e 3 ds30497 rev. 4 - 2 1 of 3 DFLS1100 powerdi is a trademark of diodes incorporated. www.diodes.com diodes incorporated DFLS1100 1.0a high voltage schottky barrier rectifier powerdi 123 b a a c e l4 l l1 e h d l3 l2 l maximum ratings @ t a = 25 c unless otherwise specified mechanical data single phase, half wave, 60hz, resistive or inductive load. for capacitive load, derate current by 20%. characteristic symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 100 v rms reverse voltage v r(rms) 71 v average forward current i f(av) 1.0 a non-repetitive peak forward surge current 8.3ms single half sine-wave superimposed on rated load i fsm 40 a operating temperature range t j -55 to +175 c storage temperature range t stg -55 to +175 c new product electrical characteristics @ t a = 25 c unless otherwise specified characteristic symbol min typ max unit test condition reverse breakdown voltage (note 3) v (br)r 100 v i r = 1 a forward voltage v f 0.77 0.86 v i f = 1.0a i f = 2.0a leakage current (note 3) i r 1 a v r = 100v, t a = 25 c total capacitance c t 36 pf v r = 5vdc, f = 1mhz powerdi 123 dim min max typ a 3.50 3.90 3.70 b 2.60 3.00 2.80 c 1.63 1.93 1.78 d 0.93 1.00 0.98 e 0.85 1.25 1.00 h 0.15 0.25 0.20 l 0.45 0.85 0.65 l1 ? ? 1.35 l2 ? ? 1.10 l3 ? ? 0.20 l4 0.90 1.30 1.05 all dimensions in mm features notes: 1. part mounted on fr-4 board with 2 oz., minimum recommended copper pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. theoretical r js calculated from the top center of the die straight down to the pcb/cathode tab solder junction. 3. short duration pulse test to minimize self-heating effect. 4. rohs revision 13.2.2003. glass and high temperature solder exemptions applied, see eu directive annex notes 5 and 7 . thermal characteristics @ t a = 25 c unless otherwise specified characteristic symbol typ max unit thermal resistance junction to ambient (note 1) r ja 125 c/w thermal resistance junction to soldering (note 2) r js 7 c/w guard ring die construction for transient protection low power loss, high efficiency high surge capability lead free finish, rohs compliant (note 4) "green" molding compound (no br, sb) qualified to aec-q101 standards for high reliability case: powerdi 123 case material: molded plastic, "green" molding compound. ul flammability classification rating 94v-0 moisture sensitivity: level 1 per j-std-020c terminal connections: cathode band terminals: finish ? matte tin annealed over copper leadframe. solderable per mil-std-202, method 208 marking & type code information: see last page ordering information: see last page weight: 0.01 grams (approx.)
ds30497 rev. 4 - 2 2 of 3 DFLS1100 powerdi is a trademark of diodes incorporated. www.diodes.com new product 0.00001 0.0001 0.01 0.001 10 1 0.1 0.2 0.1 0 0.4 0.5 0.3 0.6 0.7 0.8 0.9 1.0 i , instantaneous forward current (a) f v , instantaneous forward voltage (v) fi g .1,t y pical forward characteristics f t = 125 c a t = 150 c a t=175c a t=25c a t=-55c a t=75c a 0 v , instantaneous reverse voltage (v) fig. 2 typical reverse characteristics r 0.0001 0.001 0.01 0.1 1 10 100 1,000 10 20 30 40 50 60 70 80 90 100 t = -55oc a t = 25oc a t = 75oc a t = 125oc a t = 150oc a t = 175oc a c , total capacitance (pf) t v , reverse voltage (v) r fi g .3 t y pical total capacitance 0 5101520 0 20 40 60 80 100 25 30 f=1mhz note 1 25 50 75 100 125 150 175 200 1 . 2 1.0 0.6 0.8 0.4 0.2 t , ambient temperature ( c) fi g . 4 dc forward current deratin g a i , dc forward current (a) f
ds30497 rev. 4 - 2 3 of 3 DFLS1100 powerdi is a trademark of diodes incorporated. www.diodes.com new product f09 ym f09 = product type marking code ym = date code marking y = year (ex: r = 2004) m = month (ex: 9 = september) year 2004 2005 2006 2007 2008 2009 code rs t u vw date code key month jan feb march apr may jun jul aug sep oct nov dec code 1234567 89 o nd marking information ordering information notes: 5. for packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. device packaging shipping DFLS1100-7 powerdi 123 3000/tape & reel (note 5) 0 0.2 0.4 0.6 2 1.8 1.6 1.4 1.2 1 0.8 0 0.5 3 1 1.5 2.5 2 3.5 p , average f o rward power dissipation (w) f(av) i , average forward current (a) fig. 5 forward power dissipation f(av) i pk i av = 1 (dc)
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