ltcc directional couplers d a t a s he e t D3DP30F 6.23.2010 1 emct.com ? rflabs.com ? 772-286-9300 as 9100, iso 9001, iso 14001, ohsas 18001 certifie d features applications ? low profile surface mount package ? high power ? low insertion loss ? high isolation ? rohs compliant ? tape and reel available for high volume production ? 100% rf tested ? power amplifiers ? power monitors ? reflectometers ? signal distribution networks ? switch networks ? phase shifters general description the D3DP30F is a high performance directional coupl er in a surface mount package. this low profile cou pler handles up to 200 watts of cw power. the D3DP30F is designe d for those demanding applications where high power , low loss and excellent directivity are required. the D3DP30F is manufactured with materials that hav e thermal expansion characteristics compatible with industry standard board materials like ro3003, ro4350, fr4 a nd others. the couplers are available in a rohs com pliant finish and packaged in tape and reel. electrical specifications* specification notes: * measured on florida rf labs test fixture. specifi cations are subject to change without notice. frequency mhz coupling (db) directivity db (min) insertion loss db (max) vswr (max) power handling watts cw operating temperature c 2300-2700 30 1.5 18 0.2 1.2 200 -55 to +125
ltcc directional couplers d a t a s he e t D3DP30F 6.23.2010 2 emct.com ? rflabs.com ? 772-286-9300 as 9100, iso 9001, iso 14001, ohsas 18001 certifie d coupler pin configuration and mechanical outline ports p1 p2 p3 p4 p1 - out iso coup p2 out - coup iso p3 iso coup - out p4 coup iso out - 0.560 [14.22] 0.079 [2.00] 0.350 [8.89] 0.039 [1.00] 0.065 [1.65] p1 p2 p3 p4 p2 p1 p4 p3 commonly used attachment materials material composition thermal conductivity ( watts/cm/ c ) melting temperature ( c ) gold-tin solder 80% gold / 20% tin 0.58 280 lead-free solder 99.3% tin C 0.7% copper n/a 227 lead-free solder 96.5% tin / 3.5% silver 0.33 221 lead-free solder 96.5% tin / 3% silver / 0.5% coppe r n/a 217 - 220 sn63 solder 63% tin / 37% lead 0.49 183 conductive epoxy silver filled 0.01 to 0.29 n/a
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