? 2005 california micro devices corp. all rights reserved. 10/05/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 1 cm1203 1, 2 and 3-channel esd arrays in csp features ? functionally and pin compatible with cmd?s cspesd301/302/303 fa mily of devices ? optiguard ? coated for improved reliability at assembly ? 1, 2 or 3 channels of esd protection ? 15kv esd protection (iec 61000-4-2, contact discharge) ? 30kv esd protection (hbm) ? supports both ac and dc signal applications ? low leakage current (<100na) ? chip scale package features extremely low lead inductance for optimum esd and filter perfor- mance ? 4 bump, 1.06 x 0.93mm footprint chip scale package (csp) ? lead-free version available applications ? i/o port protection ? emi filtering for data ports ? cellphones, notebook computers, pdas ? wireless handsets ? mp3 players ? digital still cameras ? handheld pcs product description the cm1203 comprises a family of 1, 2, and 3-channel esd protection arrays, which integrate two, three and four identical avalanche-style diodes. it is intended that one of these diodes is co nnected to gnd and the other diodes provide esd protection for up to 3 lines depending upon the configur ation utilized. the back- to-back diode connections pr ovide esd protection for nodes that have ac signals up to 5.9v peak. these devices provide a very high level of protection for sen- sitive electronic components that may be subjected to electrostatic discharge (esd). the cm1203 safely dis- sipate esd strikes of 1 5kv, well beyond the maxi- mum requirements of the iec 61000-4-2 international standard. using the mi l-std-883 (method 3015) specification for human body model (hbm) esd, these devices protect agai nst contact discharges of greater than 30kv. the diodes also provide some emi filtering, when used in combination with a pcb trace or series resistor. these devices are particularly well-suited for portable electronics (e.g. cellular telephones, pdas, notebook computers) because of their small package format and easy-to-use pin assignments. the cm1203 incorporates optiguard ? coating which results in improved relia bility at assembly. the cm1203 is available in a space-saving, low-profile, chip-scale package with optional lead-free finishing. electrical schematics b1 a2 b2 b1 a2 b2 b1 a2 a1 cm1203-01 cm1203-02 cm1203-03
? 2005 california micro devices corp. all rights reserved. 2 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 10/05/05 cm1203 ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices ar e specified by using a " + " character for the top side orientation mark. b2 b1 a1 a2 orientation marking a1 2 1 b a n* orientation marking (see note 2) package / pinout diagrams notes : cm1203 top view bottom view (bumps down view) (bumps up view) * see ordering information for appropriate part marking. 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. 4-bump csp package 3) all 4 bumps are always present. un used bumps are electrically unconnected. part numbering information bumps package standard finish lead-free finish 2 ordering part number 1 part marking ordering part number 1 part marking 4 csp cm1203-01cs p cm1203-01cp p 4 csp cm1203-02cs q CM1203-02CP q 4 csp cm1203-03cs r cm1203-03cp r
? 2005 california micro devices corp. all rights reserved. 10/05/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 3 cm1203 specifications note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to another diode, one at a time. note 3: these parameters are guaranteed by design and char- acterization. figure 1. parameter legend absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc package power rating 200 mw standard operat ing conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics (see note 1) symbol parameter conditions min typ max units v so diode stand-off voltage i diode = 10 a 6.0 v i leak diode leakage current v in =3.3v 100 na v sig small signal clamp voltage positive clamp negative clamp i diode = 10ma i diode = -10ma 6.0 -9.2 7.6 -7.6 9.2 -6.0 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 notes 2 and 3 30 15 kv kv v cl clamping voltage during esd discharge mil-std-883 (method 3015), 8kv between adjacent bumps between diagonal bumps notes 2 and 3 19.5 19.9 v v r d dynamic resistance between adjacent bumps between diagonal bumps notes 2 and 3 0.85 1.10 ? ? c capacitance at 0vdc, 1mhz, 30mvac 27 pf 3.3v 10ma 10 a v sig v cl v i esd i leak slope = 1 / r d v so i
? 2005 california micro devices corp. all rights reserved. 4 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 10/05/05 cm1203 performance information figure 2. typical emi filter performance (0vdc, 50 ohm environment) figure 3. typical capacitance vs. input voltage (normalized to 0vdc)
? 2005 california micro devices corp. all rights reserved. 10/05/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 5 cm1203 performance information (cont?d) figure 4. low current i-v curve figure 5. high current i-v curve 2 2 4 6 8 -6 -4 -2 468 -8 -6 -4 -2 i( a) v (v) -8 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 -12-11-10-9-8-7-6-5-4-3-2-10123456789101112 high current i-v characteristic - pads a1 to a2 current [a] voltage [v]
? 2005 california micro devices corp. all rights reserved. 6 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 10/05/05 cm1203 application information refer to application no te ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 6. recommended non-solder mask defined pad illustration figure 7. eutectic (snpb) solder ball reflow profile figure 8. lead-free (snagcu) solder ball reflow profile printed circuit boar d recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (las er cut, 5% tapered walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature for eutectic de vices using a eutectic solder paste 240c maximum soldering temperature for lead-free devices using a lead-free solder paste 260c solder mask opening 0.325mm dia. non-solder mask defined pad 0.275mm dia. solder stencil opening 0.330mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2005 california micro devices corp. all rights reserved. 10/05/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 7 cm1203 mechanical details csp mechanical specifications the cm1203 is offered in a custom chip scale pack- age (csp). dimensions are shown below. for com- plete information on the chip scale package, see the california micro devices csp package information document. package dimensions for cm1203 chip scale package csp tape and reel specifications figure 9. tape and reel mechanical data package dimensions package custom csp bumps 4 dim millimeters inches min nom max min nom max a1 0.881 0.926 0.971 0.0347 0.0365 0.0382 a2 1.015 1.060 1.105 0.0400 0.0417 0.0435 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.495 0.500 0.505 0.0195 0.0197 0.0199 c1 0.163 0.213 0.263 0.0064 0.0084 0.0104 c2 0.230 0.280 0.330 0.0091 0.0110 0.0130 d1 0.575 0.644 0.714 0.0226 0.0254 0.0281 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a b 1 c1 b1 a1 c2 dimensions in millimeters d1 d2 a2 bottom view side view 2 b2 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 cm1203 1.06 x 0.93 x 0.644 1.14 x 1. 00 x 0.70 8mm 178mm (7") 3500 4mm 4mm to p for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
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