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1 x 9 fiber optic transceivers for fibre channel technical data hfbr-53d3 family, 850 nm vcsel HFCT-53D3 family, 1300 nm fp laser features ? hfbr-53d3 is compliant with ansi x3.297-1996 fibre channel physical interface fc-ph-2 revision 7.4 proposed specifications for 100-m5-sn-i and 100-m6-sn-i signal interfaces ? HFCT-53D3 is compliant with ansi 100-sm-lc-l revision 2 enhancement to ansi x3.297-1996 fc-ph-2 revision 7.4 ? industry standard mezzanine height 1 x 9 package style with integral duplex sc connector ? performance: hfbr-53d3: 300 m over 62.5/125 m mmf 500 m over 50/125 m mmf HFCT-53D3: 500 m with 50/125 m mmf 500 m with 62.5/125 m mmf 10 km with 9/125 m smf ? iec 60825-1 class 1/cdrh class i laser eye safe ? single +5 v power supply operation with pecl logic interfaces ? wave solderable and aqueous wash process compatible applications: ? mass storage systems i/o ? computer systems i/o ? high-speed peripheral interface ? high-speed switching systems ? host adapter i/o ? raid cabinets related products ? physical layer ics available for optical or copper interface (hdmp- 1536a/46a) ? versions of this transceiver module also available for gigabit ethernet (hfbr/hfct-53d5 family) ? gigabit interface converters (gbic) for fibre channel (cx, sx, lx) description the hfbr/HFCT-53D3 transceiver from hewlett-packard allows the system designer to implement a range of solutions for multimode and single mode fibre channel applications. the overall hp transceiver prod- uct consists of three sections: the transmitter and receiver optical subassemblies, an electrical subassembly, and the package housing which incorporates a duplex sc connector receptacle. transmitter section the transmitter section of the hfbr-53d3 consists of an 850 nm vertical cavity surface emitting laser (vcsel) in an optical subassembly (osa), which mates to the fiber cable. the HFCT-53D3 incorporates a 1300 nm fabry- perot (fp) laser designed to meet the fibre channel specification. the osa is driven by a custom, silicon bipolar ic which converts differential pecl logic signals (ecl referenced to a +5 v supply) into an analog laser diode drive current. receiver section the receiver of the hfbr-53d3 includes a silicon pin photodiode mounted together with a custom, silicon bipolar transimpedance preamplifier ic in an osa. this osa is mated to a custom silicon bipolar circuit that provides post- amplification and quantization. the HFCT-53D3 utilizes an inp pin photodiode in the same configuration.
2 the post-amplifier also includes a signal detect circuit which provides a pecl logic-high output upon detection of a usable input optical signal level. this single- ended pecl output is designed to drive a standard pecl input through a 50 w pecl load. package and handling instructions flammability the hfbr/HFCT-53D3 transceiver housing is made of high strength, heat resistant, chemically resistant, and ul 94v-0 flame retardant plastic. recommended solder and wash process the hfbr/HFCT-53D3 is compatible with industry-standard wave or hand solder processes. process plug this transceiver is supplied with a process plug (hfbr-5000) for protection of the optical ports within the duplex sc connector receptacle. this process plug prevents contamination during wave solder and aqueous rinse as well as during handling, shipping and storage. it is made of a high- temperature, molded sealing material that can withstand +80c and a rinse pressure of 110 lbs per square inch. recommended solder fluxes solder fluxes used with the hfbr/HFCT-53D3 should be water-soluble, organic fluxes. recommended solder fluxes include lonco 3355-11 from london chemical west, inc. of burbank, ca, and 100 flux from alpha-metals of jersey city, nj. recommended cleaning/ degreasing chemicals alcohols : methyl, isopropyl, isobutyl. aliphatics : hexane, heptane. other: soap solution, naphtha. do not use partially halogenated hydrocarbons such as 1,1.1 trichloroethane, ketones such as mek, acetone, chloroform, ethyl acetate, methylene dichloride, phenol, methylene chloride, or n-methylpyrolldone. also, hp does not recommend the use of cleaners that use halogenated hydrocarbons because of their potential environmental harm. regulatory compliance (see the regulatory compliance table for transceiver performance) the overall equipment design will determine the certification level. the transceiver performance is offered as a figure of merit to assist the designer in considering their use in equipment designs. electrostatic discharge (esd) there are two design cases in which immunity to esd damage is important. the first case is during handling of the transceiver prior to mounting it on the circuit board. it is important to use normal esd handling precautions for esd sensitive devices. these precautions include using grounded wrist straps, work benches, and floor mats in esd controlled areas. the transceiver performance has been shown to provide adequate performance in typical industry production environments. the second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. to the extent that the duplex sc connector receptacle is exposed to the outside of the equipment chassis it may be subject to whatever system-level esd test criteria that the equipment is intended to meet. the transceiver performance is more robust than typical industry equipment requirements of today. electromagnetic interference (emi) most equipment designs utilizing these high-speed transceivers from hewlett-packard will be required to meet the requirements of fcc in the united states, cenelec en55022 (cispr 22) in europe and vcci in japan. refer to emi section (page 5) for more details. immunity equipment utilizing these transceivers will be subject to radio-frequency electromagnetic fields in some environments. these transceivers have good immunity to such fields due to their shielded design. eye safety these laser-based transceivers are classified as ael class i (u.s. 21 cfr(j) and ael class 1 per en 60825-1 (+a11). they are eye safe when used within the data sheet limits per cdrh. they are also eye safe under normal operating conditions and under all reasonably foreseeable single fault conditions per en60825-1. hewlett-packard has tested the transceiver design for compliance with the requirements listed below under normal operating conditions and under single fault conditions where applicable. tuv rheinland has granted certification to these transceivers for laser eye safety and use in en 60950 and en 60825-2 applications. their performance enables the transceivers to be used without concern for eye safety up to 7 v transmitter v cc .
3 caution: there are no user serviceable parts nor any maintenance required for the hfbr/HFCT-53D3. all adjustments are made at the factory before shipment to our customers. tampering with or modifying the performance of the hfbr/HFCT-53D3 will result in voided product warranty. it may also result in improper operation of the hfbr/HFCT-53D3 circuitry, and possible overstress of the laser source. device degradation or product failure may result. connection of the hfbr/HFCT-53D3 to a non- approved optical source, operating above the recommended absolute maximum conditions or operating the hfbr/HFCT-53D3 in a manner inconsistent with its design and function may result in hazardous radiation exposure and may be considered an act of modifying or manufacturing a laser product. the person(s) performing such an act is required by law to recertify and reidentify the laser product under the provisions of u.s. 21 cfr (subchapter j). regulatory compliance feature test method performance electrostatic discharge (esd) to the electrical pins mil-std-883c method 3015.4 class 1 (>2000 v). electrostatic discharge (esd) to the duplex sc receptacle variation of iec 801-2 typically withstand at least 15 kv without damage when the duplex sc connector receptacle is contacted by a human body model probe. electromagnetic interference (emi) fcc class b cenelec en55022 class b (cispr 22a) vcci class i margins are dependent on customer board and chassis designs. immunity variation of iec 801-3 typically show no measurable effect from a 3 v/m field swept from 27 to 1000 mhz applied to the transceiver without a chassis enclosure. laser eye safety and equipment type testing us 21 cfr, subchapter j per paragraphs 1002.10 and 1002.12 en 60825-1: 1994 +a11 en 60825-2: 1994 en 60950: 1992+a1+a2+a3 ael class i, fda/cdrh hfbr-53d3 accession #9720151-03 HFCT-53D3 accession #9521220-16 ael class 1, tuv rheinland of north america hfbr-53d3: certificate #e9771047.09 protection class iii HFCT-53D3 certificate #933/510803 component recognition underwriters laboratories and canadian standards association joint component recognition for information technology equipment including electrical business equipment. ul file #e173874
4 application support optical power budget and link penalties the worst-case optical power budget (opb) in db for a fiber- optic link is determined by the difference between the minimum transmitter output optical power (dbm avg.) and the lowest receiver sensitivity (dbm avg.). this opb provides the necessary optical signal range to establish a working fiber-optic link. the opb is allocated for the fiber-optic cable length and the corresponding link penalties. for proper link performance, all penalties that affect the link performance must be accounted for within the link optical power budget. data line interconnections hewlett-packards hfbr/hfct- 53d3 fiber-optic transceiver is designed to directly couple to +5 v pecl signals. the transmitter inputs are internally dc-coupled to the laser driver circuit from the transmitter input pins (pins 7, 8). there is no internal, capacitively-coupled 50 ohm termination resistance within the transmitter input section. the transmitter driver circuit for the laser light source is a dc-coupled circuit. this circuit regulates the output optical power. the regulated light output will maintain a constant output optical power provided the data pattern is reasonably balanced in duty factor. if the data duty factor has long, continuous state times (low or high data duty factor), then the output optical power will gradually change its average output optical power level to its preset value. as for the receiver section, it is internally ac-coupled between the preamplifier and the post- amplifier stages. the actual data and data-bar outputs of the post- amplifier are dc-coupled to their respective output pins (pins 2, 3). signal detect is a single-ended, +5 v pecl output signal that is dc-coupled to pin 4 of the module. signal detect should not be ac- coupled externally to the follow-on circuits because of its infrequent state changes. caution should be taken to account for the proper interconnection between the supporting physical layer integrated circuits and this hfbr/HFCT-53D3 transceiver. figure 3 illustrates a recommended interface circuit for interconnecting to a +5 v dc pecl fiber-optic transceiver. some fiber-optic transceiver suppliers modules include internal capacitors, with or without 50 ohm termination, to couple their data and data-bar lines to the i/o pins of their module. when designing to use these type of transceivers along with hewlett-packard transceivers, it is important that the interface circuit can accommodate either internal or external capacitive coupling with 50 ohm termination components for proper operation of both transceiver designs. the internal dc-coupled design of the hfbr/HFCT-53D3 i/o connections was done to provide the designer with the most flexibility for interfacing to various types of circuits. eye safety circuit for an optical transmitter device to be eye-safe in the event of a single fault failure, the transmitter must either maintain normal, eye- safe operation or be disabled. in the hfbr-53d3 there are three key elements to the laser driver safety circuitry: a monitor diode, a window detector circuit and direct control of the laser bias. the window detection circuit monitors the average optical power using the monitor diode. if a fault occurs such that the transmitter dc regulation circuit cannot maintain the preset bias conditions for the laser emitter within 20%, the transmitter will automatically be disabled. once this has occurred, only an electrical power reset will allow an attempted turn-on of the transmitter. the HFCT-53D3 utilizes an integral fiber stub along with a current limiting circuit to guarantee eye-safety. it is intrinsically eye safe and does not require shut down circuitry. signal detect the signal detect circuit provides a deasserted output signal that implies the link is open or the transmitter is off. the signal detect threshold is set to transition from a high to low state between the minimum receiver input optional power and -30 dbm avg. input optical power indicating a definite optical fault (e.g. unplugged connector for the receiver or transmitter, broken fiber, or failed far-end transmitter or data source). a signal detect indicating a working link is functional when receiving encoded 8b/l0b characters. the signal detect does not detect receiver data error or error-rate. data errors are determined by signal processing following the transceiver.
5 electromagnetic interference (emi) one of a circuit board designers foremost concerns is the control of electromagnetic emissions from electronic equipment. success in controlling generated electromagnetic interference (emi) enables the designer to pass a governmental agencys emi regulatory standard; and more importantly, it reduces the possibility of interference to neighboring equipment. there are three options available for the hfbr-53d3 and two for the HFCT-53D3 with regard to emi shielding which provide the designer with a means to achieve good emi performance. the emi performance of an enclosure using these transceivers is dependent on the chassis design. hp encourages using standard rf suppression practices and avoiding poorly emi-sealed enclosures. the first configuration is a standard hfbr-53d3 fiber optic transceiver that has no external emi shield. this unit is for applications where emi is either not an issue for the designer, the unit resides completely inside a shielded enclosure, or the module is used in a low density, extremely quiet application. the HFCT-53D3 is not available for use without an external shield. the second configuration, option em, is for emi shielding applications where the position of the transceiver module will extend outside the equipment enclosure. the metallized plastic package and integral external metal shield of the transceiver helps locally to terminate em fields to the chassis to prevent their emissions outside the enclosure. this metal shield contacts the panel or enclosure on the inside of the aperture on all but the bottom side of the shield and provides a good rf connection to the panel. this option can accommodate various panel or enclosure thickness, i.e., .04 in. min. to 0.10 in. max. the reference plane for this panel thickness variation is from the front surface of the panel or enclosure. the recommended length for protruding the hfbr/HFCT-53D3 em transceiver beyond the front surface of the panel or enclosure is 0.25 in. with this option, there is flexibility of positioning the module to fit the specific need of the enclosure design. (see figure 6 for the mechanical drawing dimensions of this shield.) the third configuration, option fm, is for applications that are designed to have a flush mounting of the module with respect to the front of the panel or enclosure. the flush-mount design accommodates a large variety of panel thickness, i.e., 0.04 in. min. to 0.10 in. max. note the reference plane for the flush- mount design is the interior side of the panel or enclosure. the recommended distance from the centerline of the transceiver front solder posts to the inside wall of the panel is 0.55 in. this option contacts the inside panel or enclosure wall on all four sides of this metal shield. see figure 8 for the mechanical drawing dimensions of this shield. the two metallized designs are comparable in their shielding effectiveness. both design options connect only to the equipment chassis and not to the signal or logic ground of the circuit board within the equipment closure. the front panel aperture dimensions are recommended in figures 7 and 9. when layout of the printed circuit board is done to incorporate these metal-shielded transceivers, keep the area on the printed circuit board directly under the metal shield free of any components and circuit board traces. for additional emi performance advantage, use duplex sc fiber-optic connectors that have low metal content inside them. this lowers the ability of the metal fiber-optic connectors to couple emi out through the aperture of the panel or enclosure.
6 absolute maximum ratings recommended operating conditions process compatibility notes: 1. the transceiver is class 1 eye safe up to v cc = 7 v. 2. this is the maximum voltage that can be applied across the differential transmitter data inputs without damaging the input circuit. 3. case temperature measurement referenced to the center-top of the internal metal transmitter shield. 4. tested with a 50 mv p-p sinusoidal signal in the frequency range from 500 hz to 1500 khz on the v cc supply with the recommended power supply filter in place. typically less than a 0.25 db change in sensitivity is experienced. 5. compatible with 10 k, 10 kh, and 100 k ecl and pecl input signals. 6. the outputs are terminated to v cc -2 v. 7. aqueous wash pressure <110 psi. parameter symbol min. typ. max. unit reference storage temperature t s -40 +100 c supply voltage v cc -0.5 7.0 v 1 data input voltage v i -0.5 v cc v transmitter differential input voltage v d 1.6 v 2 output current i d 50 ma relative humidity rh 5 95 % parameter symbol min. typ. max. unit reference hand lead soldering temperature/time t sold /t sold +260/10 c/sec. wave soldering and aqueous wash t sold /t sold +260/10 c/sec. 7 parameter symbol min. typ. max. unit reference ambient operating temperature t a 0+70 c case temperature t c +90 c 3 supply voltage v cc 4.75 5.25 v power supply rejection psr 50 mv p-p 4 transmitter data input voltage - low v il -v cc -1.810 -1.475 v 5 transmitter data input voltage - high v ih -v cc -1.165 -0.880 v 5 transmitter differential input voltage v d 0.3 1.6 v data output load r dl 50 w 6 signal detect output load r sdl 50 w 6
7 hfbr-53d3 family, 850 nm vcsel transmitter electrical characteristics (ta = 0c to +70c, v cc = 4.75 v to 5.25 v) receiver electrical characteristics (ta = 0c to +70c, v cc = 4.75 v to 5.25 v) notes: 1. the laser reset voltage is the voltage level below which the v cct voltage must be lowered to cause the laser driver circuit to reset from an electrical/optical shutdown condition to a proper electrical/optical operating condition. the maximum value corresponds to the worst-case highest v cc voltage necessary to cause a reset condition to occur. the laser safety shutdown circuit will operate properly with transmitter v cc levels of 3.5 v dc < v cc < 7.0 v dc. 2. receiver supply current and power dissipation do not include current and power in external 270 ohm terminating resistors. 3. these outputs are compatible with 10 k, 10 kh, and 100 k ecl and pecl inputs. 4. these are 20-80% values. hfbr-53d3 family, 850 nm vcsel transmitter optical characteristics (ta = 0c to +70c, v cc = 4.75 v to 5.25 v) see notes on following page. parameter symbol min. typ. max. unit reference supply current i cct 85 120 ma power dissipation p dist 0.45 0.63 w data input current - low i il -350 0 a data input current - high i ih 16 350 a laser reset voltage v cct-reset 2.7 2.5 v 1 parameter symbol min. typ. max. unit reference supply current i ccr 105 130 ma 2 power dissipation p disr 0.53 0.68 w 2 data output voltage - low v ol - v cc -1.950 -1.620 v 3 data output voltage - high v oh - v cc -1.045 -0.740 v 3 data output rise time t r 0.40 ns 4 data output fall time t f 0.40 ns 4 signal detect output voltage - low v ol - v cc -1.950 -1.620 v 3 signal detect output voltage - high v oh - v cc -1.045 -0.740 v 3 parameter symbol min. typ. max. unit reference output optical power 50/125 m, na = 0.20 fiber p out -10 -4 dbm avg. output optical power 62.5/125 m, na = 0.275 fiber p out -10 -4 dbm avg. optical extinction ratio 9 db 1 center wavelength l c 830 850 860 nm spectral width - rms s 0.85 nm rms optical rise/fall time t r /t f 0.45 ns 2, 3 figure 1 rin 12 -116 db/hz deterministic transmitter jitter 188 ps
8 receiver optical characteristics (ta = 0c to +70c, v cc = 4.75 v to 5.25 v) notes: 1. optical extinction ratio is defined as the ratio of the average output optical power of the transmitter in the high (1) sta te to the low (0) state. this optical extinction ratio is expressed in decibels (db) by the relationship 10log(p high avg /p low avg ). 2. these are 20-80% values and include the effect of a fourth order filter. 3. laser transmitter pulse response characteristics are specified by an eye diagram (figure 1). the characteristics include rise time, fall time, pulse overshoot, pulse undershoot, and ringing, all of which are controlled to prevent excessive degradation of the receiver sensitivity. 4. the receive sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye. 5. return loss is defined as the minimum attenuation (db) of received optical power for energy reflected back into the optical f iber. HFCT-53D3 family, 1300 nm fp/laser transmitter electrical characteristics (ta = 0c to +70c, v cc = 4.75 v to 5.25 v) receiver electrical characteristics (ta = 0c to +70c, v cc = 4.75 v to 5.25 v) notes: 1. receiver supply current and power dissipation do not include current and power in external 270 ohm terminating resistors. 2. these outputs are compatible with 10 k, 10 kh, and 100 k ecl and pecl inputs. 3. these are 20-80% values. parameter symbol min. typ. max. unit reference input optical power p in -16 0 dbm avg. 4 operating center wavelength l c 770 860 nm return loss 12 db 5 signal detect ? asserted p a -18 dbm avg. signal detect ? deasserted p d -30 dbm avg. signal detect ? hysteresis p a - p d 1.5 db parameter symbol min. typ. max. unit reference supply current i cct 65 130 ma power dissipation p dist 0.35 0.68 w data input current - low i il -350 0 a data input current - high i ih 16 350 a parameter symbol min. typ. max. unit reference supply current i ccr 120 140 ma 1 power dissipation p disr 0.53 0.74 w 1 data output voltage - low v ol - v cc -1.950 -1.620 v 2 data output voltage - high v oh - v cc -1.045 -0.740 v 2 data output rise time t r 0.40 ns 3 data output fall time t f 0.40 ns 3 signal detect output voltage - low v ol - v cc -1.950 -1.620 v 2 signal detect output voltage - high v oh - v cc -1.045 -0.740 v 2
9 HFCT-53D3 family, 1300 nm fp-laser transmitter optical characteristics (ta = 0c to +70c, v cc = 4.75 v to 5.25 v) receiver optical characteristics (ta = 0c to +70c, v cc = 4.75 v to 5.25 v) notes: 1. specifications for 1300 nm transceivers with multimode fiber are modeled after ieee.802.3z standard for gigabit ethernet. 2. optical extinction ratio is defined as the ratio of the average output optical power of the transmitter in the high (1) sta te to the low (0) state. this optical extinction ratio is expressed in decibels (db) by the relationship 10log(p high avg /p low avg ). 3. these are 20-80% values and are corrected to remove the effects of the fourth order filter used during measurement. 4. laser transmitter pulse response characteristics are specified by an eye diagram (figure 1). the characteristics include rise time, fall time, pulse overshoot, pulse undershoot, and ringing, all of which are controlled to prevent excessive degradation of the receiver sensitivity. 5. the receive sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye. 6. return loss is defined as the minimum attenuation (db) of received optical power for energy reflected back into the optical f iber. parameter symbol min. typ. max. unit reference output optical power 9 mm smf output optical power 62.5 mm mmf output optical power 50 mm mmf p out -9.5 -11.5 -11.5 -3 -3 -3 dbm dbm dbm 1 1 optical extinction ratio 9 db 2 center wavelength l c 1285 1343 nm spectral width - rms s 2.8 nm rms optical rise/fall time t r /t f 0.32 ns 3, 4 figure 1 rin 12 -116 db/hz deterministic transmitter jitter 188 ps parameter symbol min. typ. max. unit reference input optical power p in -20 -3 dbm avg. 5 operating center wavelength l c 1270 1355 nm return loss 12 db 6 signal detect ? asserted p a -20 dbm avg. signal detect ? deasserted p d -30 dbm avg. signal detect ? hysteresis p a - p d 1.5 db figure 1. transmitter optical eye diagram mask 1.3 1.0 0.8 0.5 0.2 0 -0.2 normalized amplitude normalized time 0 0.15 0.375 0.625 0.85 1.0
10 table 1. pinout table pin symbol functional description mounting pins the mounting pins are provided for transceiver mechanical attachment to the circuit board. they are embedded in the nonconductive plastic housing and are not connected to the transceiver internal circuit, nor is there a guaranteed connection to the metallized housing in the em and fm versions. they should be soldered into plated-through hole on the printed circuit board. 1v eer receiver signal ground directly connect this pin to receiver signal ground plane. (for hfbr-53d3, v eer = v eet ) 2 rd+ receiver data out rd+ is an open-emitter output circuit. terminate this high-speed differential pecl output with standard pecl techniques at the follow-on device input pin. 3 rd? receiver data out bar rd? is an open-emitter output circuit. terminate this high-speed differential pecl output with standard pecl techniques at the follow-on device input pin. 4 sd signal detect normal optical input levels to the receiver result in a logic ?1? output, v oh , asserted. low input optical levels to the receiver result in a fault condition indicated by a logic ?0? output v ol , deasserted. signal detect is a single-ended pecl output. sd can be terminated with standard pecl techniques via 50 w to v ccr - 2 v. alternatively, sd can be loaded with a 270 w resistor to v eer to conserve electrical power with small compromise to signal quality. if signal detect output is not used, leave it open-circuited. this signal detect output can be used to drive a pecl input on an upstream circuit, such as, signal detect input or loss of signal-bar. 5v ccr receiver power supply provide +5 v dc via the recommended receiver power supply filter circuit. locate the power supply filter circuit as close as possible to the v ccr pin. 6v cct transmitter power supply provide +5 vdc via the recommended transmitter power supply filter circuit. locate the power supply filter circuit as close as possible to the v cct pin. 7 td? transmitter data in-bar terminate this high-speed differential pecl input with standard pecl techniques at the transmitter input pin. 8 td+ transmitter data in terminate this high-speed differential pecl input with standard pecl techniques at the transmitter input pin. 9v eet transmitter signal ground directly connect this pin to the transmitter signal ground plane. figure 2. pin-out 1 = v eer 2 = rd+ 3 = rdC 4 = sd 5 = v ccr 6 = v cct 7 = tdC 8 = td+ 9 = v eet top view nic nic rx tx nic = no internal connection (mounting pins)
11 figure 3. recommended gigabit/sec ethernet hfbr/HFCT-53D3 fiber-optic transceiver and hdmp-1536a/1546a serdes integrated circuit transceiver interface and power supply filter circuits. 9 8 7 6 5 4 3 1 pecl input output driver clock synthesis circuit parallel to serial circuit laser driver circuit input buffer clock recovery circuit serial to parallel circuit pre- amplifier post- amplifier signal detect circuit r10 270 to signal detect (sd) input at upper-level-ic r11 270 50 w r9 270 r14 100 c12 0.01 f c11 0.01 f 2 c4 10 f c3 0.1 f 5 vdc c2 0.1 f c1 0.1 f c8* 10 f* l2 1 h l1 1 h c10 0.01 f c9 0.01 f c5 0.1 f r1 191 r4 191 r3 68 r2 68 5 vdc r13 150 r12 150 50 w 50 w 50 w + + + 3.3 vdc gnd td+ td- rd- rd+ td+ td- rd- rd+ sd v ccr v cct v eet v eer hfbr/HFCT-53D3 fiber-optic transceiver hdmp-1536a/-1546a serial/de-serializer (serdes - 10 bit transceiver) notes: *c8 is an optional bypass capacitor for additional low-frequency noise filtering . use surface-mount components for optimum high-frequency performance. use 50 w microstrip or stripline for signal paths. locate 50 w terminations at the inputs of receiving units. v cc2 v ee2 see hdmp-1536a/-1546a data sheet for details about this transceiver ic.
12 figure 5. package outline drawing for hfbr/HFCT-53D3. figure 4. recommended board layout hole pattern. (8x) 2.54 0.100 20.32 0.800 20.32 0.800 1.9 0.1 0.075 0.004 (2x) ? ?0.000 m a 0.8 0.1 0.032 0.004 (9x) ? ?0.000 m a CaC top view 39.6 (1.56) max. area reserved for process plug 12.7 (0.50) 25.4 (1.00) max. 12.7 (0.50) 20.32 (0.800) 20.32 (0.800) dimensions are in millimeters (inches). all dimensions are 0.025 mm unless otherwise specified. 9.8 (0.386) max. +0.1 -0.05 0.25 +0.004 -0.002 ( 0.010 3.3 0.38 (0.130 0.015) 8x ) 20.32 (0.800) 2.5 (0.10) slot depth xxxx-xxxx zzzzz laser prod 21cfr(j) class 1 country of origin yyww tx rx slot width 4.7 (0.185) 23.8 (0.937) +0.25 -0.05 0.46 +0.010 -0.002 ( 0.018 ) 9x ? 1.3 (0.051) 2x ? 15.8 0.15 (0.622 0.006) +0.25 -0.05 1.27 +0.010 -0.002 ( 0.050 ) 2x ? 2.0 0.1 (0.079 0.004) key: yyww = date code for multimode module: xxxx-xxxx = hfbr-53xx zzzz = 850 nm 0.51 (0.020) 2.54 (0.100)
13 figure 6. package outline for hfbr/HFCT-53D3em. 39.6 (1.56) max. area reserved for process plug 12.7 (0.50) 25.4 (1.00) max. 12.7 (0.50) 20.32 (0.800) 20.32 (0.800) dimensions are in millimeters (inches). all dimensions are 0.025 mm unless otherwise specified. 9.8 (0.386) max. +0.1 -0.05 0.25 +0.004 -0.002 ( 0.010 3.3 0.38 (0.130 0.015) ) 20.32 (0.80) slot width 4.7 (0.185) 23.8 (0.937) +0.25 -0.05 0.46 +0.010 -0.002 ( 0.018 ) 9x ? 1.3 (0.051) 2x ? 15.8 0.15 (0.622 0.006) +0.25 -0.05 1.27 +0.010 -0.002 ( 0.050 ) 2x ? 2.0 0.1 (0.079 0.004) 29.6 (1.16) key: yyww = date code for multimode module: xxxx-xxxx = hfbr-53xx zzzz = 850 nm for singlemode modules: xxxx-xxxx = hfct-53xx zzzz = 1300 nm 8x 2.54 (0.100) 10.2 (0.40) 1.3 (0.05) max. 2.09 (0.08) uncompressed uncompressed xxxx-xxxx zzzzz laser prod 21cfr(j) class 1 country of origin yyww tx rx
14 figure 7. suggested module positioning and panel cut-out for hfbr/HFCT-53D3em. 27.4 0.50 (1.08 0.02) 9.4 (0.37) 6.35 (0.25) pcb bottom view module protrusion 2x 0.8 (0.032) +0.5 -0.25 10.9 +0.02 -0.01 (0.43 ) 2x 0.8 (0.032)
15 39.6 (1.56) max. area reserved for process plug 12.7 (0.50) 25.4 (1.00) max. 20.32 (0.800) 20.32 (0.800) dimensions are in millimeters (inches). all dimensions are 0.025 mm unless otherwise specified. +0.1 -0.05 0.25 +0.004 -0.002 ( 0.010 3.3 0.38 (0.130 0.015) ) 20.32 (0.800) 2.2 (0.09) slot depth 23.8 (0.937) +0.25 -0.05 0.46 +0.010 -0.002 ( 0.018 ) 9x ? 1.3 (0.051) 2x ? 15.8 0.15 (0.622 0.006) +0.25 -0.05 1.27 +0.010 -0.002 ( 0.050 ) 2x ? 14.4 (0.57) 29.7 (1.17) 12.7 (0.50) slot width 4.7 (0.185) 2.0 0.1 (0.079 0.004) key: yyww = date code for multimode module: xxxx-xxxx = hfbr-53xx zzzz = 850 nm for singlemode modules: xxxx-xxxx = hfct-53xx zzzz = 1300 nm 25.8 (1.02) max. 22.0 (0.87) 8x 2.54 (0.100) area reserved for process plug 9.8 (0.386) max. 10.2 (0.40) max. xxxx-xxxx zzzzz laser prod 21cfr(j) class 1 country of origin yyww tx rx 1.01 (0.40) figure 8. package outline for hfbr/HFCT-53D3fm.
www.hp.com/go/fiber for technical assistance or the location of your nearest hewlett-packard sales office, distributor or representative call: americas/canada: 1-800-235-0312 or 408-654-8675 far east/australasia: call your local hp sales office. japan: (81 3) 3335-8152 europe: call your local hp sales office. data subject to change. copyright ? 1999 hewlett-packard co. 5968-5302e (4/99) 10.82 (0.426) 26.4 (1.04) 1.98 (0.078) 13.82 (0.544) 30.2 (1.19) 14.73 (0.58) keep out zone bottom side of pcb dimension shown for mounting module flush to panel. thicker panel will recess module. thinner panel will protrude module. 12.0 (0.47) 0.36 (0.014) 1.27 (0.05) optional septum dimensions are in millimeters (inches). all dimensions are 0.025 mm unless otherwise specified. 1.82 (0.072) ordering information 850 nm vcsel (short wavelength laser) hfbr-53d3 no shield, plastic housing. hfbr-53d3em extended/protruding shield, metallized housing. hfbr-53d3fm flush shield, metallized housing. 1300 nm fp laser (long wavelength laser) HFCT-53D3em extended/protruding shield, metallized housing. HFCT-53D3fm flush shield, metallized housing. figure 9. suggested module positioning and panel cut-out for hfbr/HFCT-53D3fm.

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