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to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
notice 1. all information included in this document is current as of the date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas el ectronics products li sted herein, please confirm the latest product information with a renesas electronics sales office. also , please pay regular and careful attention to additional and different information to be disclosed by rene sas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringeme nt of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electroni cs products or techni cal information descri bed in this document . no license, express, implied or otherwise, is granted hereby under any patents, copyri ghts or other intell ectual property right s of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any re nesas electronics product, wh ether in whole or in part . 4. descriptions of circuits, software and other related informat ion in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully re sponsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this doc ument, you should comply with the applicable export control laws and regulations and follow the proc edures required by such laws and re gulations. you should not use renesas electronics products or the technology described in this docum ent for any purpose relating to mil itary applicati ons or use by the military, including but not l imited to the development of weapons of mass de struction. renesas electronics products and technology may not be used for or incor porated into any products or systems whose manufacture, us e, or sale is prohibited under any applicable dom estic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing th e information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. renesas electronics products ar e classified according to the following three quality grades: ?standard?, ?high quality?, an d ?specific?. the recommended applications for each renesas electronics product de pends on the product?s quality grade, as indicated below. you must check the qua lity grade of each renesas electronics pr oduct before using it in a particular application. you may not use any renesas electronics produc t for any application categorized as ?speci fic? without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. (note 1) ?renesas electronics? as used in this document means renesas electronics corporation and also includes its majority- owned subsidiaries. (note 2) ?renesas electronics product(s)? means any product developed or manufactured by or for renesas electronics. description the pc8172tk is a silicon monolit hic integrated circuit desi gned as frequency up-conve rter for cellular telephone transmitter stage. this tk suffix ic which is smaller package than conventiona l tb suffix ic contribute to reduce your system size. this ic is manufactured using our 30 ghz f max uhs0 (u ltra h igh s peed process) silicon bipolar process. features ? high output frequency : f rfout = 0.8 to 2.5 ghz circuit current : i cc = 9.0 ma typ. high-density surface mounting : 6-pin lead-less minimold package supply voltage : v cc = 2.7 to 3.3 v applicaions pcs1900m 2.4 ghz band transmitter/receiver system (wireless lan etc.) rf module etc. ordering information part number order number package marking supplying form pc8172tk-e2 pc8172tk-e2-a 6-pin lead-less minimold (1511) (pb-free) note 6a embossed tape 8 mm wide pin 1, 6 face the perforation side of the tape qty 5 kpcs/reel note with regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. remark to order evaluation samples, contact your nearby sales office. part number for sample order: pc8172tk data sheet caution observe precautions when handling because these devices are sensitive to electrostatic discharge. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. bipolar analog integrated circuit pc8172tk small package frequenc y up-converter ic document no. pu10407ej02v0ds (2nd edition) date published december 2004 cp(k) printed in japan the mark ? shows major revised points. ? nec compound semiconductor devices, ltd. 2003, 2004 contents 1. pin connections ............................................................................................................ ............ 3 2. product line-up ............................................................................................................ ............ 3 3. block diagram.............................................................................................................. ............. 4 4. system application example.............................................................................................. 4 5. pin explanation............................................................................................................ ............. 5 6. absolute maximum ratings................................................................................................. 6 7. recommended operating range ....................................................................................... 6 8. electrical characteristics ............................................................................................... 6 9. other characteristics, for reference purposes only .................................... 7 10. test circuit .............................................................................................................. ................. 8 10.1 test circuit 1 (f rfout = 0.9 ghz) ..................................................................................... 8 10.2 test circuit 2 (f rfout = 1.9 ghz) ..................................................................................... 10 10.3 test circuit 3 (f rfout = 2.4 ghz) ..................................................................................... 12 11. typical characteristics ................................................................................................... .. 14 11.1 f rfout = 900 mhz matching.................................................................................................. 15 11.2 f rfout = 1 900 mhz matching............................................................................................... 19 11.3 f rfout = 1 950 mhz matching............................................................................................... 23 11.4 f rfout = 2 400 mhz matching............................................................................................... 25 12. s-parameters ............................................................................................................... ............. 29 13. package dimensions ........................................................................................................ ...... 30 14. note on correct use ..................................................................................................... ..... 31 15. recommended soldering conditions............................................................................ 31 data sheet pu10407ej02v0ds 2 pc8172tk 1. pin connections pin no. pin name 1 ifinput 2 gnd 3 loinput 4 ps 5 v cc 1 2 3 6 (top view) 5 4 6 5 4 1 (bottom view) 2 3 6a 6 rfoutput caution pin arrangement diffe rs from the conventional 6- pin super mini-mold type ( pc8172tb). 2. product line-up cg (db) part no. package i cc (ma) f rfout (ghz) @ rf0.9 (ghz) note @ rf1.9 (ghz) @ rf2.4 (ghz) pc8172tk 6-pin lead-less minimold 9.0 0.8 to 2.5 9.5 8.5 8.0 pc8106tb 6-pin super minimold 9.0 0.4 to 2.0 9.0 7.0 ? pc8109tb (1511) 5.0 0.4 to 2.0 6.0 4.0 ? pc8163tb 16.5 0.8 to 2.0 9.0 5.5 ? pc8172tb 9.0 0.8 to 2.5 9.5 8.5 8.0 pc8187tb 15.0 0.8 to 2.5 11.0 11.0 10.0 p o (sat) (dbm) oip 3 (dbm) part no. @ rf0.9 (ghz) note @ rf1.9 (ghz) @ rf2.4 (ghz) @ rf0.9 (ghz) note @ rf1.9 (ghz) @ rf2.4 (ghz) pc8172tk + 0.5 0 ? 0.5 + 7.5 + 6.0 + 4.0 pc8106tb ? 2.0 ? 4.0 ? + 5.5 + 2.0 ? pc8109tb ? 5.5 ? 7.5 ? + 1.5 ? 1.0 ? pc8163tb + 0.5 ? 2.0 ? + 9.5 + 6.0 ? pc8172tb + 0.5 0 ? 0.5 + 7.5 + 6.0 + 4.0 pc8187tb + 4.0 + 2.5 + 1.0 + 10.0 + 10.0 + 8.5 note f rfout = 0.83 ghz@ pc8163tb, pc8187tb remarks 1. typical performance. please refer to electrical characteristics in detail. 2. to know the associated product, please refer to each latest data sheet. data sheet pu10407ej02v0ds 3 pc8172tk 3. block diagram ifinput gnd loinput rfoutput v cc ps (top view) pc8172tk loinput gnd ifinput ps v cc rfoutput (top view) pc8172tb conventional 4. system application example demo. pll 0 90 i q i q pa sw tx rx pll n pc8172tk low noise tr vco phase shifter caution to know the associated products, pl ease refer to each latest data sheet. data sheet pu10407ej02v0ds 4 pc8172tk 5. pin explanation pin no. pin name applied voltage (v) pin voltage (v) note function and applications inte rnal equivalent circuit 1 ifinput ? 1.3 this pin is if input to double balanced mixer (dbm). the input is designed as high impedance. the circuit contributes to suppress spurious signal. also this symmetrical circuit can keep specified performance insensitive to process-conditi on distribution. for above reason, double balanced mixer is adopted. 2 gnd gnd ? gnd pin. ground pattern on the board should be formed as wide as possible. track length should be kept as short as possible to minimize ground impedance. 3 loinput ? 2.4 local input pin. recommendable input level is ?10 to 0 dbm. 5 v cc 2.7 to 3.3 ? supply voltage pin. 6 rfoutput same bias as v cc through external inductor ? this pin is rf output from dbm. this pin is designed as open collector. due to the high impedance output, this pin should be externally equipped with lc matching circuit to next stage. 3 5 6 1 2 4 ps v cc /gnd ? power save control pin. bias controls operation as follows. v cc gnd 5 4 2 note each pin voltage is measured with v cc = v ps = v rfout = 3.0 v pin bias control v cc operation gnd power save data sheet pu10407ej02v0ds 5 pc8172tk 6. absolute maximum ratings parameter symbol test conditions ratings unit supply voltage v cc t a = +25 c 3.6 v ps pin input voltage v ps t a = +25 c 3.6 v power dissipation of package p d t a = +85c note 203 mw operating ambient temperature t a ? 40 to +85 c storage temperature t stg ? 55 to +150 c input power p in +10 dbm note mounted on double-side copper-clad 50 50 1.6 mm epoxy glass pwb 7. recommended operating range parameter symbol min. typ. max. unit remarks supply voltage v cc 2.7 3.0 3.3 v same voltage should be applied to pin 5 and pin 6. operating ambient temperature t a ? 40 +25 +85 c local input level p loin ? 10 ? 5 0 dbm z s = 50 (without matching) rf output frequency f rfout 0.8 ? 2.5 ghz with external matching circuit if input frequency f ifin 50 ? 600 mhz 8. electrical characteristics (t a = +25 c, v cc = v rfout = 3.0 v, f ifin = 240 mhz, p loin = ? 5 dbm, and v ps 2.7 v, unless otherwise specified) parameter symbol test conditions min. typ. max. unit circuit current i cc no signal 5.5 9.0 13 ma circuit current in power save mode i cc (ps) v ps = 0 v ? ? 2.0 a cg1 f rfout = 0.9 ghz note1 6.5 9.5 12.5 db cg2 f rfout = 1.9 ghz note2 5.5 8.5 11.5 db conversion gain cg3 f rfout = 2.4 ghz note2 p ifin = ? 30 dbm f ifin = 240 mhz 5.0 8.0 11.0 db p o (sat) 1 f rfout = 0.9 ghz note1 ? 2.5 + 0.5 ? dbm p o (sat) 2 f rfout = 1.9 ghz note2 ? 3.5 0 ? dbm saturated rf output power p o (sat) 3 f rfout = 2.4 ghz note2 p ifin = 0 dbm f ifin = 240 mhz ? 4.0 ? 0.5 ? dbm notes 1. f rfout < f loin @ f rfout = 0.9 ghz 2. f loin < f rfout @ f rfout = 1.9 ghz/2.4 ghz data sheet pu10407ej02v0ds 6 pc8172tk 9. other characteristics, fo r reference purposes only (t a = +25 c, v cc = v rfout = 3.0 v, p loin = ? 5 dbm, and v ps 2.7 v, unless otherwise specified) parameter symbol test conditions data unit oip 3 1 f rfout = 0.9 ghz note1 +7.5 dbm oip 3 2 f rfout = 1.9 ghz note2 +6.0 dbm output 3rd order distortion intercept point oip 3 3 f rfout = 2.4 ghz note2 f ifin 1 = 240 mhz f ifin 2 = 241 mhz +4.0 dbm iip 3 1 f rfout = 0.9 ghz note1 ? 2.0 dbm iip 3 2 f rfout = 1.9 ghz note2 ? 2.5 dbm input 3rd order distortion intercept point iip 3 3 f rfout = 2.4 ghz note2 f ifin 1 = 240 mhz f ifin 2 = 241 mhz ? 4.0 dbm ssb nf1 f rfout = 0.9 ghz, f ifin = 240 mhz 9.5 db ssb nf2 f rfout = 1.9 ghz, f ifin = 240 mhz 10.4 db ssb noize figure ssb nf3 f rfout = 2.4 ghz, f ifin = 240 mhz 10.6 db rise time t ps (rise) v ps : gnd v cc 1.0 s power save response time fall time t ps (fall) v ps : v cc gnd 1.5 s notes1. f rfout < f loin @ f rfout = 0.9 ghz 2. f loin < f rfout @ f rfout = 1.9 ghz/2.4 ghz data sheet pu10407ej02v0ds 7 pc8172tk 10. test circuit 10.1 test circuit 1 (f rfout = 0.9 ghz) 50 1 pf 68 pf 50 100 pf spectrum analyzer 10 nh 1 000 pf v cc strip line : 8 mm 1 f 1 f 6 1 2 3 5 4 50 100 pf 100 pf signal generator signal generator rf out v cc ps if in gnd lo in 1 000 pf data sheet pu10407ej02v0ds 8 pc8172tk example of test circuit 1 assembled on evaluation board rf output lo input pc8172tk l 1 c 8 c 3 c 5 c 1 c 2 c 4 c 7 v cc c 9 if input c 6 gnd ps component list form symbol value type code maker chip capacitor c 1 , c 2 ,c 3 100 pf grm39ch101j50pt murata c 4 1 000 pf grm39b102k50pt murata c 5 ,c 6 1 f grm39f105z10pt murata c 7 68 pf grm39ch680j50pt murata c 8 1 pf grm39ch010c50pt murata feed-through capacitor c 9 1 000 pf dft301-801 7r102s50 murata chip inductor l 1 10 nh ll1608-f10n toko ( 1) 35 42 0.4 mm polyimide board, double-sided copper clad ( 2) ground pattern on rear of the board ( 3) solder plated patterns ( 4) : through holes data sheet pu10407ej02v0ds 9 pc8172tk 10.2 test circuit 2 (f rfout = 1.9 ghz) 50 30 pf 50 100 pf spectrum analyzer 100 nh 1 000 pf v cc strip line : 12 mm 1 000 pf 1 000 pf 6 1 2 3 5 4 50 100 pf 100 pf signal generator signal generator rf out v cc ps if in gnd lo in 3 pf 1 000 pf strip line : 5 mm data sheet pu10407ej02v0ds 10 pc8172tk example of test circuit 2 assembled on evaluation board pc8172tk gnd rf output lo input if input ps l 1 c 5 c 1 c 2 c 4 c 8 c 3 c 7 c 6 v cc c 9 component list form symbol value type code maker chip capacitor c 1 , c 2 ,c 3 100 pf grm39ch101j50pt murata c 4 , c 5 , c 6 1 000 pf grm39b102k50pt murata c 7 30 pf grm39ch300j50pt murata c 8 3 pf grm39ch030c50pt murata feed-through capacitor c 9 1 000 pf dft301-801 7r102s50 murata chip inductor l 1 100 nh ll1608-fr10 toko ( 1) 35 42 0.4 mm polyimide board, double-sided copper clad ( 2) ground pattern on rear of the board ( 3) solder plated patterns ( 4) : through holes data sheet pu10407ej02v0ds 11 pc8172tk 10.3 test circuit 3 (f rfout = 2.4 ghz) 50 10 pf 50 100 pf spectrum analyzer 470 nh 1 000 pf v cc strip line : 8 mm 1 000 pf 1 000 pf 6 1 2 3 5 4 50 100 pf 100 pf signal generator signal generator rf out v cc ps if in gnd lo in 2 pf strip line : 7 mm 1 000 pf data sheet pu10407ej02v0ds 12 pc8172tk example of test circuit 3 assembled on evaluation board pc8172tk gnd rf output lo input if input ps l 1 c 5 c 1 c 2 c 4 c 8 c 3 c 7 c 6 v cc c 9 component list form symbol value type code maker chip capacitor c 1 , c 2 ,c 3 100 pf grm39ch101j50pt murata c 4 , c 5 , c 6 1 000 pf grm39b102k50pt murata c 7 10 pf grm39ch100d50pt murata c 8 2 pf grm39ch020c50pt murata feed-through capacitor c 9 1 000 pf dft301-801 7r102s50 murata chip inductor l 1 470 nh ll2012-fr47 toko ( 1) 35 42 0.4 mm polyimide board, double-sided copper clad ( 2) ground pattern on rear of the board ( 3) solder plated patterns ( 4) : through holes data sheet pu10407ej02v0ds 13 pc8172tk 11. typical characteristics (t a = +25 c, unless otherwise specified) 12 10 8 6 4 2 0 01234 12 10 8 6 4 2 0 0 1 1.5 2.5 3.5 0.5 2 3 4 12 11 10 9 8 7 6 ?60 ?20 0 40 80 ?40 20 60 100 ?40 c t a = +85 c +25 c 2.7 v 3.0 v v cc = 3.3 v v cc = 3.0 v, no signal circuit current i cc (ma) circuit current vs. supply voltage supply voltage v cc (v) circuit current i cc (ma) operating ambient temperature t a ( c) circuit current vs. operating ambient temperature circuit current i cc (ma) ps pin input voltage v ps (v) circuit current vs. ps pin input voltage remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 14 pc8172tk 11.1 f rfout = 900 mhz matching 10 5 0 ?5 ?10 ?15 ?20 ?25 10 5 0 ?5 ?10 ?15 ?20 ?25 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 15 10 5 0 ?5 ?10 ?15 15 10 5 0 ?5 ?10 ?15 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 3.0 v v cc = 3.3 v 2.7 v +25 c t a = ?40 c +85 c +25 c t a = ?40 c +85 c f rfout = 900 mhz f ifin = 240 mhz f loin = 1 140 mhz p loin = ?5 dbm v cc = 3.0 v f rfout = 900 mhz f ifin = 240 mhz f loin = 1 140 mhz p loin = ?5 dbm v cc = 3.0 v f rfout = 900 mhz f ifin = 240 mhz f loin = 1 140 mhz p ifin = ?30 dbm f rfout = 900 mhz f ifin = 240 mhz f loin = 1 140 mhz p ifin = ?30 dbm 3.0 v v cc = 3.3 v 2.7 v conversion gain cg (db) conversion gain vs. local input level local input level p loin (dbm) rf output level p rfout (dbm) rf output level vs. if input level if input level p ifin (dbm) conversion gain cg (db) conversion gain vs. local input level local input level p loin (dbm) rf output level p rfout (dbm) rf output level vs. if input level if input level p ifin (dbm) ps pin control response time ref lvl = 0 dbm 10 db/div (vertical axis) att = 10 db center = 0.9 ghz span = 0 hz rbw = 2 mhz vbw = 3 mhz swp = 50 sec 5 sec/din (horizontal axis) rf output level p rfout (dbm) response time ( s) v cc = 3.0 v f rfout = 0.9 ghz f ifin = 240 mhz p ifin = ?30 dbm f loin = 1 140 mhz p loin = ?5 dbm mkr ?20.0 dbm,14.7 s remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 15 pc8172tk 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?30 ?25 ?20 ?15 ?10 ?5 0 ?30 ?25 ?20 ?15 ?10 ?5 0 ?30 ?25 ?20 ?15 ?10 ?5 0 ?30 ?25 ?20 ?15 ?10 ?5 0 ?30 ?25 ?20 ?15 ?10 ?5 0 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 im 3 (des) v cc = 2.7 v f rfout = 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 140 mhz p loin = ?5 dbm im 3 (undes) v cc = 3.0 v f rfout = 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 140 mhz p loin = ?5 dbm p out (des) p out (undes) im 3 (des) im 3 (undes) p out (des) p out (undes) im 3 (des) im 3 (undes) im 3 (des) im 3 (undes) p out (des) p out (undes) v cc = 3.3 v f rfout = 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 140 mhz p loin = ?5 dbm t a = +25 c v cc = 3.0 v f rfout = 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 140 mhz p loin = ?5 dbm p out (des) p out (undes) im 3 (des) im 3 (undes) t a = +85 c v cc = 3.0 v f rfout = 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 140 mhz p loin = ?5 dbm p out (des) p out (undes) ?30 ?25 ?20 ?15 ?10 ?5 0 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 im 3 (des) im 3 (undes) p out (des) p out (undes) t a = ?40 c v cc = 3.0 v f rfout = 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 140 mhz p loin = ?5 dbm rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 16 pc8172tk ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?50 ?40 ?30 ?20 ?10 0 ?40 ?30 ?20 ?10 0 ?10 ?15 ?20 ?25 ?30 ?35 ?40 ?45 ?50 ?55 ?60 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?90 ?40 ?30 ?20 ?10 0 0 1 000 2 000 2 500 500 1 500 3 000 ?10 ?15 ?20 ?25 ?30 ?35 ?40 ?45 0 500 1 000 1 500 2 000 2 500 3 000 ?45 ?50 ?55 ?60 ?65 ?70 ?75 ?80 ?85 0 100 200 300 400 500 3.0 v v cc = 3.3 v 2.7 v f rfout = 900 mhz f ifin = 240 mhz f loin = 1 140 mhz p ifin = ?30 dbm f rfout = 900 mhz f ifin = 240 mhz f loin = 1 140 mhz p loin = ?5 dbm 3.0 v 3.3 v v cc = 2.7 v f rfout = 900 mhz f loin = 1 140 mhz rf out = 50 terminate v cc = 3.0 v f rfout = 900 mhz p loin = ?5 dbm if port = 50 terminate v cc = 3.0 v f rfout = 900 mhz p ifin = ?30 dbm f loin = 1 140 mhz p loin = ?5 dbm v cc = 3.0 v f rfout = 900 mhz p loin = ?5 dbm rf port = 50 terminate 3.0 v v cc = 3.3 v 2.7 v local leakage at if pin lo if (dbm) local input level p loin (dbm) local leakage at if pin vs. local input level local leakage at rf pin lo rf (dbm) local leakage at rf pin vs. local input level local input level p loin (dbm) if leakage at rf pin if rf (dbm) if input power p ifin (dbm) if leakage at rf pin vs. if input power local leakage at if pin lo if (dbm) local leakage at if pin vs. local input frequency local input frequency f loin (mhz) local input frequency f loin (mhz) local leakage at rf pin lo rf (dbm) local leakage at rf pin vs. local input frequency if leakage at rf pin if rf (dbm) if leakage at rf pin vs. if input frequency if input frequency f ifin (mhz) remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 17 pc8172tk 11.5 11.0 10.5 10.0 9.5 9.0 8.5 2.4 2.6 2.8 3.0 3.2 3.4 3.6 f rfout = 900 mhz f loin = 1 140 mhz p loin = ?5 dbm 13 12 11 10 9 8 7 6 5 1 050 1 100 1 150 1 200 1 250 3.0 v v cc = 3.3 v 2.7 v f rfout = 900 mhz f ifin = 240 mhz p ifin = ?30 dbm p loin = ?5 dbm 12 11 10 9 8 0 100 200 300 400 500 600 700 3.0 v 2.7 v v cc = 3.3 v f rfout = 900 mhz p ifin = ?30 dbm p loin = ?5 dbm ssb noise figure ssb nf (db) ssb noise figure vs. supply voltage supply voltage v cc (v) conversion gain vs. local input frequency local input frequency f loin (mhz) conversion gain cg (db) if input frequency f ifin (mhz) conversion gain vs. if input frequency conversion gain cg (db) remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 18 pc8172tk 11.2 f rfout = 1 900 mhz matching 15 10 5 0 ?5 ?10 ?15 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 3.0 v v cc = 3.3 v 2.7 v f rfout = 1 900 mhz f ifin = 240 mhz f loin = 1 660 mhz p ifin = ?30 dbm 15 10 5 0 ?5 ?10 ?15 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 +25 c t a = ?40 c +85 c v cc = 3.0 v f rfout = 1 900 mhz f ifin = 240 mhz f loin = 1 660 mhz p ifin = ?30 dbm 10 5 0 ?5 ?10 ?15 ?20 ?25 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 2.7 v 3.0 v v cc = 3.3 v f rfout = 1 900 mhz f ifin = 240 mhz f loin = 1 660 mhz p loin = ?5 dbm 10 5 0 ?5 ?10 ?15 ?20 ?25 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 v cc = 3.0 v f rfout = 1 900 mhz f ifin = 240 mhz f loin = 1 660 mhz p loin = ?5 dbm +25 c t a = ?40 c +85 c ps pin control response time conversion gain cg (db) conversion gain vs. local input level local input level p loin (dbm) rf output level p rfout (dbm) rf output level vs. if input level if input level p ifin (dbm) conversion gain cg (db) conversion gain vs. local input level local input level p loin (dbm) rf output level p rfout (dbm) rf output level vs. if input level if input level p ifin (dbm) ref lvl = 0 dbm 10 db/div (vertical axis) att = 10 db center = 1.9 ghz span = 0 hz rbw = 2 mhz vbw = 3 mhz swp = 50 sec 5 sec/din (horizontal axis) rf output level p rfout (dbm) response time ( s) v cc = 3.0 v f rfout = 1.9 ghz f ifin = 240 mhz p ifin = ?30 dbm f loin = 1 660 mhz p loin = ?5 dbm mkr ?21.0 dbm,17.9 s remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 19 pc8172tk 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?30 ?20 ?10 0 v cc = 2.7 v f rfout = 1 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 660 mhz p loin = ?5 dbm im 3 (des) im 3 (undes) p out (des) p out (undes) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) ?30 ?25 ?20 ?15 ?10 ?5 0 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 im 3 (des) im 3 (undes) p out (des) p out (undes) t a = ?40 c v cc = 3.0 v f rfout = 1 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 660 mhz p loin = ?5 dbm rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?30 ?25 ?20 ?15 ?10 ?5 0 v cc = 3.0 v f rfout = 1 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 660 mhz p loin = ?5 dbm im 3 (des) im 3 (undes) p out (des) p out (undes) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) ?30 ?25 ?20 ?15 ?10 ?5 0 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 im 3 (des) im 3 (undes) p out (des) p out (undes) t a = +25 c v cc = 3.0 v f rfout = 1 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 660 mhz p loin = ?5 dbm rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) ?30 ?20 ?10 0 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 im 3 (des) im 3 (undes) p out (des) p out (undes) v cc = 3.3 v f rfout = 1 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 660 mhz p loin = ?5 dbm rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) ?30 ?25 ?20 ?15 ?10 ?5 0 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 im 3 (des) im 3 (undes) p out (des) p out (undes) t a = +85 c v cc = 3.0 v f rfout = 1 900 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 1 660 mhz p loin = ?5 dbm rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 20 pc8172tk v cc = 3.0 v f rfout = 1 900 mhz p loin = ?5 dbm if port = 50 terminate 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?50 ?40 ?30 ?20 ?10 0 ?50 ?40 ?30 ?20 ?10 0 ?10 ?15 ?20 ?25 ?30 ?35 ?40 ?45 ?50 ?55 ?60 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?90 ?40 ?30 ?20 ?10 0 0 1 000 2 000 2 500 500 1 500 3 000 ?10 ?15 ?20 ?25 ?30 ?35 ?40 ?45 0 500 1 000 1 500 2 000 2 500 3 000 ?25 ?30 ?35 ?40 ?45 0 100 200 300 400 500 v cc = 3.3 v 3.0 v 2.7 v f rfout = 1 900 mhz f ifin = 240 mhz f loin = 1 660 mhz p ifin = ?30 dbm f rfout = 1 900 mhz f ifin = 240 mhz f loin = 1 660 mhz p loin = ?5 dbm 3.0 v 3.3 v v cc = 2.7 v f rfout = 1 900 mhz f loin = 1 660 mhz rf out = 50 terminate 3.0 v v cc = 3.3 v 2.7 v v cc = 3.0 v f rfout = 1 900 mhz p ifin = ?30 dbm f loin = 1 660 mhz p loin = ?5 dbm v cc = 3.0 v f rfout = 1 900 mhz p loin = ?5 dbm rf port = 50 terminate local leakage at if pin lo if (dbm) local input level p loin (dbm) local leakage at if pin vs. local input level local leakage at rf pin lo rf (dbm) local input level p loin (dbm) local leakage at rf pin vs. local input level if leakage at rf pin if rf (dbm) if input power p ifin (dbm) if leakage at rf pin vs. if input power local leakage at if pin lo if (dbm) local leakage at if pin vs. local input frequency local input frequency f loin (mhz) local input frequency f loin (mhz) local leakage at rf pin lo rf (dbm) local leakage at rf pin vs. local input frequency if leakage at rf pin if rf (dbm) if leakage at rf pin vs. if input frequency if input frequency f ifin (mhz) remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 21 pc8172tk 11.5 11.0 10.5 10.0 9.5 9.0 8.5 2.4 2.6 2.8 3.0 3.2 3.4 3.6 f rfout = 1 900 mhz f ifin = 240 mhz p ifin = ?20 dbm f loin = 1 660 mhz p loin = ?5 dbm 11 10 9 8 7 12 11 10 9 8 7 6 5 1 550 1 600 1 650 1 700 1 750 1 800 0 200 300 500 600 100 400 700 0 200 300 500 600 100 400 700 11 10 9 8 7 2.7 v 3.0 v v cc = 3.3 v 2.7 v 3.0 v v cc = 3.3 v f rfout = 1 900 mhz f ifin = 240 mhz p ifin = ?30 dbm p loin = ?5 dbm f rfout = 1 900 mhz p ifin = ?30 dbm p loin = ?5 dbm f rfout = 1 900 mhz p ifin = ?30 dbm p loin = ?5 dbm 2.7 v 3.0 v v cc = 3.3 v ssb noise figure ssb nf (db) ssb noise figure vs. supply voltage supply voltage v cc (v) conversion gain vs. local input frequency local input frequency f loin (mhz) conversion gain cg (db) if input frequency f ifin (mhz) conversion gain vs. if input frequency (f loin < f rfout ) conversion gain cg (db) if input frequency f ifin (mhz) conversion gain vs. if input frequency (f loin > f rfout ) conversion gain cg (db) remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 22 pc8172tk 11.3 f rfout = 1 950 mhz matching 5 0 ?5 ?10 ?15 ?20 ?25 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 2.7 v f rfout = 1 950 mhz f ifin = 570 mhz f loin = 2 520 mhz p loin = ?5 dbm 3.0 v v cc = 3.3 v 15 10 5 0 ?5 ?10 ?15 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 f rfout = 1 950 mhz f ifin = 570 mhz f loin = 2 520 mhz p ifin = ?30 dbm 2.7 v 3.0 v v cc = 3.3 v 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?30 ?25 ?20 ?15 ?10 ?5 0 v cc = 3.3 v f rfout = 1 950 mhz f ifin 1 = 570 mhz f ifin 2 = 571 mhz f loin = 2 520 mhz p loin = ?5 dbm 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?30 ?25 ?20 ?15 ?10 ?5 0 v cc = 2.7 v f rfout = 1 950 mhz f ifin 1 = 570 mhz f ifin 2 = 571 mhz f loin = 2 520 mhz p loin = ?5 dbm 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?30 ?25 ?20 ?15 ?10 ?5 0 v cc = 3.0 v f rfout = 1 950 mhz f ifin 1 = 570 mhz f ifin 2 = 571 mhz f loin = 2 520 mhz p loin = ?5 dbm ?20 ?25 ?30 ?35 ?40 ?45 ?50 ?55 ?60 ?65 ?70 ?40 ?30 ?25 ?15 ?5 ?35 ?20 ?10 0 3.3 v 3.0 v v cc = 2.7 v f loin = 2 520 mhz 1 951 mhz 1 948 mhz 1 949 mhz 1 950 mhz 1 949 mhz 1 950 mhz 1 948 mhz 1 951 mhz 1 949 mhz 1 950 mhz 1 948 mhz 1 951 mhz conversion gain cg (db) conversion gain vs. local input level local input level p loin (dbm) rf output level p rfout (dbm) rf output level vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) local leakage at if pin lo if (dbm) local input level p loin (dbm) local leakage at if pin vs. local input level remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 23 pc8172tk ?10 ?20 ?30 ?40 ?50 ?60 ?70 ? 50 ? 40 ? 35 ? 30 ? 20 ? 10 ? 5 ? 45 ? 25 ? 15 0 2.7 v 3.0 v v cc = 3.3 v f ifin = 570 mhz f loin = 2 520 mhz p loin = ?5 dbm 10.0 9.5 9.0 8.5 8.0 7.5 7.0 ssb noise figure ssb nf (db) 2.4 2.8 3.4 2.6 3.0 3.2 3.6 f rfout = 1 950 mhz f loin = 2 520 mhz p loin = ?5 dbm 12 11 10 9 8 7 6 5 0 100 200 300 400 500 600 700 10 8 6 4 2 0 10 8 6 4 2 0 2 000 2 200 2 400 2 600 2 800 3 000 300 400 500 600 700 800 3.0 v v cc = 3.3 v 2.7 v 3.0 v v cc = 3.3 v 2.7 v f ifin = 570 mhz p ifin = ?30 dbm p loin = ?5 dbm f loin = 2 520 mhz p ifin = ?30 dbm p loin = ?5 dbm f rfout = 1 950 mhz p ifin = ?30 dbm p loin = ?5 dbm 3.0 v v cc = 3.3 v 2.7 v ?30 ?35 ?40 ?45 ?50 ?55 ?60 ?65 ?70 ?40 ?30 ?25 ?10 ?5 ?35 ?20 ?15 0 f ifin = 570 mhz f loin = 2 520 mhz p if = ?30 dbm 3.0 v v cc = 3.3 v 2.7 v local leakage at rf pin lo rf (dbm) local input level p loin (dbm) local leakage at rf pin vs. local input level ssb noise figure vs. supply voltage supply voltage v cc (v) conversion gain vs. local input frequency local input frequency f loin (mhz) conversion gain cg (db) if input frequency f ifin (mhz) conversion gain vs. if input frequency conversion gain cg (db) if input frequency f ifin (mhz) conversion gain vs. if input frequency conversion gain cg (db) if leakage at rf pin if rf (dbm) if input power p ifin (dbm) if leakage at rf pin vs. if input power remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 24 pc8172tk 11.4 f rfout = 2 400 mhz matching 10 5 0 ?5 ?10 ?15 ?20 ?25 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 15 10 5 0 ?5 ?10 ?15 15 10 5 0 ?5 ?10 ?15 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 2.7 v 3.0 v v cc = 3.3 v 2.7 v +25 c t a = ?40 c +85 c 3.0 v v cc = 3.3 v f rfout = 2 400 mhz f ifin = 240 mhz f loin = 2 160 mhz p loin = ?5 dbm f rfout = 2 400 mhz f ifin = 240 mhz f loin = 2 160 mhz p ifin = ?30 dbm v cc = 3.0 v f rfout = 2 400 mhz f ifin = 240 mhz f loin = 2 160 mhz p ifin = ?30 dbm rf output level p rfout (dbm) rf output level vs. if input level if input level p ifin (dbm) conversion gain cg (db) conversion gain vs. local input level local input level p loin (dbm) 10 5 0 ?5 ?10 ?15 ?20 ?25 ?30 ?20 ?15 ?5 5 ?25 ?10 0 10 v cc = 3.0 v f rfout = 2 400 mhz f ifin = 240 mhz f loin = 2 160 mhz p loin = ?5 dbm +25 c t a = ?40 c +85 c conversion gain cg (db) conversion gain vs. local input level local input level p loin (dbm) rf output level p rfout (dbm) rf output level vs. if input level if input level p ifin (dbm) ps pin control response time ref lvl = 0 dbm 10 db/div (vertical axis) att = 10 db center = 2.4 ghz span = 0 hz rbw = 2 mhz vbw = 3 mhz swp = 50 sec 5 sec/din (horizontal axis) v cc = 3.0 v f rfout = 2.4 ghz f ifin = 240 mhz p ifin = ?30 dbm f loin = 2 160 mhz p loin = ?5 dbm mkr ?21.5 dbm,13.8 s rf output level p rfout (dbm) response time ( s) remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 25 pc8172tk 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?30 ?25 ?20 ?15 ?10 ?5 0 ?30 ?25 ?20 ?15 ?10 ?5 0 ?30 ?25 ?20 ?15 ?10 ?5 ?30 ?25 ?20 ?15 ?10 ?5 0 ?30 ?25 ?20 ?15 ?10 ?5 0 ?30 ?25 ?20 ?15 ?10 ?5 0 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 10 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 v cc = 2.7 v f rfout = 2 400 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 2 160 mhz p loin = ?5 dbm v cc = 3.0 v f rfout = 2 400 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 2 160 mhz p loin = ?5 dbm im 3 (des) im 3 (undes) im 3 (des) im 3 (undes) p out (des) p out (undes) im 3 (des) im 3 (undes) p out (des) p out (undes) p out (des) p out (undes) v cc = 3.3 v f rfout = 2 400 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 2 160 mhz p loin = ?5 dbm t a = +25 c v cc = 3.0 v f rfout = 2 400 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 2 160 mhz p loin = ?5 dbm im 3 (des) im 3 (undes) p out (des) p out (undes) im 3 (des) im 3 (undes) p out (des) p out (undes) t a = ?40 c v cc = 3.0 v f rfout = 2 400 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 2 160 mhz p loin = ?5 dbm im 3 (des) im 3 (undes) t a = +85 c v cc = 3.0 v f rfout = 2 400 mhz f ifin 1 = 240 mhz f ifin 2 = 241 mhz f loin = 2 160 mhz p loin = ?5 dbm p out (des) p out (undes) 0 rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) rf output level of each tone p rfout (dbm) 3rd order intermodulation distortion im 3 (dbm) rf output level, im 3 vs. if input level if input level p ifin (dbm) remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 26 pc8172tk ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?90 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?50 ?40 ?30 ?20 ?10 0 ?40 ?30 ?20 ?10 0 ?10 ?15 ?20 ?25 ?30 ?35 ?40 ?45 ?50 ?55 ?60 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?50 ?40 ?30 ?20 ?10 0 0 1 000 2 000 2 500 500 1 500 3 000 ?10 ?15 ?20 ?25 ?30 ?35 ?40 ?45 0 500 1 000 1 500 2 000 2 500 3 000 ?25 ?30 ?35 ?40 ?45 0 100 200 300 400 500 f rfout = 2 400 mhz f ifin = 240 mhz f loin = 2 160 mhz p ifin = ?30 dbm v cc = 3.3 v 3.0 v 2.7 v f rfout = 2 400 mhz f loin = 2 160 mhz rf out = 50 terminate 3.0 v 3.3 v v cc = 2.7 v 3.0 v v cc = 3.3 v 2.7 v f rfout = 2 400 mhz f ifin = 240 mhz f loin = 2 160 mhz p loin = ?5 dbm v cc = 3.0 v f rfout = 2 400 mhz p loin = ?5 dbm if port = 50 terminate v cc = 3.0 v f rfout = 2 400 mhz p ifin = ?30 dbm f loin = 2 160 mhz p loin = ?5 dbm v cc = 3.0 v f rfout = 2 400 mhz p loin = ?5 dbm rf port = 50 terminate local leakage at if pin lo if (dbm) local input level p loin (dbm) local leakage at if pin vs. local input level local leakage at rf pin lo rf (dbm) local input level p loin (dbm) local leakage at rf pin vs. local input level if leakage at rf pin if rf (dbm) if input power p ifin (dbm) if leakage at rf pin vs. if input power local leakage at if pin lo if (dbm) local leakage at if pin vs. local input frequency local input frequency f loin (mhz) local input frequency f loin (mhz) local leakage at rf pin lo rf (dbm) local leakage at rf pin vs. local input frequency if leakage at rf pin if rf (dbm) if leakage at rf pin vs. if input frequency if input frequency f ifin (mhz) remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 27 pc8172tk 12.5 12.0 11.5 11.0 10.5 10.0 9.5 2.4 2.6 2.8 3.0 3.2 3.4 3.6 f rfout = 2 400 mhz f loin = 2 160 mhz p loin = ?5 dbm 11 10 9 8 7 12 11 10 9 8 7 6 5 2 050 2 100 2 150 2 200 2 250 0 200 300 600 100 400 500 700 f rfout = 2 400 mhz f ifin = 240 mhz p ifin = ?30 dbm p loin = ?5 dbm f rfout = 2 400 mhz p ifin = ?30 dbm p loin = ?5 dbm 3.0 v v cc = 3.3 v 2.7 v 3.0 v v cc = 3.3 v 2.7 v ssb noise figure ssb nf (db) ssb noise figure vs. supply voltage supply voltage v cc (v) conversion gain vs. local input frequency local input frequency f loin (mhz) conversion gain cg (db) if input frequency f ifin (mhz) conversion gain vs. if input frequency conversion gain cg (db) remark the graphs indicate nominal characteristics. data sheet pu10407ej02v0ds 28 pc8172tk 12. s-parameters 3 1 2 marker 3 2.4 ghz start 100.000 000 mhz stop 3 100.000 000 mhz lo port inpedance (at l loaded) ch1 b 11 1 u fb b : 17.816 ?49.146 1.3493 pf 2 400.000 000 mhz 1: 45.734 ? 136.26 900 mhz 2: 22.445 ? 85.655 1.90 hz marker 3 2.4 ghz ch1 b 11 1 u fb b : 25.383 ?96.613 672.47 ff 2 400.000 000 mhz start 100.000 000 mhz stop 3 100.000 000 mhz if port inpedance (at l loaded) 3 1 2 1: 66.539 ? 236.11 900 mhz 2: 34.626 ? 121.79 1.90 hz marker 3 2.4 ghz start 100.000 000 mhz stop 3 100.000 000 mhz rf port inpedance (at l loaded) 3 1 2 ch1 b 22 1 u fb b : 22.96 ?107.45 617.19 ff 2 400.000 000 mhz 1: 63.672 ? 275.47 900 mhz 2: 28.953 ? 141.21 1.90 hz data sheet pu10407ej02v0ds 29 pc8172tk 13. package dimensions 6-pin lead-less minimold (1511) (unit: mm) 0.480.05 0.480.05 1.50.1 1.30.05 1.10.1 0.550.03 0.11 +0.1 ?0.05 0.160.05 0.90.1 0.20.1 (bottom view) (top view) remark ( ) : reference value data sheet pu10407ej02v0ds 30 pc8172tk 14. notes on correct use (1) observe precautions for handling becaus e of electro-static sensitive devices. (2) form a ground pattern as widely as possible to minimi ze ground impedance (to prevent undesired oscillation). (3) connect a bypass capacitor (example : 1 000 pf) to the v cc pin. (4) connect a matching circuit to the rf output pin. (5) the dc cut capacitor must be attached to input and output pin. 15. recommended soldering conditions this product should be soldered and mounted under t he following recommended conditions. for soldering methods and conditions other than those recommend ed below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ir260 wave soldering peak temperature (molten solder temperature) : 260 c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 c or below maximum number of flow processes : 1 time maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature (terminal temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering methods together ( except for partial heating). data sheet pu10407ej02v0ds 31 pc8172tk when the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the au thority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license . m8e 00. 4 - 0110 the information in this document is current as of december, 2004. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ? data sheet pu10407ej02v0ds 32 pc8172tk nec compound semiconductor devices hong kong limited e-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-558-5209 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-0 fax: +49-211-6503-1327 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0406 nec compound semiconductor devices, ltd. http://www.ncsd.necel.com/ e-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) sales division tel: +81-44-435-1588 fax: +81-44-435-1579 for further information, please contact pc8172tk |
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