stps15l25d/g ? october 1998 - ed : 4b low drop power schottky rectifier symbol parameter value unit v rrm repetitive peak reverse voltage 25 v i f(rms) rms forward current 30 a i f(av) average forward current tc = 145c d = 0.5 15 a i fsm surge non repetitive forward current tp = 10ms sinusoidal 250 a i rrm repetitive peak reverse current tp=2 m s square f=1khz 1 a i rsm non repetitive peak reverse current tp = 100 m s square 4 a t stg storage temperature range - 65 to + 150 c tj maximum operating junction temperature * 150 c dv/dt critical rate of rise of reverse voltage 10000 v/ m s absolute ratings (limiting values) to-220ac stps15l25d very low forward voltage drop for less power dissipation and re- duced heatsink optimized conduction/reverse losses trade-off which means the highest efficiency in the applications avalanche rated features single schottky rectifier suited for switched mode power supplies and high frequency dc to dc con- verters (vrm s ). packaged in to-220ac or d 2 pak, this device is especially intended for use as a rectifier at the secondary of 3.3v smps and dc/dc units. description i f(av) 15 a v rrm 25 v tj (max) 150 c v f (max) 0.35 v main product characteristics k a d 2 pak stps15l25g nc a k * : dptot dtj < 1 rth ( j - a ) thermal runaway condition for a diode on its own heatsink 1/5
symbol parameter value unit r th(j-c) junction to case 1 c/w thermal resistances symbol parameters test conditions min. typ. max. unit i r * reverse leakage current tj = 25c v r = v rrm 1.3 ma tj = 125c 225 450 ma v f * forward voltage drop tj = 25c i f = 15a 0.46 v tj = 125c i f = 15a 0.3 0.35 tj = 25c i f = 30a 0.56 tj = 125c i f = 30a 0.41 0.46 pulse test : * tp = 380 m s, d < 2% to evaluate the maximum conduction losses use the following equation : p = 0.24 x i f(av) + 0.0073 i f 2 (rms) static electrical characteristics 0 2 4 6 8 10 12 14 16 0 1 2 3 4 5 6 7 8 if(av) (a) pf(av)(w) d = 0.2 d = 0.5 d = 1 d = 0.05 d = 0.1 t d =tp/t tp fig.1 : average forward power dissipation versus average forward current. 0 25 50 75 100 125 150 0 2 4 6 8 10 12 14 16 if(av)(a) rth(j-a)=50c/w rth(j-a)=rth(j-c) tamb(c) t d =tp/t tp fig.2 : average forward current versus ambient temperature ( d = 0.5). stps15l25d/g 2/5
1e-3 1e-2 1e-1 1e+0 0 50 100 150 200 250 300 350 im(a) tc=25c tc=100c tc=75c t(s) i m t d =0.5 fig.3 : non repetitive surge peak forward current versus overload duration (maximum values). 0 5 10 15 20 25 1e-2 1e-1 1e+0 1e+1 1e+2 1e+3 ir(ma) tj=125c tj=25c tj=150c vr(v) fig.5 : reverse leakage current versus reverse voltage applied (typical values). 1.0e-4 1.0e-3 1.0e-2 1.0e-1 1.0e+0 0.0 0.2 0.4 0.6 0.8 1.0 t(s) zth(j-c)/rth(j-c) t d =tp/t tp single pulse d = 0.1 d = 0.2 d = 0.5 fig.4 : relative variation of thermal impedance junction to case versus pulse duration. 12 5102030 0.1 1.0 5.0 vr(v) c(nf) f=1mhz tj=25c fig.6 : junction capacitance versus reverse voltage applied (typical values). ifm(a) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.1 1.0 10.0 100.0 200.0 vfm(v) tj=25c tj=125c typical values tj=150c fig.7 : forward voltage drop versus forward current (maximum values). 0 4 8 1216202428323640 0 10 20 30 40 50 60 70 80 rth(j-a) (c/w) s(cu) (cm2) fig.8 : thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board fr4, copper thickness : 35 m m). (stps15l25g only) stps15l25d/g 3/5
package mechanical data d 2 pak a c2 d r 2.0 min. flat zone a2 v2 c a1 g l l3 l2 b b2 e ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.30 4.60 0.169 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.25 1.40 0.049 0.055 c 0.45 0.60 0.017 0.024 c2 1.21 1.36 0.047 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.28 0.393 0.405 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 r 0.40 0.016 v2 0 8 0 8 8.90 3.70 1.30 5.08 16.90 10.30 foot print dimensions (in millimeters) cooling method: by conduction (method c) stps15l25d/g 4/5
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsib ility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without expres s written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 1998 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - france - germany - italy - japan - korea - malaysia - malta - mexico - morocco - the netherlands - singapore - spain - sweden - switzerland - taiwan - thailand - united kingdom - u.s.a. http://www.st.com package mechanical data to-220ac a c d e m l7 h2 ? i l5 l6 l9 l4 g f1 f l2 ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 h2 10.00 10.40 0.393 0.409 l2 16.40 typ. 0.645 typ. l4 13.00 14.00 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. i 3.75 3.85 0.147 0.151 cooling method : c recommended torque value : 0.55 m.n maximum torque value : 0.70 m.n ordering type marking package weight base qty delivery mode stps15l25d stps15l25d to-220ac 1.86g 50 tube stps15l25g stps15l25g d 2 pak 1.48g 50 tube stps15l25g-tr stps15l25g d 2 pak 1.48g 500 tape & reel epoxy meets ul94,v0 stps15l25d/g 5/5
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