hlmp-d101/d105, hlmp-k101/k105 t-1 3 / 4 (5 mm), t-1 (3 mm), high intensity, double heterojunction algaas red led lamps data sheet description these solid state led lamps utilize newly developed double heterojunction (dh) algaas/gaas material tech - nology. this led material has outstanding light output efciency over a wide range of drive currents. the color is deep red at the dominant wavelength of 637 nanometres. these lamps may be dc or pulse driven to achieve desired light output. features ? exceptional brightness ? wide viewing angle ? outstanding material efciency ? low forward voltage ? cmos/mos compatible ? ttl compatible ? deep red color applications ? bright ambient lighting conditions ? moving message panels ? portable equipment ? general use package dimensions 1.14 (0.045) 0.51 (0.020) 3.43 (0.135) 2.92 (0.115) 24.1 (0.95) min. 4.70 (0.185) 4.19 (0.165) 3.17 (0.125) 2.67 (0.105) 2.79 (0.110) 2.29 (0.090) 1.52 (0.060) 1.02 (0.040) 6.35 (0.250) 5.58 (0.220) 0.55 (0.022) 0.40 (0.016) cathode ? 0.65 (0.026) max. sq. typ. shoulder a b c
2 selection guide package description device hlmp- luminous intensity iv (mcd) at 20 ma 2 1/2 [1] degree package outline min. typ. max. t-1 3/4 red tinted difused d101 35.2 70.0 C 65 a d101-j00xx 35.2 70.0 C 65 a d101-jk0xx 35.2 70.0 112.8 65 a t-1 3/4 red untinted non-difused d105 138.0 240.0 C 24 b d105-m00xx 138.0 240.0 C 24 b d105-no0xx 200.0 290.0 580.0 24 b t-1 red tinted difused k101 22.0 45.0 C 60 c k101-i00xx 22.0 45.0 C 60 c t-1 red untinted non-difused k105 35.2 65.0 C 45 c k105-j00xx 35.2 65.0 C 45 c note: 1. 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1 / 2 the on-axis value. part numbering system hlmp - x x xx - x x x xx mechanical option 00: bulk 01: tape & reel, crimped leads 02: tape & reel, straight leads a1: right angle housing, uneven leads, t1 a2: right angle housing, even leads, t1 b1: right angle housing, uneven leads, t-1 3 / 4 b2: right angle housing, even leads, t-1 3 / 4 dd, uq: ammo pack color bin options 0: full color bin distribution maximum iv bin options 0: open (no max. limit) others: please refer to the iv bin table minimum iv bin options please refer to the iv bin table lens type 01: tinted, difused 05: untinted, nondifused color options 1: algaas red package options d: t-1 3 / 4 k: t-1
3 absolute maximum ratings at t a = 25c parameter value peak forward current [1,2] 300 ma average forward current [2] 20 ma dc current [3] 30 ma power dissipation 87 mw reverse voltage (i r = 100 a) 5 v transient forward current (10 s pulse) [4] 500 ma led junction temperature 110c operating temperature range -20 to +100c storage temperature range -40 to +100c notes: 1. maximum i peak at f = 1 khz, df = 6.7%. 2. refer to figure 6 to establish pulsed operating conditions. 3. derate linearly as shown in figure 5. 4. the transient peak current is the maximum non-recurring peak current the device can withstand without damaging the led die and wire bonds. it is not recommended that the device be operated at peak currents beyond the absolute maximum peak forward current. electrical/optical characteristics at t a = 25c symbol description min. typ. max. unit test condition v f forward voltage 1.8 2.2 v i f = 20 ma v r reverse breakdown voltage 5.0 15.0 v i r = 100 a p peak wavelength 645 nm measurement at peak d dominant wavelength 637 nm note 1 ? 1 / 2 spectral line halfwidth 20 nm s speed of response 30 ns exponential time constant, e -t /t s c capacitance 30 pf v f = 0, f = 1 mhz r j-pin thermal resistance 260 [3] 210 [4] 290 [5] c/w junction to cathode lead v luminous efcacy 80 im/w note 2 notes: 1. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the device. 2. the radiant intensity, i e , in watts per steradian, may be found from the equation i e = l v / v , where i v is the luminous intensity in candelas and v is luminous effcacy in lumens/watt. 3. hlmp-d101. 4. hlmp-d105. 5. hlmp-k101/-k105.
4 figure 3. relative luminous intensity vs. dc forward current. figure 4. relative efciency vs. peak forward current. figure 5. maximum forward dc current vs. ambient temperature. derating based on t j max. = 110c. figure 6. maximum tolerable peak current vs. peak duration (i peak max. determined from temperature derated i dc max.). figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage.
5 figure 7. relative luminous intensity vs. angular displacement. hlmp-d101. figure 8. relative luminous intensity vs. angular displacement. hlmp-k101. figure 9. relative luminous intensity vs. angular displacement. hlmp-d105. figure 10. relative luminous intensity vs. angular displacement. hlmp-k105.
6 mechanical option matrix mechanical option code defnition 00 bulk packaging, minimum increment 500 pcs/bag 01 tape & reel, crimped leads, minimum increment 1300 pcs (t-1 3 / 4 )/1800 pcs (t-1) 02 tape & reel, straight leads, minimum increment 1300 pcs (t-1 3 / 4 )/1800 pcs (t-1) a1 right angle housing, uneven leads, minimum increment 500 pcs/bag a2 right angle housing, even leads, minimum increment 500 pcs/bag b1 right angle housing, uneven leads, minimum increment 500 pcs/bag b2 right angle housing, even leads, minimum increment 500 pcs/bag dd ammo pack, straight leads in 2k increment uq ammo pack, horizontal leads in 2k increment note: all categories are established for classifcation of products. products may not be available in all categories. please contact your local avago representative for further clarifcation/information. intensity bin limits color bin intensity range (mcd) min. max. red i j k l m n o p q r s t u v w x y z 24.8 39.6 39.6 63.4 63.4 101.5 101.5 162.4 162.4 234.6 234.6 340.0 340.0 540.0 540.0 850.0 850.0 1200.0 1200.0 1700.0 1700.0 2400.0 2400.0 3400.0 3400.0 4900.0 4900.0 7100.0 7100.0 10200.0 10200.0 14800.0 14800.0 21400.0 21400.0 30900.0 maximum tolerance for each bin limit is 18%.
7 precautions: lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standof. ? recommended soldering conditions: wave soldering manual solder dipping pre-heat temperature 105 c max. C pre-heat time 30 sec max. C peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max. ? wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profle to ensure the soldering profle used is always conforming to recommended soldering condition. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25c, before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole sizes for led component leads: led component plated through lead size diagonal hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. figure 11. recommended wave soldering profle. laminar wa ve bo tt om side of pc bo ard ho t air knife turbulent wa ve fluxing prehea t 01 02 0 30 50 100 150 200 250 30 40 50 time ? seconds tempera ture ? c 60 70 80 90 100 t op side of pc bo ard convey or speed = 1.83 m/min (6 ft/min) prehea t setting = 150 c (100 c pcb) solder wa ve tempera ture = 245 c air knife air tempera ture = 390 c air knife dist ance = 1.91 mm (0.25 in.) air knife angle = 40 no te : allo w for bo ards to be sufficient ly cooled before exer ting mechanical force.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. av02-0230en - september 24, 2008
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