design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or us e. should a safety concern arise regarding this product, please be sure to contact us immediately. chip resistor networks n features l high density placing for digital signal circuits bussed 8 or 15 resistors for pull up/down circuits exbd: 3.2 mm 1.6 mm 0.55 mm, 0.635 mm pitch exbe: 4.0 mm 2.1 mm 0.55 mm, 0.8 mm pitch exba: 6.4 mm 3.1 mm 0.55 mm, 1.27 mm pitch exbq: 3.8 mm 1.6 mm 0.45 mm, 0.5 mm pitch available direct placing on the bus line by means of half pitch spacing without through-holes on pwb (high density placing is shown below) l high speed mounting by conventional placing machine n explanation of part numbers chip resistor networks type: exbd:1206 exbe:1608 exba:2512 exbq:1506 e 1 x 2 b 3 e 4 1 5 0 6 c 7 1 8 0 9 3 10 j 11 12 product code thick film resistor network number of terminals 10 16 circuit configuration code c common terminal position the first two digits are significant figures of resistance value and the third one denotes the number of zeros following. resistance value resistance tolerance j suffix for special requirements dimension code of chip resistor network type: inches dimensions 4.0 mm 2.1 mm 6.4 mm 3.1 mm 3.8 mm 1.6 mm p p e center common circuit exbd, exbe diagonal common circuit (terminal 5 and terminal 10) exba10p d : 1206 e : 1608 a : 2512 q : 1506 3.2 mm 1.6 mm one side common circuit (terminal 16) exbq16p diagonal common circuit (terminal 1 and terminal 6) exba10e 5 % no through hole through holes pull up resistors 0.4 mm pitch 0.635 mm pitch exbe10c exba10p direct placing on the bus line ic ic v cc ic ic v cc ic ic v cc .com .com .com 4 .com u datasheet
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or us e. should a safety concern arise regarding this product, please be sure to contact us immediately. chip resistor networks protective coating thick film resistive element electrode (inner) electrode (between) electrode (outer) alumina substrate (1) rated continuous working voltage (rcwv) shall be determined from rcwv= power rating resistance value, or limiting element voltage (maximum rcwv) listed above, whichever less. (2) overload ( short-time overload) test voltage (sotv) shall be determined from sotv=2.5 rcwv ] or maximum overload voltage listed above whichever less. n construction (example : exbd) n dimensions in mm (not to scale) n circuit configuration n ratings power derating curve for resistors operated in ambient temperature above 70 ?c, power rating shall be derated in accordance with the right figure. 0 20 40 60 80 100 e60 e40 e20 0 20406080 100 120 140 160 180 e55 ?c 70 ?c 125 ?c rated load (%) ambient temperature (?c) ? i03 0.3 0.2 0.5 0.2 f 0.3 + 0.1 - 0.2 0.3 0.2 0.25 0.20 0.5 0.2 0.8 0.1 4.0 0.2 0.25 0.20 0.35 0.20 0.4 0.2 0.35 0.20 0.4 0.2 0.5 0.2 0.4 0.2 2.1 0.2 0.55 0.10 f 0.3 + 0.1 - 0.2 0.7 0.2 0.3 0.2 0.3 0.2 6.4 0.2 1.27 0.10 0.5 0.2 0.5 0.2 0.5 0.2 3.1 0.2 0.55 0.10 i03 exba10e i03 i03 exba10p 0.250.10 0.30.1 0.250.10 0.350.15 0.35 0.15 0.400.15 1.600.15 0.550.10 0.20.1 0.330.15 0.20.1 0.20.1 0.2 0.1 f 0.20.1 3.200.15 0.6350.10 0.400.15 exbd, exbe exba exba10p exba10e exbq 10 15 9 234 678 11 12 13 14 15 16 10987 2345 6 1 10 6 15 987 234 10 6 15 987 234 exbe exba exbd exbq 0.15 + 0.15 - 0.05 0.15 + 0.20 - 0.05 0.15 + 0.15 - 0.05 0.3 0.1 0.2 0.1 0.25 0.15 3.8 0.2 0.5 0.1 0.30 0.15 1.6 0.2 0.45 0.10 472 item specifications series exbd exbe exba exbq resistance range 47 w to 1 m w (e12 series) 100 w to 470 k w (e6 series) resistance tolerance 5 % number of terminals 10 terminals 16 terminals number of resistors 8 resistors 15 resistors power rating at 70 ?c 0.05 w/element 0.063 w/element 0.025 w/element limiting element voltage 25 v 50 v 25 v (maximum rated continuous working voltage) (1) maximum overload voltage (2) 50 v 100 v 50 v t.c.r. 200 10 -6 /?c( ppm/?c) category temperature range e55 ?c to +125 ?c (operating temperature range) mass (weight)[1000 pcs.] : 10 g mass (weight)[1000 pcs.] : 16 g mass (weight)[1000 pcs.] : 40 g mass (weight)[1000 pcs.] : 9 g alumina substrate protective coating electrode (inner) thick film resistive element .com .com .com .com 4 .com u datasheet
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or us e. should a safety concern arise regarding this product, please be sure to contact us immediately. chip resistor networks n packaging methods (taping) l standard quantity l taping reel l carrier tape (unit : mm) (unit : mm) type kind of taping pitch (p 1 ) quantity punched carrier embossed carrier exbd exbq 180.0 +0 60 min. 13.0 1.0 9.0 1.0 11.4 1.0 exbe exba 13.0 1.0 15.4 2.0 type a b w f e p 1 p 2 p 0 f d 0 t f d 1 exbd 2.00 0.20 3.60 0.20 0.84 0.10 _ exbq 1.90 0.20 4.10 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 +0.10 0.64 0.05 _ exbe 2.50 0.20 4.40 0.20 1.10 0.20 1.50 +0.10 exba 3.50 0.20 6.80 0.20 12.00 0.30 5.50 0.20 1.75 0.20 - 0 type f a f b f cw t - 3.0 f b w t f a f c t t a p 0 p 2 p 1 f d 0 b f w e f d 1 (only emboss) exbd punched carrier taping 5000 pcs./reel exbq exbe embossed carrier taping 4 mm 4000 pcs./reel exba - 0 .com .com .com .com 4 .com u datasheet
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or us e. should a safety concern arise regarding this product, please be sure to contact us immediately. chip resistor networks n recommended land pattern (mm) pitch 1.27 mm pitch 0.635 mm through-hole less ] at designing high dencity land pattern, examine further the reliability of isolation among the lines and adopt the chip resistor networks. 4.4 2.2 0.2 0.4 to 0.5 1.27 4.4 2.2 0.2 1.27 exba10p exba10e 1.27 0.635 1.27 0.635 0.4 to 0.5 pitch 0.8 mm pitch 0.4 mm through-hole less 0.8 0.4 to 0.5 3.3 to 3.4 5.0 to 5.4 0.35 to 0.4 1.4 to 1.5 3.1 to 3.5 2.1 to 2.5 4.3 to 4.7 1.27 0.4 to 0.6 3.4 1.4 5.2 3.3 0.5 0.8 0.4 0.35 to 0.4 0.1 to 0.15 0.635 0.9 to 1.1 2.0 to 2.6 0.3 to 0.4 0.2 to 0.3 2.6 to 2.8 3.6 to 4.2 pitch 0.635 mm exbe exba for popular pattern for high density pattern ] exbd for popular pattern for high density pattern ] exbq 0.50 0.9 to 1.1 2.0 to 2.6 0.20 to 0.25 pitch 0.5 mm .com .com .com .com 4 .com u datasheet
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or us e. should a safety concern arise regarding this product, please be sure to contact us immediately. chip resistor networks l flow soldering ask the flow soldering of exba series to us. we can not recommended the flow soldering to chip resistor networks: exbd/exbe/exbq, because we are afraid that solder bridge happens owing to narrow 0.635 mm/ 0.8 mm/0.5 mm pitch of exbd/exbe/exbq type. preheating peak heating temperature time l recommended soldering conditions for reflow reflow soldering shall be two times maximum. please contact us for additional information when you use in conditions other than those specified. please measure a temperature of terminations and study solderability every kind of solder and board, before actual use. temperature time preheating 140 ?c to 160 ?c 60 s to 120 s main heating above 200 ?c 30 s to 40 s peak 235 5 ?c max. 10 s temperature time preheating 150 ?c to 180 ?c 60 s to 120 s main heating above 230 ?c 30 s to 40 s peak max. 260 ?c max. 10 s for solder (example : sn/pb) for lead-free solder (example : sn/ag/cu) cautions for safety n recommended soldering conditions recommendations and precautions are described below. the following are precautions for individual products. please also refer to the precautions common to fixed resistors shown on page er3 of this catalog. 1. take measures against mechanical stress during and after mounting of chip resistors networks(hereafter called the resistors) so as not to damage their electrodes and protective coatings. be careful not to misplace the resistors on the land patterns. otherwise, solder bridges may be caused. 2. if a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. never exceed the rated power. otherwise, the performance and/or reliability of the resistors may be impaired. 3. do not use halogen-based or other high-activity flux. otherwise, the residue may impair the resistors' performance and/or reliability. 4. when soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. when using a soldering iron with a high temperature tip, finish the soldering as quickly as possible (within three seconds at 350 ?c max.). 5. as the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. avoid applying an excessive amount of solder. 6. do not apply a shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 7. avoid excessive bend of printed circuit boards in order to protect the resistors from abnormal stress. .com .com .com .com 4 .com u datasheet
C er3 C caution for safety (common precautions for fixed resistors) when using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. the design and specifications in this catalog are subject to change without prior notice. do not use the products beyond the specifications described in this catalog. this catalog explains the quality and performance of the products as individual components. before use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ] systems equipped with a protection circuit and a protection device ] systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) precautions for use these products are designed and manufactured for general purpose and standard use in general electronic equip ment (e.g. av equipment, home electric appliances, office equipment, information and communication equipment) these products are not intended for use in the following special conditions. before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. in an environment where strong static electricity or electromagnetic waves exist 5. in an environment where these products cause dew condensation 6. sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials these products generate joule heat when energized. carefully position these products so that their heat will not affect the other components. carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products . note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the perfor mance or reliability of the products. carefully select a flux cleaning agent for use after soldering. an unsuitable agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. otherwise, the insulation performance may be deteriorated. (2) precautions for storage the performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 ?c to 35 ?c and a relative humidity of 45 % to 85 %. even within the above guarantee periods, do not store these products in the following conditions. otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package markings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. .com .com .com 4 .com u datasheet
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