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rev 1.1 12/8/00 characteristics subject to change without notice. 1 of 13 www.xicor.com recommended system management alternative: x4043 for a more integrated solution use xicor system management products block diagram start stop logic control logic slave address register +comparator h. v. generation timing & control word address counter x dec y dec d out ack eeprom 16 x 128 data register start cycle (8) v cc r/w pin (4) v ss (5) sda (6) scl (3) a 2 (2) a 1 (1) a 0 d out load inc ck 8 (7) wp 2k x24c02 256 x 8 bit serial eeprom features 2.7v to 5.5v power supply versions low power cmos active read current less than 1 ma active write current less than 1.5 ma internally organized 256 x 8 2-wire serial interface bidirectional data transfer protocol schmitt trigger input noise suppression 400khz across v cc range sixteen byte page write mode minimizes total write time per byte self-timed write cycle typical write cycle time of 5 ms high reliability endurance: 1,000,000 cycles data retention: 100 years 8-pin soic description the x24c02 is a cmos 2048 bit serial eeprom, internally organized 256 x 8. the x24c02 features a serial interface and software protocol allowing opera- tion on a simple two wire bus. the x24c02 is fabricated with xicors advanced cmos textured poly floating gate technology. the x24c02 utilizes xicors proprietary directwrite cell, providing a minimum endurance of 1,000,000 cycles and a minimum data retention of 100 years.
x24c02 characteristics subject to change without notice. 2 of 13 rev 1.1 12/8/00 www.xicor.com for a more integrated solution use xicor system management products pin descriptions serial clock (scl) the scl input is used to clock all data into and out of the device. serial data (sda) sda is a bidirectional pin used to transfer data into and out of the device. it is an open drain output and may be wire-ored with any number of open drain or open col- lector outputs. an open drain output requires the use of a pull-up resistor. for selecting typical values, refer to the pull-up resistor selection graph at the end of this data sheet. address (a 0 , a 1 , a 2 ) the address inputs (a 0 , a 1 , a 2 ) are used to set the appropriate bits of the seven bit slave address. these inputs can be used static or actively driven. if used statically they must be tied to v ss or v cc as appropri- ate. if driven they must be driven to v ss or to v cc . pin names pin configuration device operation the x24c02 supports a bidirectional bus oriented pro- tocol. the protocol de?es any device that sends data onto the bus as a transmitter, and the receiving device as the receiver. the device controlling the transfer is a master and the device being controlled is the slave. the master will always initiate data transfers, and pro- vide the clock for both transmit and receive operations. therefore, the x24c02 will be considered a slave in all applications. clock and data conventions data states on the sda line can change only during scl low. sda state changes during scl high are reserved for indicating start and stop conditions. refer to figures 1 and 2. start condition all commands are preceded by the start condition, which is a high to low transition of sda when scl is high. the x24c02 continuously monitors the sda and scl lines for the start condition and will not respond to any command until this condition has been met. symbol description a 0 ? 2 address inputs sda serial data scl serial clock wc write control v ss ground v cc supply voltage soic a 0 a 1 a 2 v ss v cc wc scl sda x24c02 1 2 3 4 8 7 6 5
x24c02 characteristics subject to change without notice. 3 of 13 rev 1.1 12/8/00 www.xicor.com for a more integrated solution use xicor system management products stop condition all communications must be terminated by a stop con- dition, which is a low to high transition of sda when scl is high. the stop condition is also used by the x24c02 to place the device in the standby power mode after a read sequence. a stop condition can only be issued after the transmitting device has released the bus. figure 1. data validity figure 2. definition of start and stop scl sda data stable data change scl sda start bit stop bit acknowledge acknowledge is a software convention used to indicate successful data transfer. the transmitting device, either master or slave, will release the bus after transmitting eight bits. during the ninth clock cycle the receiver will pull the sda line low to acknowledge that it received the eight bits of data. refer to figure 3. the x24c02 will respond with an acknowledge after recognition of a start condition and its slave address. if both the device and a write operation have been selected, the x24c02 will respond with an acknowledge after the receipt of each subsequent eight bit word. in the read mode the x24c02 will transmit eight bits of data, release the sda line and monitor the line for an acknowledge. if an acknowledge is detected and no stop condition is generated by the master, the x24c02 will continue to transmit data. if an acknowledge is not detected, the x24c02 will terminate further data transmissions. the master must then issue a stop con- dition to return the x24c02 to the standby power mode and place the device into a known state.
x24c02 characteristics subject to change without notice. 4 of 13 rev 1.1 12/8/00 www.xicor.com for a more integrated solution use xicor system management products figure 3. acknowledge response from receiver scl from master data output from transmitter 1 89 from receiver start acknowledge data output device addressing following a start condition the master must output the address of the slave it is accessing. the most signi? cant four bits of the slave are the device type identi?r (see figure 4). for the x24c02 this is ?ed as 1010[b]. figure 4. slave addressing the next three signi?ant bits address a particular device. a system could have up to eight x24c02 devices on the bus (see figure 10). the eight addresses are de?ed by the state of the a 0 , a 1 and a 2 inputs. the last bit of the slave address de?es the operation to be performed. when set to one a read operation is selected, when set to zero a write operation is selected. following the start condition, the x24c02 monitors the sda bus comparing the slave address being transmit- ted with its slave address (device type and state of a 0 , a 1 and a 2 inputs). upon a correct compare the x24c02 outputs an acknowledge on the sda line. depending on the state of the r/w bit, the x24c02 will execute a read or write operation. write operations byte write for a write operation, the x24c02 requires a second address ?ld. this address ?ld is the word address, comprised of eight bits, providing access to any one of the 256 words of memory. upon receipt of the word address the x24c02 responds with an acknowledge, and awaits the next eight bits of data, again responding with an acknowledge. the master then terminates the transfer by generating a stop condition, at which time the x24c02 begins the internal write cycle to the non- volatile memory. while the internal write cycle is in progress the x24c02 inputs are disabled, and the device will not respond to any requests from the mas- ter. refer to figure 5 for the address, acknowledge and data transfer sequence. 1 a 1 a 0 r/w address 010a 2 device type identifier device
x24c02 characteristics subject to change without notice. 5 of 13 rev 1.1 12/8/00 www.xicor.com for a more integrated solution use xicor system management products figure 5. byte write bus activity: master sda bus bus activity: x24c02 s t a r t slave address s t o p a c k a c k a c k word address data p s page write the x24c02 is capable of a sixteen byte page write operation. it is initiated in the same manner as the byte write operation, but instead of terminating the write cycle after the ?st data word is transferred, the master can transmit up to ?teen more words. after the receipt of each word, the x24c02 will respond with an acknowledge. after the receipt of each word, the four low order address bits are internally incremented by one. the high order ?e bits of the address remain constant. if the master should transmit more than sixteen words prior to generating the stop condition, the address counter will ?oll over and the previously written data will be overwritten. as with the byte write operation, all inputs are disabled until completion of the internal write cycle. refer to figure 6 for the address, acknowledge and data transfer sequence. figure 6. page write s t a r t slave address s t o p a c k a c k a c k a c k a c k data n + 1 word address (n) data n s p data n + 15 note: in this example n = xxxx 000 (b); x = 1 or 0 bus activity: master sda line bus activity: x24c02 acknowledge polling the disabling of the inputs can be used to take advan- tage of the typical 5 ms write cycle time. once the stop condition is issued to indicate the end of the hosts write operation, the x24c02 initiates the internal write cycle. ack polling can be initiated immediately. this involves issuing the start condition, followed by the slave address for a write operation. if the x24c02 is still busy with the write operation no ack will be returned. if the x24c02 has completed the write operation an ack will be returned, and the host can then proceed with the next read or write operation. refer to flow 1.
x24c02 characteristics subject to change without notice. 6 of 13 rev 1.1 12/8/00 www.xicor.com for a more integrated solution use xicor system management products flow 1. ack polling sequence read operations read operations are initiated in the same manner as write operations with the exception that the r/w bit of the slave address is set to a one. there are three basic read operations: current address read, random read and sequential read. it should be noted that the ninth clock cycle of the read operation is not a ?on? care. to terminate a read operation, the master must either issue a stop condition during the ninth cycle, or hold sda high during the ninth clock cycle and then issue a stop condition. current address read internally the x24c02 contains an address counter that maintains the address of the last word accessed, incremented by one. therefore, if the last access (either a read or write) was to address n, the next read operation would access data from address n + 1. upon receipt of the slave address with the r/w bit set to one, the x24c02 issues an acknowledge and transmits the eight bit word. the read operation is terminated by the master by not responding with an acknowledge, and issuing a stop condition. refer to figure 7 for the sequence of address, acknowledge and data transfer. figure 7. current address read random read random read operations allow the master to access any memory location in a random manner. prior to issuing the slave address with the r/w bit set to one, the master must ?st perform a ?ummy write opera- tion. the master issues the start condition, and the slave address followed by the word address it is to read. after the word address acknowledge, the master immediately reissues the start condition and the slave address with the r/w bit set to one. this will be fol- lowed by an acknowledge from the x24c02 and then by the eight bit word. the read operation is terminated by the master by not responding with an acknowledge, and issuing a stop condition. refer to figure 8 for the address, acknowledge and data transfer sequence. write operation completed enter ack polling issue start issue slave address and r/w = 0 ack returned? next operation a write? issue byte address proceed issue stop no yes yes proceed issue stop no s t a r t slave address a c k s bus activity: master sda line bus activity: x24c02 data s t o p p
x24c02 characteristics subject to change without notice. 7 of 13 rev 1.1 12/8/00 www.xicor.com for a more integrated solution use xicor system management products figure 8. random read s t a r t slave address a c k a c k s s t a r t slave address word address n s a c k data n s t o p p bus activity: master sda line bus activity: x24c02 sequential read sequential read can be initiated as either a current address read or random access read. the ?st word is transmitted as with the other modes, however, the master now responds with an acknowledge, indicating it requires additional data. the x24c02 continues to output data for each acknowledge received. the read operation is terminated by the master; by not responding with an acknowledge and by issuing a stop condition. the data output is sequential, with the data from address n followed by the data from n + 1. the address counter for read operations increments all address bits, allowing the entire memory contents to be serially read during one operation. at the end of the address space (address 255), the counter ?olls over to address 0 and the x24c02 continues to output data for each acknowl- edge received. refer to figure 9 for the address, acknowledge and data transfer sequence. figure 9. sequential read figure 10. typical system configuration slave address s t o p a c k a c k a c k a c k data n data n+1 data n+2 data n+x p bus activity: master sda line bus activity: x24c02 master transmitter/ receiver slave receiver slave transmitter/ receiver master transmitter master transmitter/ receiver pull-up resistors sda scl v cc
x24c02 characteristics subject to change without notice. 8 of 13 rev 1.1 12/8/00 www.xicor.com for a more integrated solution use xicor system management products absolute maximum ratings temperature under bias ........................?5 to +135? storage temperature .............................?5 to +150? voltage on any pin with respect to v ss .................................. ?.0v to +7.0v d.c. output current .............................................. 5 ma lead temperature (soldering, 10 seconds) ........300? comment stresses above those listed under ?bsolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device (at these or any other conditions above those indicated in the operational sections of this speci?ation) is not implied. exposure to absolute maximum rating condi- tions for e xtended periods may affect device reliability. recommended operating conditions temperature min. max. commercial 0? 70? industrial ?0? +85? supply voltage limits x24c02-2.7 2.7v to 5.5v d.c. operating characteristics (over recommended operating conditions unless otherwise specified) capacitance t a = 25 c, f = 1.0mhz, v cc = 5v notes: (1) must perform a stop command prior to measurement. (2) v il min. and v ih max. are for reference only and are not tested. (3) this parameter is periodically sampled and not 100% tested. symbol parameter limits unit test conditions min. max. i cc1 v cc supply current (read) 1 ma scl = v cc x 0.1/vd x 0.9 levels @ 100 khz, sda = open, all other inputs = gnd or v cc ?0.3v i cc2 v cc supply current (write) 1.5 i sb 1 (1) v cc standby current 10 ? scl = sda = v cc ?0.3v, all other inputs = gnd or v cc , v cc = 5.5v i li input leakage current 10 ? v in = gnd to v cc i lo output leakage current 10 ? v out = gnd to v cc v ll (2) input low voltage ?.0 v cc x 0.3 v v ih (2) input high voltage v cc x 0.7 v cc + 0.5 v v ol output low voltage 0.4 v i ol = 3 ma, v cc 2.7v symbol parameter max. unit test conditions c i/o (3) input/output capacitance (sda) 8 pf v i/o = 0v c in (3) input capacitance (a 0 , a 1 , a 2 , scl) 6 pf v in = 0v
x24c02 characteristics subject to change without notice. 9 of 13 rev 1.1 12/8/00 www.xicor.com for a more integrated solution use xicor system management products a.c. conditions of test equivalent a.c. load circuit input pulse levels v cc x 0.1 to v cc x 0.9 input rise and fall times 10 ns input and output timing levels v cc x 0.5 5.0v 1533 ? 100pf output a.c. characteristics (over recommended operating conditions unless otherwise specified) read & write cycle limits power-up timing note: (4) t pur and t puw are the delays required from the time v cc is stable until the speci?d operation can be initiated. these parameters are periodically sampled and not 100% tested. symbol parameter min. max. unit f scl scl clock frequency 0 400 khz t i noise suppression time constant at scl, sda inputs 50 ns td scl low to sda data out valid 0.1 0.9 ? t buf time the bus must be free before a new transmission can start 1.2 ? t hd:sta start condition hold time 0.6 ? t low clock low period 1.2 ? t high clock high period 0.6 ? t su:sta start condition setup time (for a repeated start condition) 0.6 ? t hd:dat data in hold time 0 s t su:dat data in setup time 100 ns t r sda and scl rise time 300 ? t f sda and scl fall time 300 ns t su:sto stop condition setup time 0.6 ? t dh data out hold time 50 300 ns symbol parameter max. unit t pur (4) power-up to read operation 1 ms t puw (4) power-up to write operation 5 ms
x24c02 characteristics subject to change without notice. 10 of 13 rev 1.1 12/8/00 www.xicor.com for a more integrated solution use xicor system management products bus timing write cycle limits notes: (5) typical values are for t a = 25? and nominal supply voltage (5v). (6) t wr is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. it is the maximum time the device requires to automatically complete the internal write operation. the write cycle time is the time from a valid stop condition of a write sequence to the end of the internal erase/write cycle. during the write cycle, the x24c02 bus interface circuits are disabled, sda is allowed to remain high, and the device does not respond to its slave address. write cycle timing symbol parameter min. typ. (5) max. unit t wc (6) write cycle time 5 10 ms t su:sta t hd:sta t hd:dat t su:dat t low t su:sto t r t buf scl sda in sda out t dh t aa t f t high scl sda 8 th bit word n ack t wc stop condition start condition x24c02 address
x24c02 characteristics subject to change without notice. 11 of 13 rev 1.1 12/8/00 www.xicor.com for a more integrated solution use xicor system management products guidelines for calculating typical values of bus pull-up resistors symbol table 120 100 80 40 60 20 20 40 60 80 100 120 0 0 resistance (k ? ) bus capacitance (pf) min. resistance max. resistance r max = c bus t r r min = i ol min. v cc max. =1.8k ? waveform inputs outputs must be steady will be steady may change from low to high will change from low to high may change from high to low will change from high to low don? care: changes allowed changing: state not known n/a center line is high impedance
x24c02 characteristics subject to change without notice. 12 of 13 rev 1.1 12/8/00 www.xicor.com for a more integrated solution use xicor system management products packaging information 0.150 (3.80) 0.158 (4.00) 0.228 (5.80) 0.244 (6.20) 0.014 (0.35) 0.019 (0.49) pin 1 pin 1 index 0.010 (0.25) 0.020 (0.50) 0.050 (1.27) 0.188 (4.78) 0.197 (5.00) 0.004 (0.19) 0.010 (0.25) 0.053 (1.35) 0.069 (1.75) (4x) 7 0.016 (0.410) 0.037 (0.937) 0.0075 (0.19) 0.010 (0.25) 0?- 8 x 45 8-lead plastic small outline gull wing package type s note: all dimensions in inches (in parentheses in millimeters) 0.250" 0.050"typical 0.050" typical 0.030" typical 8 places footprint
for a more integrated solution use xicor system management products x24c02 characteristics subject to change without notice. 13 of 13 limited warranty devices sold by xicor, inc. are covered by the warranty and patent indemni?ation provisions appearing in its terms of sale onl y. xicor, inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the descr ibed devices from patent infringement. xicor, inc. makes no warranty of merchantability or ?ness for any purpose. xicor, inc. reserves the right to discontinue produ ction and change speci?ations and prices at any time and without notice. xicor, inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a xicor, inc. product. no o ther circuits, patents, or licenses are implied. trademark disclaimer: xicor and the xicor logo are registered trademarks of xicor, inc. autostore, direct write, block lock, serialflash, mps, and xd cp are also trademarks of xicor, inc. all others belong to their respective owners. u.s. patents xicor products are covered by one or more of the following u.s. patents: 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976; 4,980,859; 5,012,132; 5,003,197; 5,023,694; 5,084, 667; 5,153,880; 5,153,691; 5,161,137; 5,219,774; 5,270,927; 5,324,676; 5,434,396; 5,544,103; 5,587,573; 5,835,409; 5,977,585. foreign patents and addition al patents pending. life related policy in situations where semiconductor component failure may endanger life, system designers using this product should design the sy stem with appropriate error detection and correction, redundancy and back-up features to prevent such an occurrence. xicors products are not authorized for use in critical components in life support devices or systems. 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) sup port or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to res ult in a signi?ant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ?icor, inc. 2000 patents pending rev 1.1 12/8/00 www.xicor.com ordering information part mark convention device x24c02 x x -x temperature range blank = commercial = 0 c to +70 c i = industrial = ?0 c to +85 c package s8 = 8-lead soic v cc range 2.7 = 2.7v to 5.5v x24c02 8-lead soic f = 2.7 to 5.5v, 0 to +70? g = 2.7 to 5.5v, -40 to +85? xx blank = 8-lead soic
xicor product change notice 02/04/00 page 1 of 9 file://f:\export\projects\bitting2\imaging\bitting\mail_pdf\recode\pcn_000204.html 1/15/01 product change notice : pcn february 4, 2000 february 4, 2000 ref: pcn-00-01 dear xicor customer, at xicor, we continuously strive to improve the performance and efficiency of our operations, and the quality of our products. consistent with this effort, we are currently adding additional wafer fabrication capacity for various iic and spi serial products. this added wafer fabrication capacity will complement current operations and will expand xicor ? s capabilities to accommodate future growth. in addition, several of the iic and spi serial products are undergoing a die revision change. the new die revision is functionally and pin to pin compatable with the existing die revision. see the detailed product number list below for the implementation date and description of the change. samples for qualification will be available approximately 4 weeks before the implementation date. qualification data is available upon request. if you have any further questions, please contact your regional xicor sales office. sincerely, xicor marketing department xicor part number implement date description of change iic serial products x24164p 2/28/00 foundry change x24164p-3 2/28/00 foundry change x24164pi 2/28/00 foundry change x24164pi-3 2/28/00 foundry change x24164s 2/28/00 foundry change x24164s-2.7 2/28/00 foundry change x24164s-3 2/28/00 foundry change x24164si 2/28/00 foundry change x24164si-2.7 2/28/00 foundry change x24c04p 5/31/00 die rev / foundry change x24c04p-2.7 5/31/00 die rev / foundry change x24c04p-3 5/31/00 die rev / foundry change x24c04p-3.5 5/31/00 die rev / foundry change x24c04pi 5/31/00 die rev / foundry change x24c04pi-2.7 5/31/00 die rev / foundry change
xicor product change notice 02/04/00 page 2 of 9 file://f:\export\projects\bitting2\imaging\bitting\mail_pdf\recode\pcn_000204.html 1/15/01 x24c04pi-2.7 5/31/00 die rev / foundry change x24c04pi-3 5/31/00 die rev / foundry change x24c04pi-3.5 5/31/00 die rev / foundry change x24c04pm 5/31/00 die rev / foundry change x24c04pm-3 5/31/00 die rev / foundry change x24c04pm-3.5 5/31/00 die rev / foundry change x24c04s14 5/31/00 die rev / foundry change x24c04s14-3 5/31/00 die rev / foundry change x24c04s14-3.5 5/31/00 die rev / foundry change x24c04s14i 5/31/00 die rev / foundry change x24c04s14i-3 5/31/00 die rev / foundry change x24c04s14i-3.5 5/31/00 die rev / foundry change x24c04s14m 5/31/00 die rev / foundry change x24c04s14m-3 5/31/00 die rev / foundry change x24c04s14m-3.5 5/31/00 die rev / foundry change x24c04s8 5/31/00 die rev / foundry change x24c04s8-2.7 5/31/00 die rev / foundry change x24c04s8-3 5/31/00 die rev / foundry change x24c04s8-3.5 5/31/00 die rev / foundry change x24c04s8i 5/31/00 die rev / foundry change x24c04s8i-2.7 5/31/00 die rev / foundry change x24c04s8i-3 5/31/00 die rev / foundry change x24c04s8i-3.5 5/31/00 die rev / foundry change x24c04s8m 5/31/00 die rev / foundry change x24c04s8m-3 5/31/00 die rev / foundry change x24c04s8m-3.5 5/31/00 die rev / foundry change x24c08p 8/31/00 die rev / foundry change x24c08p-2.7 8/31/00 die rev / foundry change x24c08p-3 8/31/00 die rev / foundry change x24c08p-3.5 8/31/00 die rev / foundry change x24c08pi 8/31/00 die rev / foundry change x24c08pi-2.7 8/31/00 die rev / foundry change x24c08pi-3 8/31/00 die rev / foundry change x24c08pi-3.5 8/31/00 die rev / foundry change x24c08pm 8/31/00 die rev / foundry change x24c08pm-3 8/31/00 die rev / foundry change x24c08pm-3.5 8/31/00 die rev / foundry change x24c08s 8/31/00 die rev / foundry change x24c08s-3 8/31/00 die rev / foundry change x24c08s-3.5 8/31/00 die rev / foundry change x24c08s8 8/31/00 die rev / foundry change x24c08s8-2.7 8/31/00 die rev / foundry change x24c08s8-3 8/31/00 die rev / foundry change x24c08s8i 8/31/00 die rev / foundry change x24c08s8i-2.7 8/31/00 die rev / foundry change
xicor product change notice 02/04/00 page 3 of 9 file://f:\export\projects\bitting2\imaging\bitting\mail_pdf\recode\pcn_000204.html 1/15/01 x24c08s8i-3 8/31/00 die rev / foundry change x24c08s8m 8/31/00 die rev / foundry change x24c08si 8/31/00 die rev / foundry change x24c08si-3 8/31/00 die rev / foundry change x24c08si-3.5 8/31/00 die rev / foundry change x24c08sm 8/31/00 die rev / foundry change x24c08sm-3 8/31/00 die rev / foundry change x24c08sm-3.5 8/31/00 die rev / foundry change spi serial products x25020p 7/31/00 die rev / foundry change x25020p-2.7 7/31/00 die rev / foundry change x25020pi 7/31/00 die rev / foundry change x25020pi-2.7 7/31/00 die rev / foundry change x25020s 7/31/00 die rev / foundry change x25020s-2.7 7/31/00 die rev / foundry change x25020s-3 7/31/00 die rev / foundry change x25020si 7/31/00 die rev / foundry change x25020si-2.7 7/31/00 die rev / foundry change x25020si-3 7/31/00 die rev / foundry change x25040p 7/31/00 die rev / foundry change x25040p-2.7 7/31/00 die rev / foundry change x25040pi 7/31/00 die rev / foundry change x25040pi-2.7 7/31/00 die rev / foundry change x25040s 7/31/00 die rev / foundry change x25040s-2.7 7/31/00 die rev / foundry change x25040si 7/31/00 die rev / foundry change x25040si-2.7 7/31/00 die rev / foundry change x25040sm 7/31/00 die rev / foundry change x25160s 8/31/00 foundry change x25160s-2.7 8/31/00 foundry change x25160si 8/31/00 foundry change x25160si-2.7 8/31/00 foundry change x25320p 8/31/00 foundry change x25320s 8/31/00 foundry change x25320s-2.7 8/31/00 foundry change x25320si 8/31/00 foundry change x25320si-2.7 8/31/00 foundry change
xicor product change notice 02/04/00 page 4 of 9 file://f:\export\projects\bitting2\imaging\bitting\mail_pdf\recode\pcn_000204.html 1/15/01 ? february 4, 2000 dear xicor customer, at xicor, we continuously strive to improve the performance and efficiency of our operations, and the quality of our products. consistent with this effort, we are revising the tape and reel "t" codes to eliminate partial reel quantities. see the detailed tape and reel "t" codes definitions list and definitions matrix below . the implementation date for the new tape and reel "t" codes is march 1, 2000. all existing orders with shipment dates on or after march 1, 2000 will be converted to the new tape and reel "t" codes. all new orders on or after march 1, 2000 must use the new tape and reel "t" codes. if you have any further questions, please contact your regional xicor sales office. sincerely, xicor marketing department ? tape and reel "t" code definitions code package qty requirements reel size t1 soic (150 mil soic) "s" =2500 tape and reel 13" t1 soic (300 mil soic) "s" =1000 tape and reel 13" t1 eiaj (wide soic) "a" =2000 tape and reel 13" t1 tsop (thin soic) "t" =1000 tape and reel 13" t1 plcc "j" =750 tape and reel 13" t1 msop "m" =2500 tape and reel 13" t1 gull wing "r" =500 tape and reel 13" t1 tssop "v" =2500 tape and reel 13" t1 xbga "b" or "z" =10000 tape and reel 13" t2 soic (150 mil soic) "s" =1000 tape and reel 7" t2 soic (300 mil soic) "s" =500 tape and reel 13" t2 eiaj (wide soic) "a" =1000 tape and reel 7"
xicor product change notice 02/04/00 page 5 of 9 file://f:\export\projects\bitting2\imaging\bitting\mail_pdf\recode\pcn_000204.html 1/15/01 t2 tsop (thin soic) "t" =500 tape and reel 13" t2 plcc "j" =500 tape and reel 13" t2 msop "m" =1000 tape and reel 7" t2 gull wing "r" =250 tape and reel 13" t2 tssop "v" =1000 tape and reel 7" t2 xbga "b" or "z" =5000 tape and reel 13" t3 soic (150 mil soic) "s" =2500 tape and reel & dry pack 13" t3 soic (300 mil soic) "s" =1000 tape and reel & dry pack 13" t3 eiaj (wide soic) "a" =2000 tape and reel & dry pack 13" t3 tsop (thin soic) "t" =1000 tape and reel & dry pack 13" t3 plcc "j" =750 tape and reel & dry pack 13" t3 msop "m" =2500 tape and reel & dry pack 13" t3 gull wing "r" =500 tape and reel & dry pack 13" t3 tssop "v" =2500 tape and reel & dry pack 13" t3 xbga "b" or "z" =10000 tape and reel & dry pack 13" t4 soic (150 mil soic) "s" =1000 tape and reel & dry pack 7" t4 soic (300 mil soic) "s" =500 tape and reel & dry pack 13" t4 eiaj (wide soic) "a" =1000 tape and reel & dry pack 7" t4 tsop (thin soic) "t" =500 tape and reel & dry pack 13" t4 plcc "j" =500 tape and reel & dry pack 13" t4 msop "m" =1000 tape and reel & dry pack 7" t4 gull wing "r" =250 tape and reel & dry pack 13" t4 tssop "v" =1000 tape and reel & dry pack 7" t4 xbga "b" or "z" =5000 tape and reel & dry pack 13" t5 msop "m" =3500 tape and reel 13" t5 tssop "v" =3500 tape and reel 13" t5 xbga "b" or "z" =2500 tape and reel 13" t6 msop "m" =3500 tape and reel & dry pack 13" t6 tssop "v" =3500 tape and reel & dry pack 13" t6 xbga "b" or "z" =2500 tape and reel & dry pack 13"
xicor product change notice 02/04/00 page 6 of 9 file://f:\export\projects\bitting2\imaging\bitting\mail_pdf\recode\pcn_000204.html 1/15/01 ? tape and reel "t" code definition matrix *note: dry pack only ? *note: dry pack only t6 xbga "b" or "z" =2500 tape and reel & dry pack 13" t7 all packages all qtys. dry pack n/a 150 mil soic "s" (8l, 14l,16l) code 2500 1000 dry pack t1 x x x t2 x x x t3 x ? x t4 x x x t7* x x x tsop thin soic "t" code 1000 500 dry pack t1 x x x t2 x x x t3 x x x t4 x x x t7* x x x gull wing "r" code 500 250 dry pack t1 x x x t2 x x x t3 x x x t4 x x x t7* x x x
xicor product change notice 02/04/00 page 7 of 9 file://f:\export\projects\bitting2\imaging\bitting\mail_pdf\recode\pcn_000204.html 1/15/01 *note: dry pack only *note: dry pack only ? *note: dry pack only *note: dry pack only 300 mil soic "s" (20l, 24l, 28l) code 1000 500 dry pack t1 x x x t2 x x x t3 x x x t4 x x x t7* x x x xbga "b" or "z" code 10000 5000 2500 dry pack t1 x x x x t2 x x x x t3 x x x x t4 x x x x t5 x x x x t6 x x x x t7* x x x x eiaj "a" code 2000 1000 dry pack t1 x x x t2 x x x t3 x x x t4 x x x t7* x x x
xicor product change notice 02/04/00 page 8 of 9 file://f:\export\projects\bitting2\imaging\bitting\mail_pdf\recode\pcn_000204.html 1/15/01 ? *note: dry pack only *note: dry pack only ? plcc "j" code 750 500 dry pack t1 x x x t2 x x x t3 x x x t4 x x x t7* x x x tssop "v" code 2500 1000 3500 dry pack t1 x x x x t2 x x x x t3 x x x x t4 x x x x t5 x x x x t6 x x x x t7* x x x x msop "m" code 2500 1000 3500 dry pack t1 x x x x t2 x x x x t3 x x x x t4 x x x x t5 x x x x t6 x x x x
xicor product change notice 02/04/00 page 9 of 9 file://f:\export\projects\bitting2\imaging\bitting\mail_pdf\recode\pcn_000204.html 1/15/01 *note: dry pack only t7* x x x x our web site makes extensive use adobe acrobat (pdf) documents to provide you with the highest quality in electronic publishing. if you do not have the adobe acrobat reader , click this hyperlink for a free copy. home | products | corporate | support | reps & disti's | what's new cool jobs | contact info | datasheets | search | site map copyright ? 2000 xicor inc.

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