hsms-280x surface mount rf schottky barrier diodes data sheet description/applications these schottky diodes are specifcally designed for both analog and digital applications. this series ofers a wide range of specifc a tions and package co nfgur a tions to give the designer wide fex i bility. the hsms?280x series of diodes is optimized for high voltage applications. note that avagos manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match. package lead code identifcation, sot-23/sot-143 (top view) package lead code identifcation, sot-323 (top view) package lead code identifcation, sot-363 (top view) common cathode f common anode e series c single b common cathode quad m unconnected trio l bridge quad p common anode quad n ring quad r 1 2 3 6 5 4 high isolation unconnected pair k 1 2 3 6 5 4 1 2 3 6 5 4 1 2 3 6 5 4 1 2 3 6 5 4 1 2 3 6 5 4 features ? surface mount packages ? high breakdown voltage ? low fit (failure in time) rate* ? six ? sigma quality level ? single, dual and quad versions ? tape and reel options available ? lead ? free option available * for more information see the surface mount schottky reli ? ability data sheet. common cathode #4 unconnected pair #5 common anode #3 series #2 single #0 1 2 3 1 2 3 4 bridge quad #8 1 2 3 4 1 2 3 1 2 3 1 2 3
2 absolute maximum ratings [1] t c = 25c symbol parameter unit sot-23/sot-143 sot-323/sot-363 i f forward current (1 s pulse) amp 1 1 p iv peak inverse voltage v same as v br same as v br t j junction temperature c 150 150 t stg storage temperature c ?65 to 150 ?65 to 150 jc thermal resistance [2] c/w 500 150 notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. t c = +25c, where t c is defned to be the temperature at the package pins where contact is made to the circuit board. notes: 1. package marking provides orientation and identifcation. 2. see electrical specifcations for appropriate package marking. esd warning: handling precautions should be taken to avoid static discharge. pin connections and package marking, sot-363 gux 1 2 3 6 5 4 electrical specifcations t a = 25c, single diode [3] part number hsms [4] package marking code lead code confguration minimum breakdown voltage v br (v) maximum forward voltage v f (mv) maximum forward voltage v f (v) @ i f (ma) maximum reverse leakage i r (na) @ v r (v) maximum capacitance c t (pf) typical dynamic resistance r d (?) [5] 2800 a0 0 single 70 410 1.0 @ 15 200 @ 50 2.0 35 2802 a2 2 series 2803 a3 3 common anode 2804 a4 4 common cathode 2805 a5 5 unconnected pair 2808 a8 8 bridge quad [4] 280b a0 b single 280c a2 c series 280e a3 e common anode 280f a4 f common cathode 280k ak k high isolation unconnected pair 280l al l unconnected trio 280m h m common cathode quad 280n n n common anode quad 280p ap p bridge quad 280r o r ring quad test conditions i r = 10 ma i f = 1 ma v f = 0 v f = 1 mhz i f = 5 ma notes: 1. dv f for diodes in pairs and quads in 15 mv maximum at 1 ma. 2. dc to for diodes in pairs and quads is 0.2 pf maximum. 3. efective carrier lifetime (t) for all these diodes is 100 ps maximum measured with krakauer method at 5 ma. 4. see section titled quad capacitance. 5. r d = r s + 5.2 f at 25c and i f = 5 ma.
3 quad capacitance capacitance of schottky diode quads is measured using an hp4271 lcr meter. this instrument efectively isolates individual diode branches from the others, allowing accurate capacitance measurement of each branch or each diode. the conditions are: 20 mv r.m.s. voltage at 1 mhz. avago defnes this measurement as cm, and it is equivalent to the capac i tance of the diode by itself. the equivalent diagonal and adj a cent capacitances can then be calculated by the formulas given below. in a quad, the diagonal capac i tance is the capacitance between points a and b as shown in the fgure below. the diagonal capacitance is calculated using the follow ? ing formula c 1 x c 2 c 3 x c 4 c diagonal = _______ + _______ c 1 + c 2 c 3 + c 4 c 1 c 2 c 4 c 3 a b c the equivalent adjacent capacitance is the capacitance between points a and c in the fgure below. this capaci ? tance is calculated using the following formula 1 c adjacent = c 1 + ____________ 1 1 1 CC + CC + CC c 2 c 3 c 4 this information does not apply to cross ? over quad diodes. spice parameters parameter units hsms-280x b v v 75 c j0 pf 1.6 e g ev 0.69 i bv a e?5 i s a 3.00e?08 n 1.08 r s ? 30 p b v 0.65 p t 2 m 0.5 c j r j r s r j = 8.33 x 10 -5 nt i b + i s where i b = e xter nally applied bias current in amps i s = saturation current (see tab le of spice parameters) t = temperature , k n = ideality f actor (see tab le of spice parameters) note: to eff ectiv ely model the pac kaged hsms-280x product, please ref er to application note an1124. r s = ser ies resistance (see ta b le of spice parameters) c j = junction capacitance (see ta b le of spice parameters) linear equivalent circuit, diode chip
4 typical performance, t c = 25c (unless otherwise noted), single diode 0 0.1 0.3 0.2 0.5 0.6 0.4 0.8 0.7 0.9 i f ? forward current (ma) v f ? forward voltage (v) figure 1. forward current vs. forward voltage at temperatures. 0.01 10 1 0.1 100 t a = +125 c t a = +75 c t a = +25 c t a = ?25 c figure 2. reverse current vs. reverse voltage at temperatures. 0 1 0 2 0 3 0 5 0 40 i r ? reverse current (na) v r ? reverse voltage (v) 1 1000 100 10 100,000 10,000 t a = +125 c t a = +75 c t a = +25 c figure 3. dynamic resistance vs. forward current. 0.1 1 100 r d ? dynamic resistance ( ? ) i f ? forward current (ma) 10 1 10 1000 100 figure 4. total capacitance vs. reverse voltage. 0 1 0 2 0 3 0 5 0 40 c t ? capacitance (pf) v r ? reverse voltage (v) 0 1.5 1 0.5 2 v f - forward voltage (v) figure 5. typical v f match, pairs and quads. 30 10 1 0.3 30 10 1 0.3 i f - forward current (ma) ? v f - forward voltage difference (mv) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 i f (left scale) ? v f (right scale)
5 table 1. typical spice parameters parameter units hsms-280x hsms-281x hsms-282x b v v 75 25 15 c j0 pf 1.6 1.1 0.7 e g ev 0.69 0.69 0.69 i bv a 1 e?5 1 e?5 1 e?4 i s a 3 e?8 4.8 e?9 2.2 e?8 n 1.08 1.08 1.08 r s f 30 10 6 p b (v j ) v 0.65 0.65 0.65 p t (xti) 2 2 2 m 0.5 0.5 0.5 applications information introduction product selection avagos family of schottky products provides unique solu ? tions to many design problems. the frst step in choosing the right product is to select the diode type. all of the products in the hsms?280x family use the same diode chip, and the same is true of the hsms ? 281x and hsms ? 282x families. each family has a diferent set of characteristics which can be compared most easily by consulting the spice parameters in table 1. a review of these data shows that the hsms ? 280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (r s ). in applications which do not require high voltage the hsms ? 282x family, with a lower value of series resistance, will ofer higher current carrying capacity and better performance. the hsms ? 281x family is a hybrid schottky (as is the hsms ? 280x), ofering lower 1/f or ficker noise than the hsms ? 282x family. in general, the hsms ? 282x family should be the designers frst choice, with the ? 280x family reserved for high volt ? age applications and the hsms ? 281x family for low ficker noise applications. assembly instructions sot-323 pcb footprint a recommended pcb pad layout for the miniature sot ? 323 (sc? 70) package is shown in figure 6 (dimensions are in inches). this layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 0.039 0.079 0.022 dimensions in inches figure 6. recommended pcb pad layout for avagos sc70 3l/sot-323 products. assembly instructions sot-363 pcb footprint a recommended pcb pad layout for the miniature sot ? 363 (sc? 70, 6 lead) package is shown in figure 7 (dimensions are in inches). this layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the perfor ? mance. 0.026 0.079 0.018 0.039 dimensions in inches figure 7. recommended pcb pad layout for avagos sc70 6l/sot-363 products.
6 time (seconds) t max temperature ( c) 0 0 50 100 150 200 250 60 preheat zone cool down zone reflow zone 120 180 240 300 figure 8. surface mount assembly profle. smt assembly reliable assembly of surface mount components is a com ? plex process that involves many material, process, and equipment factors, including: method of heating (e.g., ir or vapor phase refow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. components with a low mass, such as the sot package, will reach solder refow temperatures faster than those with a greater mass. avagos sot diodes have been qualifed to the time ? temperature profle shown in figure 8. this profle is representative of an ir refow type of surface mount as ? sembly process. after ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. the preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. the refow zone briefy elevates the temperature sufciently to produce a refow of the solder. the rates of change of temperature for the ramp ? up and cool ? down zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. the maximum temperature in the refow zone (t max ) should not exceed 235c. these parameters are typical for a surface mount assem ? bly process for avago diodes. as a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform refow of solder. part number ordering information part number no. of devices container hsms ?280x ? tr2* 10000 13 reel hsms ?280x ? tr1* 3000 7 reel hsms ?280x ?blk* 100 antistatic bag x = 0, 2, 3, 4, 5, 8, b, c, e, f, k, l, m, n, p, r for lead ? free option, the part number will have the character "g" at the end, eg. hsms ?280x ? tr2g for a 10,000 lead? free reel.
7 package dimensions outline 23 (sot-23) outline 143 (sot-143) e b e2 e1 e1 c e xxx l d a a1 notes: xxx-package marking drawings are not to scale dimensions (mm) min. 0.79 0.000 0.37 0.086 2.73 1.15 0.89 1.78 0.45 2.10 0.45 max. 1.20 0.100 0.54 0.152 3.13 1.50 1.02 2.04 0.60 2.70 0.69 symbol a a1 b c d e1 e e1 e2 e l e b e2 b1 e1 e1 c e xxx l d a a1 notes: xxx-package marking drawings are not to scale dimensions (mm) min. 0.79 0.013 0.36 0.76 0.086 2.80 1.20 0.89 1.78 0.45 2.10 0.45 max. 1.097 0.10 0.54 0.92 0.152 3.06 1.40 1.02 2.04 0.60 2.65 0.69 symbol a a1 b b1 c d e1 e e1 e2 e l outline sot-363 (sc-70 6 lead) outline sot-323 (sc-70 3 lead) e he d e a1 b a a2 q1 l c dimensions (mm) min. 1.15 1.80 1.80 0.80 0.80 0.00 0.10 0.15 0.10 0.10 max. 1.35 2.25 2.40 1.10 1.00 0.10 0.40 0.30 0.20 0.30 symbol e d he a a2 a1 q1 e b c l 0.650 bcs e b e1 e1 c e xxx l d a a1 notes: xxx-package marking drawin g s are not to scale dimensions (mm) min. 0.80 0.00 0.15 0.10 1.80 1.10 1.80 max. 1.00 0.10 0.40 0.20 2.25 1.40 2.40 symbol a a1 b c d e1 e e1 e l 1.30 typical 0.65 typical 0.425 typical
8 user feed directio n cover tape carrier tape reel note: "ab" represents package marking code. "c" re pr esents date code. end vie w 8 mm 4 mm top view abc abc abc abc note: "ab" represents package marking code. "c" represents date code. end vie w 8 mm 4 mm top view abc abc abc abc end view 8 mm 4 mm top view note: "ab" represents package marking code. "c" represents date code. abc abc abc abc device orientation for outline sot-143 for outlines sot-23, -323 for outline sot-363
9 tape dimensions and product orientation for outline sot-23 for outline sot-143 9 max a 0 p p 0 d p 2 e f w d 1 ko 8 max b 0 13.5 max t1 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 3.15 0.1 0 2.77 0.1 0 1.22 0.1 0 4.00 0.1 0 1.00 + 0 .0 5 0.124 0.004 0.109 0.004 0.048 0.004 0.157 0.004 0.039 0.002 cavity diameter pitch position d p 0 e 1.50 + 0.10 4.00 0.1 0 1.75 0.1 0 0.059 + 0.004 0.157 0.004 0.069 0.004 perforation width thickness w t1 8.00 + 0.30 - 0.10 0.229 0.013 0.315 + 0.012 - 0.004 0.009 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.0 5 2.00 0.0 5 0.138 0.002 0.079 0.002 distance between centerline w f e p 2 p 0 d p d 1 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 3.19 0.1 0 2.80 0.1 0 1.31 0.1 0 4.00 0.1 0 1.00 + 0 .2 5 0.126 0.004 0.110 0.004 0.052 0.004 0.157 0.004 0.039 + 0. 010 cavity diameter pitch position d p 0 e 1.50 + 0.10 4.00 0.1 0 1.75 0.1 0 0.059 + 0.004 0.157 0.004 0.069 0.004 perforation width thickness w t1 8.00 + 0.30 - 0.10 0.254 0.013 0.315+ 0 .012 - 0.004 0.0100 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.0 5 2.00 0.0 5 0.138 0.002 0.079 0.002 distance a 0 9 max 9 max t 1 b 0 k 0
tape dimensions and product orientation for outlines sot-323, -363 for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 2006 avago technologies, limited. all rights reserved. obsoletes 5989-4020en av02-0533en - june 2 1, 2007 p p 0 p 2 f w c d 1 d e a 0 an t 1 (carrier tape thickness) t t (cover tape thickness) an b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.40 0.10 2.40 0.10 1.20 0.10 4.00 0.10 1.00 + 0.25 0.094 0.004 0.094 0.004 0.047 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.55 0.05 4.00 0.10 1.75 0.10 0.061 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 0.30 0.254 0.02 0.315 0.012 0.0100 0.0008 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance for sot-323 (sc70-3 lead) an 8 c max for sot-363 (sc70-6 lead) 10 c max angle width tape thickness c t t 5.4 0.10 0.062 0.001 0.205 0.004 0.0025 0.00004 cover tape
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