109 ?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: august 8, 2011 sp3011 series sp3011 low capacitance esd protection - sp3011 series description applications the sp3011 integrates six channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for usb 3.0 ports that may experience destructive electrostatic discharges (esd). this high density array can safely absorb repetitive esd strikes at the maximum level specifed in the iec61000-4-2 international standard (level 4, 8kv contact discharge) without performance degradation. its extremely low loading capacitance makes it ideal for protecting any high-speed signal pins. features ? esd, iec61000-4-2, 8kv contact, 15kv air ? eft, iec61000-4-4, 40a (5/50ns) ? lightning, iec61000-4-5, 3a (8/20s) ? low capacitance of 0.4pf (typ) per i/o ? low leakage current of 0.1a (typ) at 5v ? small form factor udfn package saves board space ? notebooks ? external storage ? digital camcorder ? mp3/pmp player ? desktops ? ultramobile pc ? smartphone ? set top box (dvr/pvr) pinout 8 7 14 1 functional block diagram gn d (p in 10) pin 11 pin 8 pin 9 pin 12 pin 13 pin 14 *pins 1, 2, 3, 4, 5, 6, 7 are not internally connected but should be connected to the opposite pin with the pcb trace. life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application example si gn al gn d usb co nt ro ll er usb po rt ou ts id e world v bu s ss tx + ss tx - ssrx + ssrx - gnd d+ d- sp 3011-0 6utg ic sp3011 series 0.40pf rail clamp array for usb 3.0
?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 110 tvs diode arrays (spa ? family of products) revision: august 8, 2011 sp3011 series low capacitance esd protection - sp3011 series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 3.0 a t op operating temperature -40 to 85 c t stor storage temperature -60 to 150 c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 6.0 v reverse leakage current i leak v r =5v, any i/o to gnd 0.1 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 11. 0 v i pp =2a, t p =8/20s, fwd 12.5 v dynamic resistance r dyn (v c2 -v c1 ) / (i pp2 -i pp1 ) 1. 5 esd withstand voltage 1 v esd iec61000-4-2 (contact) 8 kv iec61000-4-2 (air) 15 kv diode capacitance 1 c i/o-gnd reverse bias=0v 0.4 pf note: 1 parameter is guaranteed by design and/or device characterization. 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0. 05 .0 10. 0 15. 02 0. 02 5. 03 0. 0 ti me ( s ) pe rc en t of i pp insertion loss (s21) i/o to gnd capacitance vs. bias voltage clamping voltage vs. i pp 0.0 0.1 0.2 0.3 0.4 0.5 0.0 1. 0 2.0 3.0 4.0 5.0 bias v oltag e (v) capacitance (pf) 0. 0 2. 0 4. 0 6. 0 8. 0 10. 0 12. 0 14. 0 16. 0 1. 01 .5 2. 02 .5 3. 0 p eak pul se cu rren t - i pp (a) cl am p vo lt age (v c ) -3 0 -2 5 -2 0 -1 5 -1 0 -5 0 10 100 1000 10000 fr equency (mhz ) at te nuat i on (d b) pulse waveform
111 ?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: august 8, 2011 sp3011 series sp3011 low capacitance esd protection - sp3011 series ti me te mperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zo n e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters product characteristics lead plating pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. all specifcations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte fnish vdi 11-13. part numbering system part marking system sp 3011 06 u t g series package udfn-14 (3.5x1.35mm) t= tape & reel g= green number of channels -06 = 6 channels ? silicon protection array (spa tm ) family of tvs diode arrays r h 6 product series r = sp3011 assembly site number o f channels part number package marking min. order qty. SP3011-06UTG udfn-14 rh6 3000 ordering information
?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 112 tvs diode arrays (spa ? family of products) revision: august 8, 2011 sp3011 series low capacitance esd protection - sp3011 series embossed carrier tape & reel specifcation udfn-14 package dimensions udfn-14 (3.5x1.35x0.5mm) symbol millimeters a0 1.58 +/- 0.10 b0 3.73 +/- 0.10 d0 0.60 + 0.05 d1 ? 0.60 + 0.05 e 1.75 +/- 0.10 f 5.50 +/- 0.05 k0 0.68 +/- 0.10 p0 2.00 +/- 0.05 p1 4.00 +/- 0.10 p2 4.00 +/- 0.10 t 0.28 +/- 0.02 w 12.00 + 0.30 /- 0.10 t b0 k0 a0 p0 d0 e f p1 p2 d1 w udfn-14 (3.5x1.35x0.5mm) symbol millimeters inches min nom max min nom max a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.000 0.001 0.002 a2 0.203 ref 0.008 ref b 0.15 0.20 0.25 0.006 0.008 0.012 d 3.40 3.50 3.60 0.134 0.138 0.142 d2 - - - - - - e 1.25 1.35 1.45 0.050 0.054 0.058 e1 - - - - - - e 0.500 bsc 0.020 bsc l 0.25 0.30 0.35 0.010 0.012 0.014 d e b top view a bottom view side view pin 1 index area 1 2 3 4 a c b a1 a2 s eating plane pin 1 identi?cation chamfer 0.1 0x45o notes: 1. dimension and tolerancing comform to asme y14.5m-1994. 2. controlling dimensions: millimeter. converted inch dimensions are not necessarily exact. symbol milimeter inches s e b d e l s1 soldering pad layout recomended
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