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z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) specification ssc - STW8C2SA rohs
z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 12 (rev.01) ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com features applications description ? lead frame type led pkg size: 3.0*3.0 thickness 0.65mm ? white colored smt package ? pb - free reflow soldering application ? rohs compliant ? interior lighting ? general lighting ? indoor and out door displays ? architectural / decorative lighting STW8C2SA STW8C2SA this surface - mount led comes in standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a lead frame. the die is attached within the reflector cavity and the cavity is encapsulated by silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability.
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) [ contents ] 1. full code of STW8C2SA 2. outline dimensions of STW8C2SA 3. characteristics of STW8C2SA 4. characteristic diagrams 5. color & binning 6. bin code description 7. labeling 8. packing 9. recommended solder pad 10. soldering 11. precaution for use 12. handling of silicone resin leds
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 1. full code of STW8C2SA full code form : x 1 x 2 C x 3 x 4 C x 5 C x 6 x 7 C x 8 1. part number - x 1 : company - x 2 : kind of led 2. internal number - x 3 x 4 : cri group - x 5 : package series - x 6 x 7 : characteristic code - x 8 : version
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 2. outline dimensions of STW8C2SA notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.2mm esd protection device package mark ( - ) top view bottom view side view circuit cathode anode cathode 2 1
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) material structure parts no. name description materials lead frame metal copper alloy (silver plated) chip source blue led gan on sapphire wire metal gold wire encapsulation silicone +phosphor body thermo plastic heat - resistant polymer zener diode si -
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 3. characteristics of STW8C2SA 1) electro - optical characteristics at 100ma 2) absolute maximum ratings parameter symbol value unit forward current i f 200 ma power dissipation* [1] p d 1.36 w junction temperature t j 125 oc operating temperature t opr - 40 ~ +85 oc storage temperature t stg - 40 ~ +100 oc esd (hbm) 5,000v hbm v *notes : leds properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. [1] care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. (ta=25 , rh30%) *notes : all measurements were made under the standardized environment of ssc. [1] the luminous intensity iv was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the led package. [2] 2 1/2 is the off - axis where the luminous intensity is 1/2 of the peak intensity. [3] thermal resistance: rth js (junction / solder) * tolerance : vf : 0.2v, iv : 7%, ra : 2, x,y : 0.007 parameter symbol value unit min typ max forward voltage v f - 6.3 6.8 v reverse voltage v r (ir=5ma) - 0.9 1.4 v luminous intensity* [1] (3,700~7,000 k) i v - 22.4 (72.6) - cd (lm) luminous intensity* [1] (2,600~3,700 k) i v - 20.9 (66.1) - cd (lm) correlated color temperature cct 2,600 - 7,000 k viewing angle [2] 2 1/2 - 120 - - thermal resistance [3] r th js - 10 - oc/w color rendering index* ra 80 83 90 -
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 1) spectrum data (if=100ma, ta=25 , rh30%) 4. characteristic diagrams 300 400 500 600 700 800 0.0 0.5 1.0 2600~3700k 3700~4700k 4700~7000k relative emission intensity wavelength [nm] 2) viewing angle, ta=25
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 4) forward current vs. relative luminous intensity, ta=25 3) forward voltage vs. forward current, ta=25 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 relative luminous intensity forward current i f [ma] 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 0.00 0.05 0.10 0.15 0.20 if[a] vf[v]
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 5) chromaticity coordinate vs. forward current, ta=25 (2600~4000k) (4000~7000k) 0.338 0.339 0.340 0.341 0.342 0.343 0.342 0.344 0.346 0.348 0.350 0.352 0.354 0.356 0.358 200ma 150ma 100ma 75ma 50ma 20ma y x 0.433 0.434 0.435 0.436 0.437 0.438 0.399 0.400 0.401 0.402 0.403 200ma 150ma 100ma 75ma 50ma 20ma y x
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 30 45 60 75 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous intensity ju n ctio n tem pe ratu re tj ( o c ) 6) relative luminous intensity vs. junction temperature, if=100ma
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 7) chromaticity coordinate vs. junction temperature (2600~4000k) (4000~7000k) 0.320 0.325 0.330 0.335 0.340 0.345 0.325 0.330 0.335 0.340 0.345 0.350 0.355 25 70 100 125 y x 0.420 0.422 0.424 0.426 0.428 0.430 0.432 0.434 0.384 0.388 0.392 0.396 0.400 0.404 25 70 100 125 y x
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) -40 -20 0 20 40 60 80 100 0 50 100 150 200 250 forward current i f [ma] ambient temperature t a [ o c] 8) junction temperature vs. relative forward voltage 9) ambient temperature vs. maximum forward current 30 45 60 75 9 0 105 120 0 .0 0 .2 0 .4 0 .6 0 .8 1 .0 relative forward voltage ju n ctio n te m p era tu re t j ( o c ) rth j - a : 60 /w
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 5. color & binning 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 f5 f3 f1 f4 f2 f0 e5 e3 e1 e4 e2 d0 d5 d3 d1 d4 d2 e0 c5 c3 c1 c4 c2 c0 b5 b3 b1 b4 b2 b0 a3 a5 a1 a4 a2 a0 2600k 2700k 2900k 3000k 3200k 3500k 3700k 4000k 4200k 4500k 4700k 5000k 5300k 5600k 6000k 6500k 7000k cie y cie x 0.42 0.44 0.46 0.48 0.38 0.40 0.42 0.44 2700k 2600k h12 g42 g11 g21 cie y 2900k 3000k 3200k cie x g41 g31 g22 g32 g12 g43 g23 g33 g13 g44 g24 g34 g14 h42 h11 h21 h41 h31 h22 h32 h43 h23 h33 h13 h44 h24 h34 h14 macadam 3step rank macadam 3step rank * measurement uncertainty of the color coordinates : 0.007 * apply the energy star binning(3200~7000k) & macadam 3 step binning (just, 2600~3200k) 0.42 0.44 0.46 0.48 0.38 0.40 0.42 0.44 2700k 2600k h12 g42 g11 g21 cie y 2900k 3000k 3200k cie x g41 g31 g22 g32 g12 g43 g23 g33 g13 g44 g24 g34 g14 h42 h11 h21 h41 h31 h22 h32 h43 h23 h33 h13 h44 h24 h34 h14
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) color rank 5. color & binning a0 a1 a2 cie x cie y cie x cie y cie x cie y 0.3028 0.3304 0.3115 0.3393 0.3041 0.324 0.3041 0.324 0.3126 0.3324 0.3055 0.3177 0.3126 0.3324 0.321 0.3408 0.3136 0.3256 0.3115 0.3393 0.3205 0.3481 0.3126 0.3324 a3 a4 a5 cie x cie y cie x cie y cie x cie y 0.3126 0.3324 0.3055 0.3177 0.3136 0.3256 0.3136 0.3256 0.3068 0.3113 0.3146 0.3187 0.3216 0.3334 0.3146 0.3187 0.3221 0.3261 0.321 0.3408 0.3136 0.3256 0.3216 0.3334 b0 b1 b2 cie x cie y cie x cie y cie x cie y 0.3207 0.3462 0.3292 0.3539 0.3212 0.3389 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 0.3292 0.3539 0.3376 0.3616 0.3293 0.3461 b3 b4 b5 cie x cie y cie x cie y cie x cie y 0.3293 0.3461 0.3217 0.3316 0.3293 0.3384 0.3293 0.3384 0.3222 0.3243 0.3294 0.3306 0.3369 0.3451 0.3294 0.3306 0.3366 0.3369 0.3373 0.3534 0.3293 0.3384 0.3369 0.3451 * measurement uncertainty of the color coordinates : 0.007
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) color rank 5. color & binning c0 c1 c2 cie x cie y cie x cie y cie x cie y 0.3376 0.3616 0.3463 0.3687 0.3373 0.3534 0.3373 0.3534 0.3456 0.3601 0.3369 0.3451 0.3456 0.3601 0.3539 0.3669 0.3448 0.3514 0.3463 0.3687 0.3552 0.376 0.3456 0.3601 c3 c4 c5 cie x cie y cie x cie y cie x cie y 0.3456 0.3601 0.3369 0.3451 0.3448 0.3514 0.3448 0.3514 0.3366 0.3369 0.344 0.3428 0.3526 0.3578 0.344 0.3428 0.3514 0.3487 0.3539 0.3669 0.3448 0.3514 0.3526 0.3578 d0 d1 d2 cie x cie y cie x cie y cie x cie y 0.3548 0.3736 0.3641 0.3804 0.3536 0.3646 0.3536 0.3646 0.3625 0.3711 0.3523 0.3555 0.3625 0.3711 0.3714 0.3775 0.3608 0.3616 0.3641 0.3804 0.3736 0.3874 0.3625 0.3711 d3 d4 d5 cie x cie y cie x cie y cie x cie y 0.3625 0.3711 0.3523 0.3555 0.3608 0.3616 0.3608 0.3616 0.3511 0.3465 0.359 0.3521 0.3692 0.3677 0.359 0.3521 0.367 0.3578 0.3714 0.3775 0.3608 0.3616 0.3692 0.3677 * measurement uncertainty of the color coordinates : 0.007
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) color rank 5. color & binning e0 e1 e2 cie x cie y cie x cie y cie x cie y 0.3736 0.3874 0.3869 0.3958 0.3714 0.3775 0.3714 0.3775 0.3842 0.3855 0.3692 0.3677 0.3842 0.3855 0.397 0.3935 0.3813 0.3751 0.3869 0.3958 0.4006 0.4044 0.3842 0.3855 e3 e4 e5 cie x cie y cie x cie y cie x cie y 0.3842 0.3855 0.3692 0.3677 0.3813 0.3751 0.3813 0.3751 0.367 0.3578 0.3783 0.3646 0.3934 0.3825 0.3783 0.3646 0.3898 0.3716 0.397 0.3935 0.3813 0.3751 0.3934 0.3825 f0 f1 f2 cie x cie y cie x cie y cie x cie y 0.3996 0.4015 0.4146 0.4089 0.396 0.3907 0.396 0.3907 0.4104 0.3978 0.3925 0.3798 0.4104 0.3978 0.4248 0.4048 0.4062 0.3865 0.4146 0.4089 0.4299 0.4165 0.4104 0.3978 f3 f4 f5 cie x cie y cie x cie y cie x cie y 0.4104 0.3978 0.3925 0.3798 0.4062 0.3865 0.4062 0.3865 0.3889 0.369 0.4017 0.3751 0.4198 0.3931 0.4017 0.3751 0.4147 0.3814 0.4248 0.4048 0.4062 0.3865 0.4198 0.3931 * measurement uncertainty of the color coordinates : 0.007
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) color rank 5. color & binning g11 g21 g31 g41 cie x cie y cie x cie y cie x cie y cie x cie y 0.4365 0.4189 0.4430 0.4212 0.4496 0.4236 0.4562 0.4260 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4515 0.4168 0.4261 0.4077 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4299 0.4165 0.4365 0.4189 0.4430 0.4212 0.4496 0.4236 g12 g22 g32 g42 cie x cie y cie x cie y cie x cie y cie x cie y 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4515 0.4168 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4468 0.4077 0.4223 0.3990 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4261 0.4077 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 g13 g23 g33 g43 cie x cie y cie x cie y cie x cie y cie x cie y 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4468 0.4077 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4420 0.3985 0.4185 0.3902 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4223 0.3990 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 g14 g24 g34 g44 cie x cie y cie x cie y cie x cie y cie x cie y 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4316 0.3873 0.4203 0.3834 0.4259 0.3853 0.4259 0.3853 0.4302 0.3943 0.4147 0.3814 0.4203 0.3834 0.4420 0.3985 0.4373 0.3893 0.4185 0.3902 0.4243 0.3922 0.4316 0.3873 0.4361 0.3964 * measurement uncertainty of the color coordinates : 0.007
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) color rank 5. color & binning h11 h21 h31 h41 cie x cie y cie x cie y cie x cie y cie x cie y 0.4325 0.4275 0.4687 0.4289 0.4750 0.4304 0.4810 0.4319 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4758 0.4225 0.4515 0.4168 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4562 0.4260 0.4625 0.4275 0.4687 0.4289 0.4750 0.4304 h12 h22 h32 h42 cie x cie y cie x cie y cie x cie y cie x cie y 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4758 0.4225 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4703 0.4132 0.4468 0.4077 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4515 0.4168 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 h13 h23 h33 h43 cie x cie y cie x cie y cie x cie y cie x cie y 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4703 0.4132 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4648 0.4038 0.4420 0.3985 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4468 0.4077 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 h14 h24 h34 h44 cie x cie y cie x cie y cie x cie y cie x cie y 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4648 0.4038 0.4428 0.3906 0.4483 0.3919 0.4538 0.3932 0.4593 0.3944 0.4373 0.3893 0.4428 0.3906 0.4483 0.3919 0.4538 0.3932 0.4420 0.3985 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 * measurement uncertainty of the color coordinates : 0.007
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 6. bin code description bin code luminous intensity [cd] color rank forward voltage [v] k21 c3 z62 color rank @ i f = 100ma a ~ h forward voltage [v] @ i f = 100ma rank min. max. z58 5.8 6.0 z60 6.0 6.2 z62 6.2 6.4 z64 6.4 6.6 z66 6.6 6.8 luminous intensity [ cd ] * [1] @ i f = 100ma rank min. max. j17 17 19.5 j19 19.5 21.5 k21 21.5 24 k24 24 27.5 available ranks not yet available ranks cct cie iv rank 3200~7000k a - f j17 j19 k21 k24 2600~3200k g - h j17 j19 k21 k24 *notes : all measurements were made under the standardized environment of ssc. in order to ensure availability, single color rank will not be orderable. [1] ssc sort the led package according to the luminous intensity iv. ** the lumen table is only for reference. iv rank flux rank ** rank min. max. rank min. max. j17 17 19.5 j17 52.7 60.5 j19 19.5 21.5 j19 60.5 66.7 k21 21.5 24 k21 66.7 74.4 k24 24 27.5 k24 74.4 85.3
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 7. labeling x 9 x 10 x 11 x 12 x 13 x 14 x 15 x 16 x 17 xxxx STW8C2SA seoul semiconductor co.. x 9 x 10 x 11 x 12 x 13 x 14 x 15 x 16 x 17 - x 9 x 10 x 11 : luminous intensity : iv [cd] - x 12 x 13 x 14 : color coordinates : x, y (3200k~7000k : 2 digits except x 14 ) - x 15 x 16 x 17 : forward voltage : v f [v] rank
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 8. packing 1 side outer box structure material : paper(sw3b(b)) a b c 1 humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. type 7inch size (mm) 220 245 245 220 a b 102 142 c 8. packing x 9 x 10 x 11 x 12 x 13 x 14 x 15 x 16 x 17 xxxx stw8q2sa seoul semiconductor co.. x 9 x 10 x 11 x 12 x 13 x 14 x 15 x 16 x 17 xxxx stw8q2sa seoul semiconductor co.. stw8 c 2sa x 9 x 10 x 11 x 12 x 13 x 14 x 15 x 16 x 17 xxxx stw8q2sa seoul semiconductor co.. stw8 c 2sa x 9 x 10 x 11 x 12 x 13 x 14 x 15 x 16 x 17 xxxx stw8q2sa seoul semiconductor co.. stw8 c 2sa
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) ( tolerance : 0 . 2 , unit : mm ) 1) quantity : max 4,500pcs/reel (2000 ~ 4500pcs by 500pcs provided) 2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm 3) adhesion strength of cover tape : adhesion strength to be 0.1 - 0.7n when the cover tape is turned off from the carrier tape at the angle of 10 ? to the carrier tape. 4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package. 8. packing
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 9. recommended solder pad notes : [1] all dimensions are in millimeters. [2] scale : none [3] recommended solder thickness : 0.15 mm [4] undefined tolerance is 0.2mm this drawing without tolerances are for reference only.
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) 25 25 10. soldering * caution 1. reflow soldering is recommended not to be done more than two times. in the case of more than 24 hours passed soldering after first, leds will be damaged. 2. repairs should not be done after the leds have been soldered. when repair is unavoidable, suitable tools must be used. 3. die slug is to be soldered. 4. when soldering, do not put stress on the leds during heating. 5. after soldering, do not warp the circuit board. ipc/jedec j - std - 020 profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat - temperature min ( tsmin ) - temperature max ( tsmax ) - time ( tsmin to tsmax ) ( ts ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (tl) - time (tl) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak temperature (tp) 215 260 time within 5 c of actual peak temperature (tp)2 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) (1) storage to avoid the moisture penetration, we recommend store in a dry box with a desiccant . the recommended storage temperature range is 5 to 30 and a maximum humidity of rh50%. (2) use precaution after opening the packaging use proper smd techniques when the led is to be soldered dipped as separation of the lens may affect the light output efficiency. pay attention to the following: a. recommend conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than rh30% b. if the package has been opened more than 4 week(msl_2a) or the color of the desiccant changes, components should be dried for 10 - 12hr at 60 5 (3) do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) do not rapidly cool device after soldering. (5) components sh ould not be mounted on warped (non coplanar) portion of pcb. (6) radioactive exposure is not considered for the products listed here in. (7) gallium arsenide is used in some of the products listed in this publication. these products are dangerous if they are burned or shredded in the process of disposal. it is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) this device should not be used in any type of fluid such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) should be used. (9) when the leds are in operation the maximum current should be decided after measuring the package temperature. (10) leds must be stored properly to maintain the device. if the leds are stored for 3 months or more after being shipped from ssc, a sealed container with a nitrogen atmosphere should be used for storage. (11) the appearance and specifications of the product may be modified for improvement without notice. (12) long time exposure of sunlight or occasional uv exposure will cause lens discoloration. (13) vocs (volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of leds and discolor when exposed to heat and photonic energy. the result can be a significant loss of light output from the fixture. knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14)attaching leds, do not use adhesives that outgas organic vapor. (15)the driving circuit must be designed to allow forward voltage only when it is on or off. if the reverse voltage is applied to led, migration can be generated resulting in led damage. 11. precaution for use
z - power led x10490 z - power led x10490 technical data sheet ssc ssc - - STW8C2SA STW8C2SA jan 2013 jan 2013 www.seoulsemicon.com www.seoulsemicon.com ssc - qp - 7 - 07 - 12 (rev.01) (1) during processing, mechanical stress on the surface should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can also become scratched. (3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be preve nted. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds. these conditi ons must be considered during the handling of such devices. compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) ssc suggests using isopropyl alcohol for cleaning. in case other solvents are used, it must be a ssured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. (6) please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this . product with acid or sulfur material in sealed space. 12. handling of silicone resin leds

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