designed & dimensioned in millimeters[inches] do not scale from this print bec5-xxx-xx-x-x-v-a-xx-tr no of positions -060, -080, -100, -120, -140, -160, -180, -200 (see note 6) vertical card thickness -02 (1.57mm [.062] pcb) (use sub-im-c-270-02-x-x) -03 (2.36 mm [0.93] pcb) (use sub-im-c-270-03-x-x) plating specification -l: 10 " selective gold, matte tin on tail (use sub-im-c-270-xx-l-x) -s: 30 " selective gold, matte tin on tails (use sub-im-c-270-xx-s-x) packaging -tr: tape & reel alignment pins -a: aligment pins options -k: polyimide film (see fig. 2, sht 2) solder compostion & style -1: 63% tin / 37% lead charge tail (use sub-im-c-270-xx-x-1) -2: 96.5% tin / 3.5% silver lead free charge tail (use sub-im-c-270-xx-x-2) 1.86 .073 (2 plcs) 2.43 .096 ref 1.18 .046 13.00 .512 ref "f" (see note 9) bec5-xxx-xx-v-xx wt-16-04-t sub-im-c-270-xx-x-x (see note 11) see note 5 c "b" ref "a" ref ref "d" 1.00 .039 ref 9.00 .354 ref "e" (see note 8) "c" ref 10.76 ref .424 "a" "a" 'b' pin 01 pin 02 c c 1.32 .052 ref 0.64 .025 ref (typ) 1.10 ref .043 1.000 .039 (typ) non accum 6.00 .236 "j" 0.20 1.32 ref .052 "h" ref c l c c "c" "c" detail 'b' scale 4 : 1 pin 01 (top) pin 04 (top) pin 03 (bottom) pin 02 (bottom) 0.51 (typ) .020 tol non-accum section "c"-"c" scale 4 : 1 pin 04 (top) pin 03 (bottom) c bec5-140-02-x-x-v-a shown fig. 1 c sheet of unless otherwise specified, dimensions are in millimeters [inchs] tolerances are: decimals angles x.x: 0.3 [.01] 2 x.xx: 0.13 [.005] x.xxx: 0.051 [.0020] material: bi-level edge card assembly by: bec5-xxx-xx-x-x-v-a-xx-tr dwg. no. description: proprietary note this document contains information confidential and proprietary to samtec, inc. and shall not be reproduced or transferred to other documents or disclosed to others or used for any purpose other than that which it was obtained without the expressed written consent of samtec, inc. do not scale drawing m murillo 1/16/2009 2 1 sheet scale: 2:1 insulator: lcp , color black contact: becu f:\dwg\misc\mktg\bec5-xxx-xx-x-x-v-a-xx-tr-mkt.slddrw notes: 1. represents a critical dimension. 2. minimum pushout force: 2.22n[.5 lb]. 3. parts to be packaged in tape and reel as standard 4. for quantities up to 49 pieces, no leader, trailer or reel will be supplied for quantities of 50-124, no leader or trailer will be supplied 5. solder crimp volume is .20058 mm3 (0.000012691 in3) 6. number of positions equals total number of circuits. 7. these inside edges are not to appear in the window when viewed from directly above. 8. dimension taken between top and bottom pins. 9. check to the lead and not the solder crimp. 10. see document co-op-wi-3001-m for additional instruction. 11. to calculate number of subs needed take the number of positions and divide by 4. 520 park east blvd, new albany, in 47150 phone: 812-944-6733 fax: 812-948-5047 e-mail info@samtec.com code 55322 revision e
2.29 .090 ref 7.14 .281 2.41 .095 ref 1.27 .050 1.25 .049 0.05 - 0.05 + 0.08 .002 - .002 + .003 9.55 .376 ref "g" 0.10 "l" 0.10 section "a"-"a" scale 7 : 1 wt-16-04-t sub-im-c-270-xx-x-x bec5-xxx-xx-v-xx c c c see note 7 0.15 .006 "k" 0.50 [.020] 0.38 0.50 .015 .020 8.25 .325 "a" ref c l c l c c 13.18 .519 c -k: polyimide pad (use k-dot-.325-.450-.005) (bec5-140-02-x-x-v-a-k shown) fig. 2 c sheet of bi-level edge card assembly by: bec5-xxx-xx-x-x-v-a-xx-tr dwg. no. description: proprietary note this document contains information confidential and proprietary to samtec, inc. and shall not be reproduced or transferred to other documents or disclosed to others or used for any purpose other than that which it was obtained without the expressed written consent of samtec, inc. do not scale drawing m murillo 1/16/2009 2 2 sheet scale: 2:1 revision e f:\dwg\misc\mktg\bec5-xxx-xx-x-x-v-a-xx-tr-mkt.slddrw 520 park east blvd, new albany, in 47150 phone: 812-944-6733 fax: 812-948-5047 e-mail info@samtec.com code 55322
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