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z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 1 specification ssc - saw8kg0b rohs
z - power led x10490 technical data sheet ???? : ssc - qp - 7 - 07 - 18 (rev.00) 2 rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ? white colored smt package. ? pb - free reflow soldering ? suitable for all smt ? lead free and rohs compliant ? interior lighting ? general lighting ? indoor and out door displays ? architectural / decorative lighting features applications saw8kg0b ?? saw8kg0b description this surface - mount led comes in standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. the die is attached within the reflector cavity and the cavity is encapsulated by silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability.
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 3 contents 1. outline dimensions 2. characteristics of saw8kg0b led 3. characteristic diagrams 4. color & binning 5. bin code description 6. labeling 7. packing 8. recommended solder pad 9. soldering 10. precaution for use 11. handling of silicone resin leds
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 1. outline dimensions notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.1mm anode cathode 2 1 esd protection device cathode mark top view bottom view side view circuit a c n.c n.c slug : anode [note] package forward current is 20 ma
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 5 5 2. characteristics of saw8kg0b (ta=25 ) parameter symbol condition min. typ. max. unit forward voltage* v f i f =20ma 20.7 22 23 v reverse voltage v r i r =10ma 0.7 - - v luminous intensity* [1] (3700~7000k) i v i f =20ma - 17.3 (53.6) - cd (lm) luminous intensity* [1] (2600~3700k) i v i f =20ma 10.9 16.0 (49.6) - color correlated temperature cct i f =20ma 2,600 - 7,000 k viewing angle [2] 2 1/2 i f =20ma - 115 - deg. color rendering index* ra i f =20ma 80 82 90 - esd (hbm) 1.5k ? ;100 pf 5 - - kv thermal resistance [3] r th js i f =20ma - 27 - k/w [1] the luminous intensity iv was measured at the peak of the sp atial pattern which may not be aligned with the mechanical axis of the led package. [2] 2 1/2 is the off - axis where the luminous intensity is 1/2 of the peak intensity. [3] thermal resistance: rthjs (junction / solder) * tolerance : v f : 0.4v, i v : 7%, ra : 2, x,y : 0.01 [note] all measurements were made under the standardized environ ment of ssc. absolute maximum ratings electro - optical characteristics parameter symbol value unit power dissipation * [1] p d 0.58 w forward current i f 25 ma operating temperature t opr - 30~+85 storage temperature t stg - 40~+100 junction temperature t j 125 [1] care is to be taken that power dissipation does not exceed t he absolute maximum rating of the product. * led s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range.
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 6 6 color spectrum, ta=25 o c 3. characteristic diagrams 1. cool white 4700 k~7000 k 2. neutral white 3700 k~4700 k 3. warm white 2600 k~3700 k 300 400 500 600 700 800 0.0 0.5 1.0 2600~3700k 3700~4700k 4700~7000k relative emission intensity wavelength [nm]
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 7 7 current C voltage characteristics, ta=25 o c 0 5 10 15 20 25 30 35 40 20 40 60 80 100 120 140 relative luminous intensity forward current i f [ma] 0 5 10 15 20 25 0.000 0.005 0.010 0.015 0.020 forward current(a) forward voltage [v] forward current C relative luminous intensity characteristics, ta=25 o c
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 8 relative light output - junction temperature characteristics, if=20ma forward voltage shift - junction temperature characteristics, if=20ma 30 45 6 0 75 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 relative forward voltage ju n c tio n tem p era tu re tj ( o c ) 30 45 60 75 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 relative light output junction tem p era tu re tj ( o c )
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 0.4392 0.4394 0.4396 0.4398 0.4400 0.411 0.412 0.413 0.414 0.415 y x 9 forward current - chromaticity coordinate characteristics, ta=25 25ma 20ma 15ma 10ma 5ma radiation pattern, if=20ma -90 -60 -30 0 30 60 90 0.0 0.2 0.4 0.6 0.8 1.0 normalized p/metrix [lux] angle [degree]
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) junction temperature ( ) - chromaticity coordinate characteristics 0.430 0.435 0.440 0.445 0.450 0.400 0.405 0.410 0.415 0.420 25 50 75 100 125 y x
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 11 1. saw8kg0b 4. color & binning 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 cool white neutral white warm white planckian locus 7000k 2600k 2700k 2900k 3000k 3200k 3500k 3700k 4000k 4200k 4500k 4700k 5000k 5300k 5600k 6000k 6500k cie x cie y a5 a3 a1 a4 a2 a0 c0 c1 c2 c3 c4 c5 b0 b1 b2 b3 b4 b5 d0 d1 d2 d3 d4 d5 f0 f1 f2 f3 f4 f5 g0 g1 g2 g3 g4 g5 h0 h1 h2 h3 h4 h5 e0 e1 e2 e3 e4 e5
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) color rank * measurement uncertainty of the color coordinates : 0.01 6500~7000k a0 a2 a4 cie x cie y cie x cie y cie x cie y 0.3028 0.3304 0.3041 0.324 0.3055 0.3177 0.3041 0.324 0.3055 0.3177 0.3068 0.3113 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 6000~6500k a1 a3 a5 cie x cie y cie x cie y cie x cie y 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.321 0.3408 0.3216 0.3334 0.3221 0.3261 0.3205 0.3481 0.321 0.3408 0.3216 0.3334 5600~6000k b0 b2 b4 cie x cie y cie x cie y cie x cie y 0.3207 0.3462 0.3212 0.3389 0.3217 0.3316 0.3212 0.3389 0.3217 0.3316 0.3222 0.3243 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 5300~5600k b1 b3 b5 cie x cie y cie x cie y cie x cie y 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) color rank * measurement uncertainty of the color coordinates : 0.01 5000~5300k c0 c2 c4 cie x cie y cie x cie y cie x cie y 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 4700~5000k c1 c3 c5 cie x cie y cie x cie y cie x cie y 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3539 0.3669 0.3526 0.3578 0.3514 0.3487 0.3552 0.376 0.3539 0.3669 0.3526 0.3578 4500~4700k d0 d2 d4 cie x cie y cie x cie y cie x cie y 0.3548 0.3736 0.3536 0.3646 0.3523 0.3555 0.3536 0.3646 0.3523 0.3555 0.3511 0.3465 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 4200~4500k d1 d3 d5 cie x cie y cie x cie y cie x cie y 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.3736 0.3874 0.3714 0.3775 0.3692 0.3677
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) color rank * measurement uncertainty of the color coordinates : 0.01 4000~4200k e0 e2 e4 cie x cie y cie x cie y cie x cie y 0.3736 0.3874 0.3714 0.3775 0.3692 0.3677 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.3869 0.3958 0.3842 0.3855 0.3813 0.3751 3700~4000k e1 e3 e5 cie x cie y cie x cie y cie x cie y 0.3869 0.3958 0.3842 0.3855 0.3813 0.3751 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.397 0.3935 0.3934 0.3825 0.3898 0.3716 0.4006 0.4044 0.397 0.3935 0.3934 0.3825 3500~3700k f0 f2 f4 cie x cie y cie x cie y cie x cie y 0.3996 0.4015 0.396 0.3907 0.3925 0.3798 0.396 0.3907 0.3925 0.3798 0.3889 0.369 0.4104 0.3978 0.4062 0.3865 0.4017 0.3751 0.4146 0.4089 0.4104 0.3978 0.4062 0.3865 3200~3500k f1 f3 f5 cie x cie y cie x cie y cie x cie y 0.4146 0.4089 0.4104 0.3978 0.4062 0.3865 0.4104 0.3978 0.4062 0.3865 0.4017 0.3751 0.4248 0.4048 0.4198 0.3931 0.4147 0.3814 0.4299 0.4165 0.4248 0.4048 0.4198 0.3931
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) color rank * measurement uncertainty of the color coordinates : 0.01 3000~3200k g0 g2 g4 cie x cie y cie x cie y cie x cie y 0.4299 0.4165 0.4248 0.4048 0.4198 0.3931 0.4248 0.4048 0.4198 0.3931 0.4147 0.3814 0.4374 0.4093 0.4317 0.3973 0.4259 0.3853 0.443 0.4212 0.4374 0.4093 0.4317 0.3973 2900~3000k g1 g3 g5 cie x cie y cie x cie y cie x cie y 0.443 0.4212 0.4374 0.4093 0.4317 0.3973 0.4374 0.4093 0.4317 0.3973 0.4259 0.3853 0.4499 0.4138 0.4436 0.4015 0.4373 0.3893 0.4562 0.426 0.4499 0.4138 0.4436 0.4015 2700~2900k h0 h2 h4 cie x cie y cie x cie y cie x cie y 0.4562 0.426 0.4499 0.4138 0.4436 0.4015 0.4499 0.4138 0.4436 0.4015 0.4373 0.3893 0.462 0.4166 0.4551 0.4042 0.4483 0.3919 0.4687 0.4289 0.462 0.4166 0.4551 0.4042 2600~2700k h1 h3 h5 cie x cie y cie x cie y cie x cie y 0.4687 0.4289 0.462 0.4166 0.4551 0.4042 0.462 0.4166 0.4551 0.4042 0.4483 0.3919 0.474 0.4194 0.4666 0.4069 0.4593 0.3944 0.481 0.4319 0.474 0.4194 0.4666 0.4069
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 5. bin code description 1. luminous intensity bins - luminous intensity bin structure for cool white, neutral white, warm white bin code luminous intensity [ cd ] @ i f = 20ma * [note] flux (lm) t9 10.9~12.2 33.8~37.8 v2 12.2~13.5 37.8~41.9 w5 13.5~14.8 41.9~45.9 x8 14.8~16.1 45.9~49.9 y1 16.1~17.4 49.9~53.9 z4 17.4~19.0 53.9~58.9 example bin code : t9 g3b luminous intensity bin 2. color rank white product tested and binned by x,y coordinates and cc example bin code : t9 g3 b color bin [note] ssc sort the led package according to the luminous intens ity iv. (the lumen table is only for reference.) [note] color rank @ i f = 20ma 3. voltage bins bin code min. max. a 20.7 21.5 b 21.5 22.2 c 22.2 23.0 [note] forward voltage (v) @ i f = 20ma example bin code : t9g3 b voltage bin
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 6. labeling saw8kg0b 3,500
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 18 7. packing c a b 1 side 7inch 245 220 142 size (mm) outer box structure material : paper(sw3b(b)) type a b c 1 humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. rohs
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 19 reel packing structure 180 2 13 22 60 15.4 1.0 13 0.3 ( tolerance: 0.2, unit: mm ) notes : [1] quantity : 3,500pcs/reel [2] cumulative tolerance : cumulative tolerance/10 pitches to b e 0.2mm [3] adhesion strength of cover tape : adhesion strength to be 0 .1 - 0.7n when the cover tape is turned off from the carrier tape at the angle of 10 o to the carrier tape [4] package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 8. recommended solder pad notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.1mm this drawing without tolerances are for reference only.
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 21 21 9. soldering * caution 1. reflow soldering is recommended not to be done more than two t imes. in the case of more than 24 hours passed soldering after first, leds will be damaged. 2. repairs should not be done after the leds have been soldered. when repair is unavoidable, suitable tools must be used. 3. die slug is to be soldered. 4. when soldering, do not put stress on the leds during heating. 5. after soldering, do not warp the circuit board. ipc/jedec j - std - 020 profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate ( tsmax to tp ) 3 c/second max. 3 c/second max. preheat - temperature min ( tsmin ) - temperature max ( tsmax ) - time ( tsmin to tsmax ) ( ts ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (tl) - time ( tl ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak temperature ( tp ) 215 260 time within 5 c of actual peak temperature (tp)2 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 22 22 (1) storage to avoid the moisture penetration, we recommend storing ssc leds in a dry box with a desiccant . the recommended storage temperature range is 5 to 30 and a maximum humidity of rh50%. (2) use precaution after opening the packaging use proper smd techniques when the led is to be soldered dipped as separation of the lens may affect the light output efficiency. pay attention to the following: a. recommend conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than rh30% b. if the package has been opened more than 4 week(msl_2a) or the c olor of the desiccant changes, components should be dried for 10 - 12hr at 60 5 (3) do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) do not rapidly cool device after soldering. (5) components sh ould not be mounted on warped (non coplanar) portion of pcb. (6) radioactive exposure is not considered for the products list ed here in. (7) gallium arsenide is used in some of the products listed in t his publication. these products are dangerous if they are burned or shredded in the process of d isposal. it is also dangerous to drink the liquid or inhale the gas generated by such products w hen chemically disposed of. (8) this device should not be used in any type of fluid such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) should be used. (9) when the leds are in operation the maximum current should be decided after me asuring the package temperature. (10) leds must be stored properly to maintain the device. if the leds are stored for 3 months or more after being shipped from ssc, a sealed container with a nitrogen atmosphere should be used for storage. (11) the appearance and specifications of the product may be mod ified for improvement without notice. (12) long time exposure of sunlight or occasional uv exposure will ca use lens discoloration. (13) vocs (volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of leds and discolor when exposed to heat and photonic energy. the result can be a significant loss of light o utput from the fixture. knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. 10. precaution for use
z - power led x10490 z - power led x10490 technical data sheet rev.01 rev.01 september 2012 september 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc - qp - 7 - 07 - 18 (rev.00) 23 11. handling of silicone resin leds (1) during processing, mechanical stress on the surface should be mi nimized as much as possible. sharp objects of all types should not be used to pierc e the sealing compound. (2) in general, leds should only be handled from the side. by the way, this also app lies to leds without a silicone sealant, since the surface can also become s cratched. (3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mec hanical pressure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is lar ger than the led s reflector area. (4) silicone differs from materials conventionally used for the manu facturing of leds . these conditions must be considered during the handling of such devices. compared to standard encapsulants , silicone is generally softer, and the surface is more likely t o attract dust. as mentioned previously, the increased sensitivity to dust requi res special care during processing. in cases where a minimal level of dirt and du st particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) ssc suggests using isopropyl alcohol for cleaning. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. (6) please do not mold this product into another resin (epoxy, ureth ane, etc) and do not handle this product with acid or sulfur material in sealed space . (7) avoid leaving fingerprints on silicone resin parts.

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