r a i l t o r a i l o u t p u t c m o s s i n g l e o p e r a t i n g a m p l i f i e r c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 8 a p c 2 0 7 / 2 0 8 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . f e a t u r e s o r d e r i n g a n d m a r k i n g i n f o r m a t i o n t h e a p c 2 0 7 / 2 0 8 b r i n g s p e r f o r m a n c e a n d e n c o n o m y w i t h h i g h g a i n , c m o s o p e r a t i n g a m p l i f i e r , c o m b i n i n g r a i l t o r a i l o u t p u t r a n g e w i t h l a r g e o u t p u t c u r r e n t . i t p r o v i d e s a l o w i n p u t b i a s c u r r e n t 2 p a . t h e o u t p u t s w i n g o f t h e a m p l i f i e r , g u a r a n t e e d f o r l o a d s d o w n t o 1 k w a n d o u t p u t c u r r e n t t o a n 1 0 w l o a d f r o m a 5 v p o w e r s u p p l y . a p c 2 0 7 / 2 0 8 d e s i g n e d t o o p e r a t e a t 3 v i s e s p e c i a l l y w e l l - s u i t e d f o r l o w v o l t a g e a p p l i c a t i o n . t h e a p c 2 0 7 / 2 0 8 i s o f f e r e d i n t h e s p a c e s a v i n g s o t 2 3 - 5 p a c k a g e . a p p l i c a t i o n s a m p l i f i e r s f i l t e r s a n a l o g c i r c u i t g e r e r a l d e s c r i p t i o n o p e r a t i n g v o l t a g e s i n g l e s u p p l y , 3 v t o 6 v l o w i n p u t c u r r e n t , 2 p a r a i l t o r a i l o u t p u t s w i n g p u s h - p u l l o u t p u t d r i v i n g h i g h o u t p u t c u r r e n t d r i v e , 3 1 0 m a b a n d w i d t h : 7 m h z w i d e t e m p e r a t u r e r a n g e a v a i l a b l e i n t h e s o t - 2 3 - 5 p a c k a g e s i n g l e v e r s i o n o f a p c 3 0 8 lead free and green devices available (rohs compliant) n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j - s t d - 0 2 0 c f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . a n p e c d e f i n e s ? g r e e n ? t o m e a n l e a d - f r e e ( r o h s c o m p l i a n t ) a n d h a l o g e n f r e e ( b r o r c l d o e s n o t e x c e e d 9 0 0 p p m b y w e i g h t i n h o m o g e n e o u s m a t e r i a l a n d t o t a l o f b r a n d c l d o e s n o t e x c e e d 1 5 0 0 p p m b y w e i g h t ) . apc207/208 package code b : sot-23-5 temperature range i : - 40 to 85 o c handling code tr : tape & reel assembly material l : lead free device g : halogen and lead free device handling code temperature range package code apc207/8 b : 207/8 x x - date code assembly material
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 8 a p c 2 0 7 / 2 0 8 w w w . a n p e c . c o m . t w 2 t h e r m a l c h a r a c t e r i s t i c s a b s o l u t e m a x i m u m r a t i n g s ( n o t e 1 ) e l e c t r i c a l c h a r a c t e r i s t i c s v d d = 5 v , t a = 2 5 c ( u n l e s s o t h e r w i s e n o t e d ) symbol parameter typical value unit q ja thermal resistance from junction to ambient in free air sot - 23 - 5 357 o c /w symbol parameter rating unit v dd supply voltage 7 v t sc(o) output short - c ircuit d uration, at t a =25c, p tot =1w 20 s t a operating ambient temperature range - 40 to 85 c t j maximum junction temperature 150 c t stg storage temperature range - 65 to +150 c t s maximum lead soldering temperature, 10 seconds 260 c apc207/8 symbol parameter test condition s min. typ. max. unit t a =25c - 4 10 mv v os input offset voltage - 25c< t a <75c - 5 - mv i bias input bias current t a =25c - 2 - pa v icm input common mode voltage range t a =25c 0 - v dd - 0.8 v r in input r esistance - 5 - m w v o output voltage swing r l =2k w 0 - 5 v v oh output voltage high r l =10k w , - 25c< t a <75c - 5 - v v ol output voltage low r l =10k w , - 25c< t a <75c - 0 - v output current source v o =4.5v - - 310 - ma l out output current sink v o =0.5v - 370 - ma cmrr co mmon mode rejection ratio - - 80 - db psrr supply voltage rejection ratio v rr =100mv pp , f in =100h z ,r l =2k w - - 50 - db a v large signal voltage gain - 85 - db gbw gain bandwidth product - 7 - mhz sr slew rate - 5.6 - v/ m s - 25c c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 8 a p c 2 0 7 / 2 0 8 w w w . a n p e c . c o m . t w 3 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s s u p p l y c u r r e n t v s . s u p p l y v o l t a g e s u p p l y v o l t a g e ( v ) supply current (ma) s u p p l y c u r r e n t v s . t e m p e r a t u r e supply current (ma) t e m p e r a t u r e ( c ) i n p u t o f f s e t v o l t a g e v s . t e m p e r a t u r e v os (mv) t e m p e r a t u r e ( c ) s u p p l y v o l t a g e ( v ) i n p u t c o m m o n m o d e v o l t a g e v s . s u p p l y v o l t a g e v icm (v) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -25 0 25 50 75 v dd =5v 0 0.5 1 1.5 2 2.5 3 3.5 4 0 1 2 3 4 5 6 7 no load 0 1 2 3 4 5 6 7 -25 0 25 50 75 v dd =5v 0 1 2 3 4 5 6 0 1 2 3 4 5 6 7 o u t p u t s w i n g v s . t e m p e r a t u r e output swing (v) t e m p e r a t u r e ( c ) o u t p u t s w i n g v s . s u p p l y v o l t a g e s u p p l y v o l t a g e ( v ) output swing (v) 0 1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 7 r l =2k w 0 1 2 3 4 5 6 -25 0 25 50 75 v dd =5v, r l =2k w
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 8 a p c 2 0 7 / 2 0 8 w w w . a n p e c . c o m . t w 4 o u t p u t c u r r e n t v s . o u t p u t s w i n g o u t p u t s w i n g v s . l o a d r e s i s t a n c e output swing (ma) o u t p u t s w i n g ( v ) output swing (v) l o a d r e s i s t a n c e ( w ) t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) s i n k c u r r e n t v s . o u t p u t v o l t a g e o u t p u t v o l t a g e r e f e r r e d t o g r o u n d ( v ) sink current (ma) s o u r c e c u r r e n t v s . o u t p u t v o l t a g e source current (ma) o u t p u t v o l t a g e r e f e r r e d t o v d d ( v ) 0.1 1 10 100 1000 0 1 2 3 4 5 6 v dd =5v 0 1 2 3 4 5 6 10 100 1k 10k v dd =5v 0 100 200 300 400 500 0 0.2 0.4 0.6 0.8 1 v dd =5v 0 100 200 300 400 500 0 0.2 0.4 0.6 0.8 1 v dd =5v l a r g e s i g n a l v o l t a g e g a i n v s . f r e q u e n c y f r e q u e n c y ( h z ) a v (db) l a r g e s i g n a l f r e q u e n c y r e s p o n s e output swing (v) f r e q u e n c y ( h z ) +0 +100 +10 +20 +30 +40 +50 +60 +70 +80 +90 10 10m 100 1k 10k 100k 1m v dd =5v 0 1 2 3 4 5 6 10 100 1k 10k 100k 1m 10m v dd =5v, r l =2k w
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 8 a p c 2 0 7 / 2 0 8 w w w . a n p e c . c o m . t w 5 s u p p l y v o l t a g e ( v ) l a r g e s i g n a l v o l t a g e g a i n v s . s u p p l y v o l t a g e a v (db) c m r r v s . f r e q u e n c y f r e q u e n c y ( h z ) cmrr (db) p s r r v s . f r e q u e n c y f r e q u e n c y ( h z ) psrr (db) v o l t a g e f o l l o w e r p u l s e r e s p o n s e t i m e ( m s ) output voltage (v) input voltage (v) t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) 50 55 60 65 70 75 80 85 90 95 100 1 2 3 4 5 -100 +0 -90 -80 -70 -60 -50 -40 -30 -20 -10 10 100k 100 1k 10k v dd =5v,r l =10k w t i m e ( m s ) v o l t a g e f o l l o w e r p u l s e r e s p o n s e output voltage (v) input voltage (v) -80 +0 -70 -60 -50 -40 -30 -20 -10 10 100k 100 1k 10k v dd =5v v rr =100mv pp /100hz 0 1 2 3 4 5 6 7 8 9 -4 -3 -2 -1 0 1 2 3 4 5 0 v dd =5v,r l =2k w 1 2 3 4 5 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 -0.5 0.2 -0.4 -0.3 -0.2 -0.1 0 0.1 1 2 0 3 4 v dd =5v,c l =270pf
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 8 a p c 2 0 7 / 2 0 8 w w w . a n p e c . c o m . t w 6 b l o c k d i a g r a m a p c 2 0 7 t o p v i e w s o t - 2 3 - 5 s o t - 2 3 - 5 a p c 2 0 8 t o p v i e w 1 2 3 4 5 out gnd in v dd in + - 1 2 3 4 5 in gnd in out v dd + -
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 8 a p c 2 0 7 / 2 0 8 w w w . a n p e c . c o m . t w 7 p a c k a g e i n f o r m a t i o n s o t - 2 3 - 5 max. 0.057 0.051 0.024 0.006 0.009 0.020 0.012 l 0.30 0 e e1 e1 e d c b 0.08 0.30 0.60 0.012 0.95 bsc 1.90 bsc 0.22 0.50 0.037 bsc 0.075 bsc 0.003 min. millimeters s y m b o l a1 a2 a 0.00 0.90 sot-23-5 max. 1.45 0.15 1.30 min. 0.000 0.035 inches 8 0 8 0 b c e1 0 l view a 0 . 2 5 gauge plane seating plane a a 2 a 1 e d e e 1 see view a 1.40 2.60 1.80 3.00 2.70 3.10 0.122 0.071 0.118 0.102 0.055 0.106 note : 1. follow jedec to-178 aa. 2. dimension d and e1 do not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 8 a p c 2 0 7 / 2 0 8 w w w . a n p e c . c o m . t w 8 application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 8.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 8.0 ? 0.30 1.75 ? 0.10 3.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 sot - 23 - 5 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.0 min. 0.6+0.00 - 0.4 0 3.20 ? 0.20 3.10 ? 0.20 1.50 ? 0.20 (mm) d e v i c e s p e r u n i t c a r r i e r t a p e & r e e l d i m e n s i o n s package type unit quantity sot - 23 - 5 tape & reel 3000 a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 h t1 a d
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 8 a p c 2 0 7 / 2 0 8 w w w . a n p e c . c o m . t w 9 r e f l o w c o n d i t i o n ( i r / c o n v e c t i o n o r v p r r e f l o w ) test item method description solderability mil - std - 883d - 2003 245 c, 5 sec holt mil - std - 883d - 1005.7 1000 hrs bias @125 c pct jesd - 22 - b, a102 168 hrs, 100 % rh, 121 c tst mil - std - 883d - 1011.9 - 65 c~150 c, 200 cycles esd mil - std - 883d - 3015.7 vhbm > 2kv, vmm > 200v latch - up jesd 78 10ms, 1 tr > 100ma r e l i a b i l i t y t e s t p r o g r a m t 25 c to peak tp ramp-up t l ramp-down ts preheat tsmax tsmin t l t p 25 t e m p e r a t u r e time critical zone t l to t p t a p i n g d i r e c t i o n i n f o r m a t i o n s o t - 2 3 - 5 user direction of feed
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 8 a p c 2 0 7 / 2 0 8 w w w . a n p e c . c o m . t w 1 0 c l a s s i f i c a t i o n r e f l o w p r o f i l e s profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat - temperature min (tsmin) - temperature max (tsmax) - time (min to max) (ts) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (t l ) - time (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak /classification temperature (tp) see table 1 see table 2 time within 5 c of actual peak temperature (tp) 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/sec ond max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package. measured on the body surface. table 2. pb - free process ? package classification reflow temperatures package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 +0 c* 260 +0 c* 260 +0 c* 1.6 mm ? 2.5 mm 260 +0 c* 250 +0 c* 245 +0 c* 3 2.5 mm 250 +0 c* 245 +0 c* 245 +0 c* *tolerance: the device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means peak reflow temperature +0 c. for example 260 c+0 c) at the rated msl level. table 1. snpb eutectic process ? package peak reflow temperature s package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 240 +0/ - 5 c 225 +0/ - 5 c 3 2.5 mm 225 +0/ - 5 c 225 +0/ - 5 c c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8
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