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37011155 MAX5909 EM6A9325 1XAS33 29LV1 30C01SS 091DL G381BK
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  xxx xx xx xxx xxxx yy xx 1. the ''lf'' products meet european union directives and other country regulations as described in gs-22-008 2. the housing will withstand exposure to 260c peak temperature for 3.5 seconds in a wave solder application with a 1.6 mm minimum thick circuit board 3. lead free or rohs directive labeling to be provided as per gs-14-920 for lead free version. notes:- linear b c d 6 5 4 3 b c 2 1 d form: a3 6 a 5 4 3 2 1 a fciconnect.com copyright fci din reverse header wire wrap din 41612 style-r c-8609-2005 pdm: rev:d released . status: printed: oct 30, 2007


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