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? !"!##$ % & ' () (' * ( " ( ' ) ) )') ? -20v/-1.5a , r ds(on) =130m ? (typ.) @ v gs =-4.5v r ds(on) =170m ? (typ.) @ v gs =-2.5v ? ? ? ? ? super high dense cell design ? ? ? ? ? reliable and rugged ? ? ? ? ? lead free available (rohs compliant) ? power management in notebook computer, portable equipment and battery powered systems p-channel mosfet g s d apm2323 handling code temp. range package code package code a : sot-23 operating junction temp. range c : -55 to 150c handling code tr : tape & reel lead free code l : lead free device blank : original device apm2323a : m23x xxxxx - date code lead free code top view of sot-23 d g s note: anpec lead-free products contain molding compounds/die attach materials and 100% matte in plate termina- tion finish; which are fully compliant with rohs and compatible with both snpb and lead-free soldiering operations. anpec lead-free products meet or exceed the lead-free requirements of ipc/jedec j std-020c for msl classifica- tion at lead-free peak reflow temperature. ? !"!##$ ! (t a = 25 c unless otherwise noted) ! (t a = 25 c unless otherwise noted) note: *surface mounted on 1in 2 pad area, t 10sec. symbol parameter rating unit v dss drain-source voltage -20 v gss gate-source voltage 10 v i d * continuous drain current -1.5 i dm * 300 s pulsed drain current v gs =-4.5v -6 a i s diode continuous forward current -1 a t j maximum junction temperature 150 t stg storage temperature range -55 to 150 c t a =25 c 0.83 p d * maximum power dissipation t a =100 c 0.3 w r ja * thermal resistance-junction to ambient 150 c/w apm2323a symbol parameter test condition min. typ. max. unit static characteristics bv dss drain-source breakdown voltage v gs =0v, i ds =-250 a -20 v v ds =-16v, v gs =0v -1 i dss zero gate voltage drain current t j =85 c -30 a v gs(th) gate threshold voltage v ds =v gs , i ds =-250 a -0.45 -0.7 -1 v i gss gate leakage current v gs =10v, v ds =0v 100 na v gs =-4.5v, i ds =-1.5a 130 170 r ds(on) a drain-source on-state resistance v gs =-2.5v, i ds =-1a 170 220 m ? v sd a diode forward voltage i sd =-1a, v gs =0v -0.7 -1.3 v gate charge characteristics b q g total gate charge 4 6 q gs gate-source charge 0.6 q gd gate-drain charge v ds =-10v, v gs =-4.5v, i ds =-1.5a 0.7 nc ? !"!##$ + ! " #$ (t a = 25 c unless otherwise noted) apm2323a symbol parameter test condition min. typ. max. unit dynamic characteristics b r g gate resistance v gs =0v,v ds =0v,f=1mhz 12 ? c iss input capacitance 255 c oss output capacitance 70 c rss reverse transfer capacitance v gs =0v, v ds =-20v, frequency=1.0mhz 45 pf t d(on) turn-on delay time 6 10 t r turn-on rise time 8 12 t d(off) turn-off delay time 9.8 15 t f turn-off fall time v dd =-10v, r l =10 ? , i ds =1a, v gen =-4.5v, r g =6 ? 5 10 ns notes: a : pulse test ; pulse width 300 s, duty cycle 2%. b : guaranteed by design, not subject to production testing. ? !"!##$ , 1e-4 1e-3 0.01 0.1 1 10 30 0.01 0.1 1 2 mounted on 1in 2 pad r ja : 150 o c/w 0.01 0.02 0.05 0.1 0.2 single pulse duty = 0.5 0 20406080100120140160 0.0 0.2 0.4 0.6 0.8 1.0 t a =25 o c %& ! -i d - drain current (a) drain current t j - junction temperature ( c) safe operation area -v ds - drain - source voltage (v) thermal transient impedance square wave pulse duration (sec) power dissipation p tot - power (w) t j - junction temperature ( c) -i d - drain current (a) 0 20 40 60 80 100 120 140 160 0.0 0.4 0.8 1.2 1.6 2.0 t a =25 o c, v g =4.5v normalized transient thermal resistance 0.01 0.1 1 10 100 0.01 0.1 1 10 20 rds(on) limit 1s t a =25 o c 10ms 300 s 1ms 100ms dc ? !"!##$ $ r ds(on) - on - resistance ( ? ) drain-source on resistance -i d - drain current (a) t j - junction temperature ( c) gate threshold voltage normalized threshold voltage -v ds - drain - source voltage (v) -i d - drain current (a) output characteristics transfer characteristics -v gs - gate - source voltage (v) -i d - drain current (a) -50 -25 0 25 50 75 100 125 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 i ds = -250 a %& ! " #$ 0123456 0.00 0.05 0.10 0.15 0.20 0.25 0.30 v gs = -2.5v v gs = -4.5v 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 0 1 2 3 4 5 6 t j =125 o c t j =25 o c t j =-55 o c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 1 2 3 4 5 6 7 8 -2v v gs = -3,-4,-5,-6,-7,-8,-9,-10v ? !"!##$ - -v ds - drain - source voltage (v) drain-source on resistance normalized on resistance t j - junction temperature ( c) c - capacitance (pf) -v sd - source - drain voltage (v) source-drain diode forward -i s - source current (a) capacitance gate charge q g - gate charge (nc) -v gs - gate-source voltage (v) -50 -25 0 25 50 75 100 125 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 r on @t j =25 o c: 135m ? v gs = -4.5v i ds = -1.5a 0 4 8 12 16 20 0 100 200 300 400 500 frequency=1mhz crss coss ciss %& ! " #$ 012345 0 1 2 3 4 5 v ds =-10 v i ds =-1.5 a 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.1 1 6 t j =150 o c t j =25 o c ? !"!##$ . sot-23 d e h e a a1 l c b 3 2 1 millimeters inches dim min. max. min. max. a 1.00 1.30 0.039 0.051 a1 0.00 0.10 0.000 0.004 b 0.35 0.51 0.014 0.020 c 0.10 0.25 0.004 0.010 d 2.70 3.10 0.106 0.122 e 1.40 1.80 0.055 0.071 e 1.90/2.1 bsc. 0.075/0.083 bsc. h 2.40 3.00 0.094 0.118 l 0.37 0.015 ? !"!##$ / terminal material solder-plated copper (solder material : 90/10 or 63/37 snpb), 100%sn lead solderability meets eia specification rsi86-91, ansi/j-std-002 category 3. t 25 c to peak tp ramp-up t l ramp-down ts preheat tsmax tsmin t l t p 25 temperature time critical zone t l to t p ' (ir/convection or vpr reflow) ' !&( sn-pb eutectic assembly pb-free assembly profile feature large body small body large body small body average ramp-up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat temperature min (tsmin) temperature mix (tsmax) time (min to max)(ts) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds tsmax to t l - ramp-up rate 3 c/second max tsmax to t l temperature(t l ) time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(tp) 225 +0/-5 c 240 +0/-5 c 245 +0/-5 c 250 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds ramp-down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package. measured on the body surface. ? !"!##$ 0 % ) a j b t2 t1 c t ao e w po p ko bo d1 d f p1 test item method description solderability mil-std-883d-2003 245 c,5 sec holt mil-std 883d-1005.7 1000 hrs bias @ 125 c pct jesd-22-b, a102 168 hrs, 100% rh, 121 c tst mil-std 883d-1011.9 -65 c ~ 150 c, 200 cycles &% application a b c j t1 t2 w p e 178 1 60 1.0 12.0 2.5 0.15 9.0 0.5 1.4 8.0+ 0.3 - 0.3 4.0 1.75 f d d1 po p1 ao bo ko t sot- 23 3.5 0.05 1.5 +0.1 0.1min 4.0 2.0 0.05 3.1 3.0 1.3 0.2 0.03 (mm) ? !"!##$ %# application carrier width cover tape width devices per reel sot-23 8 5.3 3000 (* anpec electronics corp. head office : 5f, no. 2 li-hsin road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 taipei branch : 7f, no. 137, lane 235, pac chiao rd., hsin tien city, taipei hsien, taiwan, r. o. c. tel : 886-2-89191368 fax : 886-2-89191369 *% |
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