of bits in one port. ? direction control of individual bits. ? all i/o default to inputs after reset. ? up to eight gpio pins can be selected from all gpio pins to create an edge- or level-sensitive gpio interrupt request.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 75 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller ? two gpio group interrupts can be triggered by any pin or pins in each port. 7.13 ahb peripherals 7.13.1 state configurable timer (sct) subsystem the sct allows a wide variety of timing, counting, output modulation, and input capture operations. the inputs and outputs of the sct are shared with t he capture and match inputs/outputs of the 32-bit general purpose counter/timers. the sct can be configured as two 16-bit counters or a unified 32-bit counter. in the two-counter case, in addition to the counter value the following operational elements are independent for each half: ? state variable ? limit, halt, stop, and start conditions ? values of match/capture registers, plus reload or capture control values in the two-counter case, the following operational elements are global to the sct, but the last three can use match cond itions from either counter: ? clock selection ? inputs ? events ? outputs ? interrupts 7.13.1.1 features ? two 16-bit counters or one 32-bit counter. ? counter(s) clocked by bu s clock or selected input. ? up counter(s) or up-down counter(s). ? state variable allows sequencin g across multiple counter cycles. ? event combines input or output condition and/or counter match in a specified state. ? events control outputs and interrupts. ? selected event(s) can limit, halt, start, or stop a counter. ? supports: ? up to 8 inputs (one i nput connected internally) ? up to 16 outputs ? 16 match/capture registers ? 16 events ? 32 states 7.13.2 general purpose dma (gpdma) the dma controller allows peripheral-to memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. each dma stream provides unidirectional serial dma transfer s for a single source and destination. for
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 76 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller example, a bidirectional port requires one st ream for transmit and one for receives. the source and destination areas can each be either a memory region or a peripheral for master 1, but only memory for master 0. 7.13.2.1 features ? eight dma channels. each channel can support an unidirectional transfer. ? 16 dma request lines. ? single dma and burst dma request signals. each peripheral connected to the dma controller can assert either a burst dma request or a single dma request. the dma burst size is set by programming the dma controller. ? memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral transfers are supported. ? scatter or gather dma is supported through the use of linked lists. this means that the source and destination areas do not hav e to occupy contiguous areas of memory. ? hardware dma ch annel priority. ? ahb slave dma programming interface. the dma controller is programmed by writing to the dma control regist ers over the ahb slave interface. ? two ahb bus masters for transferring data. these interfaces transfer data when a dma request goes active. master 1 can access memories and peripherals, master 0 can access memories only. ? 32-bit ahb master bus width. ? incrementing or non-incrementing addressing for source and destination. ? programmable dma burst size. the dma burst size can be programmed to more efficiently transfer data. ? internal four-word fifo per channel. ? supports 8, 16, and 32-bit wide transactions. ? big-endian and little-endian support. the dma controller defaults to little-endian mode on reset. ? an interrupt to the processor can be generated on a dma completion or when a dma error has occurred. ? raw interrupt status. the dma error and dma count raw interrupt status can be read prior to masking. 7.13.3 spi flash interface (spifi) the spi flash interface (allows low-cost seri al flash memories to be connected to the arm cortex-m3 processor with little perfo rmance penalty compared to parallel flash devices with higher pin count. after a few commands configure the interface at startup, the enti re flash content is accessible as normal memory using byte, halfword, and word accesses by the processor and/or dma channels. erasure and programmi ng are handled by simple sequences of commands. many serial flash devices use a half-duplex command-driven spi protocol for device setup and initialization and then move to a half -duplex, command-driven 4-bit protocol for normal operation. different serial flash vendo rs and devices accept or require different
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 77 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller commands and command fo rmats. spifi provides sufficient flexibility to be compatible with common flash devices and includes extensio ns to help insure compatibility with future devices. 7.13.3.1 features ? interfaces to serial flash me mory in the main memory map. ? supports classic and 4-bit bidirectional serial protocols. ? half-duplex protocol compatible with various vendors and devices. ? quad spi flash interface (spifi) with 1-, 2-, or 4-bit data at rates of up to 40 mb per second. ? supports dma access. 7.13.4 sd/mmc card interface the sd/mmc card interface supports the following modes: ? secure digital memo ry (sd version 3.0) ? secure digital i/o (sdio version 2.0) ? consumer electronics advanced transport architecture (ce-ata version 1.1) ? multimedia cards (mmc version 4.4) 7.13.5 external memory controller (emc) the LPC1850/30/20/10 emc is a memory co ntroller peripheral offering support for asynchronous static memory de vices such as ram, rom, and nor flash. in addition, it can be used as an interface with off-chip memory-mapped devices and peripherals. 7.13.5.1 features ? dynamic memory interface support in cluding single data rate sdram. ? asynchronous static memory device supp ort including ram, rom, and nor flash, with or without asynchronous page mode. ? low transaction latency. ? read and write buffers to reduce latency and to improve performance. ? 8/16/32 data and 24 address lines wide static memory support. on parts lpc1820/10 only 8/16 data lines are available. ? 16 bit and 32 bit wide chip select sdram memory support. ? static memory features include: ? asynchronous page mode read ? programmable wait states ? bus turnaround delay ? output enable and write enable delays ? extended wait ? four chip selects for synchro nous memory and four chip selects for static memory devices. ? power-saving modes dynamically co ntrol cke and clkout to sdrams.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 78 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller ? dynamic memory self-refresh mode controlled by software. ? controller supports 2048 (a0 to a10), 4096 (a0 to a11), and 8192 (a0 to a12) row address synchronous memory parts. that is typical 512 mb, 256 mb, and 128 mb parts, with 4, 8, 16, or 32 data bits per device. ? separate reset domains allow the for auto-refresh through a chip reset if desired. note: synchronous static memory devices (synchronous burst mode) are not supported. 7.13.6 high-speed usb host/device/otg interface (usb0) remark: usb0 is available on parts LPC1850/30/20 (see table 2 ). the usb otg module allows the part to connect directly to a usb host such as a pc (in device mode) or to a usb device in host mode. 7.13.6.1 features ? contains utmi+ compliant transceiver (phy). ? complies with universal serial bus specification 2.0 . ? complies with usb on-the-go supplement . ? complies with enhanced host controller interface specification . ? supports auto usb 2.0 mode discovery. ? supports all high-speed usb-compliant peripherals. ? supports all full-speed usb-compliant peripherals. ? supports software host ne gotiation protocol (hnp) an d session request protocol (srp) for otg peripherals. ? supports interrupts. ? this module has its own, integrated dma engine. 7.13.7 high-speed usb host/device interface with ulpi (usb1) remark: usb1 is available on parts LPC1850/30 (see ta b l e 2 ). the usb1 interface can operate as a full-speed usb host/device interface or can connect to an external ulpi phy for high-speed operation. 7.13.7.1 features ? complies with universal serial bus specification 2.0 . ? complies with enhanced host controller interface specification . ? supports auto usb 2.0 mode discovery. ? supports all high-speed usb-compliant peripherals if connected to external ulpi phy. ? supports all full-speed usb-compliant peripherals. ? supports interrupts. ? this module has its own, integrated dma engine. 7.13.8 lcd controller remark: the lcd controller is available on the part LPC1850 only.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 79 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller the lcd controller provides all of the necessary control signals to interface directly to a variety of color and monochrome lcd panels. both stn (single and dual panel) and tft panels can be operated. the display resolution is selectable and can be up to 1024 ? 768 pixels. several color modes are provided, up to a 24-bit true-color non-palettized mode. an on-chip 512-byte color palette allows reducing bus utilizati on (i.e. memory size of the displayed data) while still supporti ng a large number of colors. the lcd interface includes its own dma controlle r to allow it to operate independently of the cpu and other system functions. a built-in fifo acts as a buffer for display data, providing flexibility for system timing. hardware cursor su pport can furthe r reduce the amount of cpu time needed to operate the display. 7.13.8.1 features ? ahb master interface to access frame buffer. ? setup and control via a separate ahb slave interface. ? dual 16-deep programmable 64-bit wide fifos for buffering incoming display data. ? supports single and dual-panel monochrome super twisted nematic (stn) displays with 4-bit or 8-bit interfaces. ? supports single and dual-panel color stn displays. ? supports thin film transi stor (tft) color displays. ? programmable display resolution including, but not limited to: 320 ? 200, 320 ? 240, 640 ? 200, 640 ? 240, 640 ? 480, 800 ? 600, and 1024 ? 768. ? hardware cursor support for single-panel displays. ? 15 gray-level monochrome, 3375 color stn, and 32 k color palettized tft support. ? 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome stn. ? 1, 2, 4, or 8 bpp palettized color displays for color stn and tft. ? 16 bpp true-color non-palettized for color stn and tft. ? 24 bpp true-color non-palettized for color tft. ? programmable timing for different display panels. ? 256 entry, 16-bit palette ram, arranged as a 128 ? 32-bit ram. ? frame, line, and pixel clock signals. ? ac bias signal for stn, data enable signal for tft panels. ? supports little and big-endian, and windows ce data formats. ? lcd panel clock may be generated from the peripheral clock, or from a clock input pin. 7.13.9 ethernet remark: ethernet is available on parts LPC1850/30 (see table 2 ). 7.13.9.1 features ? 10/100 mbit/s ? tcp/ip hardware checksum ? ip checksum ? dma support
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 80 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller ? power management remote wake-up frame and magic packet detection ? supports both full-duplex and half-duplex operation ? supports csma/cd protocol for half-duplex operation. ? supports ieee 802.3x flow control for full-duplex operation. ? optional forwarding of received pause co ntrol frames to the user application in full-duplex operation. ? back-pressure support for half-duplex operation. ? automatic transmission of zero-quanta p ause frame on deassertion of flow control input in full-dup lex operation. ? support for ieee 1588 time stamping and ieee 1588 advanced ti me stamping (ieee 1588-2008 v2). 7.14 digital serial peripherals 7.14.1 uart remark: the LPC1850/30/20/10 contain one uart with standard transmit and receive data lines. uart1 also provides a full modem control handshake interface and support for rs-485/9-bit mode allowing both software address detection and automatic address detection using 9-bit mode. uart1 includes a fractional baud rate generator. standard baud rates such as 115200 bd can be achieved with any crystal frequency above 2 mhz. 7.14.1.1 features ? maximum uart data bit rate of 8 mbit/s. ? 16 b receive and transmit fifos. ? register locations conform to 16c550 industry standard. ? receiver fifo trigger points at 1 b, 4 b, 8 b, and 14 b. ? built-in fractional baud rate generator cove ring wide range of baud rates without a need for external crystals of particular values. ? auto baud capabilities and fifo control mechanism that enables software flow control implementation. ? equipped with standard modem interface signals. this module also provides full support for hardware flow control (auto-cts/rts). ? support for rs-485/9-bit /eia-485 mode (uart1). ? dma support. 7.14.2 usart remark: the LPC1850/30/20/10 contain three usarts. in addition to standard transmit and receive data lines, the usarts support a synchronous mode and a smart card mode. the usarts include a fractional baud rate generator. standard baud rates such as 115200 bd can be achieved with any crystal frequency above 2 mhz.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 81 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 7.14.2.1 features ? maximum uart data bit rate of 8 mbit/s. ? 16 b receive and transmit fifos. ? register locations conform to 16c550 industry standard. ? receiver fifo trigger points at 1 b, 4 b, 8 b, and 14 b. ? built-in fractional baud rate generator cove ring wide range of baud rates without a need for external crystals of particular values. ? auto baud capabilities and fifo control mechanism that enables software flow control implementation. ? support for rs-485/9 -bit/eia-485 mode. ? usart3 includes an irda mode to support infrared communication. ? all usarts have dma support. ? support for synchronous mode at a data bit rate of up to 8 mbit/s. ? smart card mode conforming to iso7816 specification 7.14.3 ssp serial i/o controller remark: the LPC1850/30/20/10 co ntain two ssp controllers. the ssp controller is capable of operation on a spi, 4-wire ssi, or microwire bus. it can interact with multiple masters and slaves on the bus. only a single master and a single slave can communicate on the bus during a given data trans fer. the ssp supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. in practice, often only one of these data flows carries meaningful data. 7.14.3.1 features ? maximum ssp speed of mbit/s (master) or mbit/s (slave) ? compatible with motorola spi, 4-wire texas instruments ssi, and national semiconductor microwire buses ? synchronous serial communication ? master or slave operation ? 8-frame fifos for both transmit and receive ? 4-bit to 16-bit frame ? dma transfers supported by gpdma 7.14.4 i 2 c-bus interface remark: the LPC1850/30/20/10 each contain two i 2 c-bus controllers. the i 2 c-bus is bidirectional for inter-ic contro l using only two wires: a serial clock line (scl) and a serial data line (sda). each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an lcd driver) or a transmitter with the capability to both receive and send information (such as me mory). transmitters and/or receivers can operate in either master or sl ave mode, depending on whether the chip has to initiate a data transfer or is only addressed. the i 2 c is a multi-master bus and can be controlled by more than one bus master connected to it.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 82 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 7.14.4.1 features ? i 2 c0 is a standard i 2 c compliant bus interface with open-drain pins. i 2 c0 also supports fast mode plus with bit rates up to 1 mbit/s. ? i 2 c1 uses standard i/o pins with bit rates of up to 400 kbit/s (fast i 2 c-bus). ? easy to configure as master, slave, or master/slave. ? programmable clocks allow versatile rate control. ? bidirectional data transfer between masters and slaves. ? multi-master bus (no central master). ? arbitration between simultaneously transmit ting masters without corruption of serial data on the bus. ? serial clock synchronization allows devices with different bit rates to communicate via one serial bus. ? serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. ? the i 2 c-bus can be used for test and diagnostic purposes. ? all i 2 c-bus controllers support multiple address recognition and a bus monitor mode. 7.14.5 i 2 s interface remark: the LPC1850/30/20/10 contain two i 2 s interfaces. the i 2 s-bus provides a standard communication interface for digital audio applications. the i 2 s-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. the basic i 2 s-bus connection has one master, which is always the master, and one slave. the i 2 s-bus interface provides a separate transmit and receive channel, each of which can o perate as either a master or a slave. 7.14.5.1 features ? the interface has separate input/output chan nels each of which can operate in master or slave mode. ? capable of handling 8-bit, 16-bit, and 32-bit word sizes. ? mono and stereo audio data supported. ? the sampling frequency can range from 16 khz to 192 khz (16, 22.05, 32, 44.1, 48, 96, 192) khz. ? support for an audio master clock. ? configurable word select period in master mode (separately for i 2 s-bus input and output). ? two 8-word fifo data buffers are provided, one for transmit and one for receive. ? generates interrupt requests when buffer levels cross a programmable boundary. ? two dma requests, controlled by programma ble buffer levels. these are connected to the gpdma block. ? controls include reset, stop and mute options separately for i 2 s-bus input and i 2 s-bus output.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 83 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 7.14.6 c_can remark: the LPC1850/30/20/10 contain two c_can controllers. controller area network (can) is the definition of a high performance communication protocol for serial data communication. the c_ can controller is designed to provide a full implementation of the can protocol accordin g to the can specification version 2.0b. the c_can controller allows to build powerful local networks with low-cost multiplex wiring by supporting distributed real-t ime control with a very hi gh level of reliability. 7.14.6.1 features ? conforms to protocol version 2.0 parts a and b. ? supports bit rate of up to 1 mbit/s. ? supports 32 message objects. ? each message object has its own identifier mask. ? provides programmable fifo mode (concatenation of message objects). ? provides maskable interrupts. ? supports disabled automatic retransmission (dar) mode for time-triggered can applications. ? provides programmable loop-back mode for self-test operation. 7.15 counter/timers and motor control 7.15.1 general purpose 32-bit timers/external event counter remark: the LPC1850/30/20/10 include four 32-bit timer/counters. the timer/counter is design ed to count cycles of th e system derived clock or an externally-supplied clock. it can optionally generate interrupts , generate timed dma requests, or perform other actions at spec ified timer values, based on four match registers. each timer/counter al so includes two capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.15.1.1 features ? a 32-bit timer/counter with a programmable 32-bit prescaler. ? counter or timer operation. ? two 32-bit capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. a capture event may also generate an interrupt. ? four 32-bit match registers that allow: ? continuous operation with optional interrupt generation on match. ? stop timer on match with optional interrupt generation. ? reset timer on match with optional interrupt generation. ? up to four external outputs corresponding to match registers, with the following capabilities: ? set low on match. ? set high on match.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 84 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller ? toggle on match. ? do nothing on match. ? up to two match registers can be used to generate timed dma requests. 7.15.2 motor control pwm the motor control pwm is a specialized pwm supporting 3-phase motors and other combinations. feedback inputs are provided to automatically sense rotor position and use that information to ramp speed up or down. an abort input is also provided that causes the pwm to immediately release all motor drive ou tputs. at the same time, the motor control pwm is highly configurable for other genera lized timing, counting, capture, and compare applications. 7.15.3 quadrature encoder interface (qei) a quadrature encoder, also known as a 2-chan nel incremental encoder, converts angular displacement into two pulse signals. by mo nitoring both the number of pulses and the relative phase of the two signals, the user ca n track the position, direction of rotation, and velocity. in addition, a third channel, or index signal, can be used to reset the position counter. the quadrature encoder interface decodes the digital pulses from a quadrature encoder wheel to integrate position over ti me and determine direction of rotation. in addition, the qei can capture the velocity of the encoder wheel. 7.15.3.1 features ? tracks encoder position. ? increments/decrements depending on direction. ? programmable for 2 ? or 4 ? position counting. ? velocity capture using built-in timer. ? velocity compare function with ?less than? interrupt. ? uses 32-bit registers for position and velocity. ? three position compare registers with interrupts. ? index counter for re volution counting. ? index compare register with interrupts. ? can combine index and position interrupts to produce an interrupt for whole and partial revolution displacement. ? digital filter with prog rammable delays for encoder input signals. ? can accept decoded signal inputs (clk and direction). 7.15.4 repetitive interrupt (ri) timer the repetitive interrupt timer provides a free-r unning 32-bit counter which is compared to a selectable value, generating an interrupt when a match occurs. any bits of the timer/compare can be masked such that they do not contribute to the match detection. the repetitive interrupt timer can be used to create an interrupt that repeats at predetermined intervals. 7.15.4.1 features ? 32-bit counter. counter can be free-running or be reset by a generated interrupt.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 85 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller ? 32-bit compare value. ? 32-bit compare mask. an interrupt is generated when the counter value equals the compare value, after masking. this allows for co mbinations not poss ible with a simple compare. 7.15.5 windowed watchdog timer (wwdt) the purpose of the watchdog is to reset the controller if software fails to periodically service it within a programmable time window. 7.15.5.1 features ? internally resets chip if not periodically reloaded during the programmable time-out period. ? optional windowed operation requires reload to occur between a minimum and maximum time period, both programmable. ? optional warning interrupt can be generated at a programmable time prior to watchdog time-out. ? enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. ? incorrect feed sequence causes reset or interrupt if enabled. ? flag to indicate watchdog reset. ? programmable 24-bit timer with internal prescaler. ? selectable time period from (t cy(wdclk) ? 256 ? 4) to (t cy(wdclk) ? 2 24 ? 4) in multiples of t cy(wdclk) ? 4. ? the watchdog clock (wdclk) uses the irc as the clock source. 7.16 analog peripherals 7.16.1 analog-to-digital converter remark: the LPC1850/30/20/10 contain two 10-bit adcs. 7.16.1.1 features ? 10-bit successive approximation analog to digital converter. ? input multiplexing among 8 pins. ? power-down mode. ? measurement range 0 to vdda. ? sampling frequency up to 400 ksamples/s. ? burst conversion mode for single or multiple inputs. ? optional conversion on transition on adct rig0 or adctrig1 pi ns, combined timer outputs 8 or 15, or the pwm output mcoa2. ? individual result registers for each a/d channel to reduce interrupt overhead. ? dma support.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 86 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 7.16.2 digital-to-analog converter (dac) 7.16.2.1 features ? 10-bit resolution ? monotonic by design (resistor string architecture) ? controllable conversion speed ? low power consumption 7.17 peripherals in the rtc power domain 7.17.1 rtc the real time clock (rtc) is a set of count ers for measuring time when system power is on, and optionally when it is off. it uses very little power when its registers are not being accessed by the cpu, especially reduced power modes. the rtc is clocked by a separate 32 khz oscillator that produces a 1 hz inte rnal time reference and is powered by its own power supply pin, vbat. 7.17.1.1 features ? measures the passage of time to maintain a calendar and clock. provides seconds, minutes, hours, day of month, month, year, day of week, and day of year. ? ultra-low power design to support batter y powered systems. uses power from the cpu power supply when it is present. ? dedicated battery power supply pin. ? rtc power supply is isolated from the rest of the chip. ? calibration counter allows adjustment to better than ? 1 sec/day with 1 sec resolution. ? periodic interrupts can be generated from increments of any field of the time registers. ? alarm interrupt can be generated for a specific date/time. 7.17.2 alarm timer the alarm timer is a 16-bit timer and counts down at 1 khz from a preset value generating alarms in intervals of up to 1 min. the counter triggers a status bit when it reaches 0x00 and asserts an interrupt if enabled. the alarm timer is part of the rtc power domain and can be battery powered. 7.18 system control 7.18.1 configuration registers (creg) the following settings are controlled in the configuration register block: ? bod trip settings ? oscillator output ? dma-to-peripheral muxing ? ethernet mode ? memory mapping
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 87 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller ? timer/usart inputs ? enabling the usb controllers in addition, the creg block contains the pa rt identification and part configuration information. 7.18.2 system control unit (scu) the system control unit determines the function and electrical mode of the digital pins. by default function 0 is selected for all pins with pull-up enabled. analog i/os for the adcs and the dac as well as most usb pins are on separate pads and are not controlled through the scu. 7.18.3 clock generation unit (cgu) the clock generator unit (c gu) generates several base clocks. the base clocks can be unrelated in frequency and phase and can ha ve different clock sources within the cgu. one cgu base clock is routed to the clkout pins. the base clock that generates the cpu clock is referred to as cclk. multiple branch clocks are derived from each base clock. the branch clocks offer very flexible control for power-management purposes . all branch clocks are outputs of one of two clock control units (ccus) and can be controlled independently. branch clocks derived from the same base clock are synchronous in frequency and phase. 7.18.4 internal rc oscillator (irc) the irc is used as the clock source for the wwdt and/or as the clock that drives the plls and subsequently the cpu. the nominal irc frequency is 12 mhz. the irc is trimmed to 1 % accuracy over the entire voltage and temperature range. upon power-up or any chip reset, the lpc18 50/30/20/10 use the irc as the clock source. software may later switch to one of the other available clock sources. 7.18.5 pll0usb (for usb0) pll0 is a dedicated pll for the usb0 high-speed controller. pll0 accepts an input clock fr equency from an external osc illator in the r ange of 14 khz to 25 mhz. the input frequency is multiplied up to a high frequency with a current controlled oscillator (cco). the cco operates in the ra nge of 4.3 mhz to 550 mhz. 7.18.6 pll0audio (for audio) the audio pll pll0audio is a general purpose pll with a very small step size. this pll accepts an input clock frequency derived fr om an external oscilla tor or internal irc. the input frequency is multiplied up to a high frequency with a current controlled oscillator (cco). a sigma-delta converter modulates the pll divider ratios to obtain the desired output frequency. the output frequency can be set as a multiple of the sampling frequency f s to 32 ??? f s , 64 ??? f s , 128 ? f s , 256 ? f s , 384 ? f s , 512 ? f s and the sampling frequency f s can range from 16 khz to 192 khz (1 6, 22.05, 32, 44.1, 48, 96,192) khz. many other frequencies are possible as well.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 88 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 7.18.7 system pll1 the pll1 accepts an input clock frequency from an external oscilla tor in the range of 10 mhz to 25 mhz. the input frequency is multiplied up to a high frequency with a current controlled oscillator (cco ). the multiplier can be an inte ger value from 1 to 32. the cco operates in the range of 156 mhz to 320 mhz, so there is an additional divider in the loop to keep the cco within its frequency range wh ile the pll is providing the desired output frequency. the output divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. since the minimum output divider value is 2, it is insured that the pll output has a 50 % duty cycle. the pll is turned off and bypassed following a chip reset and may be enabled by software. the program must config ure and activate the pll, wait for the pll to lock, and then connect to the pll as a clock source. the pll settling time is 100 ? s. 7.18.8 reset generation unit (rgu) the rgu allows generation of independent reset signals for individual blocks and peripherals. 7.18.9 power control the LPC1850/30/20/10 feature several independent power domains to control power to the core and the peripherals (see figure 11 ). the rtc and its associated peripherals (the alarm timer, the creg block, the otp contro ller, the back-up registers, and the event router) are located in the rtc power-domain which can be powered by a battery supply or the main regulator. a power se lector switch ensures that the rtc block is always powered on.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 89 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller the LPC1850/30/20/10 support four redu ced power modes: sleep, deep-sleep, power-down, and deep power-down. the LPC1850/30/20/10 can wake up from deep-sleep, power-down, and deep power-down modes vi a the wakeup[3:0] pins and in terrupts generated by battery powered blocks in the rtc power domain. 7.19 emulation and debugging debug and trace functions are integrated in to the arm cortex-m3. serial wire debug and trace functions are supported in addition to a standard jtag debug and parallel trace functions. the arm cortex-m3 is configured to support up to eight breakpoints and four watch points. fig 11. LPC1850/30/20/10 power domains real-time clock backup registers reset/wake-up control regulator 32 khz oscillator always-on/rtc power domain main power domain rtcx1 vbat vddreg rtcx2 vddio vss to memories, peripherals, oscillators, plls to core to i/o pads adc dac otp adc power domain otp power domain usb0 power domain vdda vssa vpp usb0 usb0_vdda3v3_driver usb0_vdda3v3 lpc18xx ultra low-power regulator power selector alarm reset wakeup0/1/2/3 to rtc domain peripherals 002aag305 to rtc i/o pads (v ps )
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 90 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 8. limiting values [1] the following applies to the limiting values: a) this product includes circuitry specif ically designed for the protection of its in ternal devices from the damaging effects of excessive static charge. nonetheless, it is sugges ted that conventional precautions be tak en to avoid applying greater than the rated maximum. b) parameters are valid over operating te mperature range unless otherwise specifi ed. all voltages are with respect to v ss unless otherwise noted. [2] including voltage on outputs in 3-state mode; at 2.0 v the speed will be reduced. [3] the peak current is limited to 25 times the corresponding maximum current. [4] dependent on package type. [5] human body model: equivalent to dischar ging a 100 pf capacitor through a 1.5 k ? series resistor. table 6. limiting values in accordance with the absolute ma ximum rating system (iec 60134). [1] symbol parameter conditions min max unit v dd(reg)(3v3) regulator supply voltage (3.3 v) on pin vddreg 2.2 3.6 v v dd(io) input/output supply voltage on pin vddio 2.2 3.6 v v dda(3v3) analog supply voltage (3.3 v) on pin vdda 2.2 3.6 v v bat battery supply voltage on pin vbat 2.2 3.6 v v dd(3v3) supply voltage (3.3 v) on pin v dd ; lqfp100 package only 2.2 3.6 v v prog(pf) polyfuse programming voltage on pin vpp 2.7 3.6 v v i input voltage only valid when the v dd(io) supply voltage is present 5 v tolerant i/o pins (see table 3 ) [2] ? 0.5 5.5 v adc/dac pins and digital i/o pins configured for an analog function (see ta b l e 3 ) ? 0.5 v dda(3v3) v usb0 pins (see ta b l e 3 )05 . 2v usb1 pins usb1_dp and usb1_dm (see ta b l e 3 ) 05.2v i dd supply current per supply pin [3] - 100 ma i ss ground current per ground pin [3] - 100 ma i latch i/o latch-up current ? (0.5v dd(io) ) < v i < (1.5v dd(io) ); t j < 125 ?c - 100 ma t stg storage temperature [4] ? 65 +150 ?c p tot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption -1.5w v esd electrostatic discharge voltage human body model; all pins [5] ? 2000 +2000 v
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 91 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 9. thermal characteristics the average chip junction temperature, t j ( ? c), can be calculated using the following equation: (1) ? t amb = ambient temperature ( ? c), ? r th(j-a) = the package junction-to-ambient thermal resistance ( ? c/w) ? p d = sum of internal and i/o power dissipation the internal power dissipation is the product of i dd and v dd . the i/o power dissipation of the i/o pins is often small and many times can be negligible. however it can be significant in some applications. t j t amb p d r th j a ? ?? ? ?? += table 7. thermal characteristics v dd = 2.2 v to 3.6 v; t amb = ? ? ? symbol parameter conditions min typ max unit t j(max) maximum junction temperature --125 ?c
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 92 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 10. static characteristics table 8. static characteristics t amb = ? 40 ? c to +85 ? c, unless otherwise specified. applies to parts LPC1850/30/20/10 rev ?a? only. symbol parameter conditions min typ [1] max unit supply pins v dd(io) input/output supply voltage 2.2 - 3.6 v v dd(reg)(3v3) regulator supply voltage (3.3 v) 2.2 - 3.6 v v dda(3v3) analog supply voltage (3.3 v) on pin vdda 2.2 - 3.6 v v bat battery supply voltage 2.2 - 3.6 v v dd(3v3) supply voltage (3.3 v) on pin v dd ; lqfp100 package only 2.2 - 3.6 v i dd(reg)(3v3) regulator supply current (3.3 v) regulator supply active mode; code while(1){} executed from ram; all peripherals disabled cclk = 12 mhz; pll1 disabled [2] [3] - 6.5 - ma cclk = 12 mhz; pll1 enabled [2] [4] - 7.5 - ma cclk = 120 mhz [2] [4] -2 5-m a cclk = 156 mhz [2] [4] -3 0-m a i dd(reg)(3v3) regulator supply current (3.3 v) regulator supply low power mode; after wfe/wfi instruction executed from ram; all peripherals disabled sleep mode [2] [3] -5 . 5-m a deep-sleep mode [2] -7 5- ? a power-down mode [2] -1 6- ? a deep power-down mode [2] -0 . 0 2- ? a i bat battery supply current deep-sleep mode [2] [5] -1 5 ? a power-down mode [2] [5] -1 5- ? a deep power-down mode [2] [5] -3- ? a i dd(io) i/o supply current deep sleep mode - 1 - ? a power-down mode - 1 - ? a deep power-down mode - 0.03 - ? a i dd(adc) adc supply current deep sleep mode [7] -0 . 4- ? a power-down mode [7] -0 . 4- ? a deep power-down mode [7] -0 . 0 0 7- ? a
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 93 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller reset pin v ih high-level input voltage [6] 0.8 ? (v ps ? 0.35) -5.5v v il low-level input voltage [6] ? 0.5 - 0.3 ? (v ps ? 0.1) v v hys hysteresis voltage [6] 0.05 ? (v ps ? 0.35) --v standard i/o pins - normal drive strength c i input capacitance - - 2 pf i il low-level input current v i = 0 v; on-chip pull-up resistor disabled -3-na i ih high-level input current v i =v dd(io) ; on-chip pull-down resistor disabled - ? 3- na i oz off-state output current v o =0v to v dd(io) ; on-chip pull-up/down resistors disabled; absolute value -3-n a v i input voltage pin configured to provide a digital function; v dd(io) ? 2.2 v [8] 0- 5 . 5v v dd(io) = 0 v 0 - 3.6 v v o output voltage output active 0 - v dd(io) v v ih high-level input voltage 0.7 ? v dd(io) -5 . 5v v il low-level input voltage ? 0.5 - 0.3 ? v dd(io) v v hys hysteresis voltage 0.1 ? v dd(io) --v v oh high-level output voltage i oh = ? 6 ma v dd(io) ? 0.4 --v v ol low-level output voltage i ol =6 ma - - 0.4 v i oh high-level output current v oh =v dd(io) ? 0.4 v ? 6- - ma i ol low-level output current v ol =0.4v 6 - - ma i ohs high-level short-circuit output current drive high; connected to ground [9] --8 6 . 5m a i ols low-level short-circuit output current drive low; connected to v dd(io) [9] --7 6 . 5m a i pd pull-down current v i =5 v [11] [12] [13] -9 3- ? a table 8. static characteristics ?continued t amb = ? 40 ? c to +85 ? c, unless otherwise specified. applies to parts LPC1850/30/20/10 rev ?a? only. symbol parameter conditions min typ [1] max unit
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 94 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller i pu pull-up current v i =0v [11] [12] [13] - ? 62 - ? a v dd(io) LPC1850/30/20/10 rev ?a? only. symbol parameter conditions min typ [1] max unit
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 95 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller i oh high-level output current v oh =v dd(io) ? 0.4 v ? 8- - ma i ol low-level output current v ol =0.4v 8 - - ma i ohs high-level short-circuit output current drive high; connected to ground [9] [12] --6 5m a i ols low-level short-circuit output current drive low; connected to v dd(io) [9] [12] --6 3m a i/o pins - high drive strength: high drive mode i oh high-level output current v oh =v dd(io) ? 0.4 v ? 14 - - ma i ol low-level output current v ol =0.4v 14 - - ma i ohs high-level short-circuit output current drive high; connected to ground [9] [12] --1 1 3m a i ols low-level short-circuit output current drive low; connected to v dd(io) [9] [12] --1 1 0m a i/o pins - high drive strength: ultra-high drive mode i oh high-level output current v oh =v dd(io) ? 0.4 v ? 20 - - ma i ol low-level output current v ol =0.4v 20 - - ma i ohs high-level short-circuit output current drive high; connected to ground [9] [12] --1 6 5m a i ols low-level short-circuit output current drive low; connected to v dd(io) [9] [12] --1 5 6m a i/o pins - high-speed c i input capacitance - - 2 pf i il low-level input current v i = 0 v; on-chip pull-up resistor disabled -3-na i ih high-level input current v i =v dd(io) ; on-chip pull-down resistor disabled - ? 3- na i oz off-state output current v o =0v to v dd(io) ; on-chip pull-up/down resistors disabled; absolute value -3-na v i input voltage pin configured to provide a digital function; v dd(io) ? 2.2 v [8] 0- 5 . 5v v dd(io) = 0 v 0 - 3.6 v v o output voltage output active 0 - v dd(io) v v ih high-level input voltage 0.7 ? v dd(io) -5 . 5v v il low-level input voltage ? 0.5 - 0.3 ? v dd(io) v table 8. static characteristics ?continued t amb = ? 40 ? c to +85 ? c, unless otherwise specified. applies to parts LPC1850/30/20/10 rev ?a? only. symbol parameter conditions min typ [1] max unit
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 96 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller v hys hysteresis voltage 0.1 ? v dd(io) --v v oh high-level output voltage i oh = ? 8 ma v dd(io) ? 0.4 --v v ol low-level output voltage i ol =8 ma - - 0.4 v i oh high-level output current v oh =v dd(io) ? 0.4 v ? 8- - ma i ol low-level output current v ol =0.4v 8 - - ma i ohs high-level short-circuit output current drive high; connected to ground [9] --8 6m a i ols low-level short-circuit output current drive low; connected to v dd(io) [9] --7 6m a i pd pull-down current v i =v dd(io) [11] [12] [13] -6 2- ? a i pu pull-up current v i =0v [11] [12] [13] - ? 62 - ? a v dd(io) LPC1850/30/20/10 rev ?a? only. symbol parameter conditions min typ [1] max unit
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 97 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [1] typical ratings are not guaranteed. the va lues listed are at room temperature (25 ? c), nominal supply voltages. [2] v dd(reg)(3v3) = v dd(io) =v dda(3v3) = 3.3 v; t amb =25 ? c for all power consumption measurements. [3] pll1 disabled. normal power mode. [4] pll1 enabled. normal power mode. [5] on pin vbat; t amb =25 ? c. v dd(reg)(3v3) not present. [6] v ps corresponds to the output of the power switch (see figure 11 ) which is determined by the greater of v bat and v dd(reg)(3v3) . [7] v dda(3v3) = 3.3 v; t amb =25 ? c. [8] v dd(io) supply voltage must be present. [9] allowed as long as the current limit does not exceed the maximum current allowed by the device. [10] to v ss . [11] the values specified are simulated and absolute values. [12] the weak pull-up resist or is connected to the v dd(io) rail and pulls up the i/o pin to the v dd(io) level. [13] the input cell disables the weak pull-up re sistor when the applied input voltage exceeds v dd(io) . [14] the parameter value specified is a simulated value excluding bond capacitance. [15] for usb operation 3.0 v ? v dd((io) ? 3.6 v. guaranteed by design. [16] includes external resistors of 33 ?? 1 % on d+ and d ?. 10.1 power consumption remark: all power consumption data in this section apply to rev ?a? of the LPC1850/30/20/10 parts only. v i(dif) differential input voltage 100 400 1100 mv usb1 pins (usb1_dp/usb1_dm) [15] i oz off-state output current 0vLPC1850/30/20/10 rev ?a? only. symbol parameter conditions min typ [1] max unit
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 98 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller conditions: t amb = 25 ? c; normal mode entered executing code while(1){} from sram; internal pull-up resistors disabled; s ystem pll enabled; irc enabled, bo d disabled; all peripherals disabled; all peripheral clocks disabled. fig 12. typical supply current versus regulator supply voltage v dd(reeg)(3v3) in active mode conditions: v dd(reg)(3v3) = 3.0 v, normal mode entered execut ing code while(1){} from sram; internal pull-up resistors disabled; system pll enabled; irc enabled, bod disabled; all peripherals disabled; all peripheral clocks disabled. fig 13. typical supply current ver sus temperature in active mode x (x) x x x xx 001aac984 x x x x x x (x) x x (x) x x x xx 001aac984 x x x x x x (x) x
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 99 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller conditions: v dd(reg)(3v3) = 3.0 v; internal pull-up resistors disabled; system pll enabled; irc enabled, bod disabled; all peripherals dis abled; all peripheral clocks disabled. fig 14. typical supply current versus temperature in sleep mode conditions: v bat = 0 v; v dd(io) = 0 v. fig 15. typical supply current versu s temperature in deep-sleep mode x (x) x x x xx 001aac984 x x x x x x (x) x x (x) x x x xx 001aac984 x x x x x x (x) x
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 100 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller conditions: v bat = 0 v; v dd(io) = 0 v. fig 16. typical supply current versu s temperature in power-down mode conditions: v bat = 0 v; v dd(io) = 0 v. fig 17. typical supply current versus temperature in deep power-down mode x (x) x x x xx 001aac984 x x x x x x (x) x x (x) x x x xx 001aac984 x x x x x x (x) x
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 101 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 10.2 electrical pi n characteristics conditions: v dd(reg)(3v3) =v dd(io) = 3.3 v; standard port pins. conditions: v dd(reg)(3v3) =v dd(io) = 3.3 v; standard port pins. fig 18. typical high-level output voltage v oh versus high-level output source current i oh fig 19. typical low-level output current i ol versus low-level output voltage v ol x (x) xx x xx x 001aab173 x x x x x x (x) x x (x) xx x xx x 001aab173 x x x x x x (x) x conditions: v dd(io)) = 3.3 v. simulated values. values at t = 25 ? c are typical values. values at t= ?40 ? c correspond to minimum values. fig 20. typical pull-up current i pu versus input voltage v i v i (v) 0 5 4 23 1 002aag625 -40 -20 -60 0 +20 i pu (a) -80 t = 25 c -40 c
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 102 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller conditions: v dd(io)) = 3.3 v. simulated values. values at t = 25 ? c are typical values. values at t= ?40 ? c correspond to maximum values. fig 21. typical pull-down current i pd versus input voltage v i v i (v) 0 5 4 23 1 002aag626 60 30 90 120 i pd (a) 0 t =25 c -40 c
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 103 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 11. dynamic characteristics 11.1 wake-up times [1] typical ratings are not guaranteed. the va lues listed are at room temperature (25 ? c), nominal supply voltages. [2] t cy(clk) = 1/cclk with cclk = cpu clock frequency. 11.2 external clock [1] parameters are valid over operating temp erature range unless otherwise specified. [2] typical ratings are not guaranteed. the va lues listed are at room temperature (25 ? c), nominal supply voltages. table 9. dynamic characteristic: wake-up from deep-sleep, power-down, and deep power-down modes t amb = ? 40 ? c to +85 ? c symbol parameter conditions min typ [1] max unit t wake wake-up time from sleep mode [2] 3 ? t cy(clk) 5 ? t cy(clk) -ns from deep-sleep and power-down mode 12 51 - ? s from deep power-down mode - 250 - ? s after reset - 250 - ? s table 10. dynamic characteristic: external clock t amb = ? 40 ? c to +85 ? c; v dd(io) over specified ranges. [1] symbol parameter conditions min typ [2] max unit f osc oscillator frequency 1 - 25 mhz t cy(clk) clock cycle time 40 - 1000 ns t chcx clock high time t cy(clk) ? 0.4 - t cy(clk) ? 0.6 ns t clcx clock low time t cy(clk) ? 0.4 - t cy(clk) ? 0.6 ns fig 22. external clock timing (with an amplitude of at least v i(rms) = 200 mv) t clcx t chcx t cy(clk) 002aag698
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 104 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 11.3 crystal oscillator [1] parameters are valid over operating temp erature range unless otherwise specified. [2] typical ratings are not guaranteed. the va lues listed are at room temperature (25 ? c), nominal supply voltages. [3] indicates rms period jitter. [4] pll-induced jitter is not included. [5] select hf = 0 in the xtal_osc_ctrl register. [6] select hf = 1 in the xtal_osc_ctrl register. table 11. dynamic characteristic: oscillator t amb = ? 40 ? c to +85 ? c; v dd(io) , v dd(reg)(3v3) over specified ranges. [1] symbol parameter conditions min typ [2] max unit low-frequency mode (1 mhz - 20 mhz) [5] t jit(per) period jitter time 5 mhz crystal [3] [4] - 13.2 - ps 10 mhz crystal - 6.6 - ps 15 mhz crystal - 4.8 - ps high-frequency mode (20 mhz - 25 mhz) [6] t jit(per) period jitter time 20 mhz crystal [3] [4] -4.3- ps 25 mhz crystal - 3.7 - ps
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 105 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 11.4 irc and rtc oscillators [1] parameters are valid over operating te mperature range unless otherwise specified. [2] typical ratings are not guaranteed. the va lues listed are at room temperature (25 ? c), nominal supply voltages. 11.5 i 2 c-bus table 12. dynamic characteristic: irc and rtc oscillators t amb = ? 40 ? c to +85 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v. [1] symbol parameter conditions min typ [2] max unit f osc(rc) internal rc oscillator frequency - 11.88 12 12.12 mhz f i(rtc) rtc input frequency - - 32.768 - khz conditions: frequency values are typical values. fig 23. internal rc oscillator frequency versus temperature x (x) xx x xx x 001aab173 x x x x x x (x) x table 13. dynamic characteristic: i 2 c-bus pins t amb = ? 40 ? c to +85 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v. [1] symbol parameter conditions min max unit f scl scl clock frequency standard-mode 0 100 khz fast-mode 0 400 khz fast-mode plus 0 1 mhz t f fall time [3] [4] [5] [6] of both sda and scl signals standard-mode - 300 ns fast-mode 20 + 0.1 ? c b 300 ns fast-mode plus - 120 ns t low low period of the scl clock standard-mode 4.7 - ? s fast-mode 1.3 - ? s fast-mode plus 0.5 - ? s
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 106 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [1] parameters are valid over operating tem perature range unless otherwise specified. [2] thd;dat is the data hold time that is measured from the fa lling edge of scl; applies to data in transmission and the acknowl edge. [3] a device must internally provide a hold time of at least 300 ns for the sda signal (with respect to the v ih (min) of the scl signal) to bridge the undefined region of the falling edge of scl. [4] c b = total capacitance of one bus line in pf. if mixed with hs-mode devices, faster fall times are allowed. [5] the maximum t f for the sda and scl bus lines is specified at 300 ns. the maximum fall time for the sda output stage t f is specified at 250 ns. this allows series protection re sistors to be connected in between the sda and the scl pins and the sda/scl bus lines without exceeding the maximum specified t f . [6] in fast-mode plus, fall time is specified the same for bot h output stage and bus timing. if se ries resistors are used, desig ners should allow for this when c onsidering bus timing. [7] the maximum t hd;dat could be 3.45 ? s and 0.9 ? s for standard-mode and fast-mode but must be less than the maximum of t vd;dat or t vd;ack by a transition time. this maximum must only be met if the device does not stretch the low period (t low ) of the scl signal. if the clock stretches the scl, the data must be valid by the set-up time before it releases the clock. [8] tsu;dat is the data set-up time that is measured with respec t to the rising edge of scl; applies to data in transmission and the acknowledge. [9] a fast-mode i 2 c-bus device can be used in a standard-mode i 2 c-bus system but the requirement t su;dat = 250 ns must then be met. this will automatically be the case if the device does not stretch the low period of the scl signal. if such a device does stre tch the low period of the scl signal, it must output the next data bit to the sda line t r(max) + t su;dat = 1000 + 250 = 1250 ns (according to the standard-mode i 2 c-bus specification) before the scl line is released. al so the acknowledge timing must meet this set-up time. t high high period of the scl clock standard-mode 4.0 - ? s fast-mode 0.6 - ? s fast-mode plus 0.26 - ? s t hd;dat data hold time [2] [3] [7] standard-mode 0 - ? s fast-mode 0 - ? s fast-mode plus 0 - ? s t su;dat data set-up time [8] [9] standard-mode 250 - ns fast-mode 100 - ns fast-mode plus 50 - ns table 13. dynamic characteristic: i 2 c-bus pins t amb = ? 40 ? c to +85 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v. [1] symbol parameter conditions min max unit fig 24. i 2 c-bus pins clock timing 002aaf425 t f 70 % 30 % sda t f 70 % 30 % s 70 % 30 % 70 % 30 % t hd;dat scl 1 / f scl 70 % 30 % 70 % 30 % t vd;dat t high t low t su;dat
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 107 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 11.6 i 2 s-bus interface [1] clock to the i 2 s-bus interface base_apb1_clk = 150 mhz; peripheral clock to the i 2 s-bus interface pclk = base_apb1_clk / 12. i 2 s clock cycle time t cy(clk) = 79.2 ns; corresponds to the sck signal in the i 2 s-bus specification . table 14. dynamic characteristics: i 2 s-bus interface pins t amb =25 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v; 2.7 v ? v dd(io) ? 3.6 v; c l = 20 pf. conditions and data refer to i2s0 and i2s1 pins. simulated values. symbol parameter conditions min typ max unit common to input and output t r rise time - 4 - ns t f fall time - 4 - ns t wh pulse width high on pins i2sx_tx_sck and i2sx_rx_sck - - - t wl pulse width low on pins i2sx_tx_sck and i2sx_rx_sck --ns output t v(q) data output valid time on pin i2sx_tx_sda [1] -4.4- ns on pin i2sx_tx_ws - 4.3 - ns input t su(d) data input set-up time on pin i2sx_rx_sda [1] -0- ns on pin i2sx_rx_ws 0.20 ns t h(d) data input hold time on pin i2sx_rx_sda [1] -3.7- ns on pin i2sx_rx_ws - 3.9 - ns fig 25. i 2 s-bus timing (transmit) 002aag497 i2sx_tx_sck i2sx_tx_sda i2sx_tx_ws t cy(clk) t f t r t wh t wl t v(q) t v(q)
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 108 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 11.7 usart interface fig 26. i 2 s-bus timing (receive) 002aag498 t cy(clk) t f t r t wh t su(d) t h(d) t su(d) t su(d) t wl i2sx_rx_sck i2sx_rx_sda i2sx_rx_ws table 15. dynamic characte ristics: usart interface t amb =25 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v; 2.7 v ? v dd(io) ? 3.6 v; c l = 20 pf. simulated values. symbol parameter conditions min typ max unit t cy(clk) clock cycle time on pins ux_uclk - 0.1 - ? s output t v(q) data output valid time on pin ux_txd - 6.5 - ns
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 109 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 11.8 ssp interface [1] t cy(clk) = (sspclkdiv ? (1 + scr) ? cpsdvsr) / f main . the clock cycle time deriv ed from the spi bit rate t cy(clk) is a function of the main clock frequency f main , the ssp peripheral clock divider (sspclkdiv), the ssp scr parameter (specified in the ssp0cr0 register), and the ssp cpsdvsr parameter (spec ified in the ssp clock prescale register). [2] t cy(clk) = 12 ? t cy(pclk) . table 16. dynamic characteristics: ssp pins in spi mode t amb =25 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v; 2.7 v ? v dd(io) ? 3.6 v. simulated values. symbol parameter conditions min typ max unit t cy(clk) clock cycle time full-duplex mode [1] -4 0 -n s when only transmitting -2 0 -n s ssp master t ds data set-up time in spi mode - 8.8 - ns t dh data hold time in spi mode - ? 5.0 - ns t v(q) data output valid time in spi mode - 3.9 - ns t h(q) data output hold time in spi mode - 0.4 - ns ssp slave t cy(pclk) pclk cycle time 10 ns t cy(clk) clock cycle time [2] 120 - - ns t ds data set-up time in spi mode - 10.5 - ns t dh data hold time in spi mode - 1 - ns t v(q) data output valid time in spi mode - 4.0 - ns t h(q) data output hold time in spi mode - 0.2 - ns
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 110 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 27. ssp master timing in spi mode sck (cpol = 0) mosi miso t cy(clk) t clk(h) t clk(l) t ds t dh t v(q) data valid data valid t h(q) sck (cpol = 1) data valid data valid mosi miso t ds t dh data valid data valid t h(q) data valid data valid t v(q) cpha = 1 cpha = 0 002aae829
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 111 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 28. ssp slave timing in spi mode sck (cpol = 0) mosi miso t cy(clk) t clk(h) t clk(l) t ds t dh t v(q) data valid data valid t h(q) sck (cpol = 1) data valid data valid mosi miso t ds t dh t v(q) data valid data valid t h(q) data valid data valid cpha = 1 cpha = 0 002aae830
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 112 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 11.9 external memory interface table 17. dynamic characteristics: static external memory interface c l = 22 pf for emc_dn c l = 20 pf for all others; t amb = ? 40 ? c to 85 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v; 2.7 v ? v dd(io) ? 3.6 v; values guaranteed by design. symbol parameter [1] conditions min typ max unit read cycle parameters t cslav cs low to address valid time ? 3.1 - 1.6 ns t csloel cs low to oe low time [2] ? 0.6 + t cy(clk) ? waitoen - 1.3 + t cy(clk) ? waitoen ns t cslblsl cs low to bls low time pb = 1 ? 0.7 - 1.8 ns t oeloeh oe low to oe high time [2] ? 0.6 + (waitrd ? waitoen + 1) ? t cy(clk) - ? 0.4 + (waitrd ? waitoen + 1) ? t cy(clk) ns t am memory access time - - ? 16 + (waitrd ? waitoen +1) ? t cy(clk) ns t h(d) data input hold time ? 16 - - ns t cshblsh cs high to bls high time pb = 1 ? 0.4 - 1.9 ns t cshoeh cs high to oe high time ? 0.4 - 1.4 ns t oehanv oe high to address invalid pb = 1 ? 2.0 - 2.6 ns t csheor cs high to end of read time [3] ? 2.0 - 0 ns t cslsor cs low to start of read time [4] 0- 1 . 8n s write cycle parameters t cslav cs low to address valid time ? 3.1 - 1.6 ns t csldv cs low to data valid time ? 3.1 - 1.5 ns t cslwel cs low to we low time pb = 1 ? 1.5 - 0.2 ns t cslblsl cs low to bls low time pb = 1 ? 0.7 - 1.8 ns t welweh we low to we high time pb = 1 [2] ? 0.6 + (waitwr ? waitwen + 1) ? t cy(clk) - ? 0.4 + (waitwr ? waitwen + 1) ? t cy(clk) ns t wehdnv we high to data invalid time pb = 1 [2] ? 0.9 + t cy(clk) - 2.3 + t cy(clk) ns t weheow we high to end of write time pb = 1 [2] [5] ? 0.4 + t cy(clk) - ? 0.3 + t cy(clk) ns t cslblsl cs low to bls low pb = 0 ? 0.7 - 1.8 ns t blslblsh bls low to bls high time pb = 0 [2] ? 0.9 + (waitwr ? waitwen + 1) ? t cy(clk) - ? 0.1 + (waitwr ? waitwen + 1) ? t cy(clk) ns t blsheow bls high to end of write time pb = 0 [2] [5] ? 1.9 + t cy(clk) - ? 0.5 + t cy(clk) ns
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 113 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [1] parameters specified for 40 % of v dd(io) for rising edges and 60 % of v dd(io) for falling edges. [2] t cy(clk) = 1/cclk (see lpc18xx user manual ). [3] end of read (eor): longest of t cshoeh , t oehanv , t cshblsh . [4] start of read (sor): longest of t cslav , t csloel , t cslblsl . [5] end of write (eow): earliest of address not valid or emc_blsn high. t blshdnv bls high to data invalid time pb = 0 [2] ? 2.5 + t cy(clk) - 1.4 + t cy(clk) ns t csheow cs high to end of write time [5] ? 2.0 - 0 ns t blshdnv bls high to data invalid time pb = 1 ? 2.5 - 1.4 ns t wehanv we high to address invalid time pb = 1 ? 0.9 + t cy(clk) - 2.4 + t cy(clk) ns table 17. dynamic characteristics: static external memory interface ?continued c l = 22 pf for emc_dn c l = 20 pf for all others; t amb = ? 40 ? c to 85 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v; 2.7 v ? v dd(io) ? 3.6 v; values guaranteed by design. symbol parameter [1] conditions min typ max unit fig 29. external static memory read/write access (pb = 0) t csldv t cslblsl t csheow t blsheow t cslav eor sor eow emc_an emc_csn emc_oe emc_blsn emc_we emc_dn 002aag699 t cshoeh t oehanv t csheor t am t cslsor t oeloeh t csloel t cslav t h(d) t blslblsh t blshdnv
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 114 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 30. external static memory read/write access (pb = 1) emc_an t cslav t cslblsl emc_csn emc_oe emc_blsn emc_we t cslsor t csldv t am t h(d) eor sor eow emc_dn t cslwel t welweh t weheow 002aag700 t cslblsl t cslav t csloel t oeloeh t cshoeh t oehanv t cshblsh t csheor t csheow t wehdnv t blshdnv
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 115 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [1] program the emc_clkn delay values in the emcdelayclk register (see the lpc18xx user manual ). the delay values must be the same for all sdra m clocks emc_clkn: clk0_delay = clk1_delay = clk2_delay = clk3_delay. table 18. dynamic characteristics: dynamic external memory interface simulated data over temper ature and process range; c l = 10 pf for emc_dycsn , emc_ras , emc_cas , emc_we , emc_an; c l = 9 pf for emc_dn; c l = 5 pf for emc_dqmoutn , emc_clkn, emc_ckeoutn ; t amb = ? 40 ? c to 85 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v; v dd(io) =3.3 v ? 10 %; rd = 1 (see lpc18xx user manual); emc_clkn delays clk0_delay = clk1_delay = clk2_delay = clk3_delay = 0. symbol parameter min typ max unit t cy(clk) clock cycle time 8.4 - - ns common to read and write cycles t d(dycsv) dynamic chip select valid delay time - 3.1 + 0.5 ? t cy(clk) 5.1 + 0.5 ? t cy(clk) ns t h(dycs) dynamic chip select hold time 0.3 + 0.5 ? t cy(clk) 0.9 + 0.5 ? t cy(clk) -n s t d(rasv) row address strobe valid delay time - 3.1 + 0.5 ? t cy(clk) 4.9 + 0.5 ? t cy(clk) ns t h(ras) row address strobe hold time 0.5 + 0.5 ? t cy(clk) 1.1 + 0.5 ? t cy(clk) -n s t d(casv) column address strobe valid delay time - 2.9 + 0.5 ? t cy(clk) 4.6 + 0.5 ? t cy(clk) ns t h(cas) column address strobe hold time 0.3 + 0.5 ? t cy(clk) 0.9 + 0.5 ? t cy(clk) -n s t d(wev) write enable valid delay time - 3.2 + 0.5 ? t cy(clk) 5.9 + 0.5 ? t cy(clk) ns t h(we) write enable hold time 1.3 + 0.5 ? t cy(clk) 1.4 + 0.5 ? t cy(clk) -n s t d(dqmoutv) dqmout valid delay time - 3.1 + 0.5 ? t cy(clk) 5.0 + 0.5 ? t cy(clk) ns t h(dqmout) dqmout hold time 0.2 + 0.5 ? t cy(clk) 0.8 + 0.5 ? t cy(clk) -n s t d(av) address valid delay time - 3.8 + 0.5 ? t cy(clk) 6.3 + 0.5 ? t cy(clk) ns t h(a) address hold time 0.3 + 0.5 ? t cy(clk) 0.9 + 0.5 ? t cy(clk) -n s t d(ckeoutv) ckeout valid delay time - 3.1 + 0.5 ? t cy(clk) 5.1 + 0.5 ? t cy(clk) ns t h(ckeout) ckeout hold time 0.5 ? t cy(clk) 0.7 + 0.5 ? t cy(clk) -n s read cycle parameters t su(d) data input set-up time ? 1.5 ? 0.5 - ns t h(d) data input hold time - 0.8 2.2 ns write cycle parameters t d(qv) data output valid delay time - 3.8 + 0.5 ? t cy(clk) 6.2 + 0.5 ? t cy(clk) ns t h(q) data output hold time 0.5 ? t cy(clk) 0.7 + 0.5 ? t cy(clk) -n s table 19. dynamic characteristics: dynamic external memory interface; emc_clk[3:0] delay values t amb = ? 40 ? c to 85 ? c; v dd(io) =3.3 v ? 10 %; 2.2 v ? v dd(reg)(3v3) ? 3.6 v. symbol parameter conditions min typ max unit t d delay time delay value clkn_delay = 0 [1] 0.0 0.0 0.0 ns clkn_delay = 1 [1] 0.4 0.5 0.8 ns clkn_delay = 2 [1] 0.7 1.0 1.7 ns clkn_delay = 3 [1] 1.1 1.6 2.5 ns clkn_delay = 4 [1] 1.4 2.0 3.3 ns clkn_delay = 5 [1] 1.7 2.6 4.1 ns clkn_delay = 6 [1] 2.1 3.1 4.9 ns clkn_delay = 7 [1] 2.5 3.6 5.8 ns
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 116 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller for the programmable emc_clk[3:0] clock delays clkn_delay, see table 19 . remark: for sdram operation, set clk0_delay = clk1_delay = clk2_delay = clk3_delay in the emcdelayclk register. fig 31. sdram timing 002aag703 t cy(clk) emc_clkn delay = 0 emc_clkn delay > 0 emc_dycsn, emc_ras, emc_cas, emc_we, emc_ckeoutn, emc_a[22:0], emc_dqmoutn t h(q) t h(q) - t d t h(d) t su(d) t h(d) t su(d) emc_d[31:0] write emc_d[31:0] read; delay = 0 emc_d[31:0] read; delay > 0 t h(x) - t d t d(xv) - t d t d(qv) - t d t d(qv) t h(x) t d(xv) emc_clkn delay t d ; programmable clkn_delay
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 117 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 11.10 usb interface [1] characterized but not implemented as production test. guaranteed by design. table 20. dynamic characteristics: usb0 and usb1 pins (full-speed) c l = 50 pf; r pu = 1.5 k ? on d+ to v dd(io) ; 3.0 v ? v dd(io) ? 3.6 v. symbol parameter conditions min typ max unit t r rise time 10 % to 90 % 8.5 - 13.8 ns t f fall time 10 % to 90 % 7.7 - 13.7 ns t frfm differential rise and fall time matching t r /t f --1 0 9% v crs output signal crossover voltage 1.3 - 2.0 v t feopt source se0 interval of eop see figure 32 160 - 175 ns t fdeop source jitter for differential transition to se0 transition see figure 32 ? 2-+5ns t jr1 receiver jitter to next transition ? 18.5 - +18.5 ns t jr2 receiver jitter for paired transitions 10 % to 90 % ? 9-+9ns t eopr1 eop width at receiver must reject as eop; see figure 32 [1] 40 - - ns t eopr2 eop width at receiver must accept as eop; see figure 32 [1] 82 - - ns fig 32. differential da ta-to-eop transition skew and eop width 002aab561 t period differential data lines crossover point source eop width: t feopt receiver eop width: t eopr1 , t eopr2 crossover point extended differential data to se0/eop skew n t period + t fdeop
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 118 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [1] characterized but not implemented as production test. [2] total average power consumption. [3] the driver is active only 20 % of the time. 11.11 ethernet table 21. static characte ristics: usb0 phy pins [1] symbol parameter conditions min typ max unit high-speed mode p cons power consumption [2] -68- mw i dda(3v3) analog supply current (3.3 v) on pin usb0_vdda3v3_driver; total supply current [3] -18- ma during transmit - 31 - ma during receive - 14 - ma with driver tri-stated - 14 - ma i ddd digital supply current - 7 - ma full-speed/low-speed mode p cons power consumption [2] -15- mw i dda(3v3) analog supply current (3.3 v) on pin usb0_vdda3v3_driver; total supply current - 3.5 - ma during transmit - 5 - ma during receive - 3 - ma with driver tri-stated - 3 - ma i ddd digital supply current - 3 - ma suspend mode i dda(3v3) analog supply current (3.3 v) - 24 - ? a with driver tri-stated - 24 - ? a with otg functionality enabled - 3 - ma i ddd digital supply current - 30 - ? a vbus detector outputs v th threshold voltage for vbus valid 4.4 - - v for session end 0.2 - 0.8 v for a valid 0.8 - 2 v for b valid 2 - 4 v v hys hysteresis voltage for session end - 150 10 mv a valid - 200 10 mv b valid - 200 10 mv table 22. dynamic charac teristics: ethernet t amb = ? 40 ? c to 85 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v; 2.7 v ? v dd(io) ? 3.6 v. values guaranteed by design. symbol parameter conditions min max unit rmii mode f clk clock frequency for enet_rx_clk [1] -50mhz ? clk clock duty cycle [1] 50 50 %
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 119 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [1] output drivers can drive a load ? 25 pf accommodating over 12 inch of pcb trace and the input capacitance of the receiving device. [2] timing values are given from the point at which the cl ock signal waveform crosses 1.4 v to the valid input or output level. t su set-up time for enet _txdn, enet_tx_en, enet_rxdn, enet_rx_er, enet_rx_dv [1] [2] 4- ns t h hold time for enet_txdn, enet_tx_en, enet_rxdn, enet_rx_er, enet_rx_dv [1] [2] 2- ns mii mode f clk clock frequency for enet_tx_clk [1] - 25 mhz ? clk clock duty cycle [1] 50 50 % t su set-up time for enet _txdn, enet_tx_en, enet_tx_er [1] [2] 4- ns t h hold time for enet_txdn, enet_tx_en, enet_tx_er [1] [2] 2- ns f clk clock frequency for enet_rx_clk [1] - 25 mhz ? clk clock duty cycle [1] 50 50 % t su set-up time for enet _rxdn, enet_rx_er, enet_rx_dv [1] [2] 4- ns t h hold time for enet_r xdn, enet_rx_er, enet_rx_dv [1] [2] 2- ns fig 33. ethernet timing table 22. dynamic charac teristics: ethernet t amb = ? 40 ? c to 85 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v; 2.7 v ? v dd(io) ? 3.6 v. values guaranteed by design. symbol parameter conditions min max unit 002aag210 t h t su enet_rx_clk enet_tx_clk enet_rxd[n] enet_rx_dv enet_rx_er enet_txd[n] enet_tx_en enet_tx_er
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 120 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 11.12 sd/mmc 11.13 lcd table 23. dynamic characteristics: sd/mmc t amb =25 ? c, 2.2 v ? v dd(reg)(3v3) ? 3.6 v; 2.7 v ? v dd(io) ? 3.6 v, c l = 20 pf. simulated values. symbol parameter conditions min typ max unit f clk clock frequency on pin sd_clk; data transfer mode - 40 mhz on pin sd_clk; identification mode mhz t su(d) data input set-up time on pins sd_cmd, sd_datn as inputs 9.9 - ns t h(d) data input hold time on pins sd_cmd, sd_datn as inputs 0.3 - ns t d(qv) data output valid delay time on pins sd_cmd, sd_datn as outputs - 6.9 ns t h(q) data output hold time on pins sd_cmd, sd_datn as outputs 0.3 - ns fig 34. sd/mmc timing 002aag204 sd_clk sd_datn (o) sd_datn (i) t d(qv) t h(d) t su(d) t cy(clk) t h(q) sd_cmd (o) sd_cmd (i) table 24. dynamic characteristics: lcd t amb =25 ? c; 2.2 v ? v dd(reg)(3v3) ? 3.6 v; 2.7 v ? v dd(io) ? 3.6 v; c l = 20 pf. simulated values. symbol parameter conditions min typ max unit f clk clock frequency on pin lcd_dclk - 50 mhz t su(d) data input set-up time - ns t h(d) data input hold time - ns t d(qv) data output valid delay time - 14.1 ns t h(q) data output hold time - ns
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 121 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 12. adc/dac electrical characteristics [1] the adc is monotonic, there are no missing codes. [2] the differential linearity error (e d ) is the difference between the actual step width and the ideal step width. see figure 35 . [3] the integral non-linearity (e l(adj) ) is the peak difference between the center of the st eps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. see figure 35 . [4] the offset error (e o ) is the absolute difference between the straight line which fits the actual cu rve and the straight line which fits the ideal curve. see figure 35 . [5] the gain error (e g ) is the relative difference in percent between the straight line fitting the actual transfe r curve after removing offset error, and the straight line which fits the ideal transfer curve. see figure 35 . [6] the absolute error (e t ) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated adc and the ideal transfer curve. see figure 35 . [7] t amb = 25 ? c; maximum sampling frequency f s = 4.5 mhz and analog input capacitance c ia = 2 pf. [8] input resistance r i depends on the sampling frequency fs: r i = 2 k ? + 1 / (f s ? c ia ). table 25. adc characteristics v dda(3v3) over specified ranges; t amb = ? 40 ? c to +85 ? c; adc frequency 4.5 mhz; unless otherwise specified. symbol parameter conditions min typ max unit v ia analog input voltage 0 - v dda(3v3) v c ia analog input capacitance - - 2 pf e d differential linearity error 2.7 v ? v dda(3v3) ? 3.6 v [1] [2] - ? 0.8 - lsb 2.2 v ? v dda(3v3) < 2.7 v - ? 1.0 - lsb e l(adj) integral non-linearity 2.7 v ? v dda(3v3) ? 3.6 v [3] - ? 0.8 - lsb 2.2 v ? v dda(3v3) < 2.7 v - ? 1.5 - lsb e o offset error 2.7 v ? v dda(3v3) ? 3.6 v [4] - ? 0.15 - lsb 2.2 v ? v dda(3v3) < 2.7 v - ? 0.15 - lsb e g gain error 2.7 v ? v dda(3v3) ? 3.6 v [5] - ? 0.3 - % 2.2 v ? v dda(3v3) < 2.7 v - ? 0.35 - % e t absolute error 2.7 v ? v dda(3v3) ? 3.6 v [6] - ? 3- lsb 2.2 v ? v dda(3v3) < 2.7 v - ? 4- lsb r vsi voltage source interface resistance see figure 36 -- 1/(7 ? f clk(adc) ? c ia ) k? r i input resistance [7] [8] -- 1.2 m ? f clk(adc) adc clock frequency - - 4.5 mhz f c(adc) adc conversion frequency 10-bit resolution; 11 clock cycles - - 400 ksamples/s 2-bit resolution; 3 clock cycles 1.5 msamples/s
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 122 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller (1) example of an actual transfer curve. (2) the ideal transfer curve. (3) differential linearity error (e d ). (4) integral non-linearity (e l(adj) ). (5) center of a step of the actual transfer curve. fig 35. 10-bit adc characteristics 002aaf959 1023 1022 1021 1020 1019 (2) (1) 1024 1018 1019 1020 1021 1022 1023 7 123456 7 6 5 4 3 2 1 0 1018 (5) (4) (3) 1 lsb (ideal) code out v dda(3v3) ? v ssa 1024 offset error e o gain error e g offset error e o v ia (lsb ideal ) 1 lsb =
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 123 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [1] in the dac cr register, bit bias = 0 (see the lpc18xx user manual ). [2] settling time is calculated within 1/2 lsb of the final value. r s < 1/((7 ? f clk(adc) ? c ia ) ? 2 k ? fig 36. adc interface to pins lpc18xx adc0_n/adc1_n c ia = 2 pf r vsi r s v ss v ext 002aag697 adc comparator 2 k (analog pin) 2.2 k (multiplexed pin) table 26. dac characteristics v dda(3v3) over specified ranges; t amb = ? 40 ? c to +85 ? c; unless otherwise specified symbol parameter conditions min typ max unit e d differential linearity error 2.7 v ? v dda(3v3) ? 3.6 v [1] - ? 0.8 - lsb 2.2 v ? v dda(3v3) < 2.7 v - ? 1.0 - lsb e l(adj) integral non-linearity 2.7 v ? v dda(3v3) ? 3.6 v [1] - ? 1.0 - lsb 2.2 v ? v dda(3v3) < 2.7 v - ? 1.5 - lsb e o offset error 2.7 v ? v dda(3v3) ? 3.6 v [1] - ? 0.8 - lsb 2.2 v ? v dda(3v3) < 2.7 v - ? 1.0 - lsb e g gain error 2.7 v ? v dda(3v3) ? 3.6 v [1] - ? 0.3 - % 2.2 v ? v dda(3v3) < 2.7 v - ? 1.0 - % c l load capacitance - - 200 pf r l load resistance 1 - - k ? t s settling time [1] 0.4 ? s
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 124 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 13. application information 13.1 lcd panel signal usage table 27. lcd panel connections for stn single panel mode external pin 4-bit mono stn single panel 8-bit mono stn single panel color stn single panel lpc18xx pin used lcd function lpc18xx pin used lcd function lpc18xx pin used lcd function lcd_vd[23:8] - - - - - - lcd_vd7 - - p8_4 ud[7] p8_4 ud[7] lcd_vd6 - - p8_5 ud[6] p8_5 ud[6] lcd_vd5 - - p8_6 ud[5] p8_6 ud[5] lcd_vd4 - - p8_7 ud[4] p8_7 ud[4] lcd_vd3 p4_2 ud[3] p4_2 ud[3] p4_2 ud[3] lcd_vd2 p4_3 ud[2] p4_3 ud[2] p4_3 ud[2] lcd_vd1 p4_4 ud[1] p4_4 ud[1] p4_4 ud[1] lcd_vd0 p4_1 ud[0] p4_1 ud[0] p4_1 ud[0] lcd_lp p7_6 lcdlp p7_6 lcdlp p7_6 lcdlp lcd_enab/ lcdm p4_6 lcdenab/ lcdm p4_6 lcdenab/ lcdm p4_6 lcdenab/ lcdm lcd_fp p4_5 lcdfp p4_5 lcdfp p4_5 lcdfp lcd_dclk p4_7 lcddclk p4_7 lcddclk p4_7 lcddclk lcd_le p7_0 lcdle p7_0 lcdle p7_0 lcdle lcd_pwr p7_7 cdpwr p7_7 lcdpwr p7_7 lcdpwr gp_clkin pf_4 lcdclkin pf_4 lcdclkin pf_4 lcdclkin table 28. lcd panel connections for stn dual panel mode external pin 4-bit mono stn dual panel 8-bit mono stn dual panel color stn dual panel lpc18xx pin used lcd function lpc18xx pin used lcd function lpc18xx pin used lcd function lcd_vd[23:16] - - - - - - lcd_vd15 - - pb_4 l d[7] pb_4 ld[7] lcd_vd14 - - pb_5 l d[6] pb_5 ld[6] lcd_vd13 - - pb_6 l d[5] pb_6 ld[5] lcd_vd12 - - p8_3 ld[4] p8_3 ld[4] lcd_vd11 p4_9 ld[3] p4_9 ld[3] p4_9 ld[3] lcd_vd10 p4_10 ld[2] p4_10 ld[2] p4_10 ld[2] lcd_vd9 p4_8 ld[1] p4_8 ld[1] p4_8 ld[1] lcd_vd8 p7_5 ld[0] p7_5 ld[0] p7_5 ld[0] lcd_vd7 - - ud[7] p8_4 ud[7] lcd_vd6 - - p8_5 ud[6] p8_5 ud[6] lcd_vd5 - - p8_6 ud[5] p8_6 ud[5] lcd_vd4 - - p8_7 ud[4] p8_7 ud[4] lcd_vd3 p4_2 ud[3] p4_2 ud[3] p4_2 ud[3]
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 125 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller lcd_vd2 p4_3 ud[2] p4_3 ud[2] p4_3 ud[2] lcd_vd1 p4_4 ud[1] p4_4 ud[1] p4_4 ud[1] lcd_vd0 p4_1 ud[0] p4_1 ud[0] p4_1 ud[0] lcd_lp p7_6 lcdlp p7_6 lcdlp p7_6 lcdlp lcd_enab/ lcdm p4_6 lcdenab/ lcdm p4_6 lcdenab/ lcdm p4_6 lcdenab/ lcdm lcd_fp p4_5 lcdfp p4_5 lcdfp p4_5 lcdfp lcd_dclk p4_7 lcddclk p4_7 lcddclk p4_7 lcddclk lcd_le p7_0 lcdle p7_0 lcdle p7_0 lcdle lcd_pwr p7_7 lcdpwr p7_7 lcdpwr p7_7 lcdpwr gp_clkin pf_4 lcdclkin pf_4 lcdclkin pf_4 lcdclkin table 28. lcd panel connections for stn dual panel mode external pin 4-bit mono stn dual panel 8-bit mono stn dual panel color stn dual panel lpc18xx pin used lcd function lpc18xx pin used lcd function lpc18xx pin used lcd function table 29. lcd panel connections for tft panels external pin tft 12 bit (4:4:4 mode) tft 16 bit (5:6:5 mode) tft 16 bit (1 :5:5:5 mode) tft 24 bit lpc18xx pin used lcd function lpc18xx pin used lcd function lpc18xx pin used lcd function lpc18xx pin used lcd function lcd_vd23 pb_0 blue3 pb_0 blue4 pb_0 blue4 blue7 lcd_vd22 pb_1 blue2 pb_1 blue3 pb_1 blue3 blue6 lcd_vd21 pb_2 blue1 pb_2 blue2 pb_2 blue2 blue5 lcd_vd20 pb_3 blue0 pb_3 blue1 pb_3 blue1 blue4 lcd_vd19 - - p7_1 blue0 p7_1 blue0 blue3 lcd_vd18 - - - - p7_2 intensity blue2 lcd_vd17 - - - - - - p7_3 blue1 lcd_vd16 - - - - - - p7_4 blue0 lcd_vd15 pb_4 green3 pb_4 gr een5 pb_4 green4 pb_4 green7 lcd_vd14 pb_5 green2 pb_5 gr een4 pb_5 green3 pb_5 green6 lcd_vd13 pb_6 green1 pb_6 gr een3 pb_6 green2 pb_6 green5 lcd_vd12 p8_3 green0 p8_3 green2 p8_3 green1 p8_3 green4 lcd_vd11 - - p4_9 green1 p4_9 green0 p4_9 green3 lcd_vd10 - - p4_10 green0 p4_10 intensity p4_10 green2 lcd_vd9 - - - - - - p4_8 green1 lcd_vd8 - - - - - - p7_5 green0 lcd_vd7 p8_4 red3 p8_4 red4 p8_4 red4 p8_4 red7 lcd_vd6 p8_5 red2 p8_5 red3 p8_5 red3 p8_5 red6 lcd_vd5 p8_6 red1 p8_6 red2 p8_6 red2 p8_6 red5 lcd_vd4 p8_7 red0 p8_7 red1 p8_7 red1 p8_7 red4 lcd_vd3 - - p4_2 red0 p4_2 red0 p4_2 red3 lcd_vd2 - - - - p4_3 intensity p4_3 red2 lcd_vd1 - - - - - - p4_4 red1
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 126 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 13.2 crystal oscillator the crystal oscillator is controlled by t he xtal_osc_ctrl register in the cgu (see lpc18xx user manual ). the crystal oscillator operates at frequencies of 1 mhz to 25 mhz. this frequency can be boosted to a higher frequency, up to the ma ximum cpu operating frequency, by the pll. the oscillator can operate in one of two modes: slave mode and oscillation mode. ? in slave mode the input clock signal should be coupled by means of a capacitor of 100 pf (c c in figure 37 ), with an amplitude of at leas t 200 mv (rms). the xtal2 pin in this configuration can be left unconnected. ? external components and models used in oscillation mode are shown in figure 38 , and in ta b l e 3 0 and table 31 . since the feedback resistance is integrated on chip, only a crystal and the capacitances c x1 and c x2 need to be connected externally in case of fundamental mode osc illation (the fundam ental frequency is represented by l, c l and r s ). capacitance c p in figure 38 represents the parallel package capacitance and should not be larger than 7 pf. parameters f c , c l , r s and c p are supplied by the crystal manufacturer. lcd_vd0 - - - - - - p4_1 red0 lcd_lp p7_6 lcdlp p7_6 lcdlp p7_6 lcdlp p7_6 lcdlp lcd_enab /lcdm p4_6 lcdenab/ lcdm p4_6 lcdenab/ lcdm p4_6 lcdenab/ lcdm p4_6 lcdenab/ lcdm lcd_fp p4_5 lcdfp p4_5 lcdfp p4_5 lcdfp p4_5 lcdfp lcd_dclk p4_7 lcddclk p4_7 lcddclk p4_7 lcddclk p4_7 lcddclk lcd_le p7_0 lcdle p7_0 lcdle p7_0 lcdle p7_0 lcdle lcd_pwr p7_7 lcdpwr p7_7 lcdpwr p7_7 lcdpwr p7_7 lcdpwr gp_clkin pf_4 lcdclkin pf_4 lcdclkin pf_4 lcdclkin pf_4 lcdclkin table 29. lcd panel connections for tft panels external pin tft 12 bit (4:4:4 mode) tft 16 bit (5:6:5 mode) tft 16 bit (1 :5:5:5 mode) tft 24 bit lpc18xx pin used lcd function lpc18xx pin used lcd function lpc18xx pin used lcd function lpc18xx pin used lcd function table 30. recommended values for c x1/x2 in oscillation mode (crystal and external components parameters) low frequency mode fundamental oscillation frequency maximum crystal series resistance r s external load capacitors c x1 , c x2 2 mhz < 200 ? 33 pf, 33 pf < 200 ? 39 pf, 39 pf < 200 ? 56 pf, 56 pf 4 mhz < 200 ? 18 pf, 18 pf < 200 ? 39 pf, 39 pf < 200 ? 56 pf, 56 pf 8 mhz < 200 ? 18 pf, 18 pf < 200 ? 39 pf, 39 pf
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 127 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 12 mhz < 160 ? 18 pf, 18 pf < 160 ? 39 pf, 39 pf 16 mhz < 120 ? 18 pf, 18 pf < 80 ? 33 pf, 33 pf 20 mhz < 100 ? 18 pf, 18 pf < 80 ? 33 pf, 33 pf table 31. recommended values for c x1/x2 in oscillation mode (crystal and external components parameters) high frequency mode fundamental oscillation frequency maximum crystal series resistance r s external load capacitors c x1 , c x2 15 mhz < 80 ? 18 pf, 18 pf 20 mhz < 80 ? 39 pf, 39 pf < 100 ? 47 pf, 47 pf fig 37. slave mode operation of the on-chip oscillator fig 38. oscillator modes with external crystal model used for c x1 /c x2 evaluation table 30. recommended values for c x1/x2 in oscillation mode (crystal and external components parameters) low frequency mode fundamental oscillation frequency maximum crystal series resistance r s external load capacitors c x1 , c x2 lpc1xxx xtal1 c i 100 pf c g 002aae835 002aag031 lpc18xx xtal1 xtal2 c x2 c x1 xtal = c l c p r s l
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 128 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 13.3 xtal and rtcx printed circui t board (pcb) layout guidelines connect the crystal on the pcb as close as possi ble to the oscillator input and output pins of the chip. take care that the load capacitors c x1 , c x2 , and c x3 in case of third overtone crystal usage have a common ground plane. al so connect the external components to the ground plain. to keep the noise coupled in via the pcb as small as possible, make loops and parasitics as small as possible. choose smaller values of c x1 and c x2 if parasitics increase in the pcb layout. 13.4 standard i/o pi n configuration figure 39 shows the possible pin modes for standard i/o pins with analog input function: ? digital output driver: open-drain mode enabled/disabled ? digital input: pull-up enabled/disabled ? digital input: pull-down enabled/disabled ? digital input: repeater mode enabled/disabled ? analog input the default configuration for standard i/o pi ns is input with pull-up enabled. the weak mos devices provide a drive capability equiva lent to pull-up and pull-down resistors. fig 39. standard i/o pin configuration with analog input pin v dd(io) v dd(io) esd v ss esd strong pull-up strong pull-down v dd(io) weak pull-up weak pull-down open-drain enable output enable repeater mode enable pull-up enable pull-down enable data output data input analog input select analog input 002aag701 pin configured as digital output driver pin configured as digital input pin configured as analog input
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 129 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 13.5 reset pin configuration fig 40. reset pin configuration v ss reset 002aag702 v dd(io) v dd(io) v dd(io) r pu esd esd 20 ns rc glitch filter pin
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 130 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 14. package outline fig 41. package outline of the lbga256 package references outline version european projection issue date iec jedec mo-192 jeita - - - - - - sot740-2 sot740-2 05-06-16 05-08-04 unit a max mm 1.55 0.45 0.35 1.1 0.9 0.55 0.45 17.2 16.8 17.2 16.8 a 1 dimensions (mm are the original dimensions) lbga256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm x a 2 b d e e 1 e 1 15 e 2 15 v 0.25 w 0.1 y 0.12 y 1 0.35 1/2 e 1/2 e a a 2 a 1 detail x d e b a ball a1 index area y y 1 c c ab a b c d e f h k g j l m n p r t 2 4 6 8 10 12 14 16 1 3 5 7 9 11 13 15 ball a1 index area e e e 1 b e 2 c c ? v m ? w m 0 5 10 mm scale
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 131 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 42. package outline of the tfbga180 package references outline version european projection issue date iec jedec jeita sot570-3 sot570-3 08-07-09 10-04-15 unit mm max nom min 1.20 1.06 0.95 0.40 0.35 0.30 0.50 0.45 0.40 12.1 12.0 11.9 12.1 12.0 11.9 0.8 10.4 0.15 0.12 a dimensions (mm are the original dimensions) tfbga180: thin fine-pitch ball grid array package; 180 balls 0 5 10 mm scale a 1 a 2 0.80 0.71 0.65 b d e e e 1 10.4 e 2 v w 0.05 y y 1 0.1 ball a1 index area b a d e c y c y 1 x a b c d e f h k g l j m n p 2468101214 135791113 b e 2 e 1 e e 1/2 e 1/2 e ac b ? v m c ? w m ball a1 index area detail x a a 2 a 1
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 132 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 43. package outline of the lqfp208 package unit a 1 a 2 a 3 b p ce (1) eh e ll p z ywv references outline version european projection issue date iec jedec jeita mm 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 28.1 27.9 0.5 30.15 29.85 1.43 1.08 7 0 o o 0.080.12 1 0.08 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 sot459-1 136e30 ms-026 00-02-06 03-02-20 d (1) 28.1 27.9 h d 30.15 29.85 e z 1.43 1.08 d pin 1 index b p e e a 1 a l p detail x l (a ) 3 b 52 c d h b p e h a 2 v m b d z d a z e e v m a x 1 208 157 156 105 104 53 y w m w m 0 5 10 mm scale lqfp208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm sot459-1 a max. 1.6
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 133 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 44. package outline of the tfbga100 package references outline version european projection issue date iec jedec jeita sot926-1 - - - - - - - - - sot926-1 05-12-09 05-12-22 unit a max mm 1.2 0.4 0.3 0.8 0.65 0.5 0.4 9.1 8.9 9.1 8.9 a 1 dimensions (mm are the original dimensions) tfbga100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm a 2 b d e e 2 7.2 e 0.8 e 1 7.2 v 0.15 w 0.05 y 0.08 y 1 0.1 0 2.5 5 mm scale b e 2 e 1 e e 1/2 e 1/2 e ac b ? v m c ? w m ball a1 index area a b c d e f h k g j 246810 13579 ball a1 index area b a e d c y c y 1 x detail x a a 1 a 2
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 134 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 45. package outline for the lqfp144 package unit a 1 a 2 a 3 b p ce (1) eh e ll p z ywv references outline version european projection issue date iec jedec jeita mm 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 20.1 19.9 0.5 22.15 21.85 1.4 1.1 7 0 o o 0.080.2 0.08 1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 sot486-1 136e23 ms-026 00-03-14 03-02-20 d (1) (1)(1) 20.1 19.9 h d 22.15 21.85 e z 1.4 1.1 d 0 5 10 mm scale b p e e a 1 a l p detail x l (a ) 3 b c b p e h a 2 d h v m b d z d a z e e v m a x y w m w m a max. 1.6 lqfp144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm sot486-1 108 109 pin 1 index 73 72 37 1 144 36
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 135 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 46. package outline for the lqfp100 package unit a max. a 1 a 2 a 3 b p ce (1) eh e ll p z ywv references outline version european projection issue date iec jedec jeita mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 14.1 13.9 0.5 16.25 15.75 1.15 0.85 7 0 o o 0.08 0.08 0.2 1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 sot407-1 136e20 ms-026 00-02-01 03-02-20 d (1) (1)(1) 14.1 13.9 h d 16.25 15.75 e z 1.15 0.85 d b p e e a 1 a l p detail x l (a ) 3 b 25 c d h b p e h a 2 v m b d z d a z e e v m a x 1 100 76 75 51 50 26 y pin 1 index w m w m 0 5 10 mm scale lqfp100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm sot407-1
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 136 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 15. soldering fig 47. reflow soldering of the lbga256 package dimensions in mm pslspsrhxhy hx hy sot740-2 solder land plus solder paste occupied area footprint information for reflow soldering of lbga256 package solder land solder paste deposit solder resist p p sl sp sr generic footprint pattern refer to the package outline drawing for actual layout detail x see detail x sot740-2_fr 1.00 0.450 0.450 0.600 17.500 17.500
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 137 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 48. reflow soldering of the tfbga180 package dimensions in mm pslspsrhxhy hx hy sot570-3 solder land plus solder paste occupied area footprint information for reflow soldering of tfbga180 package solder land solder paste deposit solder resist p p sl sp sr generic footprint pattern refer to the package outline drawing for actual layout detail x see detail x sot570-3_fr 0.80 0.400 0.400 0.550 12.575 12.575
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 138 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 49. reflow soldering of the lqfp208 package sot459-1 dimensions in mm occupied area footprint information for reflow soldering of lqfp208 package ax bx gx gy hy hx ayby p1 p2 d2 (8) d1 (0.125) ax ay bx by d1 d2 gx gy hx hy p1 p2 c sot459-1_fr solder land c generic footprint pattern refer to the package outline drawing for actual layout 31.300 31.300 28.300 28.300 0.500 0.560 0.280 1.500 0.400 28.500 28.500 31.550 31.550
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 139 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 50. reflow soldering of the lqfp144 package sot486-1 dimensions in mm occupied area footprint information for reflow soldering of lqfp144 package ax bx gx gy hy hx ayby p1 p2 d2 (8) d1 (0.125) ax ay bx by d1 d2 gx gy hx hy p1 p2 c sot486-1_fr solder land c generic footprint pattern refer to the package outline drawing for actual layout 23.300 23.300 20.300 20.300 0.500 0.560 0.280 1.500 0.400 20.500 20.500 23.550 23.550
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 140 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 51. reflow soldering of the tfbga100 package dimensions in mm pslspsrhxhy hx hy sot926-1 solder land plus solder paste occupied area footprint information for reflow soldering of tfbga100 package solder land solder paste deposit solder resist p p sl sp sr generic footprint pattern refer to the package outline drawing for actual layout detail x see detail x sot926-1_fr 0.80 0.330 0.400 0.480 9.400 9.400
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 141 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller fig 52. reflow soldering of the lqfp100 package sot407-1 dimensions in mm occupied area footprint information for reflow soldering of lqfp100 package ax bx gx gy hy hx ayby p1 p2 d2 (8) d1 (0.125) ax ay bx by d1 d2 gx gy hx hy p1 p2 c sot407-1 solder land c generic footprint pattern refer to the package outline drawing for actual layout 17.300 17.300 14.300 14.300 0.500 0.560 0.280 1.500 0.400 14.500 14.500 17.550 17.550
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 142 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 16. appendix 16.1 static characteristics for lp c1850/30/20/10 rev?-? parts table 32. static characteristics t amb = ? 40 ? c to +85 ? c, unless otherwise specified. applies to LPC1850/30/20/10 rev ?-? only. symbol parameter conditions min typ [1] max unit supply pins v dd(io) input/output supply voltage 2.2 - 3.6 v v dd(reg)(3v3) regulator supply voltage (3.3 v) 2.2 - 3.6 v v dda(3v3) analog supply voltage (3.3 v) 2.0 - 3.6 v v bat battery supply voltage [2] 2.2 - 3.6 v v dd(3v3) supply voltage (3.3 v) on pin v dd ; lqfp100 package only 2.2 - 3.6 v i dd(reg)(3v3) regulator supply current (3.3 v) active mode; code while(1){} executed from ; all peripherals disabled cclk = 12 mhz; pll disabled [3] -1 0-m a cclk = 100 mhz; pll enabled [3] -4 0-m a cclk = 150 mhz; pll enabled [3] -5 5-m a sleep mode [3] -< t b d >-m a deep sleep mode [3] [4] -6 0- ? a power-down mode [3] [4] -3 0- ? a deep power-down mode; rtc [3] -4- ? a i bat battery supply current deep power-down mode; rtc running v dd(reg)(3v3) present [5] -< t b d >-n a v dd(reg)(3v3) not present [6] - - na i dd(io) i/o supply current deep sleep mode [7] -< t b d >-n a power-down mode [7] -< t b d >-n a deep power-down mode [7] -< t b d >-n a i dd(adc) adc supply current deep sleep mode [9] -< t b d >-n a power-down mode [9] -< t b d >-n a deep power-down mode [9] -< t b d >-n a
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 143 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller digital pins - reset pin v ih high-level input voltage [8] 0.8 ? (v ps ? 0.35) -5.5v v il low-level input voltage [8] ? 0.5 - 0.3 ? (v ps ? 0.1) v v hys hysteresis voltage [8] 0.05 ? (v ps ? 0.35) --v digital pins i il low-level input current v i = 0 v; on-chip pull-up resistor disabled -- ? a i ih high-level input current v i =v dd(io) ; on-chip pull-down resistor disabled -- ? a i oz off-state output current v o =0v; v o =v dd(io) ; on-chip pull-up/down resistors disabled -- ? a v i input voltage pin configured to provide a digital function [10] ? 0.5 - v v o output voltage output active - v dd(io) v v ih high-level input voltage 2.0 - 5.5 v v il low-level input voltage ? 0.5 - 0.8 v v hys hysteresis voltage 0.1v dd(io) --v v oh high-level output voltage i oh = ? 6 ma v dd(io) ? 0.4 --v v ol low-level output voltage i ol =6 ma - - 0.4 v i oh high-level output current v oh =v dd(io) ? 0.4 v 6 - - ma i ol low-level output current v ol =0.4v 6 - - ma i ohs high-level short-circuit output current drive high; connected to ground [11] --3 5m a i ols low-level short-circuit output current drive low; connected to v dd(io) [11] --3 0m a i pd pull-down current v i =v dd(io) ? a i pu pull-up current v i = 0 v ? a v dd(io) ? a r pu(weak) weak pull-up resistance v i =0v 455065k ? r pd(weak) weak pull-down resistance v i =v dd(io) 45 50 65 k ? open-drain i 2 c0-bus pins v ih high-level input voltage - - v v il low-level input voltage - - v table 32. static characteristics ?continued t amb = ? 40 ? c to +85 ? c, unless otherwise specified. applies to LPC1850/30/20/10 rev ?-? only. symbol parameter conditions min typ [1] max unit
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 144 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [1] typical ratings are not guaranteed. the va lues listed are at room temperature (25 ? c), nominal supply voltages. [2] the rtc typically fails when v bat drops below 2.2 v and v dd(reg)(3v3) is less than 2.2 v. [3] v dd(reg)(3v3) = 3.3 v; t amb =25 ? c for all power consumption measurements. ap plies to parts LPC1850/30/20/10 rev ?-? only. [4] conditions . [5] on pin vbat; i dd(reg)(3v3) = na; v dd(reg)(3v3) = 3.3 v; v bat < v dd(reg)(3v3) ; t amb =25 ? c. [6] on pin vbat; v bat = 3.3 v; t amb =25 ? c. [7] all internal pull-ups disabled. all pi ns configured as output and driven low. v dd(3v3) = 3.3 v; t amb =25 ? c. [8] v ps corresponds to the output of the power switch (see figure 11 ) which is determined by the greater of v bat and v dd(reg)(3v3) . [9] v dda(3v3) = 3.3 v; t amb =25 ? c. [10] v dd(io) supply voltage must be present. [11] allowed as long as the current limit does not exceed the maximum current allowed by the device. [12] to v ss . 16.2 power consumption remark: all power consumption data in this section apply to rev ?-? of the LPC1850/30/20/10 parts only. v hys hysteresis voltage - - v v ol low-level output voltage i ols = ma - - v i li input leakage current v i =v dd(io) [12] -< t b d >< t b d > ? a v i =5v - ? a oscillator pins v i(xtal1) input voltage on pin xtal1 ? 0.5 - 1.2 v v o(xtal2) output voltage on pin xtal2 ? 0.5 - 1.2 v usb pins v ic common-mode input voltage high-speed mode mv full-speed/low-speed mode - mv chirp mode - mv v i(dif) differential input voltage mv table 32. static characteristics ?continued t amb = ? 40 ? c to +85 ? c, unless otherwise specified. applies to LPC1850/30/20/10 rev ?-? only. symbol parameter conditions min typ [1] max unit
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 145 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller conditions: t amb = 25 ? c; normal mode entered executing code while(1){} from rom; internal pull-up resistors disabled; s ystem pll enabled; irc enabled, bo d disabled; all peripherals disabled; all peripheral clocks disabled. fig 53. typical supply current versus regulator supply voltage v dd(reg)(3v3) in active mode conditions: v dd(reg)(3v3) = 3.0 v, normal mode entered execut ing code while(1){} from rom; internal pull-up resistors disabled; system pll enabled; irc enabled, bod disabled; all peripherals disabled; all peripheral clocks disabled. fig 54. typical supply current ver sus temperature in active mode 002aag121 v dd(reg)(3v3) (v) 2.0 3.6 3.2 2.8 2.4 12 mhz 36 mhz 60 mhz 84 mhz 132 mhz 144 mhz 108 mhz 20 40 60 i dd(reg)(3v3) (ma) 0 temperature (c) -40 85 35 10 60 -15 002aag122 20 40 60 i dd(reg)(3v3) (ma) 0 12 mhz 36 mhz 84 mhz 144 mhz 108 mhz 60 mhz 132 mhz
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 146 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller conditions: v dd(reg)(3v3) = 3.0 v; internal pull-up resistors disabled; system pll enabled; irc enabled, bod disabled; all peripherals dis abled; all peripheral clocks disabled. fig 55. typical supply current versus temperature in sleep mode conditions: v bat = 0 v; v dd(io) = 0 v; pd0_sleep0_mode = 0x003f 00aa. fig 56. typical supply current versu s temperature in deep-sleep mode x (x) x x x xx 001aac984 x x x x x x (x) x 002aag123 temperature (c) -40 85 35 10 60 -15 v dd(reg)(3v3) = 3.6 v 3.4 v 3.0 v 2.6 v 2.2 v 100 300 200 400 i dd(reg)(3v3) (a) 0
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 147 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller conditions: v bat = 0 v; v dd(io) = 0 v; pd0_sleep0_mode = 0x003f fcba. fig 57. typical supply current versu s temperature in power-down mode conditions: v bat = 0 v; v dd(io) = 0 v; pd0_sleep0_mode = 0x003f ff7f. fig 58. typical supply current versus temperature in deep power-down mode temperature (c) -40 85 35 10 60 -15 002aag124 20 40 60 i dd(reg)(3v3) (a) 0 v dd(reg)(3v3) = 3.6 v 3.0 v 2.6 v 2.2 v 002aag125 temperature (c) -40 85 35 10 60 -15 v dd(reg)(3v3) = 3.6 v 2.2 v 4.0 8.0 2.0 6.0 10.0 i dd(reg)(3v3) (a) 0
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 148 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller [1] typical ratings are not guaranteed. the va lues listed are at room temperature (25 ? c), nominal supply voltages. 17. abbreviations table 33. power consumption fo r individual peripherals t amb = 25 ? c; v dd(reg)(3v3) = 3.3 v. peripheral conditions typical i dd(reg)(3v3) [1] irc adc dac i2c0 i2c1 i2s ssp0 ssp1 usart0 uart1 usart2 usart3 usb0 usb1 ethernet table 34. abbreviations acronym description adc analog-to-digital converter aes advanced encryption standard ahb advanced high-performance bus apb advanced peripheral bus api application programming interface bod brownout detection bga ball grid array can controller area network cmac cipher-based message authentication code csma/cd carrier sense multiple access with collision detection dac digital-to-analog converter dma direct memory access eop end of packet etb embedded trace buffer etm embedded trace macrocell gpio general purpose input/output irc internal rc irda infrared data association
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 149 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller jtag joint test action group lcd liquid crystal display lsb least significant bit lqfp low quad flat package mac media access control mcu microcontroller unit miim media independent interface management n.c. not connected otg on-the-go phy physical layer pll phase-locked loop pwm pulse width modulator rmii reduced media independent interface sdram synchronous dynami c random access memory spi serial peripheral interface ssi serial synchronous interface ssp synchronous serial port tcp/ip transmission control protocol/inter net protocol ttl transistor-transistor logic uart universal asynchronous receiver/transmitter ulpi utmi+ low pin interface usart universal synchronous asynchronous receiver/transmitter usb universal serial bus utmi usb 2.0 transceiver macrocell interface table 34. abbreviations ?continued acronym description
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 150 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 18. revision history table 35. revision history document id release date data sheet status change notice supersedes LPC1850_30_20_10 v.3 20111206 preliminary data sheet - LPC1850_30_20_10 v.2.2 modifications: ? v dda(3v3) minimum value changed to 2.2 v. ? v dd(io) and v dd(reg)(3v3) ranges added to static and dynamic characteristics tables. ? figure 29 and figure 30 updated. ? uart and usart maximum bit rates specified in section 11.7 . ? defined 5 v tolerant pins for v dd(io) present only in ta b l e 3 . ? added pin characteristics for usb1 pins in table 8 . ? added explanation of parameter r vsi ( figure 36 ). ? spifi driver removed from rom ( table 4 and table 5 ). ? multiple replaced in section 8 , section 9 , section 10 , section 11 . ? parameter c ia = 2 pf updated in ta b l e 2 5 . ? esd parameter added in table 6 . ? aes removed from memory maps. ? sd/mmc timing parameters added in ta b l e 2 3 . ? lcd timing parameters added in ta b l e 2 4 . ? emc sdram timing parameters updated in ta b l e 1 9 . ? ssp timing parameters added in table 16 . ? usart timing parameters added in table 15 . ? dac characterization data added in table 26 . ? dbgen pin reset state: pd removed ( ta b l e 3 ). ? tdo pin reset state: pu removed ( table 3 ). ? usb0_id pin: pin description updated ( ta b l e 3 ). ? usb0_vbus pin: pin description updated ( ta b l e 3 ). ? static characteristics for lpc1 850/30/20/10 rev ?-? moved to section 16 . ? dynamic characteristics added for the crystal oscillator ( section 11.3 ). ? pin function usb0_pwr_en changed to usb0_ppwr and description updated in table 3 . ? pin function usb1_vbus_en changed to usb1_ppwr and description updated in table 3 . ? updates related to the rev ?a? version of parts LPC1850/30/20/10: ? lqfp208 pin configuration added. ? sram connections in figure 8 updated and spifi added. ? emc static and dynamic sram characterization data added. ? number of gpios corrected in the lqfp208 package ( table 2 ). ? ta b l e 8 updated for parts LPC1850/30/20/10 rev ?a?. ? adc characteristics added ( ta b l e 2 5 . ? dac characteristics added ( ta b l e 2 6 ). ? reset state updated for pin pf_0 and pf_4 in ta b l e 3 . ? power consumption data added in table 8 . ? pin electrical characteristics added in ta b l e 8 , figure 20 and figure 21 . LPC1850_30_20_10 v.2.2 20110909 preliminary data sheet - LPC1850_30_20_10 v.2.1 modifications: ? pin p7_2, column lqfp144: replaced 113 by 115 in table 3.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 151 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller LPC1850_30_20_10 v.2.1 20110822 preliminary data sheet - LPC1850_30_20_10 v.2 modifications: ? lqfp100 pin package added in table 3. ? number of adc channels, qei, and motor control pwm added in table 2. ? pin p2_7 designated as isp entry pin. ? description of isp mode added (see section 7.8.1). ? updates related to the rev ?a? version of parts LPC1850/30/20/10: ? v i updated for i/o pins in table 6. ? boot pins corrected in table 3 and table 5 : pin p2_7 replaced by pin p2_9 as boot pin. pin level corrected for 4th boot pin (p2_9) in table 5. ? usart3 boot mode added in table 5. ? memory map updated: spifi data added at address 0x1400 000 in figure 9. ? boot rom size increased to 64 kb in section 2 and figure 9. ? updated pin p2_2, ctout_6 changed to ctin_6 in table 3. table 35. revision history ?continued document id release date data sheet status change notice supersedes
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 152 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller LPC1850_30_20_10 v.2 20110713 objective data sheet - LPC1850_30_20_10 v.1.2 modifications: ? power consumption data added (figure 12 to figure 17). ? pin pc_0 in table 3: function enet_rx_clk changed to n.c. and function sdio_clk changed to function enet_rx_clk. ? pin pc_8 in table 3: enet_rx_dv applies to rmii/mii interfaces. ? rename pins can1_rd and can1_td to can0_rd and can0_td in table 3. ? rename all i2s pins to i2s0 pins. ? condition for rtc operation updated in table 8, table note 2. ? figure 11 ?LPC1850/30/20/10 power domains? added. ? ?n.c.? changed to ?reserved? in table 3. ? section 11.6: characterization parameters and timing diagrams updated. ? prefix for all sd/mmc pins changed to ?sd? in table 3. ? prefix for all emc pins changed to ?emc? in table 3. ? section 11.4 added. ? section 11.8 added. ? section 11.9 added. ? lqfp144 pinout added in table 3. ? updates related to the rev ?a? version of parts LPC1850/30/20/10: ? pin p6_0 in table 3: function i2s_rx _sck moved to function level 5. ? pin pf_0 in table 3: function gp_clkin added. ? pin pa_1 in table 3: function u2_txd added. ? pin pa_2 in table 3: function u2_rxd added. ? pin pc_0 in table 3: reset state changed to i; pu. ? pin p1_16 in table 3: enet_crs_dv moved to function level 7. ? pad descriptions updated in table 3, table note 3 to table note 11. ? added function levels four to seven/eight for each pin in table 3. ? second c_can interface (c_can1) added. ? second i 2 s interface (i2s1) added. ? audio pll added (section 2 and section 7.18.6). ? all sdio functions moved to the functi on levels four to seven in table 3. ? high-speed gpio block moved to address 0x400f 4000 in figure 9 and figure 10. ? gpio interrupts and gpio group0 and group1 interrupt added in figure 1, figure 9, figure 10, section 2, and section 7.12. ? number of gpio ports increased to eight. ? total number of gpio pins increased to 164. ? gima block added (section 7.6). ? band gap output added to pin pf_7. ? package outline and soldering information added for all packages. table 35. revision history ?continued document id release date data sheet status change notice supersedes
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 153 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller LPC1850_30_20_10 v.1.2 20110217 objective data sheet - LPC1850_30_20_10 v.1 modifications: ? rmii removed from description of pin functions enet_rxd2, enet_rxd3, enet_er. enet_ref _clk removed from pin function enet_rx_clk (table 3). ? support for ieee 1588 time stamping/advanced time st amping (ieee 1588-2008 v2) added (section 2 and section 7.12.9). ? all pins with default state n.c. are inputs with pull-ups enabled on reset (table 3). ? spifi functions removed from pins pa_0, pa_3, pc_4, pc_5, pc_8, pe_2 in table 3. ? reset states added for multiple pins in table 3. ? editorial updates. ? section 13.2 ?crystal oscillator? added. ? pin p2_7 designated as boot pin 3 in table 3. ? usb0 and usb1 added to boot sources in table 4 and table 5. LPC1850_30_20_10 v.1 20110103 objective data sheet - - table 35. revision history ?continued document id release date data sheet status change notice supersedes
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 154 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 19. legal information 19.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 19.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 19.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 155 of 157 nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 19.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. i 2 c-bus ? logo is a trademark of nxp b.v. 20. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
LPC1850_30_20_10 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 3 ? 6 december 2011 156 of 157 continued >> nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller 21. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 ordering information . . . . . . . . . . . . . . . . . . . . . 4 4.1 ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 6 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 functional description . . . . . . . . . . . . . . . . . . 67 7.1 architectural overview . . . . . . . . . . . . . . . . . . 67 7.2 arm cortex-m3 processor . . . . . . . . . . . . . . . 67 7.3 ahb multilayer matrix . . . . . . . . . . . . . . . . . . . 68 7.4 nested vectored interrupt controller (nvic) . 68 7.4.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 7.4.2 interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 69 7.5 event router . . . . . . . . . . . . . . . . . . . . . . . . . . 69 7.6 global input multiplexer array (gima) . . . . . . 69 7.6.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 7.7 system tick timer (systick) . . . . . . . . . . . . . . 69 7.8 on-chip static ram. . . . . . . . . . . . . . . . . . . . . 69 7.8.1 isp (in-system programming) mode . . . . . . . 70 7.9 boot rom . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 7.10 memory mapping . . . . . . . . . . . . . . . . . . . . . . 72 7.11 security features. . . . . . . . . . . . . . . . . . . . . . . 74 7.11.1 aes security engine . . . . . . . . . . . . . . . . . . . . 74 7.11.1.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 7.11.2 one-time programmable (otp) memory . . . 74 7.12 general purpose i/o (gpio) . . . . . . . . . . . . . 74 7.12.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 7.13 ahb peripherals . . . . . . . . . . . . . . . . . . . . . . . 75 7.13.1 state configurable timer (sct) subsystem . . 75 7.13.1.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 7.13.2 general purpose dma (gpdma) . . . . . . . . . . 75 7.13.2.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 7.13.3 spi flash interface (spifi). . . . . . . . . . . . . . . 76 7.13.3.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 7.13.4 sd/mmc card interface . . . . . . . . . . . . . . . . . 77 7.13.5 external memory controll er (emc). . . . . . . . . 77 7.13.5.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 7.13.6 high-speed usb host/device/otg interface (usb0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 7.13.6.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 7.13.7 high-speed usb host/device interface with ulpi (usb1) . . . . . . . . . . . . . . . . . . . . . . 78 7.13.7.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 7.13.8 lcd controller. . . . . . . . . . . . . . . . . . . . . . . . . 78 7.13.8.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 7.13.9 ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 7.13.9.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 7.14 digital serial peripherals. . . . . . . . . . . . . . . . . 80 7.14.1 uart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 7.14.1.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 7.14.2 usart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 7.14.2.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 7.14.3 ssp serial i/o controller. . . . . . . . . . . . . . . . . 81 7.14.3.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 7.14.4 i 2 c-bus interface . . . . . . . . . . . . . . . . . . . . . . 81 7.14.4.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 7.14.5 i 2 s interface . . . . . . . . . . . . . . . . . . . . . . . . . . 82 7.14.5.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 7.14.6 c_can. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 7.14.6.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 7.15 counter/timers and motor control . . . . . . . . . 83 7.15.1 general purpose 32-bit timers/external event counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 7.15.1.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 7.15.2 motor control pwm . . . . . . . . . . . . . . . . . . . . 84 7.15.3 quadrature encoder inte rface (qei) . . . . . . . 84 7.15.3.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 7.15.4 repetitive interrupt (ri) timer. . . . . . . . . . . . . 84 7.15.4.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 7.15.5 windowed watchdog ti mer (wwdt) . . . . . . 85 7.15.5.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 7.16 analog peripherals . . . . . . . . . . . . . . . . . . . . . 85 7.16.1 analog-to-digital converter . . . . . . . . . . . . . . 85 7.16.1.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 7.16.2 digital-to-analog converter (dac). . . . . . . . . 86 7.16.2.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 7.17 peripherals in the rtc power domain . . . . . . 86 7.17.1 rtc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 7.17.1.1 features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 7.17.2 alarm timer. . . . . . . . . . . . . . . . . . . . . . . . . . . 86 7.18 system control . . . . . . . . . . . . . . . . . . . . . . . . 86 7.18.1 configuration registers (creg) . . . . . . . . . . . 86 7.18.2 system control unit (scu) . . . . . . . . . . . . . . 87 7.18.3 clock generation unit (c gu) . . . . . . . . . . . . 87 7.18.4 internal rc oscillator (irc) . . . . . . . . . . . . . . 87 7.18.5 pll0usb (for usb0) . . . . . . . . . . . . . . . . . . . 87 7.18.6 pll0audio (for audio) . . . . . . . . . . . . . . . . . 87 7.18.7 system pll1 . . . . . . . . . . . . . . . . . . . . . . . . . 88 7.18.8 reset generation unit (rgu) . . . . . . . . . . . . 88 7.18.9 power control . . . . . . . . . . . . . . . . . . . . . . . . . 88 7.19 emulation and debugging . . . . . . . . . . . . . . . 89 8 limiting values . . . . . . . . . . . . . . . . . . . . . . . . 90
nxp semiconductors LPC1850/30/20/10 32-bit arm cortex-m3 microcontroller ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 6 december 2011 document identifier: LPC1850_30_20_10 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 9 thermal characteristics . . . . . . . . . . . . . . . . . 91 10 static characteristics. . . . . . . . . . . . . . . . . . . . 92 10.1 power consumption . . . . . . . . . . . . . . . . . . . . 97 10.2 electrical pin characteristics . . . . . . . . . . . . . 101 11 dynamic characteristics . . . . . . . . . . . . . . . . 103 11.1 wake-up times . . . . . . . . . . . . . . . . . . . . . . . 103 11.2 external clock . . . . . . . . . . . . . . . . . . . . . . . . 103 11.3 crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 104 11.4 irc and rtc oscillators . . . . . . . . . . . . . . . . 105 11.5 i 2 c-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 11.6 i 2 s-bus interface . . . . . . . . . . . . . . . . . . . . . . 107 11.7 usart interface. . . . . . . . . . . . . . . . . . . . . . 108 11.8 ssp interface . . . . . . . . . . . . . . . . . . . . . . . . 109 11.9 external memory interface . . . . . . . . . . . . . . 112 11.10 usb interface . . . . . . . . . . . . . . . . . . . . . . . 117 11.11 ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 11.12 sd/mmc . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 11.13 lcd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 12 adc/dac electrical characteristics . . . . . . . 121 13 application information. . . . . . . . . . . . . . . . . 124 13.1 lcd panel signal usage . . . . . . . . . . . . . . . . 124 13.2 crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 126 13.3 xtal and rtcx printed circuit board (pcb) layout guidelines . . . . . . . . . . . . . . . . 128 13.4 standard i/o pin configurat ion . . . . . . . . . . . 128 13.5 reset pin configuration . . . . . . . . . . . . . . . . . 129 14 package outline . . . . . . . . . . . . . . . . . . . . . . . 130 15 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 16 appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 16.1 static characteristics for LPC1850/30/20/10 rev?-? parts. . . . . . . . . . . 142 16.2 power consumption . . . . . . . . . . . . . . . . . . . 144 17 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 148 18 revision history . . . . . . . . . . . . . . . . . . . . . . . 150 19 legal information. . . . . . . . . . . . . . . . . . . . . . 154 19.1 data sheet status . . . . . . . . . . . . . . . . . . . . . 154 19.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 19.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 154 19.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . 155 20 contact information. . . . . . . . . . . . . . . . . . . . 155 21 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156

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