View HSME-C190_6698627.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

avago reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availabil ity of the product(s) at anytime. features small size industry standard footprint operating temperature range of ?0?c to +85?c compatible with ir soldering available in 8 mm tape on 7" diameter reel reel sealed in zip-locked moisture barrier bags applications membrane switch indicator lcd backlighting pushbutton backlighting front panel indicator symbol backlighting keypad backlighting description this chip-type led utilizes aluminum indium gallium phosphide (alingap) material technology. the alingap material has a very high luminous efficiency, capable of producing high light output. these chipleds come in top mounting, top emitting packages (hsmx-c150/170/177/190/191/197), top mounting, side emitting packages (hsmx-c110/120) or reverse mounting, top emitting package (hsmx- c265). all packages are binned by both color and intensity. in order to facilitate pick and place operation, these chipleds are shipped in tape & reel, with 4000 units per reel for hsmx-c120/170/ 177/190/191/197 and 3000 units per reel for hsmx-c110/c150/265. these packages are compatible with reflow soldering process. hsme-cxxx alingap green chipled data sheet hsme-c110/c120/c150/c170/ c177/c190/c191/c197/c265 caution: hsme-cxxx leds are class 1a esd sensitive per jesd22-a114c.01. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details.
2 package dimensions notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. 3.2 (0.126 ) 0.5 (0.020) 0.8 (0.031) polarity cathode line 1.5 (0.059) led die clear epoxy pc board soldering terminal 1.0 (0.039) 1.0 (0.039) 2.6 (0.102 ) 1.6 (0.063 ) cathode line hsmx-c110 3.2 (0.126 ) 2.00 (0.079 ) 0.30 (0.012) 0.40 ?0.15 (0.016 ?0.006) 0.30 (0.012) polarity 0.80 (0.031) 0.40 ?0.15 (0.016 ?0.006) 1.40 (0.055) diffused epoxy pc board soldering terminal 1.25 (0.049) cathode line hsmx-c170 cathode mark 1.6 (0.063 ) 0.3 (0.012) 0.3 ?0.15 (0.012 ?0.006) 0.3 (0.012) polarity cathode mark 0.8 (0.031) 0.3 ?0.15 (0.012 ?0.006) 1.0 (0.039) diffused epoxy pc board soldering terminal 0.8 (0.031) cathode line 0.7 (0.028) min. hsmx-c190 hsmx-c191 1.6 (0.063 ) 0.3 (0.012) 0.3 ?0.15 (0.012 ?0.006) 0.3 (0.012) polarity cathode mark 0.6 (0.023) 0.3 ?0.15 (0.012 ?0.006) 1.0 (0.039) diffused epoxy pc board soldering terminal 0.8 (0.031) cathode line 0.7 (0.028) min.
3 notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. 3.40 (0.134) 0.30 (0.012) 2?1.10 (0.043) polarity cathode mark (etched) 1.10 (0.043) 2?0.50 ?0.15 (0.020 ?0.006) 1.20 (0.047) led die undiffused epoxy pc board 1.25 (0.049) cathode line hsmx-c265 hsmx-c120 1.6 (0.063) 0.5 (0.020) polarity cathode mark 1.0 (0.039) 3 ?0.3 (0.012) 1.2 (0.047) 0.3 (0.012) led die clear epoxy pc board soldering terminal 0.6 (0.024) cathode line 3.2 (0.126 ) 0.5 (0.020) 0.5 ?0.2 (0.020 ?0.008) 0.6 (0.024) polarity cathode mark 1.1 (0.043) 0.5 ?0.2 (0.020 ?0.008) 2.0 (0.079) diffused epoxy pc board soldering terminal 1.6 (0.063) cathode line hsmx-c150 0.80 (0.031) 1.60 (0.063) diffused epoxy pc board 0.40 (0.016) 0.16 (0.006) 0.70 (0.028) min. 0.30 ?0.15 (0.012 ?0.006) cathode line cathode mark hsmx-c197 polarity soldering terminal
4 package dimensions, continued notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. cathode mark 1.25 (0.049) 2.00 (0.079) diffused epoxy pc board 0.40 (0.016) 0.16 (0.006) 0.40 ?0.15 (0.016 ?0.006) soldering terminal hsmx-c177 1.10 (0.043) polarity cathode line
5 device selection guide package dimension (mm) [1,2] alingap green package description 1.6 (l) x 0.8 (w) x 0.6 (h) hsme-c191 untinted, diffused 1.6 (l) x 0.8 (w) x 0.4 (h) hsme-c197 untinted, diffused 1.6 (l) x 0.8 (w) x 0.8 (h) HSME-C190 untinted, diffused 2.0 (l) x 1.25 (w) x 0.8 (h) hsme-c170 untinted, diffused 2.0 (l) x 1.25 (w) x 0.4 (h) hsme-c177 untinted, diffused 1.6 (l) x 1.0 (w) x 0.6 (h) hsme-c120 untinted, non-diffused 3.2 (l) x 1.5 (w) x 1.0 (h) hsme-c110 untinted, non-diffused 3.2 (l) x 1.6 (w) x 1.1 (h) hsme-c150 untinted, diffused 3.4 (l) x 1.25 (w) x 1.1 (h) hsme-c265 untinted, non-diffused notes: 1. dimensions in mm. 2. tolerance 0.1 mm unless otherwise noted. absolute maximum ratings at t a = 25 c hsme-c110/120/170/177/ parameter 190/191/197/150/265 units dc forward current [1,2] 20 ma power dissipation 52 mw reverse voltage (i r = 100 a) 5 v led junction temperature 95 c operating temperature range ?0 to +85 c storage temperature range ?0 to +85 c soldering temperature see reflow soldering profile (figures 6 & 7) electrical characteristics at t a = 25 c forward voltage reverse breakdown capacitance c thermal v f (volts) v r (volts) (pf), v f = 0, resistance @ i f = 20 ma @ i r = 100 af = 1 mhz r j?in ( c/w) part number typ. max. min. typ. typ. hsme-c110/120 2.1 2.6 5 18 550 hsme-c150/170/177/190/191/197 2.1 2.6 5 15 450 hsme-c265 2.1 2.6 5 16 450 notes: 1. derate linearly as shown in figure 4. 2. drive current above 5 ma is recommended for best long term performance.
6 optical characteristics at t a = 25 c color, dominant luminous intensity peak wavelength wavelength viewing angle luminous efficacy i v (mcd) @ 20 ma [1] peak (nm) d [2] (nm) 2 1/2 degrees [3] v (lm/w) part number min. typ. typ. typ. typ. typ. hsme-c110 18 52 570 572 130 570 hsme-c120 18 52 570 572 155 570 hsme-150/170/ 18 50 570 572 170 570 190/191 hsme-c177/197 18 50 570 572 130 570 hsme-c265 18 50 570 572 150 570 notes: 1. the luminous intensity, i v , is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. the dominant wavelength, d , is derived from the cie chromatically diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. light intensity (i v ) bin limits [1] intensity (mcd) bin id min. max. a0.110 .18 b0.180 .29 c0.290 .45 d0.450 .72 e0.721 .10 f1.101 .80 g1.802 .80 h2.804 .50 j4.507 .20 k7.201 1.20 l1 1.20 18.00 m1 8.00 28.50 n2 8.50 45.00 p4 5.00 71.50 q7 1.50 112.50 r 112.50 180.00 s 180.00 285.00 t 285.00 450.00 u 450.00 715.00 green color bin limits [1] dom. wavelength (nm) bin id min. max. a 561.5 564.5 b 564.5 567.5 c 567.5 570.5 d 570.5 573.5 e 573.5 576.5 t olerance: 1 nm t olerance: 15% notes: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your avago representative for information on currently available bins. 2. the iv binning specification set-up is for lowest allowable iv binning only. there are no upper iv bin limits.
7 figure 5a. relative intensity vs. angle for hsmx-c170, hsmx-c190, hsmx-c191, and hsmx-c150. figure 4. maximum forward current vs. ambient temperature. figure 3. luminous intensity vs. forward current. figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. figure 5b. relative intensity vs. angle for hsmx-c177 and hsmx-c197. 100 50 0 400 450 550 600 650 700 relative intensity ?% wavelength - nm 90 80 70 60 40 30 20 10 500 100 10 1 0.1 1.5 1.9 2.2 v f ?forward voltage ?v i f ?forward current ?ma 1.7 2.0 1.6 1.8 2.1 05 15 i f ?forward current ?ma 0 0.4 1.0 1.2 luminous intensity (normalized @ 20 ma) 30 0.6 0.2 0.8 10 20 25 0 0 20 60 80 100 5 i f max. ?maximum forward current ?ma t a ?ambient temperature ?? 40 20 15 25 10 10 30 50 70 90 relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 20 30 5 07090 -90 -20 -80 -60 -40 -10 10 40 60 80 relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 20 30 50 70 90 -90 -20 -80 -60 -40 -10 10 40 60 80
8 figure 5c. relative intensity vs. angle for hsmx-c110. figure 5d. relative intensity vs. angle for hsmx-c120. relative intensity ?% 100 0 angle 40 20 60 80 020 100 -100 -20 -80 -60 -40 40 60 80 relative intensity ?% 100 0 angle 40 20 60 80 020 100 -100 -20 -80 -60 -40 40 60 80 relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 20 30 5 07090 -90 -20 -80 -60 -40 -10 10 40 60 80 100 90 80 70 60 50 40 30 20 10 0 relative intensity -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 angle
9 figure 6. recommended reflow soldering profile. figure 5e. relative intensity vs. angle for hsmx-c265. figure 8. recommended soldering pattern for hsmx-c265. figure 9. recommended soldering pattern for hsmx-c120. figure 10. recommended soldering pattern for hsmx-c110. figure 11. recommended soldering pattern for hsmx-c170 and hsmx-c177. figure 12. recommended soldering pattern for hsmx-c190, hsmx-c191 and hsmx-c197. figure 13. recommended soldering pattern for hsmx-c150. relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 20 30 5 07090 -90 -20 -80 -60 -40 -10 10 40 60 80 1.25 (0.049) 1.4 (0.055) 1.4 (0.055) 2.3 (0.091) 2.2 (0.087) dia. pcb hole 0.7 (0.028) 0.8 (0.031) 0.8 (0.031) 1.2 (0.047) 0.4 (0.016) 0.15 (0.006) 0.4 (0.016) centering board 5.0 (0.200) 1.0 (0.039) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) 0.9 (0.035) 0.2 (0.008) 0.9 (0.035) centering board 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) 1.2 (0.047) 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) 1.5 (0.059) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) note: 1. all dimensions in millimeters (inches). figure 7. recommended pb-free reflow soldering profile. 230? max. 10 sec. max. 4?/sec. max. over 2 min. time temperature 4?/sec. max. 140-160? ??/sec. 217 c 200 c 60 - 120 sec. 6 c/sec. max. 3 c/sec. max. 3 c/sec. max. 150 c 255 - 260 c 100 sec. max. (acc. to j-std-020c) 10 - 30 sec. time temperature
10 figure 15. reel dimensions. figure 14. reeling orientation. x x x x x x x x x x x x x x x x x x x x cathode side printed label user feed direction x x x x x note: 1. all dimensions in millimeters (inches). 10.50 ?1.0 (0.413 ?0.039) 59.60 ?1.00 (2.346 ?0.039) 20.20 min. ( 0.795 min.) 6 ps 178.40 1.00 (7.024 0.039) 3.0 0.5 (0.118 0.020) 4.0 0.5 (0.157 0.020) 5.0 0.5 (0.197 0.020) 13.1 0.5 ( 0.516 0.020) 8.0 1.0 (0.315 0.039)
11 figure 16. tape dimensions. notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. 8.00 0.30 (0.315 0.012) user feed direction dim. a (see table 1) 3.50 0.05 (0.138 0.002) 1.75 (0.069) dim. c (see table 1) 0.20 0.05 (0.008 0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 0.05 (0.079 0.002) 4.00 (0.157) 1.50 (0.059) hsmx-c265 series 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) table 1 dimensions in millimeters (inches) cathode dim. a 0.10 (0.004) dim. b 0.10 (0.004) part number dim. c 0.10 (0.004) 8.00 0.30 (0.315 0.012) user feed direction dim. a (see table 1) 3.50 0.05 (0.138 0.002) 1.75 (0.069) dim. c (see table 1) 0.20 0.05 (0.008 0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 0.05 (0.079 0.002) 4.00 (0.157) 1.50 (0.059) table 1 dimensions in millimeters (inches) cathode dim. a 0.10 ( 0.004) dim. b 0.10 ( 0.004) part number dim. c 0.10 ( 0.004) hsmx-c170 series 2.30 (0.091) 1.45 (0.057) 0.95 (0.037) hsmx-c190 series 1.75 (0.069) 0.90 (0.035) 0.90 (0.035) hsmx-c110 series 3.40 (0.134) 1.70 (0.067) 1.20 (0.047) hsmx-c191 series 1.86 (0.073) 0.89 (0.035) 0.87 (0.034) hsmx-c150 series 3.50 (0.138) 1.88 (0.074) 1.27 (0.050) hsmx-c110/c120 position in carrier tape dim. b (see table 1) dim. a (see table 1) hsmx-c110 r 1.0 0.05 (0.039 0.002) hsmx-c120 r 0.5 0.05 (0.020 0.002) hsmx-c120 series 1.90 (0.075) 1.15 (0.045) 0.80 (0.031) hsmx-c197 series 1.75 (0.069) 0.95 (0.037) 0.60 (0.024) hsmx-c177 series 2.30 (0.091) 1.40 (0.055) 0.60 (0.024)
convective ir reflow soldering for more information on solder- ing, refer to application note 1060, surface mounting smt led indicator components . storage condition: 5 to 30? c @ 60% rh max. baking is required under the con- dition: a) humidity indicator card is >10% when read at 23 5 c b) device exposed to factory conditions <30 c/60% rh more than 672 hours. baking recommended condition: 60 5 c for 20 hours. figure 17. tape leader and trailer dimensions. end start there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. mounted with components there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. minimum of 230 mm (9.05 inch) may consist of carrier and/or cover tape. for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries . data subject to change. copyright ? 2008 avago technologies limited. all rights reserved. obsoletes av01-0684en av02-0976en january 8, 2008

▲Up To Search▲

Price & Availability of HSME-C190

	To Download HSME-C190 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .