View PIR3D-06C-L415_3723582.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

everlight electronics co., ltd. http:// www.everlight.com rev 1 page: 1 of 11 device no dir-0000604 prepared date 10-30-2011 prepared by daniel yang technical data sheet 3 infrared piranha pir3d-06c/l415 features ? high reliability ? high total radiated power ? peak wavelength p=730nm ? low forward voltage ? pb free ? the product itself will remain within rohs complian t version. descriptions ? everlight?s infrared emitting diode(pir3d-06c/l415) is a high intensity diode , molded in a water clear plastic package. ? the device is spectrally matched with phototransist or , photodiode and infrared receiver module. applications ? infrared applied system device selection guide led part no. chip lens color material pir3d-06c/l415 algaas water clear
everlight electronics co., ltd. http:// www.everlight.com rev 1 page: 2 of 11 device no dir-0000604 prepared date 10-30-2011 prepared by daniel yang pir3d-06c/l415 package dimensions notes: 1.all dimensions are in millimeters 2.tolerances unless dimensions 0.25mm
everlight electronics co., ltd. http:// www.everlight.com rev 1 page: 3 of 11 device no dir-0000604 prepared date 10-30-2011 prepared by daniel yang pir3d-06c/l415 absolute maximum ratings (ta=25 ) parameter symbol rating unit continuous forward current i f 150 ma peak forward current *1 i fp 1.0 a reverse voltage v r 5 v operating temperature t opr -40 ~ +85 storage temperature t stg -40 ~ +100 soldering temperature*2 t sol 260 power dissipation at(or below) 25 free air temperature p d 450 mw notes: *1:i fp conditions--pulse width Q 100 s and duty Q 1%. *2:soldering time Q 5 seconds. electro-optical characteristics (ta=25 ) parameter symbol condition min. typ. max. unit total radiated power w i f =150ma 30 -- 200 mw peak wavelength p i f =150ma 715 730 745 nm spectral bandwidth ? i f =150ma -- 20 -- nm forward voltage v f i f =150ma --- 2.40 2.90 v reverse current i r v r =5v -- -- 10 a view angle 2 1/2 i f =150ma -- 125 -- deg note: 1. tolerance of total radiated power 11% 2. tolerance of peak wavelength 1nm 3. tolerance of forward voltage 0.1v
everlight electronics co., ltd. http:// www.everlight.com rev 1 page: 4 of 11 device no dir-0000604 prepared date 10-30-2011 prepared by daniel yang pir3d-06c/l415 bin range of total radiated power power bin code min. max. unit condition 1 30 50 mw i f =150ma 2 50 100 3 100 150 note: tolerance of radiometric power: 11% bin range of peak wavelength bin code min. max. unit condition a 715 725 nm i f =150ma b 725 735 c 735 745 d 735 745 note: tolerance of peak wavelength: 1nm bin range of forward voltage bin code min. max. unit condition 1 1.7 1.9 v i f =150ma 2 1.9 2.1 3 2.1 2.3 4 2.3 2.5 5 2.5 2.7 6 2.7 2.9 note: tolerance of forward voltage: 0.1v
everlight electronics co., ltd. http:// www.everlight.com rev 1 page: 5 of 11 device no dir-0000604 prepared date 10-30-2011 prepared by daniel yang 685 0 20 40 60 80 100 i f =150ma ta=25c 700 715 730 745 760 775 790 805 0 20 40 60 80 100 120 140 160 180 0 20 40 60 80 100 t amb - am bient tem perature (c) i f - forward current (ma) 0 15 30 45 60 75 90 105 120 135 150 1.6 1.8 2.0 2.2 2.4 2.6 0.0 0.3 0.6 0.9 1.2 1.5 0 15 30 45 60 75 90 105 120 135 150 pir3d-06c/l415 typical electro-optical characteristics curves fig.1 forward current vs. fig.2 spectral distributio n ambient temperature fig.3 relative total radiated power vs. fig. 4 forward current vs. forward current (ta=25 ) forward voltage forward current (ma) forward voltage (v) relative total radiated power forward current (ma)
everlight electronics co., ltd. http:// www.everlight.com rev 1 page: 6 of 11 device no dir-0000604 prepared date 10-30-2011 prepared by daniel yang 0 30 60 90 -90 -60 -30 0 0.0 0.2 0.4 0.6 0.8 1.0 r e la t iv e r a d ia n t i n t e n s it y view angle (degree) pir3d-06c/l415 typical electro-optical characteristics curves fig.6 relative radiant intensity vs. angular displacement
everlight electronics co., ltd. http:// www.everlight.com rev 1 page: 7 of 11 device no dir-0000604 prepared date 10-30-2011 prepared by daniel yang pir3d-06c/l415 moisture resistant packing materials tube tube label explanation ? part no: product number ? qty: packing quantity ? lot no: lot number ? cat: rank of (vf)(note*)( v) note: d /cie/color temperature note: tolerances unless mentioned 2.0mm. unit = mm standard box tube label explanation ? cpn: customer?s product number ? p/n: product number ? qty: packing quantity ? cat: rank of (note*) note: d /cie/color temperature ? luminous flux(intensity) ? hue/ref: reference ? lot no: lot number note: tolerances unless mentioned 3.0mm. unit = mm part no: qty: lot no: cat: label area rohs pb cpn : p n : xxxxxxxxxxxxx xxxxxxxxxxxxx qty : xxx lot no : xxxxxxxxxx reference : xxxxxxxx cat : xxx hue : xxx ref : xxx everlight
everlight electronics co., ltd. http:// www.everlight.com rev 1 page: 8 of 11 device no dir-0000604 prepared date 10-30-2011 prepared by daniel yang pir3d-06c/l415 packing quantity packing material length width height (mm) tube quantity (pcs) led quantity (pcs) tube 485 x 9.5 x12 1 60 standard box 510 x 100 x 45 30 1800 large box 510 x 150 x 90 105 6300 note: 1. normal packing specification is use standard box , unless already defined initially. 2. vacuum packing with anti-static bag after packin g in standard box. 3. specifications are subject to change without pri or notice.
everlight electronics co., ltd. http:// www.everlight.com rev 1 page: 9 of 11 device no dir-0000604 prepared date 10-30-2011 prepared by daniel yang pir3d-06c/l415 notes 1. lead forming during lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. lead forming should be done before soldering. avoid stressing the led package during leads formin g. the stress to the base may damage the led?s characteristics or it may break th e leds. cut the led leadframes at room temperature. cutting the leadframes at high temperatures may cause failure of the leds. when mounting the leds onto a pcb, the pcb holes mu st be aligned exactly with the lead position of the led. if the leds are mounted w ith stress at the leads, it causes deterioration of the epoxy resin and this will degr ade the leds. 2. storage the leds should be stored at 30c or less and 70%rh or less after being shipped from everlight and the storage life limits are 3 months. if the leds are stored for 3 months or more, they can be stored for a year in a sealed con tainer with a nitrogen atmosphere and moisture absorbent material. please avoid rapid transitions in ambient temperatu re, especially, in high humidity environments where condensation can occur. 3. soldering careful attention should be paid during soldering. solder the led no lower than 1.6mm from the base of stopper is recommended. avoiding applying any stress to the lead frame whil e the leds are at high temperature particularly when soldering. recommended soldering conditions: hand soldering dip soldering temp. at tip of iron 300 max. (30w max.) preheat temp. 100 max. (60 sec max.) soldering time 3 sec max. bath temp. 260 max. distance no lower than 1.6mm from the base of stopper bath time. 5 sec max. distance no lower than 1.6mm from the base of stopper
everlight electronics co., ltd. http:// www.everlight.com rev 1 page: 10 o f 11 device no dir-0000604 prepared date 10-30-2011 prepared by daniel yang pir3d-06c/l415 dip and hand soldering should not be done more than one time. after soldering the leds, the epoxy bulb should be protected from mechanical shock or vibration until the leds return to room temperature . a rapid-rate process is not recommended for cooling the leds down from the peak temperature. although the recommended soldering conditions are s pecified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the leds. wave soldering parameter must be set and maintain a ccording to recommended temperature and dwell time in the solder wave. 4. circuit protection below the zener reference voltage vz, all the curre nt flows through led and as the voltage rises to vz, the zener diode ?breakdown." i f the voltage tries to rise above vz current flows through the zener branch to keep the voltage at exactly vz. when the led is connected using serial circuit, if either piece of led is no light up but current can?t flow through causing others to light down. in new design, the led is parallel with zener diode. if either piece of led i s no light up but current can flow through causing others to light up.
everlight electronics co., ltd. http:// www.everlight.com rev 1 page: 11 o f 11 device no dir-0000604 prepared date 10-30-2011 prepared by daniel yang pir3d-06c/l415 5. cleaning when necessary, cleaning should occur only with iso propyl alcohol at room temperature for a duration of no more than one minute. dry at r oom temperature before use. do not clean the leds by the ultrasonic. when it is absolutely necessary, the influence of ultrasonic cleaning on the leds depends on factors such as ultrasonic power and the assembled condition. ultrasonic cleaning shall be p re-qualified to ensure this will not cause damage to the led 6. heat management heat management of leds must be taken into consider ation during the design stage of led application. the current should be de-rated app ropriately by referring to the de-rating curve found in each product specification . the temperature surrounding the led in the applicat ion should be controlled. please refer to the data sheet de-rating curve. 7. esd (electrostatic discharge) electrostatic discharge (esd) or surge current (eos ) can damage leds. an esd wrist strap, esd shoe strap or antistatic gl oves must be worn whenever handling leds. all devices, equipment and machinery must be proper ly grounded. use ion blower to neutralize the static charge which might have built up on surface of the leds plastic le ns as a result of friction between leds during stor age and handing. 8. other above specification may be changed without notice. everlight will reserve authority on material change for above specification. when using this product, please observe the absolut e maximum ratings and the instructions for using outlined in these specificat ion sheets. everlight assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructi ons included in these specification sheets. these specification sheets include materials protec ted under copyright of everlight corporation. please don?t reproduce or cause anyone to reproduce them without everlight?s consent.

▲Up To Search▲

Price & Availability of PIR3D-06C-L415

	To Download PIR3D-06C-L415 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .