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1. product profile 1.1 general description the IP4233CZ6 is designed to protect input/ output (i/o) ports that are sensitive to capacitive loads, such as ethernet, from destruction by electrostatic discharge (esd). the IP4233CZ6 incorporates two pairs of ultra low capacitance back-to-back diodes which protect components from esd voltages as high as 8 kv contact discharge according to iec 61000-4-2, level 4. the back-to-back diodes prevent negative clippi ng of ac signals and voltages below zero. the IP4233CZ6 is fabricated using monolithic silicon technology inte grating two ultra low capacitance back-to-back esd protection diodes in a very small 6-lead sot363 package. 1.2 features and benefits ? pb-free and restriction of hazardous substances (rohs) compliant ? esd protection compliant to iec 61000-4-2 level 4, 8 kv contact discharge ? two low input capacitance (0.9 pf typical) back-to-back esd protection diodes ? very small 6-lead sot363 package 1.3 applications ? esd protection high-frequency ac-coupled ethernet ports 1.4 quick reference data [1] guaranteed by design. [2] pins 2 to 6 and pins 3 to 5. IP4233CZ6 ultra low capacitance esd pr otection for ethernet ports rev. 3 ? 17 june 2010 product data sheet table 1. quick reference data t amb =25 c unless otherwise specified. symbol parameter conditions min typ max unit v esd electrostatic discharge voltage all pins; iec 61000-4-2, level 4; contact discharge -- 8kv c (i/o-gnd) input/output to ground capacitance v i =0v; f=1mhz [1] [2] -0.91.3pf
IP4233CZ6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 17 june 2010 2 of 11 nxp semiconductors IP4233CZ6 ultra low capacitance esd protection for ethernet ports 2. pinning information 3. ordering information 4. limiting values 5. characteristics [1] guaranteed by design. [2] pins 2 to 6 and pins 3 to 5. table 2. pinning pin description simplified outline graphic symbol 1 not connected 2 esd protection i/o channel 1 3 esd protection i/o channel 2 4 not connected 5 esd protection i/o channel 2 6 esd protection i/o channel 1 13 2 4 5 6 018aaa0 13 1 2 3 6 5 4 table 3. ordering information type number package name description version IP4233CZ6 sc-88 plastic surface-mounted package; 6 leads sot363 table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v i input voltage - 5.5 v v esd electrostatic discharge voltage all pins; iec 61000-4-2, level 4; contact discharge - 8kv t stg storage temperature ? 55 +125 c t amb ambient temperature ? 40 +85 c table 5. characteristics t amb =25 c unless otherwise specified. symbol parameter conditions min typ max unit c (i/o-gnd) input/output to ground capacitance v i =0v; f=1mhz [1] [2] -0.91.3pf i rm reverse leakage current v i =3.0v [2] - - 100 na v br breakdown voltage back-to-back diode; i=5ma 6- 9.5v
IP4233CZ6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 17 june 2010 3 of 11 nxp semiconductors IP4233CZ6 ultra low capacitance esd protection for ethernet ports 6. application information a typical application for protecting a 10/100 mbit/s ethernet transceiver against esd is shown in figure 1 . fig 1. typical application for esd protection of a 10/100 mbit/s ethernet transceiver 018aaa014 tx+ 10/100 base-t ethernet tx ? tx+ not used not used tx ? rx+ rx ? v cc v cc gnd rx+ rj45 rx ? r emi r emi r emi r emi IP4233CZ6 1 2 3 6 5 4 not used not used primary-secondary coordinating elements (opt) ptc ptc ptc ptc
IP4233CZ6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 17 june 2010 4 of 11 nxp semiconductors IP4233CZ6 ultra low capacitance esd protection for ethernet ports 7. package outline fig 2. package outline sot363 (sc-88) references outline version european projection issue date iec jedec jeita sot363 sc-88 wb m b p d e 1 e pin 1 index a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 6 plastic surface-mounted package; 6 leads sot36 3 unit a 1 max b p cd e e 1 h e l p qy w v mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.45 0.15 0.25 0.15 a 1.1 0.8 04-11-08 06-03-16
IP4233CZ6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 17 june 2010 5 of 11 nxp semiconductors IP4233CZ6 ultra low capacitance esd protection for ethernet ports 8. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 8.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 8.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 8.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities
IP4233CZ6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 17 june 2010 6 of 11 nxp semiconductors IP4233CZ6 ultra low capacitance esd protection for ethernet ports 8.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 3 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and coolin g down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 6 and 7 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 3 . table 6. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 < 2.5 235 220 2.5 220 220 table 7. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
IP4233CZ6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 17 june 2010 7 of 11 nxp semiconductors IP4233CZ6 ultra low capacitance esd protection for ethernet ports for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . msl: moisture sensitivity level fig 3. temperature profiles for large and small components 001aac84 4 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature
IP4233CZ6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 17 june 2010 8 of 11 nxp semiconductors IP4233CZ6 ultra low capacitance esd protection for ethernet ports 9. revision history table 8. revision history document id release date data sheet status change notice supersedes IP4233CZ6 v.3 20100617 product data sheet - IP4233CZ6 v.2 modifications: ? figure 1 : corrected ? section 10 ? legal information ? : updated IP4233CZ6 v.2 20100506 preliminary data sheet - IP4233CZ6_1 IP4233CZ6_1 20090330 objective data sheet - -
IP4233CZ6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 17 june 2010 9 of 11 nxp semiconductors IP4233CZ6 ultra low capacitance esd protection for ethernet ports 10. legal information 10.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 10.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 10.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
IP4233CZ6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 17 june 2010 10 of 11 nxp semiconductors IP4233CZ6 ultra low capacitance esd protection for ethernet ports quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 10.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 11. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors IP4233CZ6 ultra low capacitance esd protection for ethernet ports ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 17 june 2010 document identifier: IP4233CZ6 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 12. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 application information. . . . . . . . . . . . . . . . . . . 3 7 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 soldering of smd packages . . . . . . . . . . . . . . . 5 8.1 introduction to soldering . . . . . . . . . . . . . . . . . . 5 8.2 wave and reflow soldering . . . . . . . . . . . . . . . . 5 8.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 6 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 10.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 10.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 10.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 10.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 contact information. . . . . . . . . . . . . . . . . . . . . 10 12 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

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