extended voltage range us1a thru us1m vishay semiconductors formerly general semiconductor document number 88768 www.vishay.com 02-jul-02 1 surface mount ultrafast rectifiers reverse voltage 50 to 1000v forward current 1.0a 0.157 (3.99) 0.177 (4.50) 0.006 (0.152) 0.012 (0.305) 0.030 (0.76) 0.060 (1.52) 0.008 (0.203) max. 0.194 (4.93) 0.208 (5.28) 0.100 (2.54) 0.110 (2.79) 0.078 (1.98) 0.090 (2.29) 0.049 (1.25) 0.065 (1.65) cathode band 0.094 max. (2.38 max.) 0.220 (5.58) ref 0.066 min. (1.68 min.) 0.052 min. (1.32 min.) maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. parameter symbol us1a us1b us1d us1g us1j US1K us1m units device marking code ua ub ud ug uj uk um maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward rectified current at t l = 110? i f(av) 1.0 a peak forward surge current 8.3ms single half sine-wave i fsm 30 a superimposed on rated load (jedec method) maximum thermal resistance (1) r ja 75 ?/w r jl 27 operating and storage temperature range t j , t stg 55 to +150 ? electrical characteristics ratings at 25? ambient temperature unless otherwise specified. maximum instantaneous forward voltage at 1.0a v f 1.0 1.7 v maximum dc reverse current t a = 25? 10 at rated dc blocking voltage t a =100? i r 50 a maximum reverse recovery time at i f = 0.5a, i r = 1.0a, i rr = 0.25a t rr 50 75 ns typical junction capacitance at 4.0v, 1mhz c j 15 10 pf notes: (1) p.c.b. mounted on 0.2 x 0.2 (5.0 x 5.0mm) copper pad area features ?plastic package has underwriters laboratories flammability classification 94v-0 ?for surface mount applications ?glass passivated chip junctions ?low profile package ?easy pick and place ?ultrafast recovery times for high efficiency ?low forward voltage, low power loss ?built-in strain relief, ideal for automated placement ?high temperature soldering guaranteed: 250?/10 seconds on terminals do-214ac (sma) mounting pad layout mechanical data case: jedec do-214ac molded plastic body over passivated chip terminals: solder plated, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end weight: 0.002 ounce, 0.064 gram dimensions in inches and (millimeters)
i f instantaneous forward current (a) 10 1 i r instantaneous reverse leakage current (ma) typical reverse characteristics 0.1 0.01 0.001 forward current derating curve maximum non-repetitive peak forward surge current 0 0.4 1.2 0 75 25 50 100 125 150 0.8 average forward rectified current (a) number of cycles at 60 h z 0 15 20 25 10 5 30 110 100 lead temperature ( c) 0.1 1 10 100 0.01 t j = 150 c 100 c 25 c resistive or inductive load us1a us1g 0.4 0.6 1.4 1.6 1.8 0.8 1.0 1.2 pulse width = 300 s 1% duty cycle t j = 25 c t l = 110 c 8.3ms single half sine-wave (jedec method) 20 0 100 40 60 80 percent of rated peak reverse voltage (%) typical instantaneous forward characteristics instantaneous forward voltage (v) 0.2 0.6 1.0 us1j us1m 125 c peak forward surge current (a) 110 100 10 100 1 0.1 reverse voltage (v) t j = 25 c f = 1.0 mh z v sig = 50mvp-p typical junction capacitance pf junction capacitance us1a us1g us1j us1m transient thermal impedance ( c/w) 0.01 110 100 10 100 0.1 0.1 1 t pulse duration (sec.) typical transient thermal impedance 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas us1a thru us1m vishay semiconductors formerly general semiconductor www.vishay.com document number 88768 2 02-jul-02 ratings and characteristic curves (t a = 25 c unless otherwise noted)
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