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1. product pro?le 1.1 general description 800 ma pnp low v cesat breakthrough in small signal (biss) resistor-equipped transistor (ret) in a small sot23 (to-236ab) surface-mounted device (smd) plastic package. npn complement: pbrn123yt. 1.2 features 1.3 applications 1.4 quick reference data [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated, mounting pad for collector 1 cm 2 . [2] device mounted on a ceramic pcb, al 2 o 3 , standard footprint. [3] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w rev. 01 17 december 2007 product data sheet n 800 ma repetitive peak output current n low collector-emitter saturation voltage v cesat n high current gain h fe n reduces component count n built-in bias resistors n reduces pick and place costs n simpli?es circuit design n 10 % resistor ratio tolerance n digital application in automotive and industrial segments n switching loads n medium current peripheral driver table 1. quick reference data symbol parameter conditions min typ max unit v ceo collector-emitter voltage open base - - - 40 v i o output current [1] [2] -- - 600 ma i orm repetitive peak output current t p 1 ms; d 0.33 [3] -- - 800 ma r1 bias resistor 1 (input) 1.54 2.2 2.86 k w r2/r1 bias resistor ratio 4.1 4.55 5
PBRP123YT_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 17 december 2007 2 of 12 nxp semiconductors PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w 2. pinning information 3. ordering information 4. marking [1] * = -: made in hong kong * = p: made in hong kong * = t: made in malaysia * = w: made in china 5. limiting values table 2. pinning pin description simpli?ed outline symbol 1 input (base) 2 gnd (emitter) 3 output (collector) 12 3 sym003 3 2 1 r1 r2 table 3. ordering information type number package name description version PBRP123YT - plastic surface-mounted package; 3 leads sot23 table 4. marking codes type number marking code [1] PBRP123YT *7q table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cbo collector-base voltage open emitter - - 40 v v ceo collector-emitter voltage open base - - 40 v v ebo emitter-base voltage open collector - - 5v v i input voltage positive - +5 v negative - - 22 v i o output current [1] [2] - - 600 ma i orm repetitive peak output current t p 1 ms; d 0.33 [3] - - 800 ma
PBRP123YT_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 17 december 2007 3 of 12 nxp semiconductors PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w [1] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for collector 1 cm 2 . [2] device mounted on a ceramic pcb, al 2 o 3 , standard footprint. [3] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. p tot total power dissipation t amb 25 c [3] - 250 mw [1] - 370 mw [2] - 570 mw t j junction temperature - 150 c t amb ambient temperature - 55 +150 c t stg storage temperature - 65 +150 c (1) ceramic pcb, al 2 o 3 standard footprint (2) fr4 pcb, mounting pad for collector 1 cm 2 (3) fr4 pcb, standard footprint fig 1. power derating curves for sot23 (to-236ab) table 5. limiting values continued in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit t amb ( c) - 75 175 125 25 75 - 25 006aaa998 200 400 600 p tot (mw) 0 (1) (2) (3)
PBRP123YT_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 17 december 2007 4 of 12 nxp semiconductors PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w 6. thermal characteristics [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided cooper, tin-plated, mounting pad for collector 1 cm 2 . [3] device mounted on a ceramic pcb, al 2 o 3 , standard footprint. table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] - - 500 k/w [2] - - 338 k/w [3] - - 219 k/w r th(j-sp) thermal resistance from junction to solder point - - 105 k/w fr4 pcb, standard footprint fig 2. transient thermal impedance from junction to ambient as a function of pulse duration for sot23 (to-236ab); typical values 006aab000 10 1 10 2 10 3 z th(j-a) (k/w) 10 - 1 10 - 5 10 10 - 2 10 - 4 10 2 10 - 1 t p (s) 10 - 3 10 3 1 0.75 0.50 0.33 0.20 0.01 0.10 0.05 0.02 0 d = 1
PBRP123YT_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 17 december 2007 5 of 12 nxp semiconductors PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w fr4 pcb, mounting pad for collector 1 cm 2 fig 3. transient thermal impedance from junction to ambient as a function of pulse duration for sot23 (to-236ab); typical values ceramic pcb, al 2 o 3 standard footprint fig 4. transient thermal impedance from junction to ambient as a function of pulse duration for sot23 (to-236ab); typical values 006aab001 10 1 10 2 10 3 z th(j-a) (k/w) 10 - 1 10 - 5 10 10 - 2 10 - 4 10 2 10 - 1 t p (s) 10 - 3 10 3 1 0.75 0.50 0.33 0.20 0.01 0.10 0.05 0.02 0 d = 1 006aab002 10 1 10 2 10 3 z th(j-a) (k/w) 10 - 1 10 - 5 10 10 - 2 10 - 4 10 2 10 - 1 t p (s) 10 - 3 10 3 1 0.75 0.50 0.33 0.20 0.01 0.10 0.05 0.02 0 d = 1
PBRP123YT_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 17 december 2007 6 of 12 nxp semiconductors PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w 7. characteristics [1] pulse test: t p 300 m s; d 0.02. table 7. characteristics t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit i cbo collector-base cut-off current v cb = - 30 v; i e =0a -- - 100 na i ceo collector-emitter cut-off current v ce = - 30 v; i b =0a -- - 0.5 m a i ebo emitter-base cut-off current v eb = - 5v; i c =0a -- - 0.65 ma h fe dc current gain v ce = - 5v; i c = - 50 ma 190 270 - v ce = - 5v; i c = - 300 ma [1] 230 320 - v ce = - 5v; i c = - 600 ma [1] 190 270 - v cesat collector-emitter saturation voltage i c = - 50 ma; i b = - 2.5 ma - - 35 - 45 mv i c = - 200 ma; i b = - 10 ma - - 70 - 100 mv i c = - 500 ma; i b = - 10 ma [1] - - 200 - 300 mv i c = - 600 ma; i b = - 6ma [1] - - 450 - 750 mv v i(off) off-state input voltage v ce = - 5v; i c = - 100 m a - 0.4 - 0.6 - 1v v i(on) on-state input voltage v ce = - 0.3 v; i c = - 20 ma - 0.5 - 0.8 - 1.4 v r1 bias resistor 1 (input) 1.54 2.2 2.86 k w r2/r1 bias resistor ratio 4.1 4.55 5 c c collector capacitance v cb = - 10 v; i e =i e =0a; f=1mhz -11-pf
PBRP123YT_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 17 december 2007 7 of 12 nxp semiconductors PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w v ce = - 5v (1) t amb = 100 c (2) t amb =25 c (3) t amb = - 40 c i c /i b =20 (1) t amb = 100 c (2) t amb =25 c (3) t amb = - 40 c fig 5. dc current gain as a function of collector current; typical values fig 6. collector-emitter saturation voltage as a function of collector current; typical values i c /i b =50 (1) t amb = 100 c (2) t amb =25 c (3) t amb = - 40 c i c /i b = 100 (1) t amb = 100 c (2) t amb =25 c (3) t amb = - 40 c fig 7. collector-emitter saturation voltage as a function of collector current; typical values fig 8. collector-emitter saturation voltage as a function of collector current; typical values 006aab091 10 2 10 10 3 h fe 1 i c (ma) - 10 - 1 - 10 3 - 10 2 - 1 - 10 (1) (2) (3) 006aab092 i c (ma) - 1 - 10 3 - 10 2 - 10 - 10 - 1 v cesat (v) - 10 - 2 (1) (2) (3) 006aab093 i c (ma) - 1 - 10 3 - 10 2 - 10 - 10 - 1 - 1 v cesat (v) - 10 - 2 (1) (2) (3) i c (ma) - 10 - 10 3 - 10 2 006aab094 - 10 - 1 - 1 v cesat (v) - 10 - 2 (1) (2) (3)
PBRP123YT_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 17 december 2007 8 of 12 nxp semiconductors PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w 8. package outline v ce = - 0.3 v (1) t amb = - 40 c (2) t amb =25 c (3) t amb = 100 c v ce = - 5v (1) t amb = - 40 c (2) t amb =25 c (3) t amb = 100 c fig 9. on-state input voltage as a function of collector current; typical values fig 10. off-state input voltage as a function of collector current; typical values 006aab095 i c (ma) - 10 - 1 - 10 3 - 10 2 - 1 - 10 - 1 - 10 v i(on) (v) - 10 - 1 (1) (2) (3) 006aab096 i c (ma) - 10 - 1 - 10 2 - 10 - 1 - 1 - 10 v i(off) (v) - 10 - 1 (1) (2) (3) fig 11. package outline sot23 (to-236ab) 04-11-04 dimensions in mm 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 12 3
PBRP123YT_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 17 december 2007 9 of 12 nxp semiconductors PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w 9. packing information [1] for further information and the availability of packing methods, see section 13 . 10. soldering table 8. packing methods the indicated -xxx are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 PBRP123YT sot23 4 mm pitch, 8 mm tape and reel -215 -235 fig 12. re?ow soldering footprint sot23 (to-236ab) fig 13. wave soldering footprint sot23 (to-236ab) solder resist occupied area solder lands solder paste dimensions in mm sot023 1.00 0.60 (3x) 1.30 1 2 3 2.50 3.00 0.85 2.70 2.90 0.50 (3x) 0.60 (3x) 3.30 0.85 sot023 4.00 4.60 2.80 4.50 1.20 3.40 3 21 1.20 (2x) preferred transport direction during soldering dimensions in mm solder resist occupied area solder lands
PBRP123YT_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 17 december 2007 10 of 12 nxp semiconductors PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w 11. revision history table 9. revision history document id release date data sheet status change notice supersedes PBRP123YT_1 20071217 product data sheet - -
PBRP123YT_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 17 december 2007 11 of 12 nxp semiconductors PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 12.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 12.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 13. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors PBRP123YT pnp 800 ma, 40 v biss ret; r1 = 2.2 k w , r2 = 10 k w ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 17 december 2007 document identifier: PBRP123YT_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 14. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 thermal characteristics. . . . . . . . . . . . . . . . . . . 4 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 packing information. . . . . . . . . . . . . . . . . . . . . . 9 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 11 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 12.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13 contact information. . . . . . . . . . . . . . . . . . . . . 11 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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