november 2005 / d page 1 semiconductor tak cheong ? 500 mw do-35 hermetically sealed glass zener voltage regulators absolute maximum ratings t a = 25c unless otherwise noted parameter value units power dissipation 500 mw storage temperature range -65 to +200 c operating junction temperature +200 c lead temperature (1/16? from case for 10 seconds) +230 c these ratings are limiting values above which the serviceability of the diode may be impaired. specification features: ? zener voltage range 2.4 to 56 volts ? do-35 package (jedec) ? through-hole device type mounting ? hermetically sealed glass ? compression bonded construction ? all external surfaces are corrosion resistant and leads are readily solderable ? cathode indicated by polarity band electrical characteristics t a = 25c unless otherwise noted device type v z @ i zt (volts) nominal i zt (ma) z zt @ i zt ( ? ) max z zk @ i zk = 0.25ma ( ? ) max i r @ v r ( a) max v r (volts) tc1n5221b 2.4 20 30 1200 100 1 tc1n5222b 2.5 20 30 1250 100 1 tc1n5223b 2.7 20 30 1300 75 1 tc1n5224b 2.8 20 30 1400 75 1 tc1n5225b 3 20 29 1600 50 1 tc1n5226b 3.3 20 28 1600 25 1 tc1n5227b 3.6 20 24 1700 15 1 tc1n5228b 3.9 20 23 1900 10 1 tc1n5229b 4.3 20 22 2000 5 1 tc1n5230b 4.7 20 19 1900 5 2 tc1n5231b 5.1 20 17 1600 5 2 tc1n5232b 5.6 20 11 1600 5 3 tc1n5233b 6 20 7 1600 5 3.5 tc1n5234b 6.2 20 7 1000 5 4 tc1n5235b 6.8 20 5 750 3 5 tc1n5236b 7.5 20 6 500 3 6 tc1n5237b 8.2 20 8 500 3 6.5 tc1n5238b 8.7 20 8 600 3 6.5 tc1n5239b 9.1 20 10 600 3 7 tc1n5240b 10 20 17 600 3 8 tc1n5241b 11 20 22 600 2 8.4 tc1n5242b 12 20 30 600 1 9.1 tc1n5243b 13 9.5 13 600 0.5 9.9 tc1n5244b 14 9 15 600 0.1 10 cathode anode electrical symbol tc1n5221b through tc1n5263b series l 52 xx t device marking diagram l : logo device code : tc1n52xxt vz tolerance (t) : b = 5% : c = 2% : axial lead do35
november 2005 / d page 2 semiconductor tak cheong ? electrical characteristics t a = 25c unless otherwise noted device type v z @ i zt (volts) nominal i zt (ma) z zt @ i zt ( ? ) max z zk @ i zk = 0.25ma ( ? ) max i r @ v r ( a) max v r (volts) tc1n5245b 15 8.5 16 600 0.1 11 tc1n5246b 16 7.8 17 600 0.1 12 tc1n5247b 17 7.4 19 600 0.1 13 tc1n5248b 18 7 21 600 0.1 14 tc1n5249b 19 6.6 23 600 0.1 14 tc1n5250b 20 6.2 25 600 0.1 15 tc1n5251b 22 5.6 29 600 0.1 17 tc1n5252b 24 5.2 33 600 0.1 18 tc1n5253b 25 5 35 600 0.1 19 tc1n5254b 27 4.6 41 600 0.1 21 tc1n5255b 28 4.5 44 600 0.1 21 tc1n5256b 30 4.2 49 600 0.1 23 tc1n5257b 33 3.8 58 700 0.1 25 tc1n5258b 36 3.4 70 700 0.1 27 tc1n5259b 39 3.2 80 800 0.1 30 tc1n5258b 36 3.4 70 700 0.1 27 tc1n5259b 39 3.2 80 800 0.1 30 tc1n5260b 43 3 93 900 0.1 33 tc1n5261b 47 2.7 105 1000 0.1 36 tc1n5262b 51 2.5 125 1100 0.1 39 tc1n5263b 56 2.2 150 1300 0.1 43 v f forward voltage = 1.1 v maximum @ i f = 200 ma for all types notes: 1. the type numbers listed have zener voltage as shown and have a standard tolerance on the nominal zener voltage of 5%. device of 2% is indicated by a ?c? instead of a ?b?. 2. for detailed information on price, availability and delivery of nominal zener voltages between the voltages shown and tighte r voltage tolerances, contact your nearest tak cheong electronics representative. 3. the zener impedance is derived from the 60-cycle ac voltage, which results when an ac current having an rms value equal to 10% of the dc zener current ( i zt or i zk ) is superimposed to i zt or i zk. electrical symbol definition typical characteristics symbol parameter v z reverse zener voltage @ i zt i zt reverse current z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i zk i r reverse leakage current @ v r v r breakdown voltage i f forward current v f forward voltage @ i f v i (mv) (v) (ma) (ma) v f i f v r i r v z i zt (na)
november 2005 / d page 3 semiconductor tak cheong ? ordering information device package quantity tc1n52xxb bulk 10,000 tc1n52xxb.tb tape and ammo (52mm) 5,000 tc1n52xxb.tr tape and reel (52mm) 10,000 tc1n52xxb.t26b tape and ammo (26mm) 5,000 tc1n52xxb others (?contact tak cheong sales representatives) axial-lead tape packaging standards this axial-lead component?s packaging requirements use in automatic testing and assembly equipment. and this standard practices for lead-tape packaging of axial-lead components meets the requirements of eia standard rs-296-d ?lead-taping of components on axia l lead configuration for automatic insertion?.
november 2005 / d page 4 semiconductor tak cheong ? tape & reel packaging information tape & reel outline reel dimensions dim millimeters d1 356 d2 30 d3 84 w1 77.5 quantity per reel pkg type quantity per reel do-35 10,000
november 2005 / d page 5 semiconductor tak cheong ? tape & ammo packaging information tape & ammo outline quantity per ammo box pkg type quantity per box do-35 5,000 taping dimensions description millimeters standard width 52 26 tape spacing (b) 52 0.69 26 +0.5 / -0 component pitch (c) 5.08 0.4 5.08 0.4 untaped lead (l1 ? l2) 0.69 0.69 glass offset (f) 0.69 0.69 bent (d) 1.2 max 1.2 max tape width (g) 6.138 0.576 6.138 0.576 tape mismatch (e) 0.55 max 0.55 max taped lead (g) 3.2 min 3.2 min lead beyond tape (h) 0 0 for 52mm box 250mm x 80mm x 80mm for 26mm box 255mm x 100mm x 48mm
november 2005 / d page 6 semiconductor tak cheong ? bulk packaging information bulk outline quantity per box pkg type quantity per box do-35 10,000 plastic bag do-35 500 x 20 plastic bag quantity per plastic bag 190mm x 150mm x 65mm
november 2005 / d page 7 semiconductor tak cheong ? package outline package case outline do-35 do-35 millimeters inches dim min max min max a 0.46 0.55 0.018 0.022 b 3.05 5.08 0.120 0.200 c 25.40 38.10 1.000 1.500 d 1.53 2.28 0.060 0.090 notes: 1. all dimensions are within jedec standard. 2. do35 polarity denoted by cathode band.
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