he * l 5 * t *** * t 5 4.0 part number 5 high efficiency delay lines he*l5*t***u & s series 1.0 description 2.0 mechanical - please refer to page 43 for land pattern these delay lines come in solder ball configuration that takes up less board space than the gl series. as with all of tft?s delay lines, these feature microstrip transmission lines on ceramic for high speed, high sta- bility performance. manufacturer(s) of the products described on this page are indicated by their respective logos. r r e g i s t e r e d a 4 3 0 3 iso9001 i s o 9 0 0 1 r e g i s t e r e d a 8 5 6 1 iso14001 i s o 1 4 0 0 1 product family number of signal lines 1.1 max 6.35 0.20 0.075 ball dia = 28 mil 12 34 5 3.81 0.20 single un coupled a b c a b c a b c 12 345 12 345 a b c 6.35 0.00 1.1 max 0.075 ball dia = 28 mil 10.16 1 234 567 8 0.20 0.20 a b c single a b c 1 23 4 567 8 a b c 1 23 4 567 8 un coupled a size product type impedance (5 = 50 ohm) size designator termination type delay ?ns? x 100 (0.5 ns = 050) application type tape & reel designator tape & reel quantity (5 = 500 pcs per reel) b size 3.0 electrical application type s (single-ended) u (uncoupled - pair) size designator a b a b delay range 0.1 to 1.2 ns 0.1 & 0.5 to 3.5 ns 0.1 to 0.6 ns 0.1 to 1.6 ns standard delay increment 0.1 ns 0.5 ns 0.1 ns 0.1 ns delay tolerance (provisional) (15 ps + 2% of nominal) (15 ps + 2% of nominal) delay difference tolerance (provisional) na < (10 ps + 0.5%) individual impedance 50 ohm 10% 50 ohm 10% differential impedance na 100 ohm 10% dc resistance the greater of 1 ohm or < 2 ohm/ns rated current 100 ma temperature coeff. of time delay < 150 ppm/c insulation resistance > 100 mohm (100 vdc) isolation resistance > 100 mohm (100 vdc) operating temperature -40c to +85c storage temperature -55c to +125c dimension mm
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